Product Tape and Reel Specifications

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Transcription:

Product Tape and Reel Specifications 2008 Microchip Technology Inc. DS00151F

Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as unbreakable. Code protection is constantly evolving. We at Microchip are coitted to continuously improving the code protection features of our products. Attempts to break Microchip s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dspic, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, rfpic and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dspicdem, dspicdem.net, dspicworks, dsspeak, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Prograing, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mtouch, PICkit, PICDEM, PICDEM.net, PICtail, PIC 32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rflab, Select Mode, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. 2008, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company s quality system processes and procedures are for its PIC MCUs and dspic DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. DS00151F-page ii 2008 Microchip Technology Inc.

FIGURE 1: 8, 12, 16 AND 24 EMBOSSED CARRIER TAPE DIMENSIONS TABLE 1: 8, 12, 16 AND 24 CARRIER TAPE & CAVITY DIMENSIONS Pkg Package Style Code Type Width/ Size Leads Carrier Dimensions W P Cavity Dimensions A 0 B 0 K 0 Units Per Reel Reel Diameter VB DPAK 3 16 8 N/A N/A N/A 2500 330 EB DDPAK 3 24 16 10.6 15.8 4.9 750 330 ET DDPAK 5 24 16 10.6 15.8 4.9 750 330 EK DDPAK 7 24 16 10.6 15.8 4.9 750 330 MC DFN 2x3x0.9 12 8 2.2 3.2 1.1 3300 330 MF DFN 3x3x0.9 12 8 3.3 3.3 1.1 3300 330 12 8 3.3 3.3 1.0 3300 330 MD DFN 4x4x0.9 12 8 4.35 4.35 1.1 3300 330 MF DFN-S 5x6x0.9 16 12 5.3 6.3 1.3 3300 330 12 8 5.3 6.3 1.2 3300 330 PQ MQFP 10X10X2 44 24 24 14.2 14.2 2.8 900 330 MS MSOP 8 & 10 12 8 5.3 3.4 1.4 2500 330 L PLCC 28 24 16 13.0 13.0 4.9 750 330 L PLCC 32 24 16 13.1 15.5 3.9 900 330 ML QFN 4x4x0.9 12 8 4.35 4.35 1.1 3300 330 ML QFN 6x6x0.9 16 12 6.3 6.3 1.1 1600 330 ML QFN 8x8x0.9 16 12 8.3 8.3 1.1 1600 330 ML QFN-S 6x6x0.9 16 12 6.3 6.3 1.1 1600 330 12 8 6.23 5.4 2.12 2500 330 QR QSOP 16 12 8 6.4 5.2 2.1 2500 330 12 8 6.5 5.2 2.1 2500 330 LB SC-70 3 8 4 2.4 2.4 1.19 3000 180 2008 Microchip Technology Inc. DS00151F-page 1

TABLE 1: 8, 12, 16 AND 24 CARRIER TAPE & CAVITY DIMENSIONS (CONTINUED) Pkg Package Style Code Type Width/ Size Leads Carrier Dimensions W P Cavity Dimensions A 0 B 0 K 0 Units Per Reel Reel Diameter LT SC-70 5 8 4 2.24 2.34 1.22 3000 180 12 8 6.4 5.2 2.1 3300 330 SN SOIC.150 8 12 8 6.5 5.2 2.1 3300 330 SL SOIC.150 14 SL SOIC.150 16 16 8 6.4 9.05 2.1 2600 330 16 8 6.5 9.5 2.1 2600 330 16 8 6.5 10.3 2.0 2600 330 16 8 6.5 10.3 2.1 2600 330 SO SOIC.300 16 16 12 10.9 10.7 3.0 1000 330 24 12 10.9 13.3 3.0 1100 330 SO SOIC.300 18 24 16 11.05 12.04 2.84 1100 330 24 16 11.1 12.0 2.8 1100 330 SO SOIC.300 20 24 12 10.9 13.3 3.0 1600 330 SO SOIC.300 24 24 12 10.9 16.0 3.0 1000 330 SO SOIC.300 28 24 12 10.9 18.3 3.0 1600 330 SM SOIC 8.3 5.7 2.3 2100 330.208 8 16 12 (SOIJ) 8.6 5.7 2.3 2100 330 HA SOP 8 12 8 N/A N/A N/A 1000 330 RC SOT-143 4 8 4 3.1 2.69 1.3 3000 330 DB SOT-223 3 12 8 6.83 7.42 1.88 4000 330 OT SOT-23 5 8 4 3.23 3.17 1.37 3000 180 CH SOT-23 6 8 4 3.23 3.17 1.37 3000 180 TT SOT-23 3 8 4 3.15 2.77 1.22 3000 180 CB SOT-23A 3 8 4 3.25 3.15 1.55 3000 180 MB SOT-89 3 12 8 4.91 4.52 1.9 1000 330 MT SOT-89 5 12 8 N/A N/A N/A 1000 330 SS SSOP 20 16 12 8.4 7.6 2.5 1600 330 16 12 8.4 7.7 2.5 1600 330 SS SSOP 24 16 12 8.4 8.7 2.5 2100 330 SS SSOP 28 24 12 8.3 10.7 2.2 2100 330 PT TQFP 10x10x1 44 & 64 24 16 12.4 12.4 2.2 1200 330 PT TQFP 12x12x1 80 & 100 24 24 14.4 14.4 1.7 1200 330 PF TQFP 14x14x1 64, 80 & 100 24 20 16.5 16.5 1.9 1000 330 ST TSSOP 8 12 8 6.75 3.4 1.3 2500 330 ST TSSOP 14 16 8 6.8 5.4 1.6 2500 330 ST TSSOP 20 16 8 6.8 6.9 1.6 2500 330 DS00151F-page 2 2008 Microchip Technology Inc.

FIGURE 2: 32 AND 44 EMBOSSED CARRIER TAPE DIMENSIONS TABLE 2: Pkg Style Code 32 AND 44 CARRIER TAPE AND CAVITY DIMENSIONS Package Type Width/Size Leads Carrier Dimensions W P Cavity Dimensions A 0 B 0 K 0 Output Quantity Units Reel Diameter BU MQFP 14x14x2.7 64 32 24 18.0 18.0 3.6 250 330 L PLCC 44 32 24 18.0 18.0 4.9 500 330 44 32 25.6 25.6 5.3 300 330 L PLCC 68 44 32 25.6 25.6 5.7 300 330 44 32 25.6 25.6 5.8 300 330 L PLCC 84 44 36 30.7 30.7 5.8 300 330 2008 Microchip Technology Inc. DS00151F-page 3

FIGURE 3: TO-92 DEVICES 3 LEAD 2 LEAD 2 LEAD 3 LEAD DS00151F-page 4 2008 Microchip Technology Inc.

TABLE 3: TO-92 CARRIER TAPE DIMENSIONS Symbol Description Dimension D Sprocket Hole Diameter 4.0 ±0.2 P Device Pitch 12.7 ±0.1 P 0 Feed Hole Pitch 12.7 ±0.1 P 1 Ordinate to Adjacent lead (2-Lead TO-92) 5.07 ±0.7 P 2 Ordinate to Center Lead (3-Lead TO-92) 6.35 ±0.7 F 1 2 Lead TO-92 Spacing 2.54 +0.6/-0.2 F 3 Lead TO-92 Spacing 2.54 +0.4/-0.1 H 0 Height to Seating Plane (Formed Leads) 15.5 MIN. H 1 Overall Height Above Abscissa 32.2 MAX. H Height to Seating Plane (Straight Leads) 16-21 W Carrier Tape Width 18 W 6 Adhesive Tape Position 3 MAX. - Output Quantity Units 1000 - Reel Diameter 355 FIGURE 4: 3L SOT-23, 3L SOT-23A AND SC-70 DEVICE ORIENTATION 2008 Microchip Technology Inc. DS00151F-page 5

FIGURE 5: 5L SOT-23 AND SC-70 DEVICE ORIENTATION FIGURE 6: 6L SOT-23 DEVICE ORIENTATION DS00151F-page 6 2008 Microchip Technology Inc.

FIGURE 7: 4L SOT-143 DEVICE ORIENTATION FIGURE 8: SOP, SSOP, SOIC AND MSOP DEVICE ORIENTATION 2008 Microchip Technology Inc. DS00151F-page 7

FIGURE 9: 3L SOT-223 DEVICE ORIENTATION FIGURE 10: SOT-89 DEVICE ORIENTATION DS00151F-page 8 2008 Microchip Technology Inc.

FIGURE 11: DFN, TDFN, UDFN AND QFN DEVICE ORIENTATION FIGURE 12: QSOP, SSOP AND TSSOP DEVICE ORIENTATION 2008 Microchip Technology Inc. DS00151F-page 9

FIGURE 13: MQFP AND TQFP DEVICE ORIENTATION FIGURE 14: DPAK AND DDPAK DEVICE ORIENTATION DS00151F-page 10 2008 Microchip Technology Inc.

FIGURE 15: PLCC DEVICE ORIENTATION 2008 Microchip Technology Inc. DS00151F-page 11

DIMENSIONS AND TOLERANCES All component taping diagrams, dimensions, tolerances, and component positioning requirements are specified per ANSI/EIA Standard EIA-481, current revision. For the 8-lead SOIC EIAJ Type II Package and 16 Carrier Tape width, the component taping diagrams, dimensions, and tolerances, and component positioning requirements are specified per EIAJ Standard RC-1009B, current revision. DS00151F-page 12 2008 Microchip Technology Inc.

TAPE AND REEL APPENDIX A: REVISION HISTORY Revision F (February 2008) The content and drawings in this document have been revised for this new version. 2008 Microchip Technology Inc. DS00151F-page 13

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