Memory Configuration for Intel Xeon 5500 Series Branded Servers & Workstations May 2009 In March 2009, Intel Corporation launched its new Xeon 5500 series server processors, code-named Nehalem-EP. This new generation of processors incorporates a DDR3 memory controller to support new, high-performance DDR3 memory modules. The new platforms can support two different types of memory modules: Registered DIMMs or Unbuffered ECC DIMMs. The memory modules are shown below, with their intended applications Unbuffered ECC DIMMs (or ECC UDIMMs) are intended for lower-end servers and workstations requiring no more than 48GB of memory using 4GB modules; Registered DIMMs are intended for mid-range and high-end servers which could require more than 48GB of memory with the higher reliability offered by Registered DIMMs. The table below illustrates the different Intel Xeon 5500 series processors, grouped by the highest memory speed supported by each model. Also due to the nature of the high-performance parallel memory bus used by the 5500 series chipset, as memory loads are added to the processor in the second and third banks, the processor clocks the memory down to the next slowest speed in order to manage performance. The memory speeds shown in the table below are the maximum that the processor types can support as specified by Intel. 1
Kingston follows the configuration options recommended by OEMs. If specific OEMs offer Unbuffered ECC DIMMs on their servers or workstations, Kingston will offer them as well. When recommended by OEMs, Unbuffered ECC DIMMs are shipping in capacities up to 4GB, compared to Registered DIMMs which are shipping in capacities up to 8GB. These two module types cannot be mixed inside a specific server. Registered DIMMs offer support for enhanced error-correction capabilities using Intel x4 SDDC technology not featured on Unbuffered ECC DIMMs. Both Registered and Unbuffered ECC DIMMs support all Intel RAS features, such as Mirrored Channel Mode and Lockstep Channel Mode. For best performance when configuring a two-way server, Kingston recommends both processors be balanced by configuring the memory banks the same way. Kingston offers K3 kits of three modules to optimize the new Triple-Channel memory architecture. Depending upon the memory configuration of server or workstation boards, memory capacity could range up to 144GB with 8GB Registered DIMMs, or up to 48GB with 4GB Unbuffered ECC DIMMs. 2
The table below illustrates how to best configure a single processor. To configure a motherboard with two processors, simply apply the same rules. When a single K3 memory kit (abbreviated as 1 x K3) is installed per processor, the highest memory speed supported by the processor determines the actual memory speed achievable. This is automatically set by the Xeon processor. All Kingston DDR3 Registered and Unbuffered ECC DIMMs operate at 1333MHz by default, with the exception of Quad-Rank modules which are limited to 1066MHz. In the table below, if a Xeon X5550 or above is utilized, a DDR3-1333 kit runs at 1333MHz, while a quad-rank DDR3-1066 kit will run at 1066MHz. Xeon E5520-5540 processors will run DDR3-1333 modules at 1066MHz, while Quad-Rank DDR3-1066 will run at 1066MHz. Xeon E5504-E5510 processors will run DDR3-1333 and Quad-Rank DDR3-1066 modules at a maximum speed of 800MHz, regardless of the speed of the memory module kit. When two K3 kits (2 x K3) are installed per processor, shown below, the Xeon 5550 or above processors run memory at a maximum speed of 1066MHz. When two Quad-Rank kits are used, or one Quad-Rank kit plus one Single/Dual-Rank kit are installed, the memory speed is reduced to 800MHz. 3
In a fully loaded configuration with three Single- or Dual-Rank K3 kits (3 x K3), memory speed with all processor types is limited to 800MHz. When Quad-Rank kits are used, only two memory kits can be installed per processor. In the special case where Quad-Rank or Unbuffered ECC memory kits are used, they are restricted to only two kits or two banks per processor. If the platform offers a third bank of sockets for three kits, the third bank cannot be populated. 4
When low power consumption and reduced heat dissipation are required, Low Power (LP) options are available. Kingston matches OEM offerings with Low Power modules featuring special chip configurations or modules built with low power chips to reduce energy consumption. Kingston will follow the same strategy as OEMs on its configurator. For low power configurations, Kingston recommends installing high capacity kits in fewer sockets to reduce heat and energy costs. When Quad-Rank kits are used, up to two kits per processor can be installed, even if a single Quad-Rank kit is installed with a standard Dual-Rank or Single-Rank kit. The maximum capacity will range up to 96GB or 48GB using 8GB Quad-Rank or 4GB Quad-Rank modules respectively (or 24GB Quad-Rank or 12GB Quad- Rank kits respectively). To maximize memory capacity, utilize the non-quad Rank 8GB and 4GB memory modules (or 24GB or 12GB K3 kits) to boost memory capacity and utilize up to nine memory sockets per processor. For more information, or to use the memory finder, visit kingston.com. Information contained in this presentation is based upon Intel Xeon 5500 series specifications and is subject to change. Always check your platform specifications for specific requirements. While Kingston uses its best efforts to provide accurate and up-to-date information, we cannot guarantee that the content is free from any errors or omissions. Kingston is providing this data as is, and disclaims any and all warranties. In no event will Kingston be liable to you or to any third party for any direct, indirect, incidental, consequential, special or exemplary damages or lost profit resulting from any use or misuse of this data. Product specifications subject to change at any time without notice. 2009 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA. All rights reserved. All trademarks and registered trademarks are the property of their respective owners. Printed in the USA MKF-102.1