Customer Service Note Product Marks, Product Labels, and Packaging Labels



Similar documents
REVISION HISTORY Revision Description of Change Writer/Reviser. A New Release Julio Henriquez / Johan Martinsson / Dennis Quek

Part Number Decoder for Toshiba NAND Flash

Motorola Receiving Bar Code Specification

Product Label Specification

Handling, soldering & mounting instructions

Cree XLamp XP-G LEDs Data Sheet

SFP+ DWDM Dual LC 10G SMF 40km Transceiver. Features. Applications APPLIED OPTOELECTRONICS, INC. A7ELXDxxEDMA0609

Taping, Labeling, Storage, Packing and Marking

Label Standard for Incoming Parts

TESLA K10 GPU ACCELERATOR

EVERLIGHT ELECTRONICS CO.,LTD.

Date: TITLE BAR CODE LABEL REQUIREMENTS Page 1 of 22

Data Sheet FUJITSU Server PRIMERGY CX400 S2 Multi-Node Server Enclosure

EVERLIGHT ELECTRONICS CO.,LTD.

TESLA K20X GPU ACCELERATOR

TESLA M2075 DUAL-SLOT COMPUTING PROCESSOR MODULE

TESLA M2050 AND TESLA M2070 DUAL-SLOT COMPUTING PROCESSOR MODULES

Cree XLamp MX-3S LEDs Data Sheet

Product family data sheet

Data Sheet FUJITSU Server PRIMERGY TX100 S3p Tower Server

HENKEL CLEVELAND MANUFACTURING AND LOUSVILLE MANUFACTURING FINISHED GOODS, CHEMICAL, AND RAW MATERIAL SUPPLIERS BAR CODED LABEL SPECIFICATIONS

DDSL01. Secondary protection for DSL lines. Features. Description

Technical Note. Installing Micron SEDs in Windows 8 and 10. Introduction. TN-FD-28: Installing Micron SEDs in Windows 8 and 10.

Agilent P940xA/C Solid State PIN Diode Switches

Silicon PIN Photodiode with Daylight Blocking Filter Version 1.4 BP 104 FS

Packaging, Labeling, and Shipping Manual April 2013

TESLA K20 GPU ACCELERATOR

DSL01-xxxSC5. Secondary protection for DSL lines. Features. Description. Applications. Benefits. Complies with the following standards

UV SMD LED PLCC-2 FEATURES APPLICATIONS. at I F (ma) (ma) MIN. TYP. MAX. MIN. TYP. MAX. MIN. TYP. MAX.

Cree XLamp MX-6 LEDs Data Sheet

Reel pack, SMD, 7" Q1/T1-Q2/T3 standard product orientation Orderable part number ending,115 or X Ordering code (12NC) ending 115.

io3 Enterprise Mainstream Flash Adapters Product Guide

Product Regulatory Compliance Datasheet BE3600

Lot: a group of product that is unique to time, date and location of manufacture.

Application Server V240 Platform

Data Sheet Fujitsu PRIMERGY BX900 S1 Blade Server

Accessories SUNNY REMOTE CONTROL

IBM Flex System PCIe Expansion Node IBM Redbooks Product Guide

Available in white (2,600 K to 8,300 K CCT) Maximum drive current: 1000 ma. Wide viewing angle: 120. Electrically neutral thermal path

Master Setup Sheet Template (NAND) Premium SDXC UHS-I Card

SMART Board 8055i and 8055i-SMP

NI USB-5681 RF Power Meter Specifications

Packaging Identification Standard

SOT Packing method

Crucial MX inch Internal Solid State Drive

Features. Case: TO (2), TO-220F-3 (Option 1), TO (1) and TO Power Management Instrumentation

Product Regulatory Compliance Datasheet NBU 5330

Installation Guide MAXTOR SATAII/300 INTERNAL HARD DRIVE

Customer Service Note Lead Frame Package User Guidelines

Master Setup Sheet Template (NAND) Lexar JumpDrive S33 USB 3.0 flash drive

RealSSD Embedded USB Mass Storage Drive MTFDCAE001SAF, MTFDCAE002SAF, MTFDCAE004SAF, MTFDCAE008SAF

Data Sheet FUJITSU Server PRIMERGY CX400 M1 Multi-Node Server Enclosure

Cree XLamp XR-E LED. Table of Contents. CLD-DS05 Rev 16B. Product family data sheet

Low Current SMD LED PLCC-2

ETP01-xx21. Protection for Ethernet lines. Features. Description. Applications. Benefits. Complies with the following standards

1.55V DDR2 SDRAM FBDIMM

DOMINANT. Opto Technologies Innovating Illumination. InGaN White S-Spice : SSW-SLD DATA SHEET: SpiceLED TM. Features: Applications:

OEM Manual MODEL 2350 ELECTRONIC DUAL CYLINDER SCALE

Board Specification. Tesla C1060 Computing Processor Board. September 2008 BD _v03

Quality Assurance Provisions

QuickSpecs. Models HP T1500 UPS JPN/TWN. HP UPS T1000 G2, T1500 G2 Models Overview

ewon Flexy 3G GSM Extension Card FLB P3202 Installation Guide

ServeRAID H1110 SAS/SATA Controller for IBM System x IBM System x at-a-glance guide

Data Sheet Fujitsu PRIMERGY BX600 S3 Blade Server

SMART Board 8070i-SMP and 8070i

Scout 1U Rackmount Computer

IP4234CZ6. 1. Product profile. Single USB 2.0 ESD protection to IEC level General description. 1.2 Features. 1.

How To Test A Power Distribution Unit

DOMINANT. Opto Technologies Innovating Illumination. 150 InGaN Warm White : NAF-BSG DATA SHEET : Primax TM. Features: Applications:

Hard Disk Drive (HDD)

Data Sheet Fujitsu PRIMERGY CX1000 S1 with 38 cloud server nodes

Electrical & electronics. product certification. for electrical & electronics

How To Buy An Fujitsu Primergy Bx400 S1 Blade Server

Contents. 12. Lot Number Reel Packing Structure Precaution for Use Hazard Substance Analysis Revision History 18

Full_IG.book Page 1 Monday, January 9, :11 PM. ProSafe 24 Port Gigabit Switch Installation Guide

3mm Photodiode,T-1 PD204-6C/L3

Lenovo Global Labeling Guide. Volume 7 Packing Lists. Lenovo Part Number 41U3003

HP SuperSpeed USB 3.0 PCIe x1 Card. User Guide

Data Sheet FUJITSU Display E19-7 LED

Cree XLamp XP-G LEDs PRODUCT FAMILY DATA SHEET PRODUCT DESCRIPTION FEATURES TABLE OF CONTENTS CLD-DS20 REV 4

Data Sheet FUJITSU Storage ETERNUS DX200F All Flash Array

Intel Entry Server Chassis SC5275-E

BroadBand PowerShield. User Manual

Data Sheet FUJITSU Server PRIMERGY CX420 S1 Out-of-the-box Dual Node Cluster Server

Datasheet Fujitsu PRIMERGY CX1000 S1 with 38 CX120 S1 The Cool-Central Architecture

Data Sheet Fujitsu PRIMERGY BX400 S1 Blade Server

EMC DATA DOMAIN DEDUPLICATION STORAGE SYSTEMS

aseries A13B Mini Bullet Camera User Manual

Cisco Nexus 7000 Series.

Lenovo Global Labeling Guide. Volume 6 FRU Package Labels. Lenovo Part Number 41U3002

Vess. Architectural & Engineering Specifications For Video Surveillance. A2200 Series. Version: 1.2 Feb, 2013

Data Sheet FUJITSU Storage ETERNUS DX200F All-Flash-Array

North American Labeling Requirements (Canada, Mexico and United States) TRW PROCEDURE WA.D20.001

TRIPLE PLL FIELD PROG. SPREAD SPECTRUM CLOCK SYNTHESIZER. Features

User Guide. LabelManager

The table below lists the symbols used on the Clamp and/or in this manual. Important Information. See manual.

Fujitsu PRIMERGY BX600 S3 Blade Server

VENDOR EDI MANUAL SPORTSMAN S GUIDE (SG)

EMC DATA DOMAIN DEDUPLICATION STORAGE SYSTEMS

Transcription:

Introduction Customer Service Note Product Marks, Product Labels, and Packaging Labels Introduction Micron uses various marks and labels on our products and packaging. The first section of this customer service note describes the product marks and labels we place on our devices. The second section describes the labels used on and in our packaging. Component Mark Information Most of Micron s component products use one of two product mark variations to accommodate smaller components and different package sizes (for example, FBGA and CSP). Both product marks are right- and left-justified and have a character height of 0.040 0.050 inches depending on package size. Both marks also include a unique, laserinscribed identification number on the top side of the part for traceability purposes. Legacy component products with Elpida part marks use the same part marks used prior to Micron's acquisition of Elpida. Further information may be found in our product guides and on Micron s Web site: www.micron.com/numbering. Most component marks contain the following details (see Figure 1 on page 2): Date code (year and workweek) Special mark characters Country of diffusion (see below for country codes) Country of encapsulation (see below for country codes) Micron mark or logo Product family Process technology Device number Device versions Package type Speed Special test option (if relevant) Die revision Scribe For more information on product-specific designators, see the part numbering guides on Micron s Web site: www.micron.com/numbering. Codes for the countries of diffusion and encapsulation: 1 = USA 5 = China B = Israel 2 = Singapore 7 = Taiwan C = Ireland CSN11.fm - Rev. X 5/15 EN 1 2003 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by Micron without notice. Products are only warranted by Micron to meet Micron s production data sheet specifications. All information discussed herein is provided on an as is basis, without warranties of any kind.

3 = Italy 8 = Korea D = Malaysia 4 = Japan 9 = Mixed F = Philippines Figure 1: TSOP Component Mark Year code Week code Function mark characters (optional) Special mark characters (optional) Country of diffusion Country of encapsulation Device number Micron mark or logo Scribe Product family Process technology Device versions Package type Speed Die revision Special test options or blanks Abbreviated Component Mark Information Due to space limitations, FBGA-package component marks contain abbreviated details for two distinct types of information (see Figure 2 on page 3). The top row of the component mark contains the flooring details that are unrelated to product type: Date code (see below) Die revision Country of diffusion (see below for country codes) Country of encapsulation (see below for country codes) Date codes are alphanumeric characters that indicate the year and workweek the parts were marked, in even-numbered workweeks. The first character is the last number in the year, and the second (alpha) character is the workweek. A=2 E=10 I=18 M=26 Q=34 U=42 Y=50 B=4 F=12 J=20 N=28 R=36 V=44 Z=52 C=6 G=14 K=22 0=30 S=38 W=46 D=8 H=16 L=24 P=32 T=40 X=48 Codes for the countries of diffusion and encapsulation: 1 = USA 5 = China B = Israel 2 = Singapore 7 = Taiwan C = Ireland 3 = Italy 8 = Korea D = Malaysia 4 = Japan 9 = Mixed F = Philippines The middle and bottom rows of the component mark contain product-specific details such as: Micron logo/ball 1 designator Coded part number CSN11.fm - Rev. X 5/15 EN 2 2003 Micron Technology, Inc. All rights reserved.

Product family Special mark characters More information on product-specific designators is provided in Micron s various part numbering guides, which are available on Micron s Web site at www.micron.com/ numbering. Information on the corresponding part numbers for part mark codes is available from the FBGA Part Marking Decoder at www.micron.com/decoder. Figure 2: BGA/LGA Abbreviated Component Mark Date code Die revision Country of diffusion Country of encapsulation Scribe (If space allows) Ball 1 mark or Product family Coded part number Function mark characters (optional) Special mark characters (optional) Figure 3: Legacy BGA Component with Elpida Part Mark Product name (mark name, may have multiple lines) Lot number Engineering sample (ES) mark Year assembled Week assembled In-house code Ball 1 mark CSN11.fm - Rev. X 5/15 EN 3 2003 Micron Technology, Inc. All rights reserved.

Module Label Information CSN-11: Product Marks/Product and Packaging Labels Labels typically used for module production have standard requirements for each line printed on the label (see Figure 4): Line 1: Code 128 subset B bar code of Micron part number/date code (YWW) Line 2: Marketing part number/date code (YYWW) Line 3: JEDEC label as appropriate/optional project number Line 4: Module assembly country of origin/lot ID code The Micron logo and the Pb-free symbol are printed on the left and right sides of the label, respectively. Figure 4: Module Label MTA36ASF2G72PZ-2G1A2KJ 1510 16GB 2RX4 PC4-2133-RBP-10 Assembled in USA BZAH193001 Notes: 1. The European Regulatory Requirement logo may or may not be present on a particular module label. 2. DDR3/DDR4 ECC modules contain two characters at the end of the part number string (BA in the example above) that are not part of the ordering part number. These characters are used by Micron manufacturing. CSN11.fm - Rev. X 5/15 EN 4 2003 Micron Technology, Inc. All rights reserved.

SSD Label Information CSN-11: Product Marks/Product and Packaging Labels Figures 5 through 18 show the label structures for our SSD products. Figure 5 shows the label used on msata devices, Figure 6 on page 7 shows the 2.5-inch form factor label used on the C200 and P200 devices, Figure 7 on page 9 shows the 1.8-inch form factor label used on the C200 and C300 devices, Figure 8 on page 11 shows the 2.5-inch form factor label used only on C400 devices), and Figure 18 on page 31 shows the 2.5-inch form factor label used on USB devices. The figures have designated key notes that outline the details of each particular item on the label. Figure 5: msata Label 1 RealSSD C400 msata 128GB SATA 6.0 Gb/s 6 7 2 3 P/N: MTFDDAT128MAM F/W: XXXX 8 4 5 S/N: XXXXXXXXXXXX XXXXXXXXX WWN: 500A0751XXX 10 9 11 E320115 N12610 6 15 20 16 XXXXXX 21 KCC-REM-MU2-C400mSATA Product of XXXXXXXXXXX 17 18 22 13 14 Key note definitions: 1. Micron official logo 2. Drive part number bar code for item #3 data (follows the Code 128 standard) 3. Drive part number 4. Drive serial number bar code for item #5 data (follows the Code 128 standard) 5. Drive serial number 5a. Format: 12 characters: YYWWXXXXXXXX YY is the current year WW is the current Micron workweek XXXXXXXX is an eight digit hex (base 16 0 9. A F) serial number 6. Brief description of the product and its form factor 6a. Example: RealSSD C400 msata 7. The product s capacity, interface, and maximum interface rate 7a. 64GB msata 3 Gb/s 8. Drive firmware revision number 12 19 CSN11.fm - Rev. X 5/15 EN 5 2003 Micron Technology, Inc. All rights reserved.

9. Lot number for tracking the drive s manufacturing data 9a. This is listed as xxyyyyyzzz 9b. xx = 2 digits to denote manufacturing site 9c. yyyyy = 5 digits to denote the kit number (randomly generated) 9d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information) 10. Worldwide name assigned to Micron (as defined by IEEE) 11. Reserved for the official European Regulatory Requirement logo 12. Reserved for the official United Underwriters logo 13. Reserved for the official C-TICK (Australian) mark. 14. Reserved for the official Japan VCCI logo. 15. Reserved for the official Serial ATA logo 16. Reserved for the official Restriction of Hazardous Substances logo 16a. This device must meet the standards of RoHS to enable the 20 year indication of the RoHS logo 17. Reserved for the official TUV logo 18. Reserved for the official Ministry of Information and Communications (MIC) logo. 19. Reserved for the official Federal Communications Commission logo 19a. Cispr B is required 20. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo 21. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo 22. Country where the device is assembled, written in English 22a. With the exception of USA and UK, the full English name of the country should be included: for example, Product of Taiwan CSN11.fm - Rev. X 5/15 EN 6 2003 Micron Technology, Inc. All rights reserved.

Figure 6: 2.5-inch Label Structure C200/P200 14 11 12 13 15 16 17 18 19 10 RealSSD x200 2.5 xxxgb SATA 3Gb/s XXXXX XXXXXX 20 9 Firmware Rev: XXXX Product of: XXXXX 8 21 7 P/N: XXXXXXXXXXXX-XXX 22 6 5 4 3 2 S/N: XXXXXXXXXX-XXX Lot Number: XX-XXXX-XXX WWN: 1234567890123456 HALOGEN FREE Rated VDC AMPS +5 0.2 THIS PRODUCT IS MANUFACTURED BY MICRON UNDER ONE OR MORE PATENTS AND PENDING PATENTS, OF THE UNITED STATES OR OTHER COUNTRIES OWNED OR LICENSED BY MICRON 23 1 26 25 24 Key note definitions: 1. Micron intellectual property statement 2. Worldwide name assigned to Micron (as defined by IEEE) 3. Lot number for tracking the drive s manufacturing data 3a. This is listed as xxyyyyyzzz 3b. xx = 2 digits to denote manufacturing site 3c. yyyyy = 5 digits to denote the kit number (randomly generated) 3d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information) 4. Lot number bar code for item #2 data (follows the Code 128 standard) 5. Drive serial number 5a. Format: 12 characters: YYWWXXXXXXXX YY is the current year WW is the current Micron workweek XXXXXXXX is an eight digit hex (base 16 0 9. A F) serial number 6. Drive serial number bar code for item #5 data (follows the Code 128 standard) 7. Drive part number 8. Drive part number bar code for item #7 data (follows the Code 128 standard) 9. Drive firmware revision number CSN11.fm - Rev. X 5/15 EN 7 2003 Micron Technology, Inc. All rights reserved.

10. Brief description of the product, form factor, its capacity, interface, and maximum interface rate 10a. Example: RealSSD C200 2.5 64GB SATA 3 Gb/s 10b. If for an engineering sample, place ENGINEERING SAMPLE (in all caps) under the description 11. Micron official logo 12. Reserved for the official Serial ATA logo 13. Reserved for the official Ministry of Information and Communications (MIC) logo. 14. Reserved for the official Japan VCCI logo. 15. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo 16. Reserved for the official United Underwriters logo 17. Reserved for the official Federal Communications Commission logo 17a. Cispr B is required 18. Reserved for the official European Regulatory Requirement logo 19. Reserved for the official Restriction of Hazardous Substances logo 19a. This device must meet the standards of RoHS to enable the 20 year indication of the RoHS logo 20. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo 21. Reserved for the official C-TICK (Australian) mark. 22. Reserved for the official TUV logo 23. Empty space to be used by the end customer 24. The device s voltage level with its related amperes at normal operation (defined by Micron QRA) 25. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements 26. Country where the device is assembled, written in English 26a. With the exception of USA and UK, the full English name of the country should be included: for example, Product of Taiwan See customer addenda for all/any uniqueness beyond this standard outline. CSN11.fm - Rev. X 5/15 EN 8 2003 Micron Technology, Inc. All rights reserved.

Figure 7: 1.8-inch Label Structure C200/C300 12 10 11 13 14 15 16 17 9 8 RealSSD x300 1.8 xxxgb SATA xgb/s Firmware Rev: XXXX XXXXXX XXXXXX Product of: XXXXX XXXXXX 18 7 5 3 6 4 P/N: XXXXXXXXXXXX-XXX S/N: XXXXXXXXXXXXX Lot Number: XX-XXXXXXX WWN: 1234567890123456 Rated VDC AMPS +3.3 2.0 HALOGEN FREE XXXXX 19 20 21 2 THIS PRODUCT IS MANUFACTURED BY MICRON UNDER ONE OR MORE PATENTS AND PENDING PATENTS, OF THE UNITED STATES OR OTHER COUNTRIES OWNED OR LICENSED BY MICRON 1 24 23 22 Key note definitions: 1. Micron intellectual property statement 2. Worldwide name assigned to Micron (as defined by IEEE) 3. Lot number for tracking the drive s manufacturing data 3a. This is listed as xxyyyyyzzz 3b. xx = 2 digits to denote manufacturing site 3c. yyyyy = 5 digits to denote the kit number (randomly generated) 3d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information) 4. Drive serial number 4a. Format: 12 characters: YYWWXXXXXXXX YY is the current year WW is the current Micron workweek XXXXXXXX is an eight digit hex (base 16 0 9. A F) serial number 5. Drive serial number bar code for item #4 data (follows the Code 128 standard) 6. Drive part number 7. Drive part number bar code for item #6 data (follows the Code 128 standard) 8. Drive firmware revision number CSN11.fm - Rev. X 5/15 EN 9 2003 Micron Technology, Inc. All rights reserved.

9. Brief description of the product, form factor, its capacity, interface, and maximum interface rate 9a. Example: RealSSD C200 and C300 1.8 64GB SATA 3 Gb/s 9b. If for an engineering sample, place ENGINEERING SAMPLE (in all caps) under the description 10. Micron official logo 11. Reserved for the official Serial ATA logo 12. Reserved for the official Japan VCCI logo. 13. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo 14. Reserved for the official United Underwriters logo 15. Reserved for the official Federal Communications Commission logo 15a. Cispr B is required 16. Reserved for the official European Regulatory Requirement logo 17. Reserved for the official Restriction of Hazardous Substances logo 17a. This device must meet the standards of RoHS to enable the 20 year indication of the RoHS logo 18. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo 19. Reserved for the official C-TICK (Australian) mark. 20. Reserved for the official Ministry of Information and Communications (MIC) logo. 21. Reserved for the official TUV logo 22. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements 23. The device s voltage level with its related amperes at normal operation (defined by Micron QRA) 24. Country where the device is assembled, written in English 24a. With the exception of USA and UK, the full English name of the country should be included: for example, Product of Taiwan CSN11.fm - Rev. X 5/15 EN 10 2003 Micron Technology, Inc. All rights reserved.

Figure 8: 2.5-inch Label Structure C400 24 1 2 3 23 THIS PRODUCT IS MANUFACTURED BY MICRON UNDER ONE OR MORE PATENTS AND PENDING PATENTS, OF THE UNITED STATES OR OTHER COUNTRIES OWNED OR LICENSED BY MICRON 22 RealSSD C400 2.5 xxxgb SATA 6Gb/s XXX Firmware Rev: XXXX Product of: XXXXX HALOGEN FREE XXXXXXXXXX Rated VDC AMPS +5 2.0 4 5 21 20 P/N: XXXXXXXXXXXX-XXX 19 S/N: XXXXXXXXXX WWN: 500A0751XXXXXXXX 6 18 E320115 KCC-REM-MU2-C40025 (B) N12610 XXXXXX 17 16 15 14 13 12 11 10 9 8 7 Key note definitions: 1. Micron intellectual property statement 2. Country where the device is assembled, written in English 2a. With the exception of USA and UK, the full English name of the country should be included: for example, Product of Taiwan 3. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements 4. Lot number for tracking the drive s manufacturing data 4a. This is listed as xxyyyyyzzz 4b. xx = 2 digits to denote manufacturing site 4c. yyyyy = 5 digits to denote the kit number (randomly generated) 4d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information) 5. The device s voltage level with its related amperes at normal operation (defined by Micron QRA) 6. Worldwide name assigned to Micron (as defined by IEEE) 7. Reserved for the official Serial ATA logo 8. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo 9. Reserved for the official Restriction of Hazardous Substances logo 9a. This device must meet the standards of RoHS to enable the 20 year indication of the RoHS logo 10. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo CSN11.fm - Rev. X 5/15 EN 11 2003 Micron Technology, Inc. All rights reserved.

11. Reserved for the official TUV logo 12. Reserved for the official C-TICK (Australian) mark. 13. Reserved for the official Japan VCCI logo. 14. Reserved for the official Ministry of Information and Communications (MIC) logo. 15. Reserved for the official Federal Communications Commission logo 15a. Cispr B is required 16. Reserved for the official United Underwriters logo 17. Reserved for the official European Regulatory Requirement logo 18. Drive serial number 18a. Format: 12 characters: YYWWXXXXXXXX YY is the current year WW is the current Micron workweek XXXXXXXX is an eight digit hex (base 16 0 9. A F) serial number 19. Drive serial number bar code for item #18 data (follows the Code 128 standard) 20. Drive part number 21. Drive part number bar code for item #20 data (follows the Code 128 standard) 22. Drive firmware revision number 23. Brief description of the product, form factor, its capacity, interface, maximum interface rate, and security feature set 23a. Example: RealSSD C400 2.5 64GB SATA 3 Gb/s 23b. If for an engineering sample, place ENGINEERING SAMPLE (in all caps) under the description 23c. Feature set example: RealSSD C400 2.5 128GB SATA 6 Gb/s SED 24. Micron official logo CSN11.fm - Rev. X 5/15 EN 12 2003 Micron Technology, Inc. All rights reserved.

Figure 9: 2.5-inch Label Structure P320h 2 1 3 4 RealSSD P320h HHL XXXGB PCIe Firmware Rev: XXXX THIS PRODUCT IS MANUFACTURED BY MICRON UNDER ONE OR MORE PATENTS AND PENDING PATENTS, OF THE UNITED STATES OR OTHER COUNTRIES OWNED OR LICENSED BY MICRON Product of: XXXXX XXXXXXXXXX HALOGEN FREE Rated: VDC +12 22 20 21 19 5 6 P/N: XXXXXXXXXXXX-XXX 7 8 S/N: XXXXXXXXXX WWN: XXXXXXXXXXXXX 18 9 E320115 D33F63 N12610 19 10 KCC-REM-MU2-P320hHHHL 11 12 13 14 15 16 Key note definitions: 1. Micron intellectual property statement 2. Micron official logo 3. Brief description of the product, form factor, its capacity, interface, maximum interface rate, and security feature set 3a. Example: RealSSD P320h HHHL 64GB PLIe 3b. If for an engineering sample, place ENGINEERING SAMPLE (in all caps) under the description 4. Drive firmware revision number 5. Drive part number bar code for item #6 data (follows the Code 128 standard) 6. Drive part number 7. Drive serial number bar code for item #8 data (follows the Code 128 standard) 8. Drive serial number 8a. Format: 12 characters: YYWWXXXXXXXX YY is the current year WW is the current Micron workweek XXXXXXXX is an eight digit hex (base 16 0 9. A F) serial number 9. Reserved for the official United Underwriters logo 10. Reserved for the official European Regulatory Requirement logo 11. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo CSN11.fm - Rev. X 5/15 EN 13 2003 Micron Technology, Inc. All rights reserved.

12. Reserved for the official Ministry of Information and Communications (MIC) logo 13. Reserved for the official C-TICK (Australian) mark 14. Reserved for the official TUV logo 15. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo 16. Hot surface logo; not related to any certifications 17. Reserved for the official Restriction of Hazardous Substances logo 18. Worldwide name assigned to Micron (as defined IEEE) 19. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements 20. Lot number for tracking the drive s manufacturing data 20a. This is listed as xxyyyyyzzz 20b. xx = 2 digits to denote manufacturing site 20c. yyyyy = 5 digits to denote the kit number (randomly generated) 20d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information) 21. Country where the device is assembled, written in English 21a. With the exception of USA and UK, the full English name of the country should be included: for example, Product of Taiwan 22. The device s voltage level with its related amperes at normal operation (defined by Micron QRA) CSN11.fm - Rev. X 5/15 EN 14 2003 Micron Technology, Inc. All rights reserved.

Figure 10: 2.5-inch Label Structure P400e 2 1 24 23 3 THIS PRODUCT IS MANUFACTURED BY MICRON UNDER ONE OR MORE PATENTS AND PENDING PATENTS, OF THE UNITED STATES OR OTHER COUNTRIES OWNED OR LICENSED BY MICRON 4 RealSSD P400e 2.5 xxxgb SATA 6Gb/s XXX Firmware Rev: XXXX Product of XXXXX HALOGEN FREE XXXXXXXXXX Rated VDC AMPS +5 2.0 22 21 5 6 P/N: XXXXXXXXXXXX-XXX 7 S/N: XXXXXXXXXX WWN: XXXXXXXXXXXXXXX 20 8 E320115 KCC-REM-MU2-C40018 N12610 XXXXXX 9 10 11 12 13 14 15 16 17 18 19 Key note definitions: 1. Micron intellectual property statement 2. Micron official logo 3. Brief description of the product, form factor, its capacity, interface, maximum interface rate, and security feature set 4. Drive firmware revision number 5. Drive part number bar code for item #6 data (follows the Code 128 standard) 6. Drive part number 7. Drive serial number bar code for item #8 data (follows the Code 128 standard) 8. Drive serial number 8a. Format: 12 characters: YYWWXXXXXXXX YY is the current year WW is the current Micron workweek XXXXXXXX is an eight digit hex (base 16 0 9. A F) serial number 9. Reserved for the official European Regulatory Requirement logo 10. Reserved for the official United Underwriters logo 11. Reserved for the official Federal Communications Commission logo 11a. Cispr B is required 12. Reserved for the official Ministry of Information and Communications (MIC) logo. 13. Reserved for the official Japan VCCI logo. CSN11.fm - Rev. X 5/15 EN 15 2003 Micron Technology, Inc. All rights reserved.

14. Reserved for the official C-TICK (Australian) mark. 15. Reserved for the official TUV logo 16. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo 17. Reserved for the official Restriction of Hazardous Substances logo 17a. This device must meet the standards of RoHS to enable the 20 year indication of the RoHS logo 18. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo 19. Reserved for the official Serial ATA logo 20. Worldwide name assigned to Micron (as defined by IEEE) 21. The device s voltage level with its related amperes at normal operation (defined by Micron QRA) 22. Lot number for tracking the drive s manufacturing data 22a. This is listed as xxyyyyyzzz 22b. xx = 2 digits to denote manufacturing site 22c. yyyyy = 5 digits to denote the kit number (randomly generated) 22d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information) 23. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements 24. Country where the device is assembled, written in English 24a. With the exception of USA and UK, the full English name of the country should be included: for example, Product of Taiwan CSN11.fm - Rev. X 5/15 EN 16 2003 Micron Technology, Inc. All rights reserved.

Figure 11: 2.5-inch Label Structure P410m 2 1 24 23 3 THIS PRODUCT IS MANUFACTURED BY MICRON UNDER ONE OR MORE PATENTS AND PENDING PATENTS, OF THE UNITED STATES OR OTHER COUNTRIES OWNED OR LICENSED BY MICRON 5 4 RealSSD P410m 2.5 xxxgb SAS 6Gb/s XXX Firmware Rev: XXXX Product of: XXXXX HALOGEN FREE XXXXXXXXXX Rated VDC AMPS +12 1.25 22 21 7 6 P/N: XXXXXXXXXXXX-XXX 20 8 S/N: XXXXXXXXXX 9 WWN: XXXXXXXXXXXXXXX 19 E320115 N12610 XXXXXX KCC-REM-MU2-P410M25 S A S 10 11 12 13 14 15 16 17 18 Key note definitions: 1. Micron intellectual property statement 2. Micron official logo 3. Brief description of the product, form factor, its capacity, interface, maximum interface rate, and security feature set 3a. Example: RealSSD P410 2.5 64GB SATA 6 Gb/s 3b. If for an engineering sample, place ENGINEERING SAMPLE (in all caps) under the description 4. Drive firmware revision number 4a. Feature set example: RealSSD C400 2.5 128GB SATA 6 Gb/s SED 5. Drive part number bar code for item #6 data (follows the Code 128 standard) 6. Drive part number 7. Drive serial number bar code for item #8 data (follows the Code 128 standard) 8. Drive serial number 8a. Format: 12 characters: YYWWXXXXXXXX YY is the current year WW is the current Micron workweek XXXXXXXX is an eight digit hex (base 16 0 9. A F) serial number 9. Worldwide name assigned to Micron (as defined by IEEE) 10. Reserved for the official European Regulatory Requirement logo 11. Reserved for the official United Underwriters logo 12. Reserved for the official TUV logo CSN11.fm - Rev. X 5/15 EN 17 2003 Micron Technology, Inc. All rights reserved.

13. Reserved for the official C-TICK (Australian) mark. 14. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo 15. Reserved for the official Ministry of Information and Communications (MIC) logo. 16. Reserved for the official Restriction of Hazardous Substances logo 16a. This device must meet the standards of RoHS to enable the 20 year indication of the RoHS logo 17. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo 18. Reserved for the official SAS logo 19. VCCI-A certification in the Japanese language. English translation: This device is a class A information technology device. Use of this device in home environment may cause transmission/radio interference. You may be required to take appropriate measures in this case. 20. FCC disclaimer and notification 21. The device s voltage level with its related amperes at normal operation (defined by Micron QRA) 22. Lot number for tracking the drive s manufacturing data 22a. This is listed as xxyyyyyzzz 22b. xx = 2 digits to denote manufacturing site 22c. yyyyy = 5 digits to denote the kit number (randomly generated) 22d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information) 23. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements 24. Country where the device is assembled, written in English 24a. With the exception of USA and UK, the full English name of the country should be included: for example, Product of Taiwan CSN11.fm - Rev. X 5/15 EN 18 2003 Micron Technology, Inc. All rights reserved.

Figure 12: 2.5-inch Label Structure P400m 2 1 24 23 3 THIS PRODUCT IS MANUFACTURED BY MICRON UNDER ONE OR MORE PATENTS AND PENDING PATENTS, OF THE UNITED STATES OR OTHER COUNTRIES OWNED OR LICENSED BY MICRON 5 4 RealSSD P400m 2.5 xxxgb SAS 6Gb/s XXX Firmware Rev: XXXX Product of: XXXXX HALOGEN FREE XXXXXXXXXX Rated VDC AMPS +5 2 22 21 7 6 P/N: XXXXXXXXXXXX-XXX 20 8 S/N: XXXXXXXXXX 9 WWN: XXXXXXXXXXXXXXX 19 E320115 N12610 XXXXXX KCC-REM-MU2-P400M25 10 11 12 13 14 15 16 17 18 Key note definitions: 1. Micron intellectual property statement 2. Micron official logo 3. Brief description of the product, form factor, its capacity, interface, maximum interface rate, and security feature set 3a. Example: RealSSD C400 2.5 64GB SATA 3 Gb/s 3b. If for an engineering sample, ENGINEERING SAMPLE (in all caps) is placed under the description 3c. Feature set example: RealSSD C400 2.5 128GB SATA 6 Gb/s SED 4. Drive firmware revision number 5. Drive part number bar code for item #6 data (follows the Code 128 standard) 6. Drive part number 7. Drive serial number bar code for item #8 data (follows the Code 128 standard) 8. Drive serial number 8a. Format: 12 characters: YYWWXXXXXXXX YY is the current year WW is the current Micron workweek XXXXXXXX is an eight digit hex (base 16 0 9. A F) serial number 9. Worldwide name assigned to Micron (as defined by IEEE) 10. Reserved for the official European Regulatory Requirement logo 11. Reserved for the official United Underwriters logo 12. Reserved for the official TUV logo CSN11.fm - Rev. X 5/15 EN 19 2003 Micron Technology, Inc. All rights reserved.

13. Reserved for the official C-TICK (Australian) mark. 14. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo. 15. Reserved for the official Ministry of Information and Communications (MIC) logo. 16. Reserved for the official Restriction of Hazardous Substances logo 16a. This device must meet the standards of RoHS to enable the 20 year indication of the RoHS logo 17. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo 18. Reserved for the official Serial ATA logo 19. VCCI-A certification in the Japanese language. English translation: This device is a class A information technology device. Use of this device in home environment may cause transmission/radio interference. You may be required to take appropriate measures in this case. 20. FCC disclaimer and notification 21. The device s voltage level with its related amperes at normal operation (defined by Micron QRA) 22. Lot number for tracking the drive s manufacturing data 22a. This is listed as xxyyyyyzzz 22b. xx = 2 digits to denote manufacturing site 22c. yyyyy = 5 digits to denote the kit number (randomly generated) 22d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information) 23. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements 24. Country where the device is assembled, written in English 24a. With the exception of USA and UK, the full English name of the country is included: for example, Product of Taiwan CSN11.fm - Rev. X 5/15 EN 20 2003 Micron Technology, Inc. All rights reserved.

Figure 13: 2.5-inch Label Structure P420m 1 2 Model: XXXXXXXXXXXX 3 4 P/N: XXXXXXXXXXXX-XXX 6 5 S/N: XXXXXXXXXX 8 10 7 9 RealSSD P420m 2.5 L/N: XXXXXXXX WWN: XXXXXXXXXXXXXXX Rated VDC AMPS +5 2 PCIe Gen 2 SSD (DENS) MLC 24 23 11 THIS PRODUCT IS MANUFACTURED BY MICRON UNDER ONE OR MORE PATENTS AND PENDING PATENTS, OF THE UNITED STATES OR OTHER COUNTRIES OWNED OR LICENSED BY MICRON 22 12 Product of XXXXXXXXXX 21 20 13 E320115 KCC-REM-MU2-P420M25 D22F63 N12610 19 14 This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. 18 15 16 17 Key note definitions: 1. Micron official logo 2. Model number 3. Drive part number bar code for item #4 data (follows the Code 128 standard) 4. Drive part number 5. Drive serial number bar code for item #6 data (follows the Code 128 standard) CSN11.fm - Rev. X 5/15 EN 21 2003 Micron Technology, Inc. All rights reserved.

6. Drive serial number 6a. Format: 12 characters: YYWWXXXXXXXX YY is the current year WW is the current Micron workweek XXXXXXXX is an eight digit hex (base 16 0 9. A F) serial number 7. Brief description of the product, form factor, its capacity, interface, maximum interface rate, and security feature set 7a. Example: RealSSD P420m 2.5 64GB SATA 3 Gb/s 7b. If for an engineering sample, ENGINEERING SAMPLE (in all caps) is placed under the description 8. Lot number for tracking the drive s manufacturing data 8a. This is listed as xxyyyyyzzz 8b. xx = 2 digits to denote manufacturing site 8c. yyyyy = 5 digits to denote the kit number (randomly generated) 8d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information) 9. Worldwide name assigned to Micron (as defined by IEEE) 10. The device s voltage level with its related amperes at normal operation (defined by Micron QRA) 11. Micron intellectual property statement 12. Country where the device is assembled, written in English 12a. With the exception of USA and UK, the full English name of the country is included: for example, Product of Taiwan 13. Reserved for the official European Regulatory Requirement logo 14. Reserved for the official United Underwriters logo 15. Reserved for the official Ministry of Information and Communications (MIC) logo. 16. VCCI-A certification in the Japanese language. English translation: This device is a class A information technology device. Use of this device in home environment may cause transmission/radio interference. You may be required to take appropriate measures in this case. 17. Hot surface logo; not related to any certifications 18. FCC disclaimer and notification 19. Reserved for the official Restriction of Hazardous Substances logo 19a. This device must meet the standards of RoHS to enable the 20 year indication of the RoHS logo 20. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo 21. Reserved for the official C-TICK (Australian) mark. 22. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo. 23. Reserved for the official TUV logo 24. Description of product type CSN11.fm - Rev. X 5/15 EN 22 2003 Micron Technology, Inc. All rights reserved.

Figure 14: 2.5-inch Label Structure M5XX(DC/IT) 27 1 2 M500 2.5 SSD 26 Model: XXXXXXXXXX F/W:0002 3 25 24 P/N: XXXXXXXXXX 23 4 21 19 17 22 20 18 S/N: XXXXXXXXXX xxxgb SATA 6Gb/s XXX 5V 1.7A WWN: 500A0751XXXXXXXX L/N: XXXXXXXX HALOGEN FREE Product of: XXXXXXXX PSID: XXXXXXXXXX 5 6 E320115 KCC-REM-MU2-MTFDDAKxxxMAV N12610 XXXXXX 16 15 14 13 12 11 10 9 8 7 Key note definitions: 1. Market segment, form factor, and product 1a. Example: M500 2.5 SSD 2. The device s voltage level with its related amperes at normal operation (defined by Micron QRA) 3. Drive firmware revision number 4. PSID data matrix (2D) barcode 5. PSID alphanumeric code 6. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements 7. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo 8. Reserved for the official Federal Communications Commission logo 8a. Cispr B is required 9. Reserved for the official Japan VCCI logo 10. Reserved for the official Restriction of Hazardous Substances logo 10a. This device must meet the standards of RoHS to enable the 20 year indication of the RoHS logo 11. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo 12. Reserved for the official TUV logo 13. Reserved for the official C-TICK (Australian) mark. CSN11.fm - Rev. X 5/15 EN 23 2003 Micron Technology, Inc. All rights reserved.

14. Reserved for the official United Underwriters logo 15. Reserved for the official Ministry of Information and Communications (MIC) logo. 16. Reserved for the official European Regulatory Requirement logo 17. Reserved for the official Serial ATA logo 18. Country where the device is assembled, written in English 18a. With the exception of USA and UK, the full English name of the country should be included: for example, Product of Taiwan 19. Lot number for tracking the drive s manufacturing data 19a. This is listed as xxyyyyyzzz 19b. xx = 2 digits to denote manufacturing site 19c. yyyyy = 5 digits to denote the kit number (randomly generated) 19d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information) 20. Worldwide name assigned to Micron (as defined by IEEE) 21. Drive s capacity, product type, maximum interface rate, and security feature set (if applicable) 21a. Example: 512GB SATA 6Gb/s SED 22. Drive serial number 22a. Format: 12 characters: YYWWXXXXXXXX YY is the current year WW is the current Micron workweek XXXXXXXX is an eight digit hex (base 16 0 9. A F) serial number 23. Drive serial number bar code for item #18 data (follows the Code 128 standard) 24. Drive part number 25. Drive part number bar code for item #20 data (follows the Code 128 standard) 26. Micron model number 27. Micron official logo CSN11.fm - Rev. X 5/15 EN 24 2003 Micron Technology, Inc. All rights reserved.

Figure 15: M.2 Label Structure M500 1 2 3 4 5 6 7 25 23 26 24 22 Model: XXXXXXXXXX M500 M.2 SSD xxxgb SATA 6Gb/s XXX P/N: XXXXXXXXXX 3.3V 1.7A HALOGEN FREE L/N: XXXXXXXX WWN: 500A0751XXXXXXXX F/W:0002 PSID: XXXXXXXXXX Product of: XXXXXXXX S/N: XXXXXXXXXX 8 9 10 E320115 KCC-REM-MU2-MTFDDAVxxxMAV N12610 XXXXXX 21 20 19 18 17 16 15 14 13 12 11 Key note definitions: 1. Micron model number 2. Drive s capacity, product type, maximum interface rate, and security feature set (if applicable) 2a. Example: 512GB SATA 6Gb/s SED 3. Worldwide name assigned to Micron (as defined by IEEE) 4. Market segment, form factor, and product 4a. Example: M500 M.2 SSD 5. The device s voltage level with its related amperes at normal operation (defined by Micron QRA) 6. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements 7. Reserved for the official Serial ATA logo 8. PSID data matrix (2D) barcode 9. Drive firmware revision number 10. Country where the device is assembled, written in English 10a. With the exception of USA and UK, the full English name of the country should be included: for example, Product of Taiwan 11. Reserved for the official Ministry of Information and Communications (MIC) logo 12. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo 13. Reserved for the official C-TICK (Australian) mark. 14. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo 15. Reserved for the official Restriction of Hazardous Substances logo 15a. This device must meet the standards of RoHS to enable the 20 year indication of the RoHS logo 16. Reserved for the official Federal Communications Commission logo 16a. Cispr B is required CSN11.fm - Rev. X 5/15 EN 25 2003 Micron Technology, Inc. All rights reserved.

17. The MIC certification number assigned to this Micron product. 18. Reserved for the official European Regulatory Requirement logo 19. Reserved for the official TUV logo 20. Reserved for the official Japan VCCI logo 21. Reserved for the official United Underwriters logo 22. Drive serial number 22a. Format: 12 characters: YYWWXXXXXXXX YY is the current year WW is the current Micron workweek XXXXXXXX is an eight digit hex (base 16 0 9. A F) serial number 23. PSID alphanumeric code 24. Lot number for tracking the drive s manufacturing data 24a. This is listed as xxyyyyyzzz 24b. xx = 2 digits to denote manufacturing site 24c. yyyyy = 5 digits to denote the kit number (randomly generated) 24d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information) 25. Drive part number 26. Micron official logo CSN11.fm - Rev. X 5/15 EN 26 2003 Micron Technology, Inc. All rights reserved.

Figure 16: M.2 Label Structure M510/M550 1 2 3 4 5 6 7 8 9 25 23 21 26 24 22 M500 M.2 SSD xxxgb SATA 6Gb/s XXX F/W:0002 3.3V 1.7A Model: XXXXXXXXXX P/N: XXXXXXXXXX L/N: XXXXXXXX HALOGEN FREE PSID: XXXXXXXXXX S/N: YYWWXXXXXXXX Product of: XXXXXXXX WWN: 500A0751XXXXXXXX MSIP-REM-MU2-xxxxxxxxxxx E320115 N12610 D33F63 10 11 12 13 20 19 18 17 16 15 14 Key note definitions: 1. Market segment, form factor, and product 1a. Example: M500 M.2 SSD 2. Drive s capacity, product type, maximum interface rate, and security feature set (if applicable) 2a. Example: 512GB SATA 6Gb/s SED 3. Worldwide name assigned to Micron (as defined by IEEE) 4. Country where the device is assembled, written in English 4a. With the exception of USA and UK, the full English name of the country should be included: for example, Product of Taiwan 5. Drive serial number and bar code 5a. Format: 12 characters: YYWWXXXXXXXX YY is the current year WW is the current Micron workweek XXXXXXXX is an eight digit hex (base 16 0 9. A F) serial number 6. Reserved for the official TUV logo 7. Reserved for the official United Underwriters logo 8. Reserved for the official Japan VCCI logo 9. Reserved for the official Serial ATA logo 10. Reserved for the official Federal Communications Commission logo 10a. Cispr B is required 11. Reserved for the official Ministry of Information and Communications (MIC) logo 12. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo 13. Reserved for the official European Regulatory Requirement logo 14. Reserved for the official C-TICK (Australian) mark. 15. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo CSN11.fm - Rev. X 5/15 EN 27 2003 Micron Technology, Inc. All rights reserved.

16. Reserved for the official Restriction of Hazardous Substances logo 16a. This device must meet the standards of RoHS to enable the 20 year indication of the RoHS logo 17. The MIC certification number assigned to this Micron product. 18. PSID data matrix (2D) barcode 19. The device s voltage level with its related amperes at normal operation (defined by Micron QRA) 20. Drive firmware revision number 21. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements 22. PSID alphanumeric code 23. Lot number for tracking the drive s manufacturing data 23a. This is listed as xxyyyyyzzz 23b. xx = 2 digits to denote manufacturing site 23c. yyyyy = 5 digits to denote the kit number (randomly generated) 23d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information) 24. Drive part number 25. Micron model number 26. Micron official logo CSN11.fm - Rev. X 5/15 EN 28 2003 Micron Technology, Inc. All rights reserved.

Figure 17: msata Label Structure M5XX 28 1 2 3 26 27 25 M500 msata SSD Model: XXXXXXXXXX F/W:0002 P/N: XXXXXXXXXX xxxgb SATA 6Gb/s SED 3.3V 1.7A L/N: XXXXXXXX 4 5 6 24 22 20 23 21 S/N: XXXXXXXXXX HALOGEN FREE WWN: 500A0751XXXXXXXX Product of: XXXXXXXX PSID: XXXXXXXXXX KCC-REM-MTFDDATxxxMAV 7 8 E320115 N12610 XXXXXX 19 18 16 14 13 11 10 9 17 15 12 Key note definitions: 1. Market segment, form factor, and product 1a. Example: M500 msata SSD 2. Drive firmware revision number 3. Drive s capacity, product type, maximum interface rate, and security feature set (if applicable) 3a. Example: 512GB SATA 6Gb/s SED 4. The device s voltage level with its related amperes at normal operation (defined by Micron QRA) 5. Lot number for tracking the drive s manufacturing data 5a. This is listed as xxyyyyyzzz 5b. xx = 2 digits to denote manufacturing site 5c. yyyyy = 5 digits to denote the kit number (randomly generated) 5d. zzz = 3 digits denoting a sublot size (to provide greater resolution of manufacturing information) 6. Halogen-free mark indicating that the drive meets the IPC low-halogen requirements 7. Country where the device is assembled, written in English 7a. With the exception of USA and UK, the full English name of the country should be included: for example, Product of Taiwan 8. PSID data matrix (2D) barcode CSN11.fm - Rev. X 5/15 EN 29 2003 Micron Technology, Inc. All rights reserved.

9. Reserved for the official Bureau of Standards Metrology and Inspection (BSMI) logo 10. Reserved for the official Restriction of Hazardous Substances logo 10a. This device must meet the standards of RoHS to enable the 20 year indication of the RoHS logo 11. Reserved for the official Waste Electrical and Electronics Equipment (WEEE) logo 12. Reserved for the official C-TICK (Australian) mark. 13. Reserved for the official TUV logo 14. Reserved for the official Federal Communications Commission logo 14a. Cispr B is required 15. Reserved for the official European Regulatory Requirement logo 16. Reserved for the official Japan VCCI logo. 17. Reserved for the official United Underwriters logo 18. Reserved for the official Serial ATA logo 19. Reserved for the official Ministry of Information and Communications (MIC) logo. 20. The MIC certification number assigned to this Micron product. 21. PSID alphanumeric code 22. Worldwide name assigned to Micron (as defined by IEEE) 23. Drive serial number 23a. Format: 12 characters: YYWWXXXXXXXX YY is the current year WW is the current Micron workweek XXXXXXXX is an eight digit hex (base 16 0 9. A F) serial number 24. Drive serial number bar code for item #18 data (follows the Code 128 standard) 25. Drive part number 26. Drive part number bar code for item #20 data (follows the Code 128 standard) 27. Micron model number 28. Micron official logo CSN11.fm - Rev. X 5/15 EN 30 2003 Micron Technology, Inc. All rights reserved.

Figure 18: Embedded USB Label Structure 1 2 10 9 XXXXXXXXXXXX-XXX XXXXXXXXXX YYYYWW FW: XX 6 LEAD FREE, HF RealSSD exxx DEN X COUNTRY OF ORIGIN XXXX XX 4 3 5 E320115 8 7 6 Labels for engineering samples replace these logos with text: ENGINEERING SAMPLE. Key note definitions: 1. Micron logo 2. USB part number 3. Lot ID for tracking the USB s manufacturing data including a six-digit date code 4. Firmware revision 5. Lead free statement 6. Reserved for the official Federal Communications Commission logo 6a. Cispr B is required 7. Reserved for the official United Underwriters logo 8. Reserved for the official European Regulatory Requirement logo 9. Country where the device is assembled, written in English 10. Model number and density 10a. Example: RealSSD e230 6GB CSN11.fm - Rev. X 5/15 EN 31 2003 Micron Technology, Inc. All rights reserved.

Micron Packaging Labels Master Container Labels Bar Code Information CSN-11: Product Marks/Product and Packaging Labels Micron Packaging Labels Micron uses various packaging labels to enable quick identification of packaged contents, provide a simple order verification method, and indicate inner-package moisture levels. All labels are manufactured from matte-coated facestock or synthetic paper and contain acrylic- or water-based adhesive. See CSN-16 for complete information on all Micron packaging materials, including recyclable materials. For all shipments, Micron uses standard bar code labels that conform to EIA Standard 556. The bar code labels enable customers to scan Micron containers for quick order verification. Figure 20 on page 33 shows an example of the standard bar code label used on master containers. Each box also carries its own bar code label (see the Individual Packaging Labels section). The following information appears on the master container labels only: (3S/4S) - PKG ID: Invoice or packing slip number (1P) - SPLR PROD ID: Reserved for individual customer requirements (Q) - QUANTITY: Number of parts in master container (K) - TRANS ID: Customer purchase order number (P) - CUST PART NO: If a customer part number is not designated, the Micron part number will be printed (4L) - Country of Origin: The country in which the product was made Figure 19: Standard Master Container Shipping Label Micron Technology, Inc. For Company Name 8000 S. Federal Way BOISE ID 83707 0006 USA COMPANY NAME ADDRESS CITY STATE/PROVINCE COUNTRY ZIP CODE US01 WB # 638030055867 / 0087659818 Child W/B: 00821466 ************* Piece 1 of 1 ************* PO #s XXXXXXXX XXXXXXXX PKG ID: 87659819A1 CSN11.fm - Rev. X 5/15 EN 32 2003 Micron Technology, Inc. All rights reserved.

Individual Packaging Labels Figure 20: Standard Master Container Bar Code Label (3S) PKG ID: 87189127A1 (1P) SPLR PROD ID: MT29F2G08AACWP Ship_To_Name Address City, ST ZIP Code Country Micron Technology, Inc. 1160 Exchange, Doc 1D Boise ID 83715 USA (Q) QUANTITY: (K) TRANS ID: 1793 EA 2596PW3329100 PACKAGE COUNT: 1 OF 1 16.0 x 12.0 x 8.0 in 40.6 x 30.5 x 20.8 cm PACKAGE WEIGHT: 10.9 lb/4.9 kg SHIP DATE: 08/16/2007 (P) CUST PART NO: MT29F2G08AACWP (4L) COUNTRY OF ORIGIN US Additional Label Information The following information appears in the far-right portion of the master container labels: Ship-to name: Customer s name and ship-to address Ship-from name: Micron s name and address PACKAGE COUNT: Master container package count PACKAGE WEIGHT: Package size SHIP DATE: Date the product leaves the factory Individual Packaging Labels For quick order verification, Micron attaches a standard bar code label and inner packing container label on the inner packing container. Additionally, the moisturebarrier or static-shielding bag has a moisture sensitivity (MST) label and a standard bar code label attached to the front. If ordering in tape and reel, the tape-and-reel carrier will have a standard bar code label attached. Figure 21 on page 34 shows an example of the standard bar code label, Figure 22 on page 34 shows an example of Micron s inner packing container label, and Figure 24 on page 35 shows an example of Micron s MST label. Refer to Figure 25 on page 35 for approximate placement of these labels on Micron s moisture-barrier and static-shielding bags. CSN11.fm - Rev. X 5/15 EN 33 2003 Micron Technology, Inc. All rights reserved.

Individual Packaging Labels Figure 21: Standard Bar Code Label PART NUMBER: (1P) MT46V16M16P 6T QUANTITY: 1000 DATE: 200704 235C MST: 3 (1T)12 34567. 89 260C MST: 3 Figure 22, Micron s Inner Packing Container Label, indicates the RoHS status of compliance with either RoHS or RoHS and HF (for those products that are also free of halogens). This space will be blank on labels for containers that hold parts with lead. Also, an asterisk (*) at the end of the date code indicates that the container holds a mix of product from more than one date; the date shown is that of the oldest product in the container. Figure 22: Micron s Inner Packing Container Label Caution BXW9WZM.11 For U.S.: Country of Origin Korea For EU: Circuits Diffused in Taiwan QTY: 1000 (9D) 201214 A T69M RoHS/HF TNN 111142 Moisture-Sensitive MT46H128M32L2KQ 5 IT:A Figure 23: Micron s Inner Packing Container Label for Modules and SSDs BG112JM.3S QTY: 100 HU (9D) 201205 Country of Origin U.S. 12 Redwood Crescent E.K. G74 5PA U.K. BOX FNN FAB 6 RoHS 113904 MT36HTG51272FZ 667H1D66A Notes: 1. The European Regulatory Requirement logo may or may not be present on a particular inner packing label. CSN11.fm - Rev. X 5/15 EN 34 2003 Micron Technology, Inc. All rights reserved.

Individual Packaging Labels Figure 24: Micron s Moisture Sensitivity (MST) Label 235C Peak Package Body Temp Moisture Level: 2 Floor Life: One Year Condition < = 30 deg. C/60% RH 260C Peak Package Body Temp Floor Life: One Year Package Seal Date: Apr 08 2004 Operator: JDOE Moisture Level: Condition < = 30 deg. C/60% RH 2 Figure 25: Labeling on Moisture-Barrier and Static-Shielding Bags 1 eat-sealed moisture-barrier bag ESD and moisture precautions Internal label 2 MST label with moisture level, floor life, and package seal date 3 Standard bar code label 4 Notes: 1. This figure indicates the approximate locations only of the various labels. 2. Internal labels are applicable to tube and tray shipments only and may or may not be present on every bag. 3. See Figure 24. 4. See Figure 21. CSN11.fm - Rev. X 5/15 EN 35 2003 Micron Technology, Inc. All rights reserved.

Individual Packaging Labels 8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900 www.micron.com/productsupport Customer Comment Line: 800-932-4992 Micron and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners. CSN11.fm - Rev. X 5/15 EN 36 2003 Micron Technology, Inc. All rights reserved.

Revision History CSN-11: Product Marks/Product and Packaging Labels Revision History Rev.X...5/15 Updated Figure 4. Updated Figure 23. Rev.W...5/15 Added Note 2 to Figure 4. Rev.V...10/14 Updated information on page one. Added information for legacy components with Elpida part marks. Added DC and IT mark to M5xx SSD label title. Added 2.5in P420m label information. Rev.U...7/14 Added M.2 M510/M550 label. Rev.T...1/14 Added.../date code (YWW) to Line 1 of the Module Label Information section. Rev.S...12/13 Added European Regulatory Requirement logo and note to Figures 3 and 20. Corrected numbering on pages 4 and 5. Rev.R...8/13 Corrected label titles for Figure 14, Figure 16, and Figure 17. Rev.R...7/13 Added new SSD labels. Rev.Q...5/13 Added new SSD labels. Rev.P...2/13 Updated Inner Packing Container and Standard Master Container Shipping labels. Corrected note references for Figure 15. Rev.O...6/12 Added Microdisplay panel label. Rev.N...3/12 Added the Embedded USB label. Rev.M...2/12 Added the SSD msata label. Rev.L...2/12 Corrected references in Figure 12. Rev.K...10/11 Updated security feature set to Figure 6 and it s notes. CSN11.fm - Rev. X 5/15 EN 37 2003 Micron Technology, Inc. All rights reserved.

Revision History Rev.J...6/11 Added aliases to the links for the part numbering guides and FBGA date codes, and the FBGA Part Marking Decoder. Added specific date code information. Updated country codes. Added SSD C400 label information. Rev.H...2/10 Added date code information to the text for Figure 9 Rev.G...1/10 Corrected typo Rev.F...12/09 Added SSD product labels Added packaging label information from CSN-16 Rev.E...10/09 Updated template Updated Figure 3, Module Label Rev.D...6/08 Added Korea to note 1 country codes Updated and renamed Figure 2 Deleted Figure 3, DDR2/GDDR3 FBGA Abbreviated Component Mark Rev.C...5/07 Added Taiwan to note 1 country codes Rev. 12/9/05 Rev. 2/14/05 Added logo information to Figure 1 on page 2 and Figure 2 on page 3 Added China to note 1 country codes CSN11.fm - Rev. X 5/15 EN 38 2003 Micron Technology, Inc. All rights reserved.