INVESTOR PRESENTATION NOVEMBER 2015

INVESTOR PRESENTATION NOVEMBER 2015

Safe Harbor Statement This presentation contains statements about management's future expectations, plans and prospects of our business that constitute forward-looking statements, which are found in various places throughout the press release, including, but not limited to, statements relating to expectations of orders, net sales, product shipments, backlog, expenses, timing of purchases of assembly equipment by customers, gross margins, operating results and capital expenditures. The use of words such as anticipate, estimate, expect, can, intend, believes, may, plan, predict, project, forecast, will, would, and similar expressions are intended to identify forward looking statements, although not all forward looking statements contain these identifying words. The financial guidance set forth under the heading Outlook constitutes forward looking statements. While these forward looking statements represent our judgments and expectations concerning the development of our business, a number of risks, uncertainties and other important factors could cause actual developments and results to differ materially from those contained in forward looking statements, including the discovery of weaknesses in our internal controls and procedures, our inability to maintain continued demand for our products; the impact on our business of potential disruptions to European economies from euro zone sovereign credit issues; failure of anticipated orders to materialize or postponement or cancellation of orders, generally without charges; the volatility in the demand for semiconductors and our products and services; failure to adequately decrease costs and expenses as revenues decline, loss of significant customers, lengthening of the sales cycle, incurring additional restructuring charges in the future, acts of terrorism and violence; inability to forecast demand and inventory levels for our products, the integrity of product pricing and protect our intellectual property in foreign jurisdictions; risks, such as changes in trade regulations, currency fluctuations, political instability and war, associated with substantial foreign customers, suppliers and foreign manufacturing operations; potential instability in foreign capital markets; the risk of failure to successfully manage our diverse operations; those additional risk factors set forth in Besi's annual report for the year ended December 31, 2014 and other key factors that could adversely affect our businesses and financial performance contained in our filings and reports, including our statutory consolidated statements. We are under no obligation to (and expressly disclaim any such obligation to) update or alter our forward-looking statements whether as a result of new information, future events or otherwise. 2

Agenda I. Company Overview II. Market III. Strategy IV. Financial Review V. Outlook & Summary 3

I. COMPANY OVERVIEW 4

Besi Overview Corporate Profile Leading assembly equipment supplier with #1 and #2 positions in key products. 28.5% addressable market share Broad portfolio: die attach, packaging and plating Strategic positioning in substrate and wafer level packaging Global mfg. operations in 7 countries; 1,628 employees worldwide. HQ in Duiven, the Netherlands Financial Highlights LTM revenue and net income of 360.4 and 59.0 million Cash at 9/30/15: 109.0 million Total debt at 9/30/15: 23.8 million 115 million of dividends and share repurchases since 2011 Investment Considerations Growth of <20 nano advanced packaging, smart phones, wearable devices, auto electronics, IoT, wire bond/flip chip conversion and market share gains offer revenue upside Significant unrealized earnings potential from optimization of Asian production, supply chain efficiencies and development of common parts/platforms 5

Company History 55% 400 Die Attach Acquisitions 360.4 50% Revenue ( millions) 300 200 100 0 85.5 25.9% 2000 2002 2005 2009 Restructuring 2006 Dragon I complete: 6 million cost savings 2008 Dragon II complete: 15 million cost savings 2010 Plan: 7.0 million cost savings. Headcount and product line restructuring 2012 : 8.3 million cost savings. Headcount reduction. Plating unit rationalized 2014: US die sorting operations rationalized. Transferred to Besi Austria 2015: 10% headcount reduction announced. 12-14 million savings Asian Production Transfer 2006-09 Standard packaging and certain die bonding systems transferred to Malaysia 2007-09 Dutch tooling & Hungarian die bonding transferred to Asia 2009-11 Epoxy die bonder transferred to Malaysia 2003-12 Malaysian system and Chinese tooling capacity expansion. 2013 Soft solder die bonder transferred to Malaysia 2006-14 Asian headcount increased from 34% to 59% 2015: Transfer of certain software engineering, logistics and related administrative functions from Switzerland to Singapore 2015: Transfer of plating production from NL to Malaysia 2003 LTM Revenue Gross Margin 47.3% 45% 40% 35% 30% 25% 20% Gross Margin (%) 6

Best in Class Product Portfolio Die Attach Packaging & Plating In Development Esec Die Bonding - 2100 xp plus - 2100 sd plus New - 2100 sd PPP plus - 2100 hs - 2009 SSI - 2100 DS New - 2100 SC Fico Molding - AMS series - AMS LM 95 - MMS series - FML New Next generation Die Attach Next generation Packaging Common modules Datacon Multi Module Die Attach - 2200 evo - 2200 evo plus New Trim & Form - Compact series - Power series - Compact Line XHD New Fico Datacon/Esec Flip Chip - 8800 FCQ Sigma - 8800 CHAMEO - 8800 TCB New - 2100 FC New Fico Singulation - FSL Datacon Die Sorting - DS 9000E - WTT New - TTR New - DLA New Meco Plating - Leadframe - Solar - Film & Foil 7

Product Positioning Semiconductor Manufacturing Equipment (2014: $40.1B) Front end: $32.2B (80%) Assembly: $3.9B (10%) Test: $3.9B (10%) Semiconductor Assembly Process Dicing Die Attach Wire Bond Packaging Plating Die Sort Die Bond Wire Bond Molding Trim & Form Plating Leadframe Assembly Ball Grid Array Substrate Wire Bond Assembly Die Sort Die Bond Molding Singulation Ball Grid Array Substrate Flip Chip Assembly Die Sort FC Die Bond Molding Singulation Wafer Level Packaging Flip Chip Assembly Die Attach Packaging Ball Attach 8

Customer Ecosystem Customers OEMs End Products IDMs Subcontractors Blue chip customer base, top 10 = 60% of 2014 revenue Leading IDMs and subcontractors. 60/40% split in 2014 Equipment utilized to produce chips for leading fabless companies: Qualcomm, Broadcom, MediaTek Long term relationships, some exceeding 45 years 9

Current Operational Profile Chandler Sales Office Production Site Sales & Production Site * R&D Site Duiven & Drunen, (The Netherlands)* Cham, (Switzerland)* Radfeld, (Austria)* Suzhou Chengdu Leshan Shenzhen Malaysia Singapore* Korea Shanghai Taiwan Philippines Development activities in Europe Production and sales/service activities in Asia as of September 30, 2015 Europe/NA Asia Revenue (MMs) 90.3 33.3% 181.1 66.7% Headcount 630 38.7% 998 61.3% 10

Summary Historical Financials Year Ended December 31, ( millions, except share data) 2012 2013 2014 YTD 2014 YTD 2015 Revenue 273.7 254.9 378.8 289.7 271.4 Orders 276.1 251.9 407.6 326.2 271.0 Gross margin 40% 40% 44% 44% 49% EBITDA 32.4 27.9 82.1 65.2 56.1 Pretax income 19.5 19.2 71.3 57.1 44.9 Net income 15.8 16.1 71.1 51.4 39.3 EPS (diluted) 0.42 0.43 1.87 1.36 1.02 Net margin 6% 6% 19% 18% 15% Net cash 79.5 71.0 118.0 86.1 109.0 Record 2014 Results: Revenue and orders +48.6% and 61.8% Gross Margin +4.0% to 43.8% Net Income +341% to 71.1 million Net cash + 47.0 million Positioning in advanced packaging accelerated market share gains Enhanced profit potential of business model demonstrated YTD-15 Results: Adverse comparisons due to industry downturn Healthy profit and margins realized Cash position continues to build Operating initiatives have supported gross and net margin development Solid liquidity base to finance growth and shareholder returns 11

Stock Price Information Market profile improving: 745.43 million ($846.17 million) market capitalization as of October 22, 2015 Upgraded to Euronext AMX mid cap index in March 2015 Liquidity has increased significantly over past three years: Average daily volume: 2013: 99,811 2014: 117,084 2015: 322,253 Share concentration has reduced: Top 10 shareholders 30% of shares outstanding. Down from 60% in 2011 Largest shareholder less than 7% currently Geographic ownership has diversified: 40% NL 30% US 30% Europe ex NL Highest dividend yield among peers 7.8% as of October 22, 2015 Dividend payout ratio of between 40-80% net income per annum 12

Dividend Trends Dividend EPS (diluted) Total Dividend Yield (a) 2.00 1.87 12.0% Dividend ( ) 1.80 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 Payout Ratio: 0.00 1.50 8.1% 1.25 5.2% 4.0% 0.73 4.0% 4.3% 0.42 0.43 0.30 0.33 0.20 0.22 16% 30% 71% 77% 80% 2010 2011 2012 2013 2014 10.0% 8.0% 6.0% 4.0% 2.0% 0.0% Dividend yield a) Based on year end stock price 13

II. MARKET 14

Assembly Equipment Market Trends ( millions) (US$ billions) 5.0 4.0 3.0 2.0 1.0 0.0 400.0 300.0 200.0 100.0-4.4 326.9 4.0 (9.2%) 3.1 (22.4%) 273.7-16.3% 28.1% 3.9 Besi Revenue Revenue YoY Growth Rate 254.9-6.9% 378.8 48.6% VLSI recently downgraded 2015 and 2016 forecasts significantly Growth expected to reaccelerate in 2017 and 2018 Besi revenue growth exceeding assembly market in 5 of past 6 years 3.3 (15.0%) 289.8 271.4-6.3% 2011 2012 2013 2014 YTD 2014 YTD 2015 3.0 (11.1%) 11.3% 3.3 18.3% 3.9 3.4 (12.2%) 2011 2012 2013 2014 2015F 2016F 2017F 2018F 2019F 2020F Source: VLSI October 2015 Assembly Equipment Market Size YoY Growth Rate 3.7 7.0% 30% 20% 10% 0% -10% -20% -30% 150% 100% 50% 0% -50% 15

Assembly Equipment Market Composition Assembly Equipment Market * (2014: $3.9 billion) Besi Addressable Market * (2014: $1.7 billion) Other Assembly (Inspection, Dicing) 25.9% Wire Bonding 21.7% Molds 13.5% Lead Trim & Form 5.5% Plating 2.0% Die Bonding 39.7% Plating 0.9% Presses 11.2% Die Attach 59% Packaging 21.8% Die Attach 29.7% Singulation 9.3% Die Sorting 3.0% Flip Chip 15.8% Packaging 39% Plating 2% * Source: VLSI August 2015 Half of assembly market represented by die attach and packaging equipment Die Attach represents Besi s largest addressable market 16

Advanced Packaging Unit Volume and Market Share Are Increasing Advanced Packaging Silicon Demand Growth & Market Share 2010-2019 M wafers, 300MM Eq. 45 40 35 30 25 20 15 10 10% Advanced Packaging Wafers Advanced Packaging Unit Market Share (%) CAGR 2010-2019: 21.1% CAGR 2014-2019: 10.3% 13% 19% 26% 31% 32% 34% 35% 37% 38% 40% 35% 30% 25% 20% 15% 10% AP Market Share % 5 5% - 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 0% Source: VLSI February 2015 Advanced Packaging (Flip Chip/WLP) is fastest growing assembly process In growth phase with move to <20 nano internet device applications 17

Driven Primarily by Growth in Internet Connected Devices Key End Use Applications: Mobile internet devices, connectivity, computing power, Big Data analytics, automotive 35% CAGR device growth forecast over next 5 years Powered primarily by devices used for IoT Positive trajectory for smart phones, tablets, wearables, and automotive 18

Requiring Changes in Process/Equipment Development Front End Transistor scaling Today => Tomorrow Lithography New structures 3D Back End Assembly More contacts Smaller pitches Thinner/denser more complex packages Stacked structures 3D From simple Wire Bond to BGA/Flip Chip to complex 3D structures with TSVs, microbumps and thin dies 19

Which Has Significantly Increased Equipment Spending for < 25 Nano Nodes Spending on <25 nano nodes has increased from ~15% in 2011 to an estimated 70% of total spending in 2015 Node shift below 25 nano = new assembly equipment capacity 20

Advanced Packaging Growth Favors Besi Greater Miniaturization High Growth End User Areas: Higher Accuracy Datacon Esec Fico Greater Complexity Mobile internet, Autos, MEMS, Big Data, Cloud Servers, IoT, Wearable devices Lower Power Consumption Die Attach Die Sorting: DS 9000, WTT, TTR, DLA Die Bonding: ES 2009, ES2100 Flip Chip: DC 8800, ES2100 TCB: DC 8800, TCB Multi Module: DC evo 2200 Packaging Molding: AMS-LM 95 Singulation: FSL Increased Density Higher Performance High growth applications require ever smaller, denser and more complex chips with increased performance, all at lower power usage <20 nanometer geometry will be the standard chip design over the next 3-5 years System on Chip or System in Package via substrate and wafer level packaging process is the only answer Besi has full range of AP systems. 2014E revenue: 70% substrate/wafer level vs. 30% leadframe 21

And Is Reflected in Besi End User Application Trends 2014 Auto 13% Industrial 10% Mobile Internet Devices 22% 2008 Service 2% LED 3% Computer, PCs 50% LED 3% Industrial 10% Auto 17% Spares/ Service 15% Computer, PCs 20% Mobile Internet Devices 35% Mobile internet devices now equal 35% of Besi s end user revenue Automotive has also increased significantly in recent years Service/spare parts have grown to 15%. Less cyclical revenue stream Source: 2014 Company Estimates 22

New Smart Phone Designs Increase Besi s Addressable Market Potential - New Main Components Generation Generation Manufacturer IDM/OSAT 2012 2014 Besi system Utilized Processor X X Apple TSMC ->Amkor/Stats/ASE 8800FCQ, AMS-W/LM DRAM Memory X X Hynix/Micron Hynix/Micron 2100sD, FSL NAND Flash X X Hynix/Toshiba Hynix/Amkor/Toshiba 8800FCQ, AMS-W/LM Power Management Apple PM IC X Dialog Dialog 2100sD PMIC X X Qualcomm N/A M3 Microcontroller X NXP Amkor/NXP 8800FCQ, AMS-W/LM Accelerometer/Gyroscope/Barometric Gyroscope X X Invensense Amkor/ASE/STM 2100xP, 2100sD, AMS-W/LM, FCL 3-ax accelerometer X Bosch Bosch evo barometric sensor X Bosch Bosch evo Communications Generation 2012 Generation 2014 Manufacturer IDM/OSAT Besi systems can assemble 50% of 2012 generation components and 70% of 2014 generation components Besi system Utilized Wifi/NFC Wifi module X X Murata Murata Murata's equipment NFC X NXP Amkor 8800FCQ, AMS-W/LM NFC Booster IC X AMS Daca N/A LTE LTE Modem X Qualcomm Amkor/Stats/Spil/ASE 8800FCQ, AMS-W/LM Low Band LTE PAD X Skyworks Skyworks 2200evo, FSL Mid Band PAD X Skyworks Skyworks 2200evo, FSL High Band PAD X Avago ASE/Amkor 2100xP, 2100sD, AMS-W/LM Receiver/Transceiver RF Transceiver X X Qualcomm Amkor 2100xP, 2100sD, AMS-W/LM RF Receiver X X Qualcomm N/A Envelop Tracking IC X Qualcomm TSMC ->Amkor/Stats/ASE 8800FCQ, AMS-W/LM Antenna Switch X X RFMD Amkor/ASE,/RFMD 2100xP, 2100sD PA PA X X Avago ASE/Amkor 2100xP, 2100sD, AMS-W/LM PA Module X Triquint ASE 2200evo, 2100sD Video/Audio Generation 2012 Generation 2014 Manufacturer IDM/OSAT Besi system Utilized Camera Back side 8M (OSI) X X Apple LG, Sharp, Mitsumi 2200evo Front 1.2M X X Apple Cowell, Sony 2200evo Finger print sensor X Apple ASE 2200evo Audio 2+4 microphones X ST ST 2100 xp Audio Codec X X Cirrus Logic Amkor 2100xP, 2100sD, AMS-W/LM Touch screen control Touch screen control X X Broadcom Signetics 2100sD Touch Transmitter X TI TI FCL 23

Flip Chip/Wire Bond Process Shift Is Another Revenue Opportunity 2014* 2020* Wire Bonding Flip Chip Bonding Flip Chip Advantages Wire Bonding $861 71% Flip Chip $356 29% Wire Bonding $801 66% Flip Chip $406 34% Reduces board area by up to 95%. Requires far less height Offers higher speed electrical performance CAGR 2014-2020* Flip Chip 2.2% Wire Bond - 1.2% Greater I/O connection flexibility More durable interconnection method Move to <20 nanometer can only be accomplished by use of flip chip die bonding vs. wire bonding process Flip chip revenue represents only 29% currently of total potential market of $1.2 billion Lower cost for high volume production, with costs below $0.01 per connection Flip chip expected to gain share over next 5 years Growth could accelerate depending on adoption rates by key IDMs/subcons * Source: VLSI October 2015 24

Thermo Compression Bonding Is An Emerging Assembly Technology TCB: Next Die Bonding Process Evolution: Besi has most advanced industry concept 7 Axis bondhead, 2 bond heads/system High throughput => 2x competition User friendly compact design Wire Bonded BGA Stacked Die Memory Device Principal competition: ASM-PT, KLIC (in development) Orders significantly expanded in 2015 Production transferred to Besi APac to reduce cost Actively involved in 3D XPT program Memory producers first TCB adopters Issue: Memory performance lags CPU performance Solution: Advanced stacking design using TCB/TSV 15x higher transfer speeds 70% less energy per bit 90% less space Wire bonding process eliminated TSV TCB Memory Cube Wire Bond connections replaced by direct connection Besi TCB system 25

Besi Has Gained Share In Its Addressable Markets Besi Market Share Source: VLSI, May 2015 and Besi estimates 2012 2013 2014 Total Assembly Equipment Sales 8.6% 10.6% 12.7% Besi Addressable Market 21.4% 26.0% 28.4% Total Die Attach Equipment 26.8% 31.2% 34.7% Die Bonding 29.7% 39.2% 38.7% Flip Chip 22.2% 24.4% 31.8% Other 17.1% 4.8% 9.1% Total Packaging Equipment 11.1% 15.9% 16.4% Molds 12.0% 19.1% 19.5% Lead Trim & Form 15.0% 17.6% 19.0% Singulation 5.3% 5.1% 6.8% Total Plating 75.8% 82.3% 75.4% Gaining share in fastest growing segments of the assembly equipment market: Flip chip and multi module die attach and ultra thin molding for advanced packaging applications 26

And With Leading Edge Technology Customers Die Attach Packaging In USD 2012 2013 2014 2015 (a) 2012 2013 2014 2015 (a) Subcontractors ASE 67% 59% 69% 74% 36% 65% 36% 28% Amkor 75% 84% 89% 100% 45% 11% 22% 38% JCET (b) 75% 48% 67% N/B 0% 8% 0% N/B STATSChippac (b) 95% 100% 85% N/B 28% 100% 100% N/B SPIL 47% 93% 89% 100% 37% 76% 19% 38% Nantong Fujitsu N/B 72% 100% 100% N/B 14% 0% 100% UTAC N/B N/B 100% 100% N/B 100% N/B 100% Unisem 92% 84% 100% 100% N/B N/B N/B N/B Cowell/Foxconn (Camera Modules) 100% N/B 100% 100% N/B N/B N/B N/B IDMs (c) Skyworks 100% 96% 100% N/B 13% 24% 38% 100% ST Micro 91% 72% 78% 94% 44% 76% 42% 46% Infineon 81% 97% 100% 100% 0% 24% 90% 100% Micron 86% 100% 43% 42% 50% N/B 100% 100% NXP N/B 100% 100% 100% N/B 7% 100% 86% Samsung (d) 5% 0% N/B N/B 0% 100% N/B N/B % of product revenue 49% 52% 64% 51% 54% 70% 65% 70% Customers are largest semi mfrs. Engaged in most advanced packaging applications Strong customer market shares: 50-100% of die attach requirements 25-100% of packaging requirements Customer market shares p.a. vary based on capacity needs and purchasing cycles Primary competition: Die Attach: ASM-PT, Hitachi, Shinkawa, Panasonic, Toray Packaging: Towa, Hanmi, ASM-PT N/B No reported bookings for Besi or its competitors a) Year to date through April 30, 2015 b) Merger pending c) Fabless semiconductor companies such as Qualcomm, Broadcom and Mediatek have assembly production done by subcontractors d) In general, Samsung satisfies approximately 50% of its equipment needs internally 27

III. STRATEGY 28

Summary Strategy Develop new products and markets Maintain best in class tech leadership in advanced packaging Expand tech capabilities and applications for TCB, thin die, ewlb die bonding; large area, ultra thin and wafer level molding Increase market share in addressable markets Leverage lead in core competencies at expense of Japanese and Asian competitors Capitalize on <20 nano expertise to exploit new device introductions, further penetrate largest smart phone supply chains and expand in Chinese handset market Apply TCB tech advantage to more mainstream applications Achieve a more scalable, flexible and lower cost manufacturing model Expand Asian materials sourcing and direct shipments Expand Malaysian, Singapore and Chinese operations. Target more local production and shorter cycle times Develop common platforms, common modules and common parts Continue to reduce euro based costs. Better align currency exposures Acquire companies with complementary technologies and products Expand tech leadership in advanced packaging including wafer level assembly 29

Besi Revenue Growth Drivers World tooling up for new tech cycle <20 nano TCB expansion to memory and logic devices Increased smart phone functionality Increased share of Japanese supply chain and China handsets Revenue Growth Drivers New device introductions: IoT, wearables Solar cell plating transition from copper to silver Wire bond/flip chip conversion 30

Key Development and Operational Objectives Development Objectives 2015 2016 Advanced TCB die bonding development Introduction of next generation packaging systems Common parts/platform activities Operational Objectives Transfer of certain Swiss Die Attach software, logistics and administrative functions to Singapore Transfer of certain die bonding production from Malaysia to China Transfer of Plating production from NL to Malaysia 10% fixed & temporary headcount reduction Further reduction of European based costs Expansion of Asian supply chain. System module outsourcing 31

Asian Production Transfer Has Helped Reduce Break Even Revenue Levels Shipments 1,200 1,000 800 600 400 200 - Asian Production Has Significantly Expanded 396 43% 170 84% 86% 963 927 68% 487 331 658 673 553 579 96% 2010 2011 2012 2013 2014 Total Asian Shipments Direct Asian Shipments % Direct 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% % Direct Shipments Headcount Leading to Lower European Headcount 1,800 1,600 1,400 1,200 1,000 800 600 400 200-1,543 1,479 1,434 1,510 1,530 1,564 1,541 802 799 810 908 933 967 975 741 680 624 602 597 597 566 2011 2012 2013 2014 Q1 15 Q2 15 Europe/NA Fixed HC Asia Fixed HC Q3 15 ( millions) And Reduced Break Even Revenue Levels 300 250 200 150 100 50-270 235 212 207 2011 2012 2013 2014 32

Workforce Has Become More Scalable and Flexible 2,000 10.0% Headcount 1,800 1,600 1,400 1,200 1,000 800 600 1,607 64 802 1,539 60 799 1,458 24 810 1,632 1,680 1,684 1,628 122 150 120 87 908 933 967 975 9.0% 8.0% 7.0% 6.0% 5.0% 4.0% 3.0% Temp % of Total Headcount varies with cyclicality and seasonality of business Significant revenue ramps achieved using primarily Asian production temps Aggregate headcount down 3.3% vs. Q2-15 in response to downturn 400 200-741 680 624 602 597 597 566 2011 2012 2013 2014 Q1 2015 Q2 2015 Q3 2015 2.0% 1.0% 0.0% European/NA fixed headcount continues to decline -6.0% from year end 2014 to Q3-15 Asia 63% now Europe/NA Fixed HC Temporary HC Asia Fixed HC Temp % of Total 33

Materials Cost Reduction Is Also a Key Priority Supply Chain Actions Qualify and select Asian Vendors 75% of material is now purchased in Asia Significant potential cost savings Estimated savings 2014 2015E 2016/17E Headcount 0.9 MM 2.8 MM 1.0 MM Materials Cost 2.7 MM 1.6 MM 1.5 MM Subtotal 3.6 MM 4.4 MM 2.5 MM Development Actions 45-50% thru cycle Gross Margin Redesign products Increase standardization of systems Material costs represent largest single expense: approximately 45% of revenue Management Board reviews progress weekly component by component Shift to Asia centric supply chain reduces personnel, transport, logistics and inventory costs Also improves cycle time and ramping flexibility 34

Partially Achieved Through Common Parts Product Redesign Potential Unit Cost Savings Areas of focus: Magazine handler Wafer gripper Dispenser Wafer table Wafer Cassette Handler Die Ejector Control Platform DB2100 (7%) 2200evo (11%) 8800FCQ (11%) Average (9%) Development efforts underway to redesign die attach and packaging systems to increase common parts utilized per system Benefits: Lower unit cost, design and maintenance hours, improved working capital management, shorter cycle times 35

IV. FINANCIAL REVIEW 36

Solid Profit and Margin Development In Industry Downturn Q3-14/Q3-15 YTD-14/YTD-15* -30.3% -6.3% 23.0 MM Gross Margin 45.3% +3.4 points 48.7% OPEX +24.8% Headcount 1,649-1.3% 1,628 Effective Tax Rate 28.7 MM 10.2% +3.1 points 13.3% 69.1 MM Gross Margin 43.8% +4.7 points 48.5% OPEX +24.5% Headcount 1,649-1.3% 1,628 Effective Tax Rate 86.0 MM 10.0% +2.6 points 12.6% -12.1 points -3.2 points 21.5 6.3 51.4 39.3 * Includes net restructuring benefit of 3.3 million 37

Quarterly Book to Bill Trends Reflect Quarterly Seasonality and Volatility 1.50 1.25 1.28 Assembly Market 1.26 1.25 1.34 1.12 1.11 1.10 1.10 1.11 1.00 [VALUE] 0.97 0.94 0.98 [VALUE] 0.75 0.81 0.71 Total Semi Equipment 0.78 0.68 0.69 [VALUE] 0.73 0.50 Sept 11 Dec 11 Mar 12 Jun 12 Sept 12 0.53 Dec 12 Mar 13 Jun 13 Sept 13 Dec 13 Mar 14 Jun 14 Sept 14 Dec 14 Mar 15 Jun 15 Sep 15 Total Equipment 0.71 0.85 1.12 0.93 0.78 0.92 1.11 1.10 0.97 1.02 1.06 1.10 0.94 0.99 1.10 0.98 1.11 Assembly Market 0.81 1.02 1.28 1.11 0.53 0.92 1.08 1.26 0.68 1.06 1.25 1.25 0.69 0.84 1.34 0.92 0.73 Strong industry growth in H1 followed by weaker H2 has been the trend Assembly market more volatile than general semi equipment business Source: Semi August 2015 38

Revenue/Order/Gross Margin Trends Revenue Orders euro in millions 140 120 100 80 60 40 20 - Gross Margin Adjusted Gross Margin 124 111 116 104 104 104 91 95 89 92 81 49.0% 72 75 70 48.2% 47.9% 48.7% 57 53 45.3% 42.3% 43.2% 43.8% 40.1% Q4-13 Q1-14 Q2-14 Q3-14 Q4-14 Q1-15 Q2-15 Q3-15 60.0% 55.0% 50.0% 45.0% 40.0% 35.0% Gross Margin % Cyclical quarterly revenue/order patterns: Short term patterns due to customer caution and increased seasonality 2014 year end shows higher base line order levels than prior years New industry downturn began in Q3-15 due to 2014 capacity build and slowing Chinese growth Gross margins have improved despite cyclicality: Lower unit costs: Asian production/supply chain transfer More direct local shipments Reduction in European personnel Increased scalability Larger production runs Shorter cycle times Forex benefits: Favorable USD/euro (revenue) and euro/myr (cost) have helped in 2015 39

Net Income Trends Non Recurring Net Margin ex. NR Net Margin 24 22.9 21.5 40% 21 18 15 19.7 17.5 7.5 3.3 15.5 35% 30% 25% 6.3 million Q3-15 net income - 9.2 million vs. 15.5 million in Q2-15 - 15.2 million vs. Q3-14 Industry downturn negatively influences comparisons this year (euro in millions) 12 9 6 3 1.4 6.4% 7.0 10.0% 7.0 19.7% 20.8% 12.2 13.7% 14.2 15.0% 14.8% 6.3 8.7% 20% 15% 10% 5% Q3-15 net margin still a healthy 8.7% Reflects record gross margins Baseline opex reducing to more normal levels post Q2-15 peak Tax rate up slightly in 2015 due to absence of Q2-14 tax benefit ($700k) 12.6% in YTD-15 vs.10.0% in YTD-14 (12.0% ex. deferred tax benefit) 0 0% (2.0) (3) Q4-13 Q1-14 Q2-14 Q3-14 Q4-14 Q1-15 * Q2-15 Q3-15 -5% * Adjusted to exclude: After tax net restructuring benefit (Q1-15) ( 3.3 million) Deferred tax benefits (Q4-14) ( 7.5 million) 2.0 million non recurring charge in Q4-13 40

Liquidity Trends 180 Cash Debt Net Cash (euro in millions) 160 140 120 100 80 60 40 20 135.3 118.0 105.4 89.6 91.9 83.8 86.1 71.0 72.8 62.5 18.6 19.1 21.3 19.3 17.3 161.6 133.1 28.5 132.8 113.7 109.0 91.4 22.3 23.8 Solid liquidity position 132.8 million cash at 9/30/15 3.49 per share vs. 13.85 price (as of Sep 30, 2015) Net cash increased to 109.0 million at end of Q3-15 Has been utilized to enhance shareholder value 114.9 million spent on cash dividends and share repurchases 2011-2015 Includes May 56.9 million cash dividend 1.0 million (3%) share repurchase program initiated at end of Q3-15 0 Q4-13 Q1-14 Q2-14 Q3-14 Q4-14 Q1-15 Q2-15 Q3-15 Strong balance sheet helps support future organic growth and acquisition opportunities 41

V. OUTLOOK & SUMMARY 42

Q4-15 Guidance Revenue 72.1 Gross Margin 48.7% +10% - -10% 48% - 46% Q3-15 Q4-15 Q3-15 Q4-15 Operating Expenses 28.7 Down 3-5% Q3-15 Q4-15 43

Summary Leading semi assembly equipment supplier with #1 or #2 positions in fastest growing assembly segments Technology leader. Best in class product portfolio Gaining market share in advanced packaging Scalability and profitability of business model greatly enhanced in cyclical industry Significant upside potential. Advanced packaging growth from new technology cycle, operating initiatives and optimization of Asian production model Committed to enhancing shareholder value. Attractive dividend yield relative to peers 44