Silicone Materials for Electronic Devices and Component Assemblies

Silicone Materials for Electronic Devices and Component Assemblies

Contents Overview...- Industry Overview...3-4 Product Index Adhesives and Sealants...5-6 Grease...7 Coating Materials...7-8 Encapsulants / Potting Materials...9- Selection Guide...- Product Details Part Condensation Cure...3-7 Part Heat (Addition) Cure...8- Part Room Temperature. Cure...- Part Heat (Addition) Cure...3-4 Part & Part Gels...5-6 Junction Coating Resin (JCR) Grades...7 Grease...8 UL Certifications...9-3 Technical Information...3-3 FAQ...33 Silicone Product Profile The products introduced in this selector guide consist of RTV (Room Temperature Vulcanizing) silicone products that are commonly found in Electric and Electronic applications and component assemblies. This family of silicone products consists of both Room Temperature Cure and Heat (Addition) Cure grades. Momentive Performance Materials offers a comprehensive portfolio of silicone solutions to help meet a broad array of handling and performance needs in electronic components and assemblies. Selection of the appropriate type of RTV depends upon the required manufacturing process, handling requirements, curing RTV conditions, equipment, and desired material properties. Condensation Cure Condensation cure silicone products cure when exposed to moisture in the environment at room temperature. These materials are categorized into Alkoxy, Acetoxy, or Oxime based on the byproducts that occur during cure. Heat (Addition) Cure Heat cure grades cure upon exposure to elevated heat or room temperature. Part Condensation Cure Sealing & Adhesion Silicones are used in a wide array of applications for bonding components, and sealing against moisture or environmental contaminants. A comprehensive portfolio of Part and Part Adhesives and Sealants, many of which are excellent candidates for assembly applications on or near sensitive electrical and electronic components, are available. These materials are applied by a variety of methods ranging from manual dispensing to autodispensing units for tube, cartridge, pail, or drum packages. Mixing for Part grades may be accomplished by either manual processes or meter mix dispensing, depending on production volume and post-mix material properties. Performance Considerations - Temperature Resistance - Dielectric Resistance - Flame Retardancy - Volatility - Adhesion - Mechanical Strength - Hardness - Thermal Conductivity Process Considerations - Viscosity - Cure Mechanism - Cure Temperature - Cure Time - Pot Life Coating The Coating process involves the application of silicone in a thin protective layer to a component surface by methods such as dip, flow, spray, and selective robotic Potting & Encapsulation Silicone rubber and gels are widely used in electronics to ensure mechanical and environmental protection. A full range of products are offered in various cure speeds, viscosities, and coating. Selection of a silicone coating material for a particular application involves the consideration of various performance and processing criteria. Performance Considerations - Temperature Resistance - Dielectric Resistance - Flame Retardancy - Volatility - Stress Relief Process Considerations - Viscosity - Cure Mechanism - Cure Temperature - Cure Time - Pot Life performance, many of which offer enhancements for thermal cycling protection, stress relief, material strength, flame retardancy, or optical clarity. Silicone Silicone Varnish Millable Silicone Rubber Silicone Oil Part Heat (Addition) Cure Condensation Cure Heat (Addition) Cure Performance Considerations - Temperature Resistance - Dielectric Resistance - Flame Retardancy - Volatility - Adhesion - Stress Relief - Release Properties - Thermal Conductivity Process Considerations Relative Performance Characteristics Property Silicone RTV Epoxy Urethane Temperature Range -5 ~ + o C -5 ~ +5 o C -3 ~ + o C - Viscosity - Cure Mechanism - Cure Temperature - Cure Time - Pot Life Heat Resistance Good Poor Poor Flame Retardancy Good None None UV Stability Good Poor Poor Ozone Stability Good Poor Poor Modulus High High As a base material silicone demonstrates flame retardant properties comparable to UL94HB.

Industries Served Electronic Devices and Power Modules Momentive Performance Materials is a driving force as a supplier of advanced silicone technology to the electronics industry. Increasing electronic component densities and performance demands have created a need for specialized silicone solutions from Momentive for a broad mix of performance and handling requirements. Typical Applications: - Power converters - Inverters - Hybrid ICs - Micro-Electronic packaging - High-voltage component insulation - Membrane switches - Photo couplers Typical Applications: - Board-level adhesion, fixing, and sealing - PCB coating - Component encapsulation - Junction Coating Resins Consumer Electronics Silicones are commonly used in a variety of consumer electronics applications. In addition to providing adhesion to many substrates, an array of grades are available to provide heat resistance, flame retardancy, low volatility for sensitive components, and moisture protection. Typical Applications: - Flat panel displays - PCs and Smart Phones - LED Lighting Automotive Electronics The automotive industry plays a critical role in integrating new electronic technologies. As more and more components migrate to electronic solutions, silicones play an increasingly important role in helping deliver material solutions that contribute to design flexibility and long-term component reliability under harsh operating conditions. Typical Applications: - ECU potting, sealing, coating - Wire connector sealing - Sealing, encapsulation in a broad range of sensors - HVAC system sealing - Vibration dampening - Headlamp assemblies Aviation and Aerospace Avionics and frame assembly needs in Aviation and Aerospace are served through silicone adhesives, coating, encapsulation and potting materials that help withstand stress and temperature extremes. Typical Applications: - Avionics - Circuit and terminal protection - Wire sealants - Engine gasketing - Cargo door, window sealing - Weatherstrip adhesives - Aviation lighting - Ventilation ducts - Steam iron plate seals Board Assembly Silicones are found in boardlevel adhesion, coating, and encapsulation applications, and contribute to the longterm, reliable performance of many components and assemblies. A wide portfolio of products is available, providing flame retardancy, thermal conductivity, temperature resistance, low-volatility, or high-purity benefits. - Air conditioner units - Control panel insulation - PCB fixing and sealing Energy Reliability of electronic components and the ability for panels to withstand harsh conditions over the lifecycle of the product are important considerations in solar energy applications. Momentive Performance Materials helps serve this growing industry with its range of potting materials and sealants. Typical Applications: - Terminal box potting - Box and base sealing - Aluminum frame and glass / EVA plate sealing 3 4

Product Overview: Adhesives & Sealants Type Part Condensation Cure Part Heat Cure P RT Part Heat Cure Grade Cure Chemistry Cured Property Feature Flowability Flame Retardancy Volatility Thermally Conductive Regulatory restrictions may apply to products in certain countries. Please contact a Momentive Performance Materials sales representatives for availability in specific regions. Performance RTV33 Alkoxy Rubber non-flowable sealant. Non-flowable UL94 V- P. 3 RTV67 Alkoxy Rubber High-strength paste adhesive with and Mil Spec. Non-flowable UL94 HB MIL-A-4646B P. 3 TSE385 Alkoxy Rubber Paste adhesive. Suitable for PC substrates. Non-flowable P. 3 TSE3853-W Alkoxy Rubber, semi-flowable paste. Semi-flowable UL94 V- P. 4 TSE3854DS Alkoxy Rubber paste adhesive. Non-flowable UL94 V- P. 3 TN35 Alkoxy Rubber Fast tack, low volatile paste paste adhesive. Non-flowable P. 3 TN385 Alkoxy Rubber Fast tack, low volatile paste paste adhesive. Non-flowable UL94 V- P. 3 TSE394M Alkoxy Rubber Fast tack, thermally conductive flowable sealant. Flowable P. 4 TSE3944 Alkoxy Rubber volatile, flowable sealant. Semi-flowable UL94 V- P. 4 TN335 Alkoxy Rubber Fast tack, low volatile flowable adhesive / sealant Flowable P. 4 TSE397 Alkoxy Rubber Flowable adhesive / sealant. Flowable P. 4 TSE3976-B Alkoxy Rubber volatile, temperature resistant sealant.. Flowable UL94 HB P. 4 XE-B53 Alkoxy Rubber Fast tack, low volatile, thermally conductive adhesive.. Non-flowable UL94 HB P. 3 FRV6 Acetoxy Rubber Fuel, solvent, chemical, and temperature-resistant fluoro sealant. Non-flowable P. 6 RTV series Acetoxy Rubber FDA, USDA, and NSF compliant paste adhesive. Mil Spec. Non-flowable MIL-A-466B P. 7 RTV6 Acetoxy Rubber Temperature-resistant adhesive. FDA, USDA, & NSF compliant. Mil Spec. Non-flowable MIL-A-466B P. 7 RTV6 Acetoxy Rubber Temperature-resistant flowable sealant. FDA, USDA, & NSF compliant. Mil Spec. Flowable MIL-A-466B P. 7 RTV57 Acetoxy Rubber High strength paste / adhesive. Non-flowable P. 7 RTV59 Acetoxy Rubber High strength paste / adhesive. Temperature-resistant. Non-flowable P. 7 TSE37 Acetoxy Rubber Fast tack, general purpose paste adhesive. Non-flowable P. 7 TSE38 Oxime Rubber Fast tack, general purpose adhesive paste.. Non-flowable UL94 HB P. 5 TSE386 Oxime Rubber Fast tack adhesive for high-temperature applications. Non-flowable P. 6 TSE384-G Oxime Rubber general purpose adhesive / sealant. Semi-flowable UL94 V- P. 6 TSE3843-W Oxime Rubber general purpose adhesive / sealant. Semi-flowable UL94 V- P. 6 TSE384-B Oxime Rubber general purpose adhesive / sealant. Non-flowable UL94 V- P. 6 TSE387 Oxime Rubber General purpose flowable adhesive / sealant. Flowable P. 6 TSE3877-B Oxime Rubber Flowable sealant for high-temperature applications. Flowable P. 6 TSE388 Oxime Rubber Flowable general purpose adhesive / sealant. Flowable P. 6 TSE3 Heat Rubber Thixotropic adhesive / sealant. Semi-flowable P. 8 TSE3 Heat Rubber Flowable adhesive / sealant. Flowable P. 8 TSE3S Heat Rubber Flowable adhesive / sealant. Flowable P. 9 TSE3S Heat Rubber, semi-flowable adhesive / sealant. Semi-flowable UL94 HB P. 8 TSE36 Heat Rubber, high temperature-resistant adhesive / sealant. Flowable UL94 HB P. 9 TSE36-G Heat Rubber High temperature-resistant adhesive / sealant. Flowable P. 8 TSE36M Heat Rubber High temperature-resistant adhesive / sealant. Flowable P. 9 TSE38-G Heat Rubber Thermally conductive adhesive. Flowable P. 8 TSE38-G Heat Rubber Thermally conductive adhesive. Flowable P. 9 XE3-B38 Heat Rubber General purpose adhesive / sealant. Non-flowable P. 8 RTV577 Condensation Rubber Extreme low temperature resistant sealant. Release capability. Non-flowable P. RTV88 Condensation Rubber Semi-flowable temperature-resistant sealant. Release capability. Semi-flowable P. TSE336 Heat Rubber General purpose adhesive / sealant. Non-flowable P. 3 TSE338 Heat Rubber Thermally conductive adhesive. Fast cure at elevated temperatures. Flowable P. 3 XE4-A45 Heat Rubber Heat resistant, thermally conductive adhesive. Semi-flowable P. 3 TSE36M-EX in Europe and the Americas High Temp. Resistance Temp. Resistance FDA Compliant MIL-Spec Product Detail 5 6

Product Overview: Coating Materials Type Part Condensation Cure Part Heat Cure P RT Part Heat Cure Grade Cure Chemistry Cured Property Feature Regulatory restrictions may apply to products in certain countries. Please contact a Momentive Performance Materials sales representatives for availability in specific regions. Performance ECC3 Alkoxy Rubber Fast cure conformal coating material. Solvent free Flowable P. 5 ECC35S Alkoxy Rubber Fast cure conformal coating material. volatile. Solvent free Flowable P. 5 ECS6 Alkoxy Rubber High purity repairable electrode coating. Fast tack. Flowable P. 5 ECS6 Alkoxy Rubber High purity, non-repairable type electrode coating.. Flowable UL94 HB P. 5 ECS69FR Alkoxy Rubber High purity, non-repairable type electrode coating.. Flowable UL94 V- P. 4 RTV6 Alkoxy Rubber flowable sealant. Flowable UL94 HB P. 4 TSE394M Alkoxy Rubber Fast tack, thermally conductive flowable sealant. Flowable P. 4 TSE3944 Alkoxy Rubber volatile, flowable sealant. Semi-flowable UL94 V- P. 4 TN335 Alkoxy Rubber Fast tack, low volatile flowable adhesive / sealant Flowable P. 4 TSE397 Alkoxy Rubber Flowable sealant. Flowable P. 4 TSE3976-B Alkoxy Rubber volatile, temperature resistant sealant.. Flowable UL94 HB P. 4 TSE398 Alkoxy Rubber Pourable coating / encapsulant. Flowable P. 5 TN375 Alkoxy Rubber volatile, low viscosity coating / potting material Flowable P. 5 XE-A533S Alkoxy Rubber volatile,, thermally conductive coating & potting. Flowable UL94 V- P. 4 RTV series Acetoxy Rubber General purpose coating / encapsulant. FDA, USDA, and NSF compliant. Mil Spec. Flowable MIL-A-466B P. 7 TSE387 Oxime Rubber General purpose flowable sealant / coating. Flowable P. 6 TSE3877-B Oxime Rubber Flowable sealant for high-temperature applications. Flowable P. 6 TSE388 Oxime Rubber Flowable, general purpose sealant / coating. Flowable P. 6 TSE389 Oxime Rubber Flowable, coating / sealant. Flowable UL94 HB P. 6 ECC4865 Heat Rubber Extreme low viscosity coating material with UV tracer. Flowable P. TSE3S Heat Rubber Flowable sealant / coating material. Flowable P. 9 TSE35 Heat Rubber Flowable coating / encapsulant. Flowable P. TSE35 Heat Rubber Flowable coating / encapsulant. Flowable P. TSE35 Heat Rubber Flowable coating material. Semi-flowable P. TSE35-C Heat Rubber Flowable coating material. Semi-flowable P. TSE35-B Heat Rubber Flowable coating / encapsulant. Flowable P. TSJ355 Heat Rubber High purity JCR-grade white rubber. Semi-flowable P. 7 TSJ395-W Heat Gel High purity JCR-grade white gel. Semi-flowable P. 7 TSJ385 Heat Gel High purity JCR-grade translucent gel. Semi-flowable P. 7 RTV Condensation Rubber General purpose encapsulation and potting. FDA compliant. Flowable P. TSE333 Heat Rubber Transparent coating / encapsulant. Fast cure at elevated temperatures. Flowable P. 4 TSE333 Heat Rubber, thermally conductive, coating / encapsulant. Flowable UL94 V- P. 3 TSE333K Heat Rubber viscosity variant of TSE333. Flowable UL94 V- P. 4 TSE333K EX Heat Rubber viscosity variant of TSE333. Flowable UL94 V- P. 3 XE4-B5778 Heat Rubber High purity JCR-grade translucent rubber. Semi-flowable P. 7 TSJ375 Heat Gel High purity JCR-grade thixotropic gel. Semi-flowable P. 7 TSE333K for Asia Pacific, TSE333K EX for Europe and the Americas Flowability Flame Retardancy Volatility Thermally Conductive High Temp. Resistance JCR Grade FDA Compliant MIL-Spec Product Detail Grease - Product Index Grade Feature Thermally Conductive Bleed Performance Volatility Heat Resistant Product Detail TSK533 Moderate thermal conductivity with heat resistance. P. 8 TSK537 General electrical insulation. Swell resistant on silicone. P. 8 TSK55 General electrical insulation, arc resistance. P. 8 TSK55 Insulator protection from salt, dust. P. 8 YG6 Moderate thermal conductivity. P. 8 YG64 Moderate thermal conductivity, low-bleed performance. P. 8 YG66 Moderate thermal conductivity. P. 8 TIG High thermal conductivity. P. 8 7 8

Product Overview: Encapsulants and Potting Materials Type Part Cond. Cure Part Heat Cure Part Room Temp. Cure Part Heat Cure Grade Cure Chemistry Cured Property Feature Flowability Flame Retardancy Volatility Thermally Conductive Regulatory restrictions may apply to products in certain countries. Please contact a Momentive Performance Materials sales representatives for availability in specific regions. Performance RTV6 Alkoxy Rubber flowable encapsulant. Flowable UL94 HB P. 4 TSE398 Alkoxy Rubber Pourable coating / encapsulant. Flowable P. 5 TN375 Alkoxy Rubber volatile, low viscosity potting / coating material. Flowable P. 5 XE-A533S Alkoxy Rubber volatile,, thermally conductive coating & potting. Flowable UL94 V- P. 4 RTV series Acetoxy Rubber General purpose coating / encapsulant. FDA, USDA, and NSF compliant. Mil Spec. Flowable MIL-A-466B P. 7 RTV6 Acetoxy Rubber Temperature-resistant flowable sealant. FDA, USDA, and NSF compliant. Mil Spec. Flowable MIL-A-466B P. 7 TSE35 Heat Rubber Flowable coating / encapsulant. Flowable P. TSE35 Heat Rubber Flowable coating / encapsulant. Flowable P. TSE35-B Heat Rubber Flowable coating / encapsulant. Flowable P. TSE35 Heat Gel viscosity potting gel. Flowable P. 5 TSE35-FR Heat Gel variant of TSE35. Flowable UL94 V- P. 5 TSE35-L Heat Gel penetration variant of TSE35. Flowable P. 5 TSE353 Heat Gel High penetration gel. Flowable P. 5 RTV Condensation Rubber General purpose encapsulation and potting. FDA compliant. Flowable P. RTV3 Condensation Rubber High temperature resistant potting. Good release properties. Flowable P. RTV566 Condensation Rubber volatile, high-low temperature-resistance. Flowable P. RTV6 Condensation Rubber Extreme high temperature-resistant coating / potting. Release capability. Flowable P. TSE3663 Condensation Rubber Flowable encapsulant / potting material. Flowable P. TSE366 Condensation Rubber Flowable encapsulant / potting material. Flowable UL94 HB P. TSE3664K Condensation Rubber, flowable encapsulant / potting material. Flowable UL94 V- P. RTV65 Heat Rubber High strength potting material. Fast cure at elevated temperatures. Flowable P. 3 TSE33 Heat Rubber Transparent potting / encapsulant with excellent release properties. Flowable P. 3 TSE333 Heat Rubber viscosity, transparent potting material. Fast cure at elevated temperatures. Flowable P. 4 TSE333 Heat Rubber, thermally conductive, coating / encapsulant. Flowable UL94 V- P. 3 TSE333K Heat Rubber viscosity variant of TSE333. Flowable UL94 V- P. 4 TSE333K EX Heat Rubber viscosity variant of TSE333. Flowable UL94 V- P. 3 TSE343 Heat Rubber, thermally conductive potting material. Release capability. Flowable UL94 V- P. 4 TSE343-H Heat Rubber, thermally conductive potting material. Release capability. Flowable UL94 V- P. 4 XE4-B789 Heat Rubber low-viscosity potting material. temperture cure. Release capability. Flowable UL94 V- P. 4 YE58 Heat Rubber viscosity potting material. Good release properties. Flowable P. 4 RTV636-D Heat Gel viscosity potting gel with fast cure at low temperatures. Flowable P. 6 TSE36 Heat Gel Fast cure at low temperatures. Flowable P. 6 TSE37 Heat Gel High-elongation gel with low temperature cure. Flowable P. 6 TSE333K for Asia Pacific, TSE333K EX for Europe and the Americas High Temp. Resistance Temp. Resistance FDA Compliant MIL-Spec Product Detail 9

Selection Guide Part Grades Viscosity Range Non- Flowable High Viscosity Medium Viscosity Viscosity Thermally Conductive BLACK=Rubber RED=Gels Volatility UL Certified Alkoxy Acetoxy Oxime Heat Performance Temp. Resistant FDA Compliant General Purpose TN385 TN35 TSE3854DS TSE385 XE-B53 TN385 TN385 XE-B53 RTV33 FRV6 RTV RTV57 RTV6 RTV6 TSE37 TSE38 TSE386 TSE384-B XE3-B38 TSE3976-B TSE3853-W TSE3976-B TSE397 TSE3976-B RTV59 TSE3843-W TSE384-G TSE3877-B TSE3843-W TSE3 TSE3 TSE394M TSE3944 TSE3944 TSE398 XE-A533S XE-A533S XE-A533S TN335 RTV6 RTV67 RTV RTV6 RTV RTV6 TSE387 TSE388 TSE38-G TSE3S TSE36 TSE3S TSE38-G TSE35 TSE36-G TSE36M ECC35S ECS6 ECC3 ECS6 ECS69FR ECS6 ECS69FR TN375 TSE389 TSE35FR TSE35 TSE35-L TSE353 TSE35 TSE35 TSE35 TSE35-C TSE35-B Part Grades Viscosity Range Non-Flowable Non-Flowable High Viscosity Medium Viscosity Viscosity High Viscosity - Flowable Thermally Conductive Volatility BLACK=Rubber RED=Gels UL Certified Performance Temp. Resistant Viscosity and flowability of the silicone material are often key factors in the selection of a material for use in sealing, coating, and encapsulation / potting applications. A broad array of material performance and viscosity combinations are provided to help match the requirements of many applications. Heat FDA Compliant Room Temperature General Purpose TSE336 XE4-A45 XE4-A45 TSE397 RTV577 RTV88 TSE338 RTV566 RTV3 RTV RTV566 RTV6 TSE333 TSE333 RTV65 RTV636-D TSE333K TSE333K TSE33 TSE343 TSE343 TSE333 TSE343-H TSE343-H TSE36 XE4-B789 TSE37 TSE333 YE58 TSE366 RTV567 RTV567 TSE3663 TSE3664K TSE3664K Application Geometry and Cure Chemistry Options The shape and conditions of the part are important in selecting the suitable silicone grade for each application. Medium Viscosity-Flowable The following are some general guidelines: Viscosity - Flowable Cure System Performance Guide Attribute Fast Cure Alkoxy Slow Cure Acetoxy Oxime Heat Cure Shallow Cavity / Small Mass Complex Design - Exposed Surface Deep Cavity / Large Mass Enclosed System Cure Byproduct Alcohol Alcohol Acetic Acid Methylethyl Ketoxime Cure Speed Fast Slow Fast Moderate Very Fast None 6mm 6mm mm mm mm 5mm Corrosion on Copper None None Yes Yes None Corrosion on Metals None None Yes None None Odor Strong None Strength Good Good Very Strong Good Good Selection Options: - Part Condensation Cure - Part Heat Cure - Part Room Temp. Cure - Part Heat Cure Selection Options: - Part Heat Cure - Part Room Temp. Cure - Part Heat Cure Selection Options: - Part Heat Cure - Part Room Temp. Cure - Part Heat Cure Selection Options: - Part Heat Cure - Part Heat Cure

Product Details - Part Condensation Cure Grades Properties RTV67 RTV33 TSE385 TSE3854DS TN35 TN385 XE-B53 TSE3944 TSE3853-W TSE397 TSE3976-B XE-A533S TSE394M TN335 RTV6 ECS69FR Cure Chemistry Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Flowability Non-Flowable Non-Flowable Non-Flowable Non-Flowable Non-Flowable Non-Flowable Non-Flowable Semi-Flowable Semi-Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Application Color Packaging High strength, paste adhesive with MILA- 466B and UL certified paste adhesive. Paste adhesive Paste adhesive. Fast tack, low volatile paste adhesive. Fast tack, low volatile paste adhesive. Fast tack, low volatile, thermally conductive paste adhesive. Flowable low volatile adhesive / sealant. Flowable adhesive / sealant. Flowable adhesive / sealant. Flowable, high-temperature resistant low volatile adhesive / sealant. UL certified Flowable, low volatile thermally conductive potting Adhesive / Sealant Coating Encapsulant / Potting Viscosity (3 o C) Pa.s (P) - - - - - - - - 4 (4) () () 6 (6) 5 (5) 47 (47) 38 (38) 8 (8) Application Rate g/min 8 65 - - - - - - - - - - - - - - Tack Free Time min 4 6 9 5 7 7 5 5 5 5 5 9 4 7 Specific Gravity (3 o C)..3..33.4.63.59.3.3.4.8.64.64.4.4. Hardness 37 46 35 45 46 8 38 34 6 3 63 63 4 5 8 Tensile Strength MPa (psi) 5.5 (8) 4.5 (65).9 (4) 3. (435).8 (6).3 (335) 3.6 (5).5 ().3 (335).5 ().7 (45) 3.9 (565) 3. (465).5 ().9 (75).4 (35) Elongation % 6 5 39 3 33 5 4 7 7 35 7 4 3 5 Adhesive Strength MPa (psi). (75) -. (9). (3). (75).3 (9).3 (9). (45).3 (9). (6).3 (9).3 (9).4 (5). (45) -. (75) Thermal Conductivity W/m.K - -.7.34.8.7.3.36.34.8.8.83.83.8 - - Volume Resistivity MΩ.m 3.x 7 3.x 7 5.x 7.x 6.x 6 4.x 7.x 7.x 7.x 6.x 7.x 7 4.x 6 4.x 6.x 7 4.x 6.x 5 Dielectric Strength kv/mm 5 3 7 6 Dielectric Constant (6Hz).8.8 (Hz) 3. 3. 4..9.6 3.8 3..9 3.5 4. 4..7.8 3. Dissipation Factor (6Hz).6. (Hz)....4.5...5..4.4...5 Molecular Siloxane (D3-D) wt% - - - -....8 - -.5.5 -.8 - - Flame Retardancy UL94 HB UL94 V- UL94 V- UL94 V- UL94 HB UL94 V- UL94 V- UL94 HB UL94 V- UL94 HB UL94 V- Volatility Temperature Resistance Thermally Conductive FDA MIL-Spec MIL-A-466B 3 White Clear Black Gray Tube Cartridge Can Pail / coating material. UL certified Fast tack, thermally conductive flowable adhesive / sealant. See Page 5 for details JIS K 649 Testing is performed in accordance with current Momentive Performance Materials quality test methods, laboratory conditions, procedures, frequency and sampling. 3 MIL-A-466B Group I Type I Typical property data values should not be used as specifications Fast tack, flowable adhesive / sealant. Flowable adhesive with High-purity electrode coating material with fast tack performance. Cure Properties: Condensation cure grades cure with exposure to atmospheric moisture. The cure process begins from the outer surface and proceeds inward. Therefore, deep section curing (in excess of 6mm) is not recommended. Typically, tackfree is achieved in 5-6 minutes at 5 o C, 5%RH, depending on the grade. Cure Depth mm 8 7 6 5 4 3 TN335 (Alkoxy) 4 36 48 6 Cure Time h 3 o C, 6%RH 3 o C, 5%RH o C, 3%RH 7 Cure Depth mm 5 9 6 3 4 TSE38 (Oxime) 48 7 96 Cure Time h 5 o C, 9%RH 5 o C, 6%RH 5 o C, 3%RH 3 o C, 6%RH 3 o C, 3%RH o C, 9%RH o C, 6%RH o C, 3%RH 3 o C, 9%RH Cure Depth mm 5 5 4 TSE37 (Acetoxy) 5 o C, 9%RH 5 o C, 6%RH 5 o C, 3%RH 3 o C, 9%RH 3 o C, 6%RH 3 o C, 3%RH o C, 9%RH o C, 6%RH o C, 3%RH 48 7 96 Cure Time h Adhesion is typicaly achieved after 5-5 hours. Full material properties including electronic performance, is achieved in up to 7 days. Shear Adhesive Strength MPa.4.3.. Manifestation of Adhesion TN35 (Alkoxy) TSE38 (Oxime) TSE385 (Alkoxy) 3 4 5 6 7 8 9 Cure Time h 3 4

Product Details - Part Condensation Cure Grades Properties TSE398 ECS6 TN375 ECS6 ECS35S ECC3 TSE38 TSE386 TSE384-B TSE384-G TSE3843-W TSE3877-B TSE387 TSE388 TSE389 FRV6 Cure Chemistry Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Alkoxy Oxime Oxime Oxime Oxime Oxime Oxime Oxime Oxime Oxime Acetoxy Flowability Flowable Flowable Flowable Flowable Flowable Flowable Non-Flowable Non-Flowable Non-Flowable Semi-Flowable Semi-Flowable Flowable Flowable Flowable Flowable Non-Flowable Flowable adhesive / sealant. High-purity electrode coating material with fast tack performance. Repairable type volatile potting and coating material High-purity electrode coating material with fast tack performance Fast cure conformal coating material. volatile. Solvent free Fast cure conformal coating material. Solvent free General purpose paste adhesive. Adhesive / Sealant Coating Encapsulant / Potting Viscosity (3 o C) Pa.s (P) 7 (7) 5. (5).5 (5).4 (4).55 (5.5). (.) - - - - 5 (5) 3 (3) 6 (6) () 5.6 (56) - Application Color Packaging Application Rate g/min - - - - - - - - - - - - - - - 88 Tack Free Time min 7 7 7 5 3 6 3 6 9 6 3 Specific Gravity (3 o C).4.3...98.99.4.4.46.4.57.8.3.4.4.58 Hardness 4 3 5 35 8 9 5 3 6 5 5 6 3 4 Tensile Strength MPa (psi).3 (9). (75).4 (6).8 (5) - -.9 (75). (9).9 (4).4 (35) 3.9 (565). (9).3 (335).5 (). (9) 3.33 (485) Elongation % 3 45 3 5 - - 38 4 7 7 3 44 35 33 3 Adhesive Strength MPa (psi).7 () -. (3).3 (45) - -.7 (45).4 (5).4 (3).5 ().8 (6). (9).3 (9).3 (9).8 (6) - Thermal Conductivity W/m.K.8 -.8 - - -.8.8.59.5.67.8.8.8.8 - Volume Resistivity MΩ.m.x 7 4.x 7.x 7.x 7.x 7.x 7.x 7.x 7.x 7.x 7.x 7.x 7.x 7.x 7.x 7 - Dielectric Strength kv/mm 3 6 3 3 3.7 Dielectric Constant (6Hz) 3..8.7.6.6.78.9.9 4. 4. 3.9 3.5.9.8.7 6.3 (Hz) Dissipation Factor (6Hz).......4.4.6....4.8.9 - Molecular Siloxane (D3-D) wt% -.... - - - - - - - - - - - Flame Retardancy UL94 HB UL94 HB UL94 V- UL94 V- UL94 V- UL94 HB Volatility Temperature Resistance Thermally Conductive FDA MIL-Spec White Clear Black Gray Red Tube Cartridge Can Pail See Page 5 for details JIS K 649 Testing is performed in accordance with current Momentive Performance Materials quality test methods, laboratory conditions, procedures, frequency and sampling. High temperature resistant paste adhesive General purpose paste adhesive. semiflowable adhesive / sealant. Typical property data values should not be used as specifications General purpose flowable adhesive / sealant. General purpose flowable adhesive / sealant. General purpose flowable adhesive / sealant. General purpose flowable adhesive / sealant. Flowable sealant / coating material. UL certified Fluorosilicone with high temperature performance. Good fuel, oil, moisture, UV, ozone & chemical resistance Packaging Supplement Grade Tube Cartridge Can Pail W C B W C B G W C B W C B TN35 TN335 TN375 TSE38 TSE387 TSE389 W: White, C: Clear, B: Black, G: Gray 5 6

Product Details - Part Condensation Cure Grades Properties RTV57 RTV59 RTV series RTV6 TSE37 RTV6 RTV series Cure Chemistry Acetoxy Acetoxy Acetoxy Acetoxy Acetoxy Acetoxy Acetoxy Flowability Non-Flowable Non-Flowable Non-Flowable Non-Flowable Non-Flowable Flowable Flowable Application Color Packaging High strength paste adhesive High temperature, high strength, paste adhesive Paste adhesive with FDA, USDA, NSF, and MIL-A-466B High temperature resistant paste adhesive. FDA, USDA, NSF, MIL-A-466B Fast tack paste adhesive High temperature resistant, flowable adhesive. FDA, USDA, NSF, MIL-A-474, MIL-A-466B Flowable adhesive with FDA, USDA, NSF, MIL-A-466B Adhesive / Sealant Coating Encapsulant / Potting Viscosity (3 o C) Pa.s (P) - - - - - 5 (5) () Application Rate g/min 55 75 4 4 - - - Tack Free Time min 45 45 5 3 Specific Gravity (3 o C).9.9.5.7.4.9.5 Hardness 8 3 3 5 Tensile Strength MPa (psi) 6. (9) 7. (,5).75 (4).55 (37).5 (365).45 (355). (3) Elongation % 85 35 45 4 53 35 35 Adhesive Strength MPa (psi).3 (83) 3 -.4 ().4 (). (3).9 (5).7 () Thermal Conductivity W/m.K - - - -.8 - - Volume Resistivity MΩ.m 7.5x 6.x 7 3.x 7 3.x 6.x 7.x 6 6.x 6 Dielectric Strength kv/mm.7 9.7 6 6 Dielectric Constant (6Hz).9.6.8.8 3..8.8 Dissipation Factor (6Hz).9.7...3.. Molecular Siloxane (D3-D) wt% - - - - - - - Flame Retardancy Volatility Temperature Resistance Thermally Conductive FDA MIL-Spec MIL-A-466B 3 MIL-A-466B 3 MIL-A-466B 3 MIL-A-466B 3 White RTV RTV Clear RTV8 RTV8 Black RTV3 Gray Red Aluminum RTV9 Tube Cartridge Can Pail ASTM D 96S Testing is performed in accordance with current Momentive Performance Materials quality test methods, laboratory conditions, procedures, frequency and sampling 3 MIL-A-466B Group III Type I Typical property data values should not be used as specifications Product Details - Part Heat Cure Grades Properties XE3-B38 TSE3 TSE3 TSE3S TSE36-G TSE38-G Flowability Non-Flowable Semi-Flowable Non-Flowable Semi-Flowable Flowable Flowable Cure Properties: The cure performance of Part Heat Cure grades is demonstrated by the relationship between temperature and hardness, and temperature and adhesive strength of TSE3 when placed in an oven at temperatures ranging from 8 o C to 5 o C. Paste adhesive / Hardness & Cure Time - TSE3 Hardness sealant 5 4 3 5 o C o C Thixotropic adhesive / sealant o C 8 o C 3 4 5 Cure Time h Flowable adhesive / sealant 6 7 8 Flowable adhesive / sealant. Adhesion & Cure Time - TSE3 Shear Adhesive Strength MPa 3 High temperature resistant flowable adhesive / sealant 5 o C o C o C 8 o C 3 4 5 Cure Time h Thermally conductive flowable adhesive Adhesive / Sealant Coating Encapsulant / Potting Viscosity (3 o C) Pa.s (P) 67 (67) 8 (8) () 7 (7) 5 (5) 6 (6) Cure Condition o C/h 5/ 5/ 5/ 5/ 5/ 5/ Specific Gravity (3 o C).8.6.7.6.48. Hardness 5 5 45 37 5 6 Tensile Strength MPa (psi) 4.4 (64) 3.7 (535) 3.4 (495) 3.6 (5) 4.9 (7) 3. (465) Elongation % 43 4 3 3 6 Adhesive Strength MPa (psi) 3.7 (535).6 (375).5 (365).5 (365). (9). (9) Thermal Conductivity W/m.K..9.9.9.4.88 Volume Resistivity MΩ.m.x 7.x 7.x 7.x 7.x 7.5x 6 Dielectric Strength kv/mm 3 5 Dielectric Constant (6Hz) 3. 3. 3. 3. 3.9 4.3 Dissipation Factor (6Hz)...6.6.5. Flame Retardancy UL94 HB Temperature Resistance Thermally Conductive White Clear Black Gray Blue Tube Cartridge Can Pail JIS K 649 Typical property data values should not be used as specifications Application Color Packaging 6 7 8 7 8

. Product Details - Part Heat Cure Grades Properties TSE38-G TSE3S TSE36 TSE36M 3 TSE35 TSE35-C TSE35 TSE35-B TSE35 ECC4865 Flowability Flowable Flowable Flowable Flowable Semi-Flowable Semi-Flowable Flowable Flowable Flowable Flowable Thermally conductive flowable adhesive Flowable adhesive / sealant, coating material High temperature resistant flowable adhesive. UL certified High temperature resistant flowable adhesive Flowable coating material Flowable coating material Flowable potting / coating material Flowable potting / coating material Flowable potting / coating material viscosity conformal coating with UV tracer, fast thermal cure & long-term Adhesive / Sealant Coating Encapsulant / Potting Viscosity (3 o C) Pa.s (P) 6 (6) 58 (58) 8 (8) 6 (6) 8.5 (85) 7. (7) 4. (4) 3.5 (35).3 (3).5 (.5) Application Color Packaging Cure Condition o C/h 5/ 5/ 5/ /.5 5/ 5/ 5/ 5/ 5/ - Specific Gravity (3 o C).7.3.45.46.....97.9 Hardness 84 8 43 38 6 6 9 35 Tensile Strength MPa (psi) 4.5 (655).8 (45) 3.4 (495).9 (4).7 ().7 ().7 ().9 (3) - - Elongation % 5 37 7 8 - - Adhesive Strength MPa (psi).5 (365).5 (365). (9).5 ().4 (6).4 (6).4 (6).4 (6). (5) - Thermal Conductivity W/m.K.68.8.4.4.8.8.8.8.7 - Volume Resistivity MΩ.m 4.8x 6 6.x 7.x 7.x 7.x 7.x 7.x 7.x 7.x 7 - Dielectric Strength kv/mm 5 3 Dielectric Constant (6Hz) 5..8 3.3 3.3.8.8.9.9.8.4 Dissipation Factor (6Hz).......... Flame Retardancy UL94 HB Temperature Resistance Thermally Conductive White Clear Black Gray Red Tube Cartridge Can Pail JIS K 649 ASTM D96S 3 TSE35M EX in Europe and the Americas. Typical property data values should not be used as specifications viscosity stability Storage Stability: Storage under low temperature conditions is important particularly for -part heat cure grades to prevent viscosity inrease. Viscosity Pa s 4 3 TSE3 Viscosity and Storage Temperature 5 o C 5 o C 3 4 Storage Time months 5 6 9

Product Details - Part Room Temperature Cure Grades Properties RTV577 RTV88 RTV6 RTV566 RTV3 RTV TSE3663 TSE366 TSE3664K Components RTV577 3 DBT RTV88 3 DBT RTV6 3 DBT RTV566(A) 3 RTV566(B) 3 RTV3 3 DBT RTV 3 DBT TSE3663(A) TSE3663(B) TSE366(A) TSE366(B) TSE3664(A) TSE3664(B) Flowability Non-Flowable Semi-Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable temperature resistant paste sealant with good release capabilities High temperature resistant, semi-flowable sealant. Good release capabilities High temperature resistant flowable sealant with good release capabilities volatile, low out gassing sealant with and High temperature performance capability High temperature resistant flowable sealant with good release capabilities Sealant with good release properties. FDA compliance Flowable encapsulant / adhesive Flowable encapsulant / adhesive Flowable encapsulant / adhesive with fast Adhesive / Sealant Coating Encapsulant / Potting Mixing Ratio ((A):(B) by weight) :.5 :.5 :.5 :. :.5 :.5 : : :7.5 Application Packaging Color (mixed) White Red Red Red Red White Off-White Off-White Gray Viscosity (mixed) (3 o C) Pa.s (P) 7 (7) 88 (88) 47 (47) 43 (43) 5 (5) () 4. (4) 4. (4) 3. (3) Pot Life (3 o C) h.75.5.5.5.5. Cure Condition o C/h 5/4 5/4 5/4 5/4 5/4 5/4 3/7 3/7 3/7 Specific Gravity (3 o C).35.47.48.49.4.9.9.9.4 Hardness 48 58 57 6 54 4 4 4 6 Tensile Strength MPa (psi) 3. (44) 5.8 (84) 6.9 (995) 5.5 (795) 5.9 (87). (3).4 (5).4 (5) 3. (435) Elongation % 5 7 6 7 Adhesive Strength MPa (psi) - - - 3. (465) - -.9 (3).9 (3). (45) Thermal Conductivity W/m.K.3.3.3.3.3.9.7.7.4 Volume Resistivity MΩ.m 5.6x 6.8x 6 4.4x 6.x 6.6x 6.x 7.x 7.x 7 5.x 7 Dielectric Strength kv/mm 8.5 7.4 7.7. 7.3 6 Dielectric Constant (6Hz) 3.98 (khz) 4.3 (khz) 4. (khz) 3.9 (khz) 4.4 (khz) 3.3 (khz) 3. 3. 3. Dissipation Factor (6Hz). (khz).3 (khz). (khz). (khz).3 (khz).6 (khz).5.5. tack free times. Flame Retardancy UL94 HB UL94 V- Volatility Temperature Resistance FDA Bottle Can Pail Kit JIS K 649 ASTM D96 3Sub-Zero long-term storage required. Typical property data values should not be used as specifications Cure Speed: The cure speed of Part Condensation Cure grades can be changed by adjusting the amount of the catalyst component. However, the post-cure properties of the material may vary from those achieved under standard mixing ratios, and therefore, adequate testing and confirmation prior to use in an application is required. TSE3663 - Mixing Ratios & Viscosity (3 o C) Viscosity Pa. s 6 5 4 3 :.5 :. :.5 Time - h

Product Details - Part Heat Cure Grades Properties TSE336 XE4-A45 TSE338 RTV65 TSE33 TSE333 TSE333K EX 3 TSE333K TSE343 TSE343-H XE4-B789 YE58 TSE333 Components TSE336(A) TSE336(B) XE4-A45(A) XE4-A45(B) TSE338(A) TSE338(B) RTV65(A) RTV65(B) TSE33(A) TSE33(B) TSE333(A) TSE333(B) TSE333KEX(A) TSE333KEX(B) TSE333K(A) TSE333K(B) TSE343(A) TSE343(B) TSE343(A) TSE343(B) XE4-B789(A) XE4-B789(B) YE58(A) YE58(A) TSE333(A) TSE333(B) Flowability Non-Flowable Semi-Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable Flowable General purpose paste adhesive with extended pot life High temperature resistant paste adhesive with thermal conductive performance Thermally conductive paste adhesive viscosity encapsulant / potting material with capability to cure at RT. FDA recognition Transparent encapsulant / potting material with good release properties Thermally conductive encapsulant / potting material. Thermally conductive encapsulant / potting material. Thermally conductive encapsulant / potting material. Encapsulant / potting material with, thermal conductivity, and good release properties Encapsulant / potting material with, thermal conductivity, and good release properties Encapsulant / potting material with, low temperature cure, and good release properties viscosity transparent Adhesive / Sealant Coating Encapsulant / Potting Mixing Ratio ((A):(B) by weight) : : : : : : : : : : : : : Application Packaging encapsulant / potting material. Good release properties viscosity transparent encapsulant / potting Color (mixed) White Reddish Brown Gray Transparent Transparent Gray Dark Gray Dark Gray Black Black Black Transparent Transparent Viscosity (mixed) (3 o C) Pa.s (P) 64 (64) 4 (4) 4 (4) 4. (4) 4. (4) 3.5 (35) 3. (3).6 (6).6 (6).6 (6).3 (3). ().9 (9) Pot Life (3 o C) h 4 4 8 4 4 8 8 8.5.5 4 6 Cure Condition o C/h 5/ 5/ 5/.5 5/.5 / / / / / / 6/ / 5/.5 Specific Gravity (3 o C)...7...5.43.43.5.5.39.97. Hardness 4 65 7 44 35 6 5 45 7 7 6 7 3 Tensile Strength MPa (psi) 5.4 (785) 5. (75).5 (365) 6.3 (9) 4.5 (655).9 (4) 3. (44) 3. (45) 4.9 (7) 4. (595) 3.5 (5).4 (58). (45) Elongation % 38 7 7 6 3 3 Adhesive Strength MPa (psi) 3. (45).9 (4).5 () - -.3 (9).6 (3).6 (3) - - - -.3 (44) Thermal Conductivity W/m.K.3.8.68.9.7.63.53.53.63.63.44.7.7 Volume Resistivity MΩ.m.x 7.x 6.x 6.8x 7.x 7.x 6 6.x 6 6.x 6 5.x 7 5.x 6.x 7.x 7.x 7 Dielectric Strength kv/mm 6 5 9.7 6 6 7 7 Dielectric Constant (6Hz) 3. 3.4 5.7.7 (khz).8 3.4 3. 3. 3.4 3.5 3..8.8 Dissipation Factor (6Hz)..7..6 (khz)..7.5.5.4.4... Flame Retardancy UL94 V- UL94 V- UL94 V- UL94 V- UL94 V- UL94 V- Temperature Resistance Thermally Conductive FDA Bottle Can Pail Kit JIS K 649 ASTM D96 3Sub-Zero long-term storage required. Typical property data values should not be used as specifications material Pot Life: The pot life of a Part Heat Cure grade is affected by changes in viscosity that occur after the components have been mixed. Viscosity Pa. s 5 4 3 TSE333 Viscosity Change After Mixing 3 o C 4 6 8 Time - h Cure Properties: The cure performance of Part Heat Cure grades is demonstrated by the relationship between temperature and hardness of TSE338 when placed in an oven at temperatures ranging from o C to 5 o C. Hardness & Cure Time - TSE338 Hardness 8 7 6 5 o C o C o C Viscosity Pa. s 8 6 4 TSE343-H Viscosity Change After Mixing 3 o C 5 3 6 Cure Time - min 9.5.5 Time - h 3 4

Product Details - Part Gels Properties TSE35 TSE35-FR TSE35-L TSE353 Flowability Flowable Flowable Flowable Flowable viscosity viscosity, UL certified viscosity, low penetration viscosity, high penetration Viscosity (3 o C) Pa.s (P).7 (7).7 (7).7 (7).7 (7) Cure Condition o C/h 5/ 5/ 5/ 5/ Specific Gravity (3 o C).97.97.97.97 Penetration 85 85 65 5 Thermal Conductivity W/m.K.7.7.7.7 Volume Resistivity MΩ.m.x 7 5.x 7.x7.x 7 Dielectric Strength kv/mm 8 8 8 8 Dielectric Constant (6Hz).8.8.8.8 Dissipation Factor (6Hz).... Flame Retardancy UL94 V- White Transparent Gray kg can See below matrix 5kg can Color Pkg JIS K 649 Typical property data values should not be used as specifications Product Details - Part Gels Properties TSE36 TSE37 RTV636-D Components TSE36(A) TSE36(B) TSE37(A) TSE37(B) RTV66(A) RTV66(B) Flowability Flowable Flowable Flowable temperature cure High elongation gel Fast cure, low viscosity Mixing Ratio ((A):(B) by weight) : : : Color (mixed) Transparent Transparent Transparent Viscosity (mixed) (3 o C) Pa.s (P). ().8 (8).75 (7.5) Pot Life (3 o C) h 4.5 Cure Condition o C/h 7/.5 7/.5 /.3 Specific Gravity (3 o C).97.97.98 Penetration 55 65 6 Thermal Conductivity W/m.K.7.7.9 Volume Resistivity MΩ.m.x 7.x 7.x 7 Dielectric Strength kv/mm 8 8.5 Dielectric Constant (6Hz).7.7.8 (khz) Dissipation Factor (6Hz)... (khz) Package Bottle Can Pail JIS K 649 ASTM D96 Typical property data values should not be used as specifications TSE35 W C G W: White, C: Clear, G: Gray kg bottle 4kg can 5kg can kg pail 5 6

Product Details - Part JCR Grades Properties TSJ355 TSJ395-W TSJ385 Flowability Semi-Flowable Semi-Flowable Semi-Flowable Thixotropic JCR rubber. post-cure hardness contributes to stress relief of critical components viscosity JCR gel. Provides stress and vibration relief performance Thixotropic JCR gel. Provides stress and vibration relief performance Property Rubber Gel Gel Viscosity (3 o C) Pa.s (P) 6 (6) 4 (4) 3 (3) Color White White Translucent Cure Condition o C/h 5/4 5/4 5/4 Specific Gravity (3 o C)... Hardness - - Penetration - 8 8 Thermal Conductivity W/m.K.8.8.8 Volume Resistivity MΩ.m.x 7.x 7.x 7 Dielectric Strength kv/mm 5 5 Dielectric Constant (6Hz).8.8.7 Dissipation Factor (6Hz).4.4. Na + K + ppm < < < Pkg: 5g bottle JIS K 649 Typical property data values should not be used as specifications Product Details - Grease Properties TSK533 TSK537 TSK55 TSK55 YG6 YG64 YG66 TIG Thermally conductive compound for medium heat dissipation. Heat & sealing with swell resistant resistance Compound for electrical insulation performance Compound for electrical Compound for electrical Thermally conductive Thermally conductive Thermally conductive Thermally conductive contact insulation protection against contact insulation protection against moisture & contaminants moisture & contaminants compound for medium compound for medium compound for medium compound for medium heat dissipation. heat dissipation. heat dissipation. to high heat dissipation oil separation oil separation oil separation Color White White White Green White White White White Specific Gravity.34 -.3.3.45.45.3.5 Penetration 33 7 3 9 3 34 Bleed (5 o C, 4h) %.8.5.5..4..5. Evaporation (5 o C, 4h) %....3..4.. Thermal Conductivity W/m.K.84 - - -.84.84.84. Volume Resistivity MΩ.m -.x 5.x 7.x 7.x 6.x 6.x 7 3.x 6 Dielectric Constant (6Hz) 5..5.8.8 5. 5. 5. 5. Dissipation Factor (6Hz).5....6.6.5.6 Molecular Siloxane (D3-D) wt%.5. - -..3.3.3 Arc Resistance s - - < < - - - - Volatility Temperature Resistance Thermally Conductive Bleed Bottle Can Pail Packaging ASTM D-495 Typical property data values should not be used as specifications applications Product Details - Part JCR Grades Properties XE4-B5778 TSJ375 Components XE4-B5778(A) XE4-B5778(B) TSJ375(A) TSJ375(B) Flowability Semi-Flowable Semi-Flowable Flow-controllable JCR rubber. Thixotropic JCR gel. Soft gel property contributes to stress and vibration relief Property Rubber Gel Mixing Ratio ((A):(B) by weight) : : Color (mixed) Translucent Black Viscosity (mixed) (3 o C) Pa.s (P) 4 (4) 7 (7) Pot Life (3 o C) h 8 Cure Condition o C/h 8/ 5/ Specific Gravity (3 o C).. Hardness 6 - Penetration - 7 Thermal Conductivity W/m.K.7.8 Volume Resistivity MΩ.m.x 5.x 7 Dielectric Strength kv/mm 4 5 Dielectric Constant (6Hz).7.7 Dissipation Factor (6Hz).. Na + K + ppm < < Pkg: 5g bottle JIS K 649 Typical property data values should not be used as specifications 7 8

UL Certifications source: Underwriters Laboratories Inc. Type Grade Color Thickness mm Elec. RTI Mech. Flame Class HWI HAI HVTR D495 CTI File No. Type Grade Color Thickness mm Elec. RTI Mech. Flame Class HWI HAI HVTR D495 CTI File No. Part Condenstaion Cure ECS6 Black Clear White.5 5 5 HB - - ECS69FR TN385 RTV33 RTV6 RTV67 TSE38 TSE386 TSE384-G TSE3843-W TSE384-B TSE3853-W TSE3854DS TSE389 TSE3944 Gray. 5 5 V- - - Gray 3. 5 5 V- - - Gray. 5 5 V- Gray 3. 5 5 V- White. 5 5 V- White 3. 5 5 V- Black.7 5 5 V- 3 Black.6 5 5 V- Black 3.4 5 5 V- White.75 5 5 HB 4 White.5 5 5 HB 3 White.5 5 5 HB 3 White 3. 5 5 HB - - Gray.83 5 5 HB 3 Gray.5 5 5 HB Gray.6 5 5 HB Clear White.75 5 5 HB 4 Clear White.5 5 5 HB 3 Clear White.9 5 4 HB 3 Clear White 3. 5 4 HB 3 Red. - - - Red 3. - - - Gray.75 5 5 V- - - Gray.5 5 5 V- Gray 3. 5 5 V- White. 5 5 V- - - White.5 5 5 V- White.9 5 4 V- - - White.5 5 4 V- - - White 3. 5 4 V- - - Black. 5 5 V- Black.9 5 4 V- - - Black 3. 5 4 V- - - White.5 5 5 V- 3 White 3. 5 5 V- 3 Gray.75 5 5 V- Gray.5 5 5 V- Gray 3. 5 5 V- White.5 5 5 V- 3 White 3. 5 5 V- 3 Clear White Black.5 5 5 HB - - Clear White Black 3. 5 5 HB - - Gray.75 5 5 V- - - White.75 5 5 V- - - Gray White.5 5 5 V- Gray White 3. 5 5 V- RTI: Relative Temperature Index PLC: Performance Level Category HWI: Hot Wire Ignition HAI: High-Current Arc Ignition HVTR: High-Voltage Arc Tracking Rate D495: D495 High-Voltage Dry Arc Resistance CTI: Comparative Tracking Index 4 3 3 E3695 5 E3695 5 E3695 4 3 3 3 3 P Cond Cure Part Heat Cure Part TSE3976-B Black.64 5 5 HB - - Black.5 5 5 HB - - Black 3. 5 5 HB - - XE-A533S White 3. 5 5 V- - - XE-B53 White.5 5 5 HB - - White 3. 5 5 HB - - TSE35-FR Clear.7-3.3 5 5 V- - - TSE3S N TSE36 TSE333 TSE333K TSE333K EX TSE343 TSE343-H TSE3664K XE4-B789 TSE366 HWI Resistance to ignition when exposed to high temperatures. Expressed as the mean number of seconds required to ignite a specimen when wrapped with an energized ni-chrome resistive wire that dissipates a specified level of energy. Mean Ignition Time (sec) 6-9 3-59 5-9 7-4 <7 PLC 3 4 5 NC. 5 5 HB - - NC.5 5 5 HB - - NC 3. 5 5 HB - - Red. 5 5 HB - - Red 3. 5 5 HB - - Black. 5 5 V- - - Black.6 5 5 V- Black. 5 5 V- - - Black 3. 5 5 V- Black.5 5 5 V- - - Black 3. 5 5 V- - - Black.5 5 5 V- - - Black 3. 5 5 V- - - Gray. 5 5 V- - - Gray 4. 5 5 V- - - Gray. 5 5 V- Gray.5 5 5 V- - - Gray.5 5 5 V- Gray 3. 5 5 V- - - Gray. 5 5 V- - - Gray. 5 5 V- - - Gray 3. 5 5 V- Black. 5 5 V- - - Black 3. 5 5 V- - - All. 5 5 HB 4 All 3. 5 5 HB 3 HAI Ability to withstand electrical arcing. Expressed as the number of arc rupture exposures required to ignite a specimen when the arc occurs directly on the surface or a specified distance above the test specimen. Mean No. of Arcs 6-9 3-59 5-9 <5 PLC 3 4 HVTR Expressed as the rate (inches per minute) that a tracking path can be produced on the surface of the material under standardized test conditions. HVTR Range (in mm/min) -. - 5.4 5.5-8 8. - 5 >5 PLC 3 4 D495 Expressed as the number of seconds that a material resists the formation of a surfaceconducting path when subjected to an intermittently occurring arc of high voltage, low current characteristics. Arc Resistance (sec) 4 36-49 3-359 4-99 8-39 - 79 6-9 <6 PLC 3 4 5 6 7 Expressed as that voltage which causes tracking after 5 drops of.% ammonium chloride solution have fallen on the material. CTI Tracking Index (volts) 6 4-599 5-399 75-49 - 74 < PLC 3 4 5 9 3

Typical Adhesion Performance Condensation Cure Grades Metals Rubber Plastic Inorganic Substrate Primerless Alkoxy Acetoxy Oxime ME ME3 XP8-A5363 Primerless ME ME3 Primerless Copper Steel Brass Stainless Steel Aluminum Galvanized Steel Tin Acrylic Resin Phenol Resin Epoxy Resin Polycarbonate ME ME3 Soft Polyvinyl Chloride Rigid Polyvinyl Chloride Polyester Film Unsaturated Polyester Polyamide 3 Nylon 66 PBT 3 PPS ABS 4 Polypropylene Polyethylene Fluorocarbon Resin Silicone Resin Laminate Chloroprene Rubber Nitrile Rubber Styrene Butadiene Rubber Ethylene Propylene Rubber Silicone Glass Ceramic Adheres completely, Adheres, but separates from surface when pulled, Does not adhere May corrode under some usage conditions, Stress cracking may occur under some usage conditions, 3 YP934, 4 XP8-A5363 XP8-A5363 / YP934 Shear Adhesion Test Method adhesive JIS Method ASTM Method A: 5mm " B: mm.5" C: mm - Pull Rate: mm/min. "/min. Typical Chemical Resistance B substrate C A Typical Heat Resistance Hardness Chng. Adhesion Chng. % Elongation Chng. % 5 4 3-4 - -4 - -4-6 -8 -Part Condensation Cure Adhesive (Alkoxy Type) o C 5 o C o C Typical Electrical Performance Dielectric Strength Test Method: Equipment: Dielectric voltage gauge Voltage Rise: kv/s Terminal Gap: mm (JIS C ) 7 4 3 9 8 36 Elapsed Time days adhesive Electrical Performance of Cured Material mm.5mm TSE3843-W Volume Resistivity MΩ.m Dielectric Strength kv/mm Appearance Substrates Substrate Condensation Cure Addition Cure General ME ME3 YP934 XP8-A5363 SS44P SS444P SS479 ME5 ME53 XP8-B6 SS4 SS455 Yellow Transparent Metals, Glass, Plastic Yellow Transparent Plastic, Rubber Transparent Plastic, Rubber Yellow Transparent Pink Yellow Clear Colorless Polylefins Metals Metals Plastic Yellow Metals, Glass, Plastic, Ceramic Yellow Transparent Plastic Yellow Transparent Metals, Glass Clear Colorless Blue - - Specific Gravity (3 O C).85.86.89.88.85.85.98.87.83.7.8.8 Non-Volatile Content 5% 5% 8% 7% 5% 5% 6% 4% 5% 7.5% 3% % Drying Time (3 O C) min 3 3 3 3 3 5 3 3 3 3 3 Solvents Acetone Toluene IPA Acetone Toluene IPA Butyl Acetate Toluene Acetone Xylene N-butanol IPA Acetone Xylene N-butanol IPA Ethyl Acetate Toluene Methanol Toluene IPA Toluene IPA n-hexane Ethanol Methanol Mineral Spirits Conditions 4 O C, 95%RH 5 O C Immersed 4 O C, 95%RH 5 O C Immersed Initial.6x 7.6x 7 9 9 Day.9x 6.x 6 7 5 Days.5x 6 3.6x 6 9 3 Days.7x 6.9x 6 4 3 3 3

Other Electronic Solutions from Momentive Performance Materials Thermal Management Silicones for Electronics Provides detailed information on silicone materials used for thermal management applications in electronics and micro-electronics. Includes SilCool* grease & adhesives, and conventional grades for adhesion, encapsulation and potting. Silicone Material Solutions for LED Packages and Assemblies Provides opto-electronic solutions for LED Packages and Assemblies. Includes InvisiSil* LED encapsulants, Glob Top, Lens fabrication materials, Die Attach adhesives, and Dot Matrix assembly materials. Frequently Asked Questions What does RTV mean? RTV stands for Room Temperature Vulcanization (cure). Despite the low-temperature connotations conveyed by this name, RTV silicones consist of both Room Temperture Cure and Heat Cure grades. What is the cure mechanism of a condensation cure product? Condensation cure silicone products cure when exposed to atmospheric moisture. Moisture in the air is generally required to cure (or vulcanize) condensation cure products. The cure process begins from the outer surface, and therefore time is required for complete cure. The cure time is affected by the reaction mechanism and viscosity of the material. Generally, at 5C and 5%RH, condensation cure RTV silicones cure through in 4 to 48 hours. Full physical properties may take up to 7 days to develop. What is the depth (bead thickness) limit for a condensation cure grade? For -part, condensation cure products, the depth (bead thickness) limitation is approximately 6mm (/4"). For -part, condensation cure products, the depth (bead thickness) limitation is approximately 5mm ("). Can I accelerate the cure time of a -part product? Condensation cure silicone cure rates depend on humidity, silicone thickness, and to a smaller degree heat. Increasing the relative humidity around the silicone or reducing the thickness of the material will reduce the time to cure the material. Increased heat (not over 5C) will somewhat reduce cure time but as mentioned will do so to a much smaller degree than humidity or thickness. What is the cure mechanism of an addition cure product? Addition cure silicone RTV products may be or -part and cure when exposed to heat. Although some heat cure products can cure at room temperature, higher heat greatly accelerates the cure. -part heat cure products typically have an inhibitor in the formulation that stops the product from curing until an activation temperature, greater than room temperature, is achieved and the inhibitor is driven off and the cure reaction is allowed to proceed. What does "tack free time" mean? Tack free refers to the amount of time it takes for a condensation cure silicone product to form a cured outer layer (the cured outer layer is not tacky like uncured material). What is "mix ratio"? Mix ratio is a term used to state the amount of each material to be in a multi-component material. The mix ratios for -part products are described on the individual product data sheets and are given as a ratio by weight of each material. What does "pot life" or "work life" mean? The amount of time after a -part grade is mixed with its curing agent that it will remain useful or pliable. How do I remove silicone? Before it is cured: use a putty knife to remove any of the uncured paste. Wipe the area clean with isopropyl alcohol to remove any leftover residue. After it is cured: First mechanically remove as much of the silicone as you can with either a knife or a razor. A solvent (mineral spirits, toluene, xylene, acetone) can them be used to remove any oily residue or any remaining silicone, It may be necessary to soak the silicone in a solvent overnight to break it down. Can I thin a silicone? Silicone can be thinned using a solvent in which the silicone is miscible, generally an aromatic solvent such as toluene or xylene. As always, be sure to follow the producer's instructions when using solvent products and always use in a well-ventilated area. The shrinkage of the silicone and the cure time will increase with the addition of solvent. Alternative suggestions would include nonreactive fluids or an RTV with a lower viscosity. What can I do to improve the adhesion of the silicone adhesive to my parts? The first step to good adhesion is to have clean surfaces for the silicone to bond to. For difficultto-bond-substrates, Momentive Performance Materials offers a number of primers that can be used to improve and maximize adhesion. How do I ensure that air is removed from -part grades? If you are hand mixing, air may become added to the material during the mixing process. Vacuum de-airing is most effective in removing air prior to use. Automated mixing equipment that utilizes a static mixer can eliminate the need to de-air prior to dispensing. On complex high-density electronics, air can sometimes be trapped under components during the potting process. Where this is a concern, potting under vacuum or vacuum de-airing after potting can remove the trapped air. An alternate approach may be to use a grade with a low viscosity and longer potlife and to cure at lower temperatures (if heat-cure grade), allowing entrapped air to escape prior to the cure of the material. What is cure inhibition, and how do I prevent it? Cure inhibition is a phenomenon that may be observed in additioncure grades. These materials use a platinum catalyst to drive the curing reaction. Surfaces containing water, sulphur, nitrogen compounds, organic metal compounds, or phosphate compounds, may inhibit cure. Cure inhibition is characterized by a gummy or sticky appearance of the silicone at the interface between the silicone and offending substrate. Inhibition can be prevented by application of a barrier coat, cleaning of the offending material prior to application of the silicone material, replacing the offending material with a suitable alternative, or selection of a condensation cure grade. Dispensing Equipment Examples Tube Type Dispensing Unit Cartridge Air-Gun Dispensing Unit Cartridge Type Dispensing Unit Small Can Pump and Dispensing Unit Pail Can Pump Unit 33 34

Customer Service Centers Worldwide Hotline T + 8 95 39 / + 67 786 83 F + 67 786 839 North America cs-na.silicones@momentive.com Silicones Fluids, UA, Silianes, Specialty Coatings, RTV and Elastomers T + 8 53 586 / + 8 334 4674 F + 34 746 654 / + 34 746 63 Consumer Sealants/ Construction Sealants and Adhesives T + 877 943 735 F + 34 746 654 Latin America cs-la.silicones@momentive.com South America T +55 4534 965 F +55 4534 966 Mexico and Central America T +5 55 69 767 F +5 55 69 7699 Europe, Middle East, Africa and India cs-eur.silicones@momentive.com T + 8 43 / +4 3848 Pacific cs-ap.silicones@momentive.com China T +8 8 / +86 386 489 Japan T + 975 4 / +8 76 68 F +8 76 3 659 Korea T +8 6 46 F +8 6 46 Malaysia T +6 3 96 555 F +6 3 96 533 Thailand T +66 7 3456 F +66 7 3488 DISCLAIMER: THE MATERIALS, PRODUCTS AND SERVICES OF MOMENTIVE PERFORMANCE MATERIALS INC., MOMENTIVE PERFORMANCE MATERIALS USA INC., MOMENTIVE PERFORMANCE MATERIALS ASIA PACIFIC PTE. LTD., MOMENTIVE PERFORMANCE MATERIALS WORLDWIDE INC., MOMENTIVE PERFORMANCE MA- TERIALS GmbH, THEIR SUBSIDIARIES AND AFFILIATES DOING BUSINESS IN LOCAL JURISDICTIONS (collectively SUPPLIERS ), ARE SOLD BY THE RESPECTIVE LE- GAL ENTITY OF THE SUPPLIER SUBJECT TO SUPPLIERS STANDARD CONDITIONS OF SALE, WHICH ARE INCLUDED IN THE APPLICABLE DISTRIBUTOR OR OTHER SALES AGREEMENT, PRINTED ON THE BACK OF ORDER ACKNOWLEDGMENTS AND INVOICES, AND AVAILABLE UPON REQUEST. ALTHOUGH ANY INFORMATION, RECOMMENDATIONS, OR ADVICE CONTAINED HEREIN IS GIVEN IN GOOD FAITH, SUPPLIERS MAKE NO WARRANTY OR GUARANTEE, EXPRESS OR IMPLIED, (i) THAT THE RESULTS DESCRIBED HEREIN WILL BE OBTAINED UNDER END-USE CONDITIONS, OR (ii) AS TO THE EFFECTIVENESS OR SAFETY OF ANY DESIGN INCORPORATING SUPPLIERS PRODUCTS, MATERIALS, SERVICES, RECOMMENDATIONS OR ADVICE. AFOREMENTIONED EXCLUSIONS OR LIMITATION OF LIABIL- ITY ARE NOT APPLICABLE TO THE EXTENT THAT THE END-USE CONDITIONS AND/OR INCORPORATION CONDITIONS CORRESPOND TO THE RECOMMENDED CONDITIONS OF USE AND/OR OF INCORPORATION AS DESCRIBED BY SUPPLIER IN ITS PRODUCT DATA SHEET AND/OR PRODUCT SPECIFICATIONS. EXCEPT AS PROVIDED IN SUPPLIERS STANDARD CONDITIONS OF SALE, SUPPLIERS AND THEIR REPRESENTATIVES SHALL IN NO EVENT BE RESPONSIBLE FOR ANY LOSS RESULTING FROM ANY USE OF ITS MATERIALS, PRODUCTS OR SERVICES DESCRIBED HEREIN. Each user bears full responsibility for making its own determination as to the suitability of Suppliers materials, services, recommendations, or advice for its own particular use. Each user must identify and perform all tests and analyses necessary to assure that its finished parts incorporating Suppliers products, materials, or services will be safe and suitable for use under end-use conditions. Nothing in this or any other document, nor any oral recommendation or advice, shall be deemed to alter, vary, supersede, or waive any provision of Suppliers Standard Conditions of Sale or this Disclaimer, unless any such modification is specifically agreed to in a writing signed by Suppliers. No statement contained herein concerning a possible or suggested use of any material, product, service or design is intended, or should be construed, to grant any license under any patent or other intellectual property right of Suppliers or any of its subsidiaries or affiliates covering such use or design, or as a recommendation for the use of such material, product, service or design in the infringement of any patent or other intellectual property right. Technical subject matter in this publication is described and protected by one or more of the following U.S. Patents and their foreign counterpart patents and/or patent applications: U.S. Patent Nos. 7,4,7; 7,388,49; 7,387,784; 7,38,769; 7,374,77; 7,4,835; 7,7,777; 6,759,479; 6,538,6; 6,53,54; 6,475,568; 6,444,745; 6,9,563; 6,7,78; 5,98,68; and 5,87,956. Other U.S. and foreign patents and/or patent applications not listed covering the subject matter may be relevant. *SilCool and InvisiSil are trademarks of Momentive Performance Materials Inc. The Momentive logo is a trademark of Momentive Performance Materials Holdings LLC. Corporate Woods Boulevard Albany, NY USA + 8 95 39 + 67 786 83 momentive.com Copyright Momentive Performance Materials Inc. All rights reserved. MPM 3-55-E-GL