TI Embedded Processor for ebook Applications. Anderson Hsiao TI MCU/DSP Business Development

Transcription

1 TI Embedded Processor for ebook Applications Anderson Hsiao TI MCU/DSP Business Development

2 ebook Reader ebook Targeted mainly for Electronic download of published books and magazines/newspapers. Optimized for best reading experience on Gray Scale epaper including easy content access. Education SmartBook Revolutionary multi-display (Gray Scale epaper + Full Color LCD) SmartBook where the user interacts with different documents, books, notebooks, web pages and devices like calculators, digital pens, etc. User can combine information from multiple books, the internet, audios and videos into a personal learning experience. Education and teaching tool; Interactive computer based teaching system PLUS Generic ebook reader & Netbook Web Browsing. Optimized for the learning experience of the INTERNET age.

3 ebook Readers

4 Education SmartBook

5 Opportunities Education ebooks Large growth due to penetration into each school/university bag High differentiation with OMAP due to the combination of MID features with ebook reader functions in a mobile environment High potential to create a complete end to end offering using TI education technology IP, market channels and branding ebooks High volume, large growth market Main differentiation is a complete solution with integrated epaper controller Key for success is the best in class integration with all important epaper technologies and value chain partners

6 ebook System Block Diagram Main SDRAM PMIC Flash PMIC RAM Temp Sensor(s) Gate drivers DMA MEMIF EPSON controller 284 Screen CPU Serial Flash 284 Source drivers E-ink specific EPD solution E-ink EPD Panel

7 TI OMAP3x for ebook Applications

8 TI OMAP3 Application Processors

9 Subject to Change OMAP35x scalable platform of devices for complete product portfolio Production Now OMAP OMAP3530 OMAP3525 OMAP3515 OMAP3503 Applications Software Compatibility ARM Cortex -A MHz 720 MHz Shared Peripheral Set Peripherals 2D/3D Graphics Compatibility Graphics Open GL ES 2.0 POWERVR SGX DSP Processing & Multimedia Software Compatibility C64x+ DSP & video accelerator OMAP OMAP OMAP3525 OMAP3503 OMAP3515 ARM ARM Cortex -A8 Cortex -A8 600 MHz 600 MHz Peripherals Graphics Open GL ES 2.0 POWERVR SGX C64x+ DSP & video accelerator OMAP OMAP OMAP3515 OMAP3503 ARM Cortex -A8 ARM Cortex -A8 600 MHz 600 MHz Peripherals Peripherals Graphics Open GL ES 2.0 POWERVR SGX OMAP OMAP3503 ARM Cortex -A8 600 MHz Peripherals Pin-for-pin compatible Availability subject to applicable lead times POWERVR SGX 3D engine is licensed from Imagination Tech. Ltd.

10 Subject to Change POWERVR SGX 3D engine is licensed from Imagination Tech. Ltd. OMAP35x processor Laptop like performance at handheld power level Performance High-performance Superscalar ARM Cortex -A8 featuring NEON co-processor with immersive 2D/3D Graphics accelerator HD video decode utilizing TMS320C64x+ DSP and video hardware accelerators Low power utilizing TI s SmartReflex technology with option for integrated and discrete Power Management ICs Features Cores Cortex A-8 with NEON SIMD Coprocessor / DSP-based TMS320C64x+ DSP and video accelerators (max performance only) 720 MHz / V (operating limits apply) 600 MHz / V (operating limits apply) 550 MHz / V 2D/3D Graphics Engine - Up to 10M polygons per second Memory ARM: 16 kb I-Cache; 16 kb D-Cache; 256kB L2 TMS320C64x+ DSP and video accelerators L1 32kB Program Cache/32kB Data Cache + 48kB SRAM L2 64kB Program / Data Cache + 32 kb SRAM; 16 kb ROM On Chip: 64kB SRAM; 112kB ROM Peripheral Highlights Support for LPDDR Support for NOR, NAND, SRAM, Pseudo SRAM USB 2.0 HS Compliant OTG Controller w/ 2 additional USB Host Controllers Display subsystem with LCD and TV interface. Supports PIP, color space conversion, resize and rotation. Camera I/F with CCD controller and Image-pipe (Preview, Resize, Statistics Package 1 (CBB): 12x12 mm, 0.4mm pitch, Package On Package (POP); 515 pin PBGA; production now; can be used with discrete memory Package 2 (CUS): 16x16 mm 0.65 mm pitch. 423 pin PBGA; production now. Utilizes Via Channel Array Technology with 0.8mm pitch plus design rules. Package 3 (CBC): 14x14 mm, 0.5 mm pitch POP; 515 pin PBGA; production now; must use POP memory Applications include: Automotive Infotainment In-dash navigation Consumer PND PMP Digital Video Camera OMAP35x Processor ARM Cortex - A8 CPU Peripherals Serial Interfaces McBSP x5 McSPI x4 I 2 C x3 UART x2 UART w/irda C64x+ DSP and video accelerators (3525/3530 only) POWERVR SGX Graphics (3515/3530 only) L3/L4 Interconnect Connectivity USB 2.0 HS OTG Controller HDQ / 1-wire Medical Patient monitoring Portable ultrasound Industrial Point of sale Smart white goods USB Host Controller x3 LCD Controller Display Subsystem Camera I/F Image Pipe Video Enc System Timers GP x12 WDT x2 Program/Data Storage SDRC MMC/ SD/ GPMC SDIO x3 10 bit DAC 10 bit DAC Parallel I/F Note: Peripheral limitations may apply among different packages

11 Subject to Change POWERVR SGX 3D engine is licensed from Imagination Tech. Ltd. OMAP35x Windows CE 6.0 DVSDK Overview TI / BSQUARE s Windows CE 6.0 R2 BSP is a free, source code offering included in the OMAP35x WinCE DVSDK for the TI OMAP35x Evaluation Module (EVM) that helps customers get to market faster with Windows CE O/S based product based on OMAP35x application processor. Windows CE by EVM Hardware based on OMAP3530 Features Cortex -A8 running at 600MHz VGA on-board display with additional DVI and S-Video ports Contains 128 MB LPDDR1/128 MB Micron Flash or similar capacity and function Includes touch screen LCD display with landscape/portrait modes Expansion connector provides flexible interface capability DVSDK Base, tested BSP available now Features DirectShow Filter integration Contains Codec Engine and DSPLink for utilization of DSP and video accelerators inside WinCE Full OMAP35x peripheral support DVI and S-Video support Comprehensive Welcome Tour on-screen guide written in Flash Adobe Flash Lite 3.1 support* POWERVR SGX support for high-end graphics capabilities To get started: Get the OMAP35x EVM: Register the board (instructions are in the box) Access the Windows CE Demo or Windows CE DVSDK through *Available for purchase from BSQUARE

12 TI OMAP3 Zoom 2 Development Platform Subject to Change

13 Subject to Change Working with EPD OMAP 3 Cortex A8 NEON DSP Display I/F Thin logic - CPLD (// or GPMC) (protocol adaptation + level shifting) Source and gate drivers control 3D HW acc. SGX DSS/GPMC Temp. sensing Temp sensor PMIC for E-INK +/-15V, +/-22V Auto VCOM

14 TI Sitara Family for ebook Applications Subject to Change

15 Subject to Change What is Sitara? High performance MPUs What s new New platform of high-performance ARM microprocessors: ARM9 to ARM Cortex -A8 MPU s First new devices: AM3505 & AM3517 Software compatible roadmap for customers using TI s OMAP processors Ideal for applications requiring High-level operating system 375 MHz 1GHz+ in future devices Advanced graphical user interfaces Multiple connectivity and interface options High system integration And Scalability System cost constraints Application software portability Sitara ARM MPUs a good fit for industrial, instrumentation, POS Industrial automation Medical instrumentation Point of sale / service HVAC and building controls Test & measurement Single board computing

16 Subject to Change Sitara Processors are ideal for: Applications such as Design requirements HVAC and building controls Network appliances Industrial automation Point-of-sale machines Test and measurement Medical instrumentation Educational Consoles Single Board Computing Network Connectivity Multiple connectivity and interface options High system integration Scalability System cost constraints Operating System compatibility Application software portability Advanced graphical user interfaces Low Power PC

17 AM1808 Processor Unmatched Connectivity & Integration for Power-Efficient Processors Example Applications: Industrial Automation Home Automation Test & Measurement Portable Data Terminals ARM9 Subsystem ARM 926EJ-S CPU The boxes with yellow border are features found in AM1808 and not in AM1806 PRU LCD Controller upp Video IN/Out 128KB RAM Benefits: Multiple connectivity and interface options Rich, intuitive user interfaces High system integration Reduced system cost Peripherals UHPI SPI Switched Central Resource (SCR) / EDMA USB2.0 HS Serial Interfaces McASP McBSP Connectivity USB 1.1 I 2 C EMAC UART (3) SATA System WD Timer PWM (3) Program/Data Storage mddr/ DDR2/ SDRAM 16-bit Async EMIF 16-bit MMC/SD Subject to Change TI Confidential NDA Required

18 AM1808 Processor Features CPU Cores ARM926EJ-S (MPU) up to 450 MHz Memory ARM: 16KB L1 Program Cache 16KB L1 Data Cache On-chip 128KB RAM mddr, DDR2, SDRAM Peripherals (1.8/ 3.3V IOs) 10/100 Ethernet MAC EMIFA - DDR (mddr/ddr2) EMIFB SDRAM/NAND Flash Video Port I/F Video In/Out (BT.656) SATA, upp Power ( V Core, 1.8/3.3V IOs) Total Power < MHz, 1.2V, 25C Standby Power < 1.2V/ 25C ARM9 Subsystem ARM 926EJ-S CPU Peripherals UHPI High Speed ADC FPGA, or DSP interface Switched Central Resource (SCR) / EDMA USB2.0 HS Connectivity USB 1.1 The boxes with yellow border are features found in AM1808 and not in AM1806 EMAC PRU SATA LCD Controller upp Video IN/Out System Timer (4) PWM (3) VGA LCD 128KB RAM Package 13 x13mm nfbga (0.65mm), 16x16mm BGA (0.8mm) Extended Temperature Grade Options Commercial (0C to 70C) Industrial (-40C to 85C) Pin to pin compatible processors: OMAP-L138/AM1806/AM181x SPI Serial Interfaces McASP McBSP I 2 C Internet UART (3) Bluetooth Connectivity Program/Data Storage mddr/ DDR2/ SDRAM 16-bit Async EMIF 16-bit MMC/SD Subject to Change TI Confidential TI Confidential NDA Required

19 AM1806 Processor Unmatched Connectivity & Integration for Power-Efficient Processors Example Applications: Industrial Automation Educational Consoles Portable Data Terminals Point of Sale (Wireless) ARM9 Subsystem ARM 926EJ-S CPU PRU LCD Controller upp Video IN/Out 128KB RAM Benefits: Switched Central Resource (SCR) / EDMA Multiple connectivity and interface options Rich, intuitive user interfaces High system integration Reduced system cost Peripherals UHPI SPI USB2.0 HS Serial Interfaces McASP McBSP I 2 C UART (3) System Timer (4) PWM (3) Program/Data Storage mddr/ DDR2/ SDRAM 16-bit Async EMIF 16-bit MMC/SD Subject to Change TI Confidential NDA Required

20 AM1806 Processor High Speed ADC, or FPGA interface VGA LCD Features CPU Cores ARM926EJ-S (MPU) up to 450 MHz Memory ARM: 16KB L1 Program Cache 16KB L1 Data Cache On-chip (128KB RAM) mddr, DDR2, SDRAM Peripherals (1.8/ 3.3V IOs) EMIFA - DDR (mddr/ddr2) EMIFB SDRAM/NAND Flash Video Port I/F Video In/Out (BT.656) upp ARM9 Subsystem ARM 926EJ-S CPU PRU LCD Controller upp Video IN/out Switched Central Resource (SCR) / EDMA 128KB RAM Power ( V Core, 1.8/3.3V IOs) Total Power < MHz, 1.2V, 25C Standby Power < 1.2V/ 25C Extended Temperature Grade Options Commercial (0C to 90C) Industrial (-40C to 105C) Package 13 x13mm nfbga (0.65mm) 16x16mm BGA (0.8mm) Pin to pin compatible processors: OMAP-L138, AM1818, AM1808 Subject to Change Peripherals UHPI SPI USB2.0 HS Serial Interfaces McASP McBSP I 2 C TI Confidential NDA Required UART (3) Bluetooth Connectivity System Timer (4) PWM (3) Program/Data Storage mddr/ DDR2/ SDRAM 16-bit Async EMIF 16-bit MMC/SD

21 TI Stellaris Family Cortex-M3 Subject to Change

22 Subject to Change Stellaris Family Technology ARM Cortex -M3 v7-m Processor Core Up to 100 MHz Up to 125 MIPS (at 100 MHz) On-chip Memory 256 KB Flash; 96 KB SRAM ROM loaded with Stellaris DriverLib, BootLoader, AES tables, and CRC External Peripheral Interface (EPI) 32-bit dedicated parallel bus for external peripherals Supports SDRAM, SRAM/Flash, M2M Advanced Serial Integration 10/100 Ethernet MAC and PHY 3 CAN 2.0 A/B Controllers USB (full speed) OTG / Host / Device 3 UARTs with IrDA and ISO 7816 support* 2 I 2 Cs 2 Synchronous Serial Interfaces (SSI) Integrated Interchip Sound (I 2 S) System Integration 32-channel DMA Controller Internal Precision 16MHz Oscillator Two watchdog timers with separate clock domains ARM Cortex Systick Timer 4 32-bit timers (up to 8 16-bit) with RTC capability Lower-power battery-backed hibernation module Flexible pin-muxing capability Advanced Motion Control 8 advanced PWM outputs for motion and energy applications 2 Quadrature Encoder Inputs (QEI) Analog 2x 8-ch 10-bit ADC (for a total of 16 channels) 3 analog comparators On-chip voltage regulator (1.2V internal operation) * One UART features full modem controls

23 Stellaris value proposition Performance MHz ARM-M3 CPU Optimized for single-cycle flash usage Thumb-2 ISA with high code density Flexible clock system sources up to 8 timers Single-cycle multiply and hardware divide Three power modes and battery-backed hibernation with non-volatile memory Integrated 32-ch DMA for ease of use & high data rate without CPU overhead Connectivity Only family in the industry with: Ethernet MAC & PHY with 1588 PTP support USB Host, Device, or On-The-Go CAN 2.0 A/B with 32 mailboxes Integrated UART, I2C, SSI modules Integrated I2S master or slave External Peripheral Interface supporting SRAM, SDRAM, M2M, FPGA, CPLD Broad Portfolio Largest ARM MCU portfolio in the world with 138 devices 8KB-256KB Flash and 96KB RAM 10-bit, 8ch ADCs from 250ksps-1MSPS Up to 8 advanced PWM modules RTC, BOR, and integrated LDO Analog comparators and temp sensor 28 to 108 pin from SOIC to BGA Ease of Use C friendly IDE and compilers from industry leaders Low cost development tools Application specific and advanced development kits Production-ready application modules StellarisWare on ROM includes driver and peripheral libraries to ease development 23

24 Stellaris target applications Transaction Control Point-of-sale Printers Data acquisition AutoID Tag Scanner Vehicle ID Inventory RFID Building Control Lighting controls LED drivers Panel motor controller HVAC Pump inverter Compressor motor Building automation Audio Automation Machines Controllers Sorters Analyzers Component motors Monitors Ethernet bridges Sensors Medical Connected Motor Control Dental Drilling Machine Robotic DNA Extraction Connected General Host Data Acquisition 24

25 OS for Embedded Platforms

26 .NET Micro Framework for Portable Device

27 DK-LM3S9B96 MCU Development Kit MCUs in Series Flash (KB) Memory and Speed SRAM (KB) ROM SW Library Ext. Peripheral Interface Core Max Speed (MHz) Internal Precision Oscillator 32-bit Timer General Purpose Timer Modules 16-bit Timer Watchdog Timers CCP RTC Motion Control Serial Interfaces Analog Digital Outputs PWM Fault Inputs QEI 10/100 Ethernet MAC+PHY IEEE 1588 CAN MAC USB Full Speed UART I 2 C SSI/SPI I 2 S ADC (10-bit) LM3S1000s LM3S2000s LM3S3000s O/H/D LM3S5000s O/H/D ADC Channels ADC Speed (Ksps) Internal Temp Sensor LDO Voltage Regulator Analog Comparators Digital Comparators GPIOs (5-V) Hibernate Package Options 64-LQFP 100-LQFP 108-BGA 64-LQFP 100-LQFP 108-BGA 64-LQFP 100-LQFP 64-LQFP 100-LQFP LM3S9000s O/H/D LQFP Evaluation version software tools included in the kit: LM3S9B96 Full-Featured Development Board 80 MHz Stellaris LM3S9B96 MCU with fully-integrated Ethernet, CAN, and USB OTG/Host/Device Bright 3.5 QVGA LCD touch-screen display Navigation POT and select pushbuttons Integrated Interchip Sound (I2S) Audio Interface EPI cards: I/O break-out board and 8 MB SDR SDRAM module MicroSD card interface LM3S9B96 I/O available on labeled break-out pads ARM 20-pin JTAG debug connector with input and output modes 1 GB MicroSD Card, 128 MB USB Flash Drive Ethernet cable, CAN ribbon cable, USB and JTAG cables CDs containing evaluation software tools, documentation, quickstart guide, StellarisWare Graphics, USB, and Peripheral Driver Libraries, and source code Included EPI Breakout Board EPI 8MB SDRAM Board EPI Flash/SRAM/LCD Board Coming EPI FPGA and Camera Board Soon! Coming Soon!

28