INVESTOR PRESENTATION FEBRUARY 2015

INVESTOR PRESENTATION FEBRUARY 2015

Safe Harbor Statement This presentation contains statements about management's future expectations, plans and prospects of our business that constitute forward-looking statements, which are found in various places throughout the press release, including, but not limited to, statements relating to expectations of orders, net sales, product shipments, backlog, expenses, timing of purchases of assembly equipment by customers, gross margins, operating results and capital expenditures. The use of words such as anticipate, estimate, expect, can, intend, believes, may, plan, predict, project, forecast, will, would, and similar expressions are intended to identify forward looking statements, although not all forward looking statements contain these identifying words. The financial guidance set forth under the heading Outlook constitutes forward looking statements. While these forward looking statements represent our judgments and expectations concerning the development of our business, a number of risks, uncertainties and other important factors could cause actual developments and results to differ materially from those contained in forward looking statements, including the discovery of weaknesses in our internal controls and procedures, our inability to maintain continued demand for our products; the impact on our business of potential disruptions to European economies from euro zone sovereign credit issues; failure of anticipated orders to materialize or postponement or cancellation of orders, generally without charges; the volatility in the demand for semiconductors and our products and services; failure to adequately decrease costs and expenses as revenues decline, loss of significant customers, lengthening of the sales cycle, incurring additional restructuring charges in the future, acts of terrorism and violence; inability to forecast demand and inventory levels for our products, the integrity of product pricing and protect our intellectual property in foreign jurisdictions; risks, such as changes in trade regulations, currency fluctuations, political instability and war, associated with substantial foreign customers, suppliers and foreign manufacturing operations; potential instability in foreign capital markets; the risk of failure to successfully manage our diverse operations; those additional risk factors set forth in Besi's annual report for the year ended December 31, 2013 and other key factors that could adversely affect our businesses and financial performance contained in our filings and reports, including our statutory consolidated statements. We are under no obligation to (and expressly disclaim any such obligation to) update or alter our forward-looking statements whether as a result of new information, future events or otherwise. 2

Agenda I. Company Overview II. Market III. Strategy IV. Financial Review V. Outlook & Summary 3

I. COMPANY OVERVIEW 4

Besi Overview Corporate Profile Leading assembly equipment supplier with #1 and #2 positions in key products. 32% addressable market share Broad portfolio: die attach, packaging and plating Strategic positioning in substrate and wafer level packaging Global mfg. operations in 7 countries; 1,632 employees worldwide. HQ in Duiven, the Netherlands Financial Highlights 2014 revenue and net income of 378.8 and 71.1 million Cash at 12/31/14: 135.3 million Total debt at 12/31/14: 17.4 million 57 million of dividends and share repurchases since 2011 Investment Considerations Growth of advanced packaging, smart phones, wearable devices, auto electronics, IOT and market share offer upside Significant unrealized earnings potential from optimization of Asian production model, supply chain efficiencies and development of common platforms 5

Company History 400 Die Attach Acquisitions 378.8 43.8% 45% 40% 300 2000 2002 2005 2009 Revenue ( millions) 200 100 0 85.5 25.9% Restructuring 2006 Dragon I complete: 6 million cost savings 2008 Dragon II complete: 15 million cost savings 2010 Plan: 7.0 million cost savings. Headcount and product line restructuring 2012 : 8.3 million cost savings. Headcount reduction. Plating unit rationalized 2014: US die sorting operations rationalized. Transferred to Besi Austria Asian Production Transfer 2006-09 Standard packaging and certain die bonding systems transferred to Malaysia 2007-09 Dutch tooling & Hungarian die bonding transferred to Asia 2009-11 Epoxy DB transferred to Malaysia 2003-12 Malaysian system and Chinese tooling capacity expansion. 2013 Soft solder DB transferred to Malaysia 2006-14 Asian headcount increased from 34% to 59% 2015: Transfer of certain software engineering, logistics and related administrative functions from Switzerland to Singapore 2003 2014 35% 30% 25% 20% Gross Margin (%) Revenue Gross Margin 6

Product Positioning Back-end Semiconductor Assembly Process Dicing Die Attach Wire Bond Packaging Plating Die Sort Die Bond Wire Bond Molding Trim & Form Plating Leadframe Assembly Singulation Ball Grid Array Substrate Wire Bond Assembly Die Sort FC Die Bond Molding Singulation Ball Grid Array Substrate Flip Chip Assembly Die Sort FC Die Bond Molding Singulation Wafer Level Packaging Flip Chip Assembly Die Attach Packaging Ball Attach 7

Best in Class Product Portfolio Die Attach Packaging & Plating In Development Esec Die Bonding - 2100 xp plus - 2100 sd plus - 2100 sd PPP plus - 2100 HS New - 2009 SSI - 2100 DS Fico Molding - AMS series - AMS LM 95 - MMS series - FML New Next generation Die Attach Next generation Packaging Common modules Datacon Multi Module Die Attach - 2200 evo - 2200 evo plus New Trim & Form - Compact series - Power series - Compact Line XHD New Fico Datacon Flip Chip - 8800 FC QUANTUM - 8800 CHAMEO - 8800 TCB New - 2100 FC Fico Singulation - FSL Datacon Die Sorting - DS 9000E - WTT New - TTR New - DLA New Meco Plating - Leadframe - Solar - Film & Foil 8

Customer Ecosystem Customers OEMs End Products IDMs Subcontractors Blue chip customer base, top 10 customers represented 60% of 2014 revenue Leading IDMs and subcontractors. 60/40% split in 2014 Equipment utilized to produce chips for leading fabless companies: Qualcomm, Broadcom, MediaTek Long term relationships, some exceeding 45 years 9

Global Operations Chandler Sales Office Production Site Sales & Production Site * R&D Site Salem* Duiven & Drunen, (The Netherlands)* Cham, (Switzerland)* Radfeld, (Austria)* Suzhou Chengdu Leshan Shenzhen Malaysia Singapore* Korea Shanghai Taiwan Philippines Development activities in Europe and USA Increasing production and sales/service activities in Asia as of 31 December 2014 Europe/NA Asia Revenue (MMs) 123.4 32.6% 255.3 67.4% Headcount 663 40.6% 969 59.4% 10

Summary Historical Financials Year Ended December 31, ( millions, except share data) 2012 2013 2014 Revenue 273.7 254.9 378.8 Orders 276.1 251.9 407.6 Gross margin 40% 40% 44% EBITDA 32.4 27.9 82.1 Pretax income 19.5 19.2 71.3 Net income 15.8 16.1 71.1 EPS (diluted) 0.42 0.43 1.87 Net margin 6% 6% 19% Net cash 79.5 71.0 118.0 Strategic positioning in advanced packaging has yielded benefits: Enhanced top line and market share Increased gross margins Operating initiatives have supported gross and net margin development: Product line restructurings Asian production transfer Reduction of European based costs Increased tax efficiency Increased scalability and cycle times YTD 14 results reflect industry rebound, market share gains and profit potential of enhanced business model Solid liquidity base to finance growth and shareholder dividends 11

Dividend Trends Dividend EPS (diluted) Total Dividend Yield (a) 2.00 1.87 12.0% Dividend ( ) 1.80 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 Payout Ratio: 0.00 4.0% 1.25 0.20 0.22 0.73 4.3% 5.2% 4.0% 0.42 0.43 0.30 0.33 1.50 8.1% 16% 30% 71% 77% 80% 2010 2011 2012 2013 2014 (b) 10.0% 8.0% 6.0% 4.0% 2.0% 0.0% Dividend yield a) Based on year end stock price b) Proposed for approval at April 2015 AGM 12

II. MARKET 13

Assembly Equipment Market Trends (US$ billions) 5.0 4.0 3.0 2.0 1.0-124.0% 4.7 4.3 3.9 Assembly Equipment Market Size YoY Growth Rate 3.0 3.7 3.9 24.3% 3.4% -7.7% -9.6% -23.1% 2010 2011 2012 2013 2014E 2015F 150% 100% 50% 0% -50% ( millions) 450.0 350.0 250.0 150.0 50.0 137.4% 351.1 326.9-6.9% Besi Revenue Revenue YoY Growth Rate 378.8 273.7 254.9 48.6% -6.9% -16.3% 150% 100% 50% 0% -50% (50.0) 2010 2011 2012 2013 2014 Source: VLSI January 2015 VLSI forecasts renewed growth of assembly market in 2014 and 2015 Besi revenue growth exceeding assembly market in 5 of past 6 years -100% 14

Assembly Equipment Market Composition Assembly Equipment Market * (2014: $3.7 billion) Besi Addressable Market * (2014: $1.6 billion) Other Assembly (Inspection, Dicing) 28.1% Wire Bonding 22.3% Molds 16.1% Lead Trim & Form 6.3% Plating 1.3% Die Bonding 38.4% Plating 0.6% Presses 8.9% Die Attach 59% Packaging 20.6% Die Attach 28.4% Singulation 8.3% Die Sorting 4.5% Flip Chip 16.2% Packaging 40% Plating 1% * Source: VLSI Feb 2015 Half of assembly market represented by die attach and wire bonding equipment Die Attach represents Besi s largest addressable market 15

Advanced Packaging Unit Volume and Market Share Are Increasing Advanced Packaging Silicon Demand Growth & Market Share 2010-2019 M wafers, 300MM Eq. 45 40 35 30 25 20 15 10 Advanced Packaging Wafers Advanced Packaging Unit Market Share (%) CAGR 2010-2019: 21.1% 26% 19% 13% 10% 31% 32% 34% 35% 37% 38% 40% 35% 30% 25% 20% 15% 10% AP Market Share % 5 5% - 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 0% Source: VLSI Advanced Packaging (Flip Chip/WLP) is fastest growing assembly process In growth phase with move to <20 nano driven by smart phones, tablets, autos, Internet of Things and wearable devices 16

Advanced Packaging Growth Favors Besi Greater Miniaturization High Growth End User Areas: Higher Accuracy Datacon Esec Fico Greater Complexity Mobile internet devices, Autos, MEMS, Internet of Things, wearable devices Lower Power Consumption Die Attach Die Sorting: DS 9000 Die Bonding: ES 2009, ES2100 Flip Chip: DC 8800, ES2100 TCB: DC 8800 Multi Module: DC evo 2200 Packaging Molding: AMS-LM 95 Singulation: FSL Increased Density Higher Performance High growth applications require ever smaller, denser and more complex chips with increased performance, all at lower power usage <20 nanometer geometry will be the standard chip design over the next 3-5 years System on Chip or System in Package via substrate and wafer level packaging process is the only answer Besi has full range of AP systems. 2014E revenue: 70% substrate/wafer level vs. 30% leadframe 17

And Is Reflected in Besi End User Application Trends 2014 Auto 13% Industrial 10% Mobile Internet Devices 22% 2008 Service 2% LED 3% Computer, PCs 50% LED 3% Industrial 10% Auto 17% Spares/ Service 15% Computer, PCs 20% Mobile Internet Devices 35% Mobile internet devices now equal 35% of Besi s end user revenue Automotive has also increased significantly in recent years Service/spare parts have grown to 15%. Less cyclical revenue stream Source: 2014 Company Estimates 18

Driven Primarily by Growth in Internet Connected Devices 35% CAGR device growth forecast over next 5 years Powered by devices used for Internet of Things (IoT) Positive trajectory for smart phone, tables, wearables, and automotive Significant potential revenue growth driver 19

New Smart Phone Designs Increase Addressable Market Potential - New Main Components Generation Generation Manufacturer IDM/OSAT 2012 2014 Besi system Utilized Processor X X Apple TSMC ->Amkor/Stats/ASE 8800FCQ, AMS-W/LM DRAM Memory X X Hynix/Micron Hynix/Micron 2100sD, FSL NAND Flash X X Hynix/Toshiba Hynix/Amkor/Toshiba 8800FCQ, AMS-W/LM Power Management Apple PM IC X Dialog Dialog 2100sD PMIC X X Qualcomm N/A M3 Microcontroller X NXP Amkor/NXP 8800FCQ, AMS-W/LM Accelerometer/Gyroscope/Barometric Gyroscope X X Invensense Amkor/ASE/STM 2100xP, 2100sD, AMS-W/LM, FCL 3-ax accelerometer X Bosch Bosch evo barometric sensor X Bosch Bosch evo Communications Generation 2012 Generation 2014 Manufacturer IDM/OSAT Besi system Utilized Wifi/NFC Wifi module X X Murata Murata Murata's equipment NFC X NXP Amkor 8800FCQ, AMS-W/LM NFC Booster IC X AMS Daca N/A LTE LTE Modem X Qualcomm Amkor/Stats/Spil/ASE 8800FCQ, AMS-W/LM Low Band LTE PAD X Skyworks Skyworks 2200evo, FSL Mid Band PAD X Skyworks Skyworks 2200evo, FSL High Band PAD X Avago ASE/Amkor 2100xP, 2100sD, AMS-W/LM Receiver/Transceiver RF Transceiver X X Qualcomm Amkor 2100xP, 2100sD, AMS-W/LM RF Receiver X X Qualcomm N/A Envelop Tracking IC X Qualcomm TSMC ->Amkor/Stats/ASE 8800FCQ, AMS-W/LM Antenna Switch X X RFMD Amkor/ASE,/RFMD 2100xP, 2100sD PA PA X X Avago ASE/Amkor 2100xP, 2100sD, AMS-W/LM PA Module X Triquint ASE 2200evo, 2100sD Video/Audio Generation 2012 Generation 2014 Manufacturer IDM/OSAT Besi system Utilized Camera Back side 8M (OSI) X X Apple LG, Sharp, Mitsumi 2200evo Front 1.2M X X Apple Cowell, Sony 2200evo Finger print sensor X Apple ASE 2200evo Audio 2+4 microphones X ST ST 2100 xp Audio Codec X X Cirrus Logic Amkor 2100xP, 2100sD, AMS-W/LM Touch screen control Touch screen control X X Broadcom Signetics 2100sD Touch Transmitter X TI TI FCL Besi systems can assemble 50% of the generation 2012 components and 70% of the generation 2014 components 20

Flip Chip/Wire Bond Process Shift Is Another Revenue Opportunity 2013* 2019* Wire Bonding Flip Chip Bonding Flip Chip Advantages Wire Bonding $695 74% Flip Chip $250 26% Wire Bonding $929 68% Flip Chip $428 32% Reduces board area by up to 95%. Requires far less height Offers higher speed electrical performance CAGR 2013 19* Flip Chip 9.4% Wire Bond 5.0% Greater I/O connection flexibility More durable interconnection method Move to <20 nanometer can only be accomplished by use of flip chip die bonding vs. wire bonding process Flip chip revenue represents only 26% currently of total potential market of $1.0 billion Lower cost for high volume production, with costs below $0.01 per connection Expected to gain share rapidly over next 6 years vs. wire bonding (4.4% CAGR delta) as per VLSI Growth rates could accelerate depending on adoption rates by key IDMs/subcons * Source: VLSI 21

Besi Has Gained Market Share In Its Addressable Markets Besi Market Share Source: VLSI, Jan 2015 and Besi estimates 2012 2013 2014 Total Assembly Equipment Sales 8.6% 10.8% 13.4% Besi Addressable Market 21.8% 27.0% 31.7% Total Die Attach Equipment 27.7% 33.1% 38.7% Die Bonding 29.7% 39.6% 44.0% Flip Chip 22.2% 25.4% 34.1% Other 25.9% 7.5% 10.0% Total Packaging Equipment 11.1% 16.0% 18.0% Molds 12.0% 19.2% 21.2% Lead Trim & Form 15.0% 17.6% 18.1% Singulation 5.3% 5.1% 8.5% Total Plating 75.8% 83.8% 90%+ Gained share in fastest growing segments of the assembly equipment market: Flip chip and multi module die attach and ultra thin molding for advanced packaging applications 22

And With Leading Edge Technology Customers Die Attach Packaging In USD 2012 2013 2014 2012 2013 2014 Subcontractors ASE 67% 59% 69% 36% 65% 24% Amkor 75% 84% 89% 45% 11% 22% STATSChippac 95% 100% 85% 28% 100% 100% SPIL 47% 93% 89% 37% 76% 19% Unisem 92% 84% 100% N/B N/B N/B JCET 75% 48% 67% 0% 8% 0% Cowell/Foxconn (Camera Modules) 100% N/B 100% N/B N/B N/B IDMs * Skyworks 100% 96% 100% 13% 24% 38% ST Micro 91% 72% 78% 44% 76% 42% Infineon 81% 97% 100% 0% 24% 90% Micron 86% 100% 43% 50% N/B 100% Samsung** 5% 0% N/B 0% 100% N/B % of Besi Die Attach and Packaging systems revenue 49% 48% 60% 54% 66% 54% Customers are largest producers. Engaged in most advanced packaging applications Strong customer market shares: 60-100% of die attach requirements 20-100% of packaging requirements Customer market shares p.a. vary based on capacity needs and purchasing cycles Primary competition: Die Attach: ASM-PT, Hitachi, Canon Packaging: Towa, Hanmi, ASM-PT N/B No reported bookings for Besi or its competitors * Fabless semiconductor companies such as Qualcomm, Broadcom and Mediatek have assembly production done by subcontractors ** In general, Samsung satisfies approximately 50% of its equipment needs internally 23

III. STRATEGY 24

Operations Agenda 2015 2016 Operational Objectives Expansion of Asian supply chain. System module outsourcing Transfer of certain Swiss Die Attach software, logistics and administrative functions to Singapore Development Objectives Advanced TCB die bonding development Introduction of next generation packaging systems Common platform/parts activities 25

Asian Production Has Significantly Expanded 1,200 Total Asian Shipments Direct Asian Shipments % Direct 96.3% 100.0% Shipments 1,000 800 600 400 42.9% 396 487 68.0% 658 84.0% 553 673 86.0% 579 963 927 90.0% 80.0% 70.0% 60.0% 50.0% 40.0% 30.0% % Direct Shipments 200 170 331 20.0% 10.0% - 2010 2011 2012 2013 2014 0.0% 26

Leading to Lower European Headcount Europe/NA Fixed HC Asia Fixed HC Total 1,800 1,600 1,400 1,510 1,543 1,479 1,434 1,510 Headcount 1,200 1,000 800 600 772 802 51% 52% 799 54% 810 908 56% 60% Fixed European/North American headcount reduction: Down 18.8% since 2011 Down 3.5% since 2013 Declined from 56% of total in 2009 to 40% at year end 2014 400 200 738 741 49% 48% 680 46% 624 602 44% 40% - 2010 2011 2012 2013 2014 27

And Also Reduced Break Even Revenue Levels 300 250 270 (13.0%) 200 235 (9.8%) (2.4%) 212 207 ( millions) 150 100 50-2011 2012 2013 2014 28

Workforce Has Become More Scalable and Flexible 2,500 12.0% 2,000 10.0% Headcount 1,500 1,000 1,704 1,607 194 64 772 802 1,539 60 799 1,632 1,458 122 24 810 908 8.0% 6.0% 4.0% Temp % of Total 2014 revenue ramp achieved using primarily Asian production temps Aggregate Headcount varies with cyclicality and seasonality of business 500 738 741 680 624 602 2.0% - 2010 2011 2012 2013 2014 0.0% Europe/NA Fixed HC Temporary HC Asia Fixed HC Temp % of Total 29

Materials Cost Reduction Is Also a Key Priority Supply Chain Actions Qualify and Select Asian Vendors 50% of the way there Development Actions +5% Gross Margin Upside Redesign products Increase standardization of systems Component parts Modules Material costs represent approximately 45% of revenue Shift to Asia centric supply chain: Reduces transport, inventory costs and obsolescence Improves cycle time and ramping flexibility Management Board reviews progress weekly component by component 30

Partially Achieved Through Common Parts Product Redesign Potential Unit Cost Savings Areas of focus: Magazine handler Wafer gripper Dispenser Wafer table Wafer Cassette Handler Die Ejector Control Platform DB2100 (7%) 2200evo (11%) 8800FCQ (11%) Average (9%) Development efforts underway to redesign die attach and packaging systems to increase common parts utilized per system Benefits: Lower unit cost, improved working capital mgt, shorter cycle times Anticipated completion date: Winter 2015/16 31

IV. FINANCIAL REVIEW 32

Revenue Growth and Operating Leverage Yield Increased Profitability in 2014 Q4-14/Q4-13 FY 2014/FY 2013 Revenue Net Income Revenue Net Income millions 100 75 50 25 0 53.1 20.5 MM 2.7% +67.8% Gross Margin OPEX +20.0% 89.0 40.1% +3.7 points 43.8% Headcount 1,458 +174 1,632 Effective Tax Rate 24.6 MM -106% NM -38.9% 1.4 +19.5 points 22.2% 19.7 Q4 2013 Q4 2014 95% 90% 85% 80% 75% 70% 65% 60% 55% 50% 45% 40% 35% 30% 25% 20% 15% 10% 5% 0% Net margin % millions 400 350 300 250 200 150 100 50 0 254.9 6.3% Gross Margin 378.8 39.8% +4.0 points 43.8% 82.7 MM OPEX +13.4% Headcount 1,458 +174 1,632 Effective Tax Rate 15.8% -15.5 points 0.3% 16.1 +48.6% +12.5 points 93.8 MM 18.8% 71.1 2013 2014 95% 90% 85% 80% 75% 70% 65% 60% 55% 50% 45% 40% 35% 30% 25% 20% 15% 10% 5% 0% Net margin % 33

Besi Order Trends Highly Correlated to Assembly Equipment Industry 1.75 1.50 Assembly Market 1.25 1.26 1.00 1.01 1.10 0.97 0.94 1.03 0.95 0.81 1.00 0.75 0.71 Total Semi Equipment 0.68 0.69 0.50 Mar 11 Jun 11 Sept 11 Dec 11 Mar 12 Jun 12 Sept 12 Dec 12 Mar 13 Jun 13 Sept 13 Dec 13 Mar 14 Jun 14 Sept 14 Dec 14 Jan 15 Total Equipment 0.95 0.94 0.71 0.85 1.12 0.93 0.78 0.92 1.11 1.10 0.97 1.02 1.06 1.10 0.94 0.99 1.03 Assembly Market 1.01 0.92 0.81 1.02 1.28 1.11 0.53 0.92 1.08 1.26 0.68 1.06 1.25 1.25 0.69 0.84 1.00 Strong industry growth in H1 followed by weaker H2 has been the trend 2014 is no exception Source: Semi 34

Revenue/Gross Margin Trends euro in millions 140 120 100 80 60 40 Revenue Orders Gross Margin 124 116 111 104 91 89 83 81 70 72 64 64 65 45.3% 57 53 42.3% 43.2% 43.8% 48 39.6% 40.4% 39.2% 40.1% 60.0% 55.0% 50.0% 45.0% 40.0% Gross Margin % Quarterly revenue/order patterns show cyclicality of semiconductor business: Three cycles past 3 years Short term patterns due to customer caution and increased seasonality 2014 year end shows higher base line orders than previous years Gross margins have improved despite cyclicality: Increased scalability of production model Shift to higher margin systems Lower unit costs due to: Asian production transfer Reduction in European personnel Favorable USD/euro in H2-14 20 - Q1-13 Q2-13 Q3-13 Q4-13 Q1-14 Q2-14 Q3-14 Q4-14 35.0% 30.0% Product mix shift to higher margin advanced packaging systems has aided gross margin development: Multi module + flip chip die attach Ultra thin molding systems Drivers: mobile internet, intelligent auto components, IOT and new devices Exit from lower margin plating, wire bonding and packaging systems 35

Net Income Trends 26 24 22 20 Net Income ex. NR Net Margin Net Income Net Margin ex. NR 22.2% 20.8% 19.7% 25.0% 20.0% Quarterly net income trends reflect industry and seasonal volatility 18 Net margins of 22.2% in Q4-14 (euro in millions) 16 14 12 10 8 6 4 2 0 22.9 10.0% 21.5 19.7 9.0% 6.8% 5.9% 3.4 6.5 7.0 2.7% 3.8 4.4 1.4 Q1-13 Q2-13 Q3-13 Q4-13 Q1-14 Q2-14 Q3-14 Q4-14 15.0% 10.0% 5.0% 0.0% Profit growth aided by through cycle gross margin expansion and opex leverage in business model Quarterly opex have ranged between 20-25 million over past 12 quarters 24.6 million in Q4-14 Significant reduction in effective tax rate has also helped Declined from 15.8% to 0.3% in 2014 Due to 2012 European operational restructuring and upward revaluation of deferred tax assets 36

Liquidity Trends Quarterly Trends 160 Cash Debt Net Cash 140 120 105.4 135.3 118.0 Solid liquidity position 135.3 million cash at 12/31/14 3.59 per share vs. 18.53 price (as of December 31, 2014) Net cash reached 118.0 million at year end 2014 (euro in millions) 100 80 60 91.9 64.2 81.1 78.5 56.2 56.0 89.6 91.9 71.0 72.8 83.8 62.5 86.1 Has Been Utilized to Enhance Shareholder Value 57 million spent on cash dividends and share repurchases 2011-2014 40 20 27.7 24.9 22.5 18.6 19.1 21.3 19.3 17.3 Strong balance sheet helps support future organic growth and acquisition opportunities 0 Q1-13 Q2-13 Q3-13 Q4-13 Q1-14 Q2-14 Q3-14 Q4-14 37

V. OUTLOOK & SUMMARY 38

2015 Industry Outlook Global Market Environment Remains Positive VLSI sees assembly system growth in 2015 driven by advanced packaging apps New tech/device buys and capacity additions Strength in smart phones, automotive, IOT and wearables Die bonding and flip chip are positive. TCB flip chip is emerging Companies with thin package capabilities are winning 39

Q1-15 Guidance Revenue Gross Margin Operating Expenses* Capex 89.0 43.8% 24.6 2.9 Up 0-5% 46% - 48% Up 5-10% Down 0.8 MM Q4 Q1 Q4 Q1 Q4 Q1 Q4 Q1 *excluding restructuring Year end backlog of 78.7 million is 58% higher than year end 2013 despite typical H2 seasonal downturn Revenue up approximately 0-5% above Q4-14 and 27-34% vs. Q1-14 Gross margins of 46-48% due primarily to appreciating dollar vs. euro Opex up 5-10% vs. Q4-14 due primarily to 15% appreciation of CHF vs. euro Capex of 2.1 million. 6.5 million in 2015E comparable to 2014 40

Summary Leading semi assembly equipment supplier with #1 or #2 positions in fastest growing assembly segments Scalability and profitability of business model greatly enhanced in cyclical industry Strong 2014 growth. Gaining market share in advanced packaging. Positive outlook for 2015 Solid liquidity position to finance growth Significant upside potential. Advanced packaging growth, operating initiatives and optimization of Asian production model Committed to enhancing shareholder value. Attractive dividend yield relative to peers 41