Nano-Bio- Electronic, Photonic and MEMS Packaging

Transcription

1 Nano-Bio- Electronic, Photonic and MEMS Packaging

2 C.P. Wong Kyoung-Sik (Jack) Moon Yi Li Editors Nano-Bio- Electronic, Photonic and MEMS Packaging 123

3 Editors C.P. Wong School of Materials Science & Engineering Georgia Institute of Technology 771 Ferst Drive NW., Atlanta GA , USA Kyoung-Sik (Jack) Moon School of Materials Science & Engineering Georgia Institute of Technology 771 Ferst Drive NW., Atlanta GA , USA Yi Li Intel Corporation CH W. Chandler Blvd. Chandler AZ 85226, USA ISBN e-isbn DOI / Springer New York Dordrecht Heidelberg London Library of Congress Control Number: Springer Science+Business Media, LLC 2010 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (

4 Preface For the past decade, we have witnessed tremendous advances in nano- and biorelated science, with enormous technical information and literature published worldwide. However, limited numbers of commercialized and industrialized items have appeared. Reproducibility, low yield, and difficulties in packaging, which are critically needed to manufacture usable devices and systems, are issues that researchers strive to resolve. This book provides comprehensive reviews and overviews on the latest developments and cutting edges on nano- and bio-packaging technologies and their science, including nano- and biomaterials, devices and thermal issues for nanobiopackaging, and the molecular or atomistic scale modeling to predict those small world phenomena. This book is composed of 20 Chapters written by well-recognized world experts in this field. Chapters 1 4, 8, and 10 review various nanomaterials for nanopackaging technologies and their most recent research including nanomaterials for electrical and thermal interconnections and nanosurface manipulation for nanopackaging. Chapter 5 addresses a novel combustion method for nanoparticle synthesis and nanosurface coating. Novel nanomaterials for renewable energy and energy conversion devices are reviewed in Chapters 6 and 7. Chapter 9 addresses passive devices by using nanomaterials, and Chapter 11 reviews structural analysis of nanoelectronics and optical devices. Latest reviews on nano-thermal science are presented in Chapters 12 and 13. Some of the hot issues in the health care arena are the biomedical device and NEMS packaging, and the biosensor device and materials. Their recent development and research are reviewed in Chapters Computational molecular and atomistic scale simulations could provide us with a profound insight on the understanding of nano- and bio-related systems which are difficult to realize without high-cost equipment. These modeling efforts are reviewed in Chapters 18 to 20. We are indebted to all the contributions and efforts of the authors who share their expertise in these vital areas in delivering this book to our readers. Atlanta, Georgia, USA Atlanta, Georgia, USA C.P. Wong Kyoung-Sik (Jack) Moon v

5 Contents Nanomaterials for Microelectronic and Bio-packaging... 1 C.P. Wong and Kyoung-sik (Jack) Moon Nano-conductive Adhesives for Nano-electronics Interconnection Yi Li, Kyoung-sik (Jack) Moon, and C.P. Wong Biomimetic Lotus Effect Surfaces for Nanopackaging Yonghao Xiu and C.P. Wong Applications of Carbon Nanomaterials as Electrical Interconnects and Thermal Interface Materials Wei Lin and C.P. Wong Nanomaterials via NanoSpray Combustion Chemical Vapor Condensation, and Their Electronic Applications Andrew Hunt, Yongdong Jiang, Zhiyong Zhao, and Ganesh Venugopal 1D Nanowire Electrode Materials for Power Sources of Microelectronics Jaephil Cho Mechanical Energy Harvesting Using Wurtzite Nanowires Xudong Wang and Zhong Lin Wang Nanolead-Free Solder Pastes for Low Processing Temperature Interconnect Applications in Microelectronic Packaging Hongjin Jiang, Kyoung-sik (Jack) Moon, and C.P. Wong Introduction to Nanoparticle-Based Integrated Passives Ranjith John and Ajay P. Malshe Thermally Conductive Nanocomposites Jan Felba vii

6 viii Contents Physical Properties and Mechanical Behavior of Carbon Nano-tubes (CNTs) and Carbon Nano-fibers (CNFs) as Thermal Interface Materials (TIMs) for High-Power Integrated Circuit (IC) Packages: Review and Extension Yi Zhang, Ephraim Suhir, and Claire Gu On-Chip Thermal Management and Hot-Spot Remediation Avram Bar-Cohen and Peng Wang Some Aspects of Microchannel Heat Transfer Y. Joshi, X. Wei, B. Dang, and K. Kota Nanoprobes for Live-Cell Gene Detection Gang Bao, Won Jong Rhee, and Andrew Tsourkas Packaging for Bio-micro-electro-mechanical Systems (BioMEMS) and Microfluidic Chips Edward S. Park, Jan Krajniak, and Hang Lu Packaging of Biomolecular and Chemical Microsensors Peter J. Hesketh and Xiaohui Lin Nanobiosensing Electronics and Nanochemistry for Biosensor Packaging Dasharatham G. Janagama and Rao R. Tummala Molecular Dynamics Applications in Packaging Yao Li, Jeffrey A. Hinkley, and Karl I. Jacob Nanoscale Deformation and Strain Analysis by AFM/DIC Technique Y.F. Sun and John H.L. Pang Nano-Scale and Atomistic-Scale Modeling of Advanced Materials Ruo Li Dai, Wei-Hsin Liao, Chun-Te Lin, Kuo-Ning Chiang, and Shi-Wei Ricky Lee Index

7 Contributors Gang Bao Department of Biomedical Engineering, Georgia Institute of Technology, Atlanta, GA, USA, Avram Bar-Cohen Department of Mechanical Engineering, University of Maryland, College Park, MD, USA, Kuo-Ning Chiang Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, Jaephil Cho School of Energy Engineering, Ulsan National Institute of Science & Technology, Ulsan, Korea, Ruo Li Dai Department of Mechanical and Automation Engineering, The Chinese University of Hong Kong, Shatin, NT, Hong Kong, B. Dang IBM Corporation, Armonk, NY, USA, Jan Felba Institute of Microsystem Technology, Wrocław University of Technology, Wrocław, Poland, Claire Gu Department of Electrical Engineering, University of California, Santa Cruz, CA, USA, Peter J. Hesketh School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA, Jeffrey A. Hinkley Langley Research Center, NASA, Hampton, VA, USA, Andrew Hunt ngimat Co., Atlanta, GA, USA, Karl I. Jacob Department of Polymer, Textile and Fiber Engineering, Georgia Institute of Technology, Atlanta, GA, USA, Dasharatham G. Janagama Package Research Center (PRC), Georgia Institute of Technology, Atlanta, GA, USA, Hongjin Jiang Intel Corporation, Chandler, AZ, USA, Yongdong Jiang ngimat Co., Atlanta, GA, USA, ix

8 x Contributors Ranjit John College of Engineering, University of Arkansas, Fayetteville, AR, USA, Y. Joshi School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA, K. Kota School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA, Jan Krajniak School of Chemical and Biomolecular Engineering, Georgia Institute of Technology, Atlanta, GA, USA, Shi-Wei Ricky Lee Department of Mechanical Engineering, Hong Kong Institute of Science and Technology, Kowloon, Hong Kong, Yao Li Department of Polymer, Textile and Fiber Engineering, Georgia Institute of Technology, Atlanta, GA, USA, Yi Li Intel Corporation, Chandler, AZ, USA, Wei-Hsin Liao Department of Mechanical and Automation Engineering, The Chinese University of Hong Kong, Shatin, NT, Hong Kong, Chun-Te Lin Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, Wei Lin School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA, USA, Xiaohui Lin School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA, Hang Lu School of Chemical and Biomolecular Engineering, Georgia Institute of Technology, Atlanta, GA, USA, Ajay P. Malshe College of Engineering, University of Arkansas, Fayetteville, AR, USA, Kyoung-sik (Jack) Moon School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA, USA, John H.L. Pang School of Mechanical & Aerospace Engineering, Nanyang Technological University, Singapore, Singapore, Edward S. Park School of Chemical and Biomolecular Engineering, Georgia Institute of Technology, Atlanta, GA, USA, Won Jong Rhee Department of Biomedical Engineering, Georgia Institute of Technology, Atlanta, GA, USA, Ephraim Suhir Department of Electrical Engineering, University of California, Santa Cruz, CA, USA, Bell Laboratories, Physical Sciences and Engineering

9 Contributors xi Research Division, Murray Hill, NJ, USA (ret); Department of Mechanical Engineering, University of Maryland, College Park, MD, USA; and ERS Co., Los Altos, CA, USA, Y.F. Sun School of Mechanical & Aerospace Engineering, Nanyang Technological University, Singapore, Singapore, Andrew Tsourkas Department of Bioengineering, University of Pennsylvania, Philadelphia, PA, USA, Rao R. Tummala Package Research Center (PRC), Georgia Institute of Technology, Atlanta, GA, USA, Ganesh Venugopal ngimat Co., Atlanta, GA, USA, Peng Wang Department of Mechanical Engineering, University of Maryland, College Park, MD, USA, Xudong Wang School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA, USA, Zhong Lin Wang School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA, USA, X. Wei IBM Corporation, Armonk, NY, USA, C. P. Wong School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA, USA, Yonghao Xiu School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA, USA, Yi Zhang Department of Electrical Engineering, University of California, Santa Cruz, CA, USA, Zhiyong Zhao ngimat Co., Atlanta, GA, USA,