(51) Int Cl.: H04N 5/225 ( )

Transcription

1 (19) TEPZZ_94 66_B_T (11) EP B1 (12) EUROPEAN PATENT SPECIFICATION (4) Date of publication and mention of the grant of the patent: Bulletin 2014/38 (1) Int Cl.: H04N /22 ( ) (21) Application number: (22) Date of filing: (4) Electronic assembly comprising an image sensor chip and fabrication method thereof Elektronische Anordnung umfassend einen Bildsensorchip und Herstellungsverfahren dafür Ensemble électronique comprenant une puce détecteur d images et son procédé de fabrication (84) Designated Contracting States: AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC MT NL PL PT RO SE SI SK TR (30) Priority: US P US 7071 (43) Date of publication of application: Bulletin 2008/28 (73) Proprietors: VisEra Technologies Company Limited Hsin-Chu City, (TW) OmniVision Technologies, Inc. Santa Clara, CA 904 (US) Zung, Pai-Chun Peter Hsinchu City 300 (TW) Lin, Tzu-Han Hsinchu City 300 (TW) Shiung, Shin-Chang Fongyuan City Taichung County 420 (TW) (74) Representative: Urner, Peter Ter Meer Steinmeister & Partner Mauerkircherstrasse München (DE) (6) References cited: WO-A2-01/91193 US-A US-A (72) Inventors: Chen, Teng-Sheng Hsinchu City 300 (TW) EP B1 Note: Within nine months of the publication of the mention of the grant of the European patent in the European Patent Bulletin, any person may give notice to the European Patent Office of opposition to that patent, in accordance with the Implementing Regulations. Notice of opposition shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention). Printed by Jouve, 7001 PARIS (FR)

2 1 EP B1 2 Description BACKGROUND OF THE INVENTION Field of the Invention [0001] The invention relates to image sensor technology and more particularly to a package module and an electronic assembly comprising an image sensor chip with electromagnetic interference (EMI) shielding. Description of the Related Art [0002] Charge coupled devices (CCD) and complementary metal oxide semiconductor CMOS image sensor devices are widely used in digital imaging applications. Image capture technology is well known to consumers due to the proliferation of devices employing image sensor devices, including digital cameras, digital video recorders, image capture capable mobile phones, and monitors. [0003] A typical image sensor device includes an array of pixel diodes, control circuitry, an analogue to digital converter, and an amplifier. Regardless of whether these devices are on the same chip as the sensor device, in the camera module or on the printed circuit board (PCB), protection against electromagnetic interference EMI resulting from electromagnetic radiation is a design challenge. If EMI protection can not be designed into a package module or electronic assembly of an image sensor device performance may suffer. US 2006/ A1 discloses a CCD package comprising a wafer and a glass plate adhered to a first or front face of the wafer by using an adhesive. The adhesive is formed in such a manner that it avoids the CCD sensor part formed on the first face of the semiconductor wafer. An electrode pad out of a metallic wire layer is formed on the first face of the semiconductor wafer. An input/output terminal shown as solder ball is electrically connected with the pad by means of a conductor layer that is electrically insulated from the semiconductor wafer. The conductor layer is formed on the inner wall of a penetrating hole formed immediately below the electrode pad in the semiconductor wafer. BRIEF SUMMARY OF THE INVENTION chip disposed between lower and upper substrates. A first conductive layer is disposed over a first sidewall of the lower substrate and is insulated from the image sensor chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. [0007] An electronic assembly comprises a lens set, a package module, and an opaque conductive layer. The lens set is mounted on the package module. The package module comprises lower and upper substrates with an image sensor chip disposed therebetween. A first conductive layer is over a first sidewall of the lower substrate and is insulated from the image sensor chip. A first protective layer is on the first conductive layer and exposes a portion of the first conductive layer over the first sidewall of the lower substrate. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The opaque conductive layer is disposed on the sidewall of the lens set and is electrically connected to the first conductive layer. [0008] A method for fabricating an electronic assembly comprises providing a package module comprising an image sensor chip disposed between lower and upper substrates. A first conductive layer is over a first sidewall of the lower substrate and insulated from the image sensor chip. A first conductive layer is over a first sidewall of the lower substrate and is insulated from the image sensor chip. A first pad is on the bottom surface of the lower substrate and is electrically connected to the first conductive layer. The first protective layer is partially removed to expose a portion of the first conductive layer over the first sidewall of the lower substrate. A lens set is mounted on the package module. An opaque conductive layer is formed on the sidewall of the lens set directly on the exposed portion of the first conductive layer. The package module with the lens set is mounted on a printed circuit board comprising a grounding pad therein. BRIEF DESCRIPTION OF DRAWINGS [0009] The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein: [0004] The object underlying the present invention is to provide a package module and an electronic assembly, both comprising an image sensor chip, which can be effectively protected against electromagnetic interference resulting from electromagnetic radiation so as to improve the performance of the image sensor chip. Another object of the present invention is to provide a method of fabricating such improved devices. [000] This object is achieved by the subject matter of the independent claims. [0006] A package module comprises an image sensor 0 Fig. 1 is a cross section of an electronic assembly comprising an image sensor device known to the inventors; and Figs. 2A to 2E are cross sections of an exemplary embodiment of an electronic assembly comprising an image sensor device. DETAILED DESCRIPTION OF INVENTION [00] The following description is of the best-contemplated mode of carrying out the invention. This descrip- 2

3 3 EP B tion is provided for the purpose of illustrating the general principles of the invention and should not be taken in a limiting sense. The scope of the invention is best determined by reference to the appended claims. [0011] Fig. 1 demonstrates an electronic assembly for an image sensor device known to the inventors. This is not prior art for the purposes of determining the patentability of the invention. This merely shows a problem founded by the inventors. [0012] As shown in Fig. 1, the electronic assembly comprises an image sensor chip scale package (CSP) module and a lens set 200 sequentially mounted on a printed circuit board (PCB) 300. The CSP module comprises a device chip 4, such as a charge-coupled device (CCD) image sensor chip or CMOS image sensor chip, is interposed between lower and upper substrates 0 and 2 comprising glass, quartz or other transparent material. The device chip 4 is adhered to the lower substrate 0 via an epoxy layer 112 and is adhered to the upper substrate 2 via a spacer (or dam) 6 forming a cavity 8 therebetween. A micro-lens array (not shown) may be formed on the device chip 4 in the cavity 8. A conductive layer 1 is disposed along the sidewall and the bottom of the lower substrate 0. Typically, the conductive layer 1 on the bottom of the lower substrate 0 is patterned to form grounding pads of the CSP module and signal pads. In order to simplify the diagram, only two grounding pads 1a of the CSP module and one signal pad 1b are depicted. The conductive layer 1 over the sidewall of the lower substrate 0 laterally contact grounding pads 3 of the device chip 4 to electrically connect the grounding pads 1a of the CSP module and grounding pads 3 of the device chip 4. A protective layer 1 covers the conductive layer 1. The protective layer 1 at the bottom of the lower substrate 0 is patterned to expose the pads 1a and 1b. Solder balls 111 and 113 are respectively disposed on the corresponding pads 1a and 1 b. [0013] A lens set 200 comprising a stack of multiple lenses (not shown) is mounted on the CSP module to form a compact camera module (CCM). The CCM is mounted on the PCB 300 via solder balls 111 and 113. The solder balls 111 are electrically connected to a grounding layer 302 inside the PCB 300 through grounding pads 301 of the PCB 300 and plugs 309 thereunder. The solder ball 113 is electrically connected to the circuits (not shown) on the PCB 300 through a pad 30. [0014] In order to suppress EMI, a metal housing 2 covers the CCM and is electrically connected to the grounding layer 302 through grounding pads 303 of the PCB 300 and plugs 307 thereunder. The metal housing 2 for EMI shielding, however, increase the total volume of the CCM, thus, reducing the size and weight of the CCM is difficult. Moreover, the metal housing for EMI shielding increases manufacturing cost. The inventors have discovered that the following method for fabricating an electronic assembly for an image sensor device can integrate the semiconductor technology with EMI shielding technology without requiring use of a metal housing. [00] Accordingly, the invention relates to an electronic assembly for an image sensor device and a method for fabricating the same, capable of suppressing EMI problems without requiring use of a metal housing for EMI shielding. Fig. 2E illustrates an embodiment of an electronic assembly for an image sensor. Elements in Fig. 2E that are the same as those in Fig. 1 are labeled with the same reference numbers as in Fig. 1 and are not described again for brevity. The electronic assembly for the image sensor device comprises a CCM mounted on a PCB 300, comprising a lens set 200, a package module and an opaque conductive layer 220. Similar to the package module shown in Fig. 1, the grounding pad 3 of the device chip 4 is electrically connected to the grounding layer 302 inside the PCB 300 through the conductive layer 1, the pad 1a, the solder ball 111, the grounding pad 301 of the PCB 300 and the plug 309 formed in the PCB 300. Unlike the package module shown in Fig. 1, however, the package module shown in Fig. 2E further comprises a conductive layer 117 similar to the conductive layer 1 on a sidewall 0b of the lower substrate 0, overlying a sidewall 0a of the lower substrate 0, but is insulated from the device chip 4. That is, the conductive layer 117 is not connected to any part of grounding pad 3 of the device chip 4 or other input/output pad 119 of the device chip 4, such that the conductive layer 117 is insulated from the devices or circuits (not shown) of the device chip 4. In this embodiments, the conductive layers 1 and 117 and the pads 111, 113 and 1 comprise a single layer, respectively. In some embodiments, the conductive layers 1 and 117 and the pads 111, 113 and 1 may comprise a multi-layer structure. Typically, the multi-layer structure may comprise a plurality layers and a plurality of plugs disposed therebetween for electrical connection. [0016] Moreover, the conductive layer 117 extends to the bottom of the lower substrate 0 to form a pad 117a for electrically connecting to the grounding layer 302 through a solder ball 1 formed on the pad 117a and a grounding pad 321 of the PCB 300 and a plug 323 formed in the PCB 300. A protective layer 130a covers the conductive layer 117 and exposes a portion of the conductive layer 117 over the sidewall 0a of the lower substrate 0. The opaque conductive layer 220 is disposed on the sidewall of the lens set 200 and is electrically connected to the conductive layer 117. The opaque conductive layer 220 may, for example, extend onto the package module to directly contact the exposed portion of the conductive layer 117 over the sidewall 0a of the lower substrate 0. In this embodiment, the opaque conductive layer 220 may comprise metal or other suitable EMI shielding materials. Additionally, because the conductive layer 220 is opaque it may serve as a light-shielding layer. [0017] The opaque conductive layer 220, the conductive layer 117, the pad 117a and the solder ball 1, rather than the metal housing 2 shown in Fig. 1, serve to suppress EMI. 3

4 EP B1 6 [0018] Figs. 2A to 2E are cross sections of an exemplary embodiment of an electronic assembly for an image sensor device. Elements in Figs. 2A to 2E that are the same as those in Fig. 1 are labeled with the same reference numbers as Fig. 1 and are not described again for brevity. As shown in Fig. 2A, a package module is provided. The package module may be fabricated by CSP, wafer level CSP or other conventional package technology. In this embodiment, the package module is preferably fabricated by CSP. The package module is similar to that shown in Fig. 1, with the arrangement of a conductive layer 117 covered by a protective layer 130 being the difference. More particularly, the conductive layer 117 over a sidewall 0a of the lower substrate 0 is insulated from the device chip 4. That is, the conductive layer 117 is not connected to a grounding pad 3 of the device chip 4 or other input/output pad 119 of the device chip 4, such that the conductive layer 117 is insulated from the devices or circuits (not shown) of the device chip 4. Moreover, the conductive layer 117 partially extends to the bottom surface of the lower substrate 0 to serve as a pad 117a. A solder ball 1 is disposed on the pad 117a for a subsequent mounting process. [0019] As shown in Fig. 2B, the protective layer 130 is partially removed by conventional lithography and etching, to leave a portion of the protective layer 130a, thus, a portion of the protective layer 117 over the sidewall 0a of the lower substrate 0 is exposed. In some embodiments, the protective layer 130 may be partially removed to expose the portion of the protective layer 117 over the sidewall 0a of the lower substrate 0 prior to formation of solder balls 111, 113 and 1. [0020] A lens set 200 is subsequently mounted on the package module, as shown in Fig. 2C. In this embodiment, the lens set comprising a stack of multiple lenses (not shown) does not use a housing or holder for mounting the lens set to the package module. [0021] As shown in Fig. 2D, an opaque conductive layer 220 is deposited on the sidewall of the lens set 200 and the sidewall of the package module to directly contact the exposed conductive layer 117 over the sidewall 0a of the lower substrate 0. Thus, a CCM is completed. In this embodiment, the opaque conductive layer 220 may comprise metal or other EMI shielding materials and serve as a light shielding layer. [0022] As shown in Fig. 2E, the CCM is electrically connected to a PCB 300. For example, the CCM is mounted on a PCB 300 through the solder balls 111, 113 and 1 formed on the CCM and the pads 301, 30 and 321 on the PCB 300 for the electrical connection. More particularly, the pad 301 is electrically connected to a grounding layer 302 inside the PCB 300 through a plug 309 for grounding the system. Moreover, the pad 321 is electrically connected to the grounding layer 302 through a plug 323 for EMI shielding. Thus, an electronic assembly for an image sensor device with EMI shielding is completed. [0023] According to the invention, since the opaque conductive layer 220, the conductive layer 117, the pad a and the solder ball 1 can be utilized, rather than the metal housing 2 shown in Fig. 1, the size and weight of the CCM can be reduced. Moreover, since the electronic assembly for an image sensor device can be fabricated without forming an additional housing or cover for EMI shielding, the manufacturing cost can be reduced. [0024] While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements. Claims 1. An electronic assembly having a package module comprising: - a lower substrate and an upper substrate (0, 2) opposite thereto; and - an image sensor chip (4) disposed between the lower and upper substrates (0, 2); characterized by - a first conductive layer (117) over a first sidewall (0a) of the lower substrate (0), insulated from the image sensor chip (4); - a first protective layer (130a) on the first conductive layer (117), exposing a portion of the first conductive layer (117) over the first sidewall (0a) of the lower substrate (0); and - a first pad (117a) on the bottom surface of the lower substrate (0), electrically connected to the first conductive layer (117). 2. The electronic assembly as claimed in claim 1, further comprising: - a grounding pad (3) on the image sensor chip (4); - a second pad (1a) on the bottom surface of the lower substrate (0); - a second conductive layer (1) over a second sidewall (0b) of the lower substrate (0), electrically connected between the grounding pad (3) and the second pad (1a); and - a second protective layer (1) on the second conductive layer (1) over the second sidewall of the lower substrate (0). 3. The electronic assembly as claimed in claim 1, wherein the image sensor chip (4) comprises a 4

5 7 EP B1 8 CCD or CMOS image sensor chip (4). 4. The electronic assembly as claimed in claim 1, further comprising: - a lens set (200) mounted on the package module; and - an opaque conductive layer (220) disposed on the sidewall of the lens set (200) and electrically connected to the first conductive layer (117). the lower and upper substrates (0, 2); - a first conductive layer (117) over a first sidewall (0a) of the lower substrate (0), insulated from the image sensor chip (4); - a first protective layer (130) on the first conductive layer (117); and - a first pad (117a) on the bottom surface of the lower substrate (0), electrically connected to the first conductive layer (117);. The electronic assembly as claimed in claim 4, wherein the opaque conductive layer (220) directly contacts the exposed portion of the first conductive layer (117). 6. The electronic assembly as claimed in claim 4, further comprising: - a printed circuit board (300) mounted to the package module, comprising a grounding layer (302) therein; and - a solder ball (1) disposed on the first pad (117a) and electrically connected to the grounding layer (302). 7. The electronic assembly as claimed in claim 6, wherein the package module further comprises: - a grounding pad (3) on the image sensor chip (4); - a second pad (1a) on the bottom surface of the lower substrate (0); - a second conductive layer (1) over a second sidewall (0b) of the lower substrate (0), electrically connected between the grounding pad (3) and the second pad (1a); and - a second protective layer (1) on the second conductive layer (1) over the second sidewall (0b) of the lower substrate (0). 8. The electronic assembly as claimed in claim 7, wherein the first and second conductive layers (117, 1) and the first and second pads (117a, 1a) comprise a multi-layer structure, respectively. 9. The electronic assembly as claimed in claim 4, wherein the image sensor chip (4) comprises a CCD or CMOS image sensor chip.. A method for fabricating an electronic assembly for an image sensor device, comprising: - providing a package module, comprising: - a lower substrate and an upper substrate (0, 2) opposite thereto; - an image sensor chip (4) disposed between partially removing the first protective layer (130) to expose a portion of the first conductive layer (117) over the first sidewall (0a) of the lower substrate (0); - mounting a lens set (200) onto the package module; - forming an opaque conductive layer (220) on the sidewall of the lens set (200) and directly on the exposed portion of the first conductive layer (117); and - mounting the package module with the lens set (220) on a printed circuit board (300) comprising a grounding pad (301, 321) therein. 11. The method as claimed in claim, further forming a solder ball (1) between the first pad (117a) and the printed circuit board (300) and electrically connected to the grounding layer (302). 12. The method as claimed in claim, wherein the package module further comprises: - a grounding pad (3) on the image sensor chip (4); - a second pad (1a) on the bottom surface of the lower substrate (0); - a second conductive layer (1) over a second sidewall (0b) of the lower substrate (0), electrically connected between the grounding pad (3) and the second pad (1a); and - a second protective layer (1) on the second conductive layer (1) over the second sidewall (0b) of the lower substrate (0). 13. The method as claimed in claim 12, further forming a solder ball (111) between the second pad (1a) and the printed circuit board (300) and electrically connected to the grounding layer (302). 14. The method as claimed in claim 12, wherein the first and second conductive layers (117, 1) and the first and second pads (117a, 1 a) comprise a multilayer structure, respectively.. The method as claimed in claim, wherein the image sensor chip (4) comprises a CCD or CMOS image sensor chip.

6 9 EP B1 Patentansprüche ersten leitfähigen Schicht (117) ist. 1. Elektronische Anordnung, die ein Baugruppenmodul besitzt und umfasst: - ein unteres Substrat und ein diesem gegenüberliegendes oberes Substrat (0, 2); und - einen Bildsensorchip (4), der zwischen dem unteren und dem oberen Substrat (0, 2) angeordnet ist; gekennzeichnet durch - eine erste leitfähige Schicht (117) über einer ersten Seitenwand (0a) des unteren Substrats (0), die von dem Bildsensorchip (4) isoliert ist; - eine erste Schutzschicht (130a) auf der ersten leitfähigen Schicht (117), die einen Abschnitt der ersten leitfähigen Schicht (117) über der ersten Seitenwand (0a) des unteren Substrats (0) freilegt; und - eine erste Anschlussfläche (117a) auf der unteren Oberfläche des unteren Substrats (0), die mit der ersten leitfähigen Schicht (117) elektrisch verbunden ist. 2. Elektronische Anordnung nach Anspruch 1, die ferner umfasst: Elektronische Anordnung nach Anspruch 4, die ferner umfasst: - eine Leiterplatte (300), die an dem Baugruppenmodul montiert ist und eine Masseschicht (302) umfasst; und - eine Lötkugel (1), die an der ersten Anschlussfläche (117a) angeordnet ist und mit der Masseschicht (302) elektrisch verbunden ist. 7. Elektronische Baugruppe nach Anspruch 6, wobei das Baugruppenmodul ferner umfasst: - eine Masseanschlussfläche (3) auf dem Bildsensorchip (4); - eine zweite Anschlussfläche (1a) auf der unteren Oberfläche des unteren Substrats (0); - eine zweite leitfähige Schicht (1) über einer zweiten Seitenwand (0b) des unteren Substrats (0), die zwischen der Masseanschlussfläche (3) und der zweiten Anschlussfläche (1a) elektrisch angeschlossen ist; - eine zweite Schutzschicht (1) auf der zweiten leitfähigen Schicht (1) über der zweiten Seitenwand (0b) des unteren Substrats (0). - eine Masseanschlussfläche (3) auf dem Bildsensorchip (4); - eine zweite Anschlussfläche (1a) auf der unteren Oberfläche des unteren Substrats (0); - eine zweite leitfähige Schicht (1) über einer zweiten Seitenwand (0b) des unteren Substrats (0), die zwischen der Masseanschlussfläche (3) und der zweiten Anschlussfläche (1a) elektrisch angeschlossen ist; und eine zweite Schutzschicht (1) auf der zweiten leitfähigen Schicht (1) über der zweiten Seitenwand des unteren Substrats(0) Elektronische Anordnung nach Anspruch 7, wobei die erste und die zweite leitfähige Schicht (117, 1) und die erste und die zweite Anschlussfläche (117a, 1a) jeweils eine Mehrschichtstruktur aufweisen. 9. Elektronische Anordnung nach Anspruch 4, wobei der Bildsensorchip (4) einen CCD- oder CMOS- Bildsensor-Chip umfasst.. Verfahren zur Herstellung einer elektronischen Anordnung für eine Bildsensorvorrichtung, das umfasst: 3. Elektronische Anordnung nach Anspruch 1, wobei der Bildsensorchip (4) einen CCD- oder CMOS- Bildsensor-Chip (4) umfasst. 4. Elektronische Anordnung nach Anspruch 1, die ferner umfasst:: - ein Linsensatz (200), der auf dem Baugruppenmodul montiert ist; und - eine lichtundurchlässige leitfähige Schicht (220), die auf der Seitenwand des Linsensatzes (200) angeordnet ist und elektrisch mit der ersten leitfähigen Schicht (117) verbunden ist.. Elektronische Anordnung nach Anspruch 4, wobei die lichtundurchlässige leitfähige Schicht (220) in direktem Kontakt mit dem freiliegenden Abschnitt der Bereitstellen eines Baugruppenmoduls, das umfasst: - ein unteres Substrat und ein diesem gegenüberliegendes oberes Substrat (0, 2); - einen Bildsensorchip (4), der zwischen dem unteren und dem oberen Substrat (0, 2) angeordnet ist; - eine erste leitfähige Schicht (117) über einer ersten Seitenwand (0a) des unteren Substrats (0), die von dem Bildsensorchip (4) isoliert ist; - eine erste Schutzschicht (130) auf der ersten leitfähigen Schicht (0); und - eine erste Anschlussfläche (117a) auf der 6

7 11 EP B1 12 unteren Oberfläche des unteren Substrats (0), die mit der ersten leitfähigen Schicht (117) elektrisch verbunden ist; - teilweises Entfernen der ersten Schutzschicht (130), um einen Abschnitt der ersten leitfähigen Schicht (117) über der ersten Seitenwand (0a) des unteren Substrats (0) freizulegen; - Montieren eines Linsensatzes (200) auf dem Baugruppenmodul; - Bilden einer lichtundurchlässigen, leitfähigen Schicht (220) auf der Seitenwand des Linsensatzes (200) und direkt auf dem freigelegten Abschnitt der ersten leitfähigen Schicht (117); und - Montieren des Baugruppenmoduls mit dem Linsensatz (220) auf einer Leiterplatte (300), in der eine Masseanschlussfläche (301, 321) vorgesehen ist. 11. Verfahren nach Anspruch, das ferner ein Bilden einer Lötkugel (1) zwischen der ersten Anschlussfläche (117a) und der Leiterplatte (300) umfasst, die elektrisch mit der Masseschicht (302) verbunden ist. 12. Verfahren nach Anspruch, wobei das Baugruppenmodul ferner umfasst: - eine Masseanschlussfläche (3) auf dem Bildsensorchip (4); - eine zweite Anschlussfläche (1a) auf der unteren Oberfläche des unteren Substrats (0); - eine zweite leitfähige Schicht (1) über einer zweiten Seitenwand (0b) des unteren Substrats (0), die zwischen der Masseanschlussfläche (3) und der zweiten Anschlussfläche (1a) elektrisch angeschlossen ist; und - eine zweite Schutzschicht (1) auf der zweiten leitfähigen Schicht (1) über der zweiten Seitenwand (0b) des unteren Substrats (0). 13. Verfahren nach Anspruch 12, das ferner ein Ausbilden einer Lötkugel (111) zwischen der zweiten Anschlussfläche (1a) und der Leiterplatte (300) umfasst, die elektrisch mit der Masseschicht (302) verbunden ist. 14. Verfahren nach Anspruch 12, wobei die erste und die zweite leitfähige Schicht (117, 1) und die erste und die zweite Anschlussfläche (117a, 1a) jeweils eine Mehrschichtstruktur aufweisen Revendications 1. Ensemble électronique comportant un module de boîtier comprenant : - un substrat inférieur et un substrat supérieur (0, 2) à l opposé l un de l autre ; et - une puce détecteur d images (4) disposée entre les substrats inférieur et supérieur (0, 2) ; caractérisé par - une première couche conductrice (117) audessus d une première paroi latérale (0a) du substrat inférieur (0), isolée de la puce détecteur d images (4) ; - une première couche protectrice (130a) sur la première couche conductrice (117), exposant une portion de la première couche conductrice (117) au-dessus de la première paroi latérale (0a) du substrat inférieur (0) ; et - un premier plot (117a) sur la surface inférieure du substrat inférieur (0), relié électriquement à la première couche conductrice (117). 2. Ensemble électronique selon la revendication 1, comprenant en outre : - un plot de mise à la masse (3) sur la puce détecteur d images (4) ; - un deuxième plot (1a) sur la surface inférieure du substrat inférieur (0) ; - une deuxième couche conductrice (1) audessus d une deuxième paroi latérale (0b) du substrat inférieur (0), reliée électriquement entre le plot de mise à la masse (3) et le deuxième plot (1a) ; et - une deuxième couche protectrice (1) sur la deuxième couche conductrice (1) au-dessus de la deuxième paroi latérale du substrat inférieur (0). 3. Ensemble électronique selon la revendication 1, dans lequel la puce détecteur d images (4) comprend une puce détecteur d images CCD ou CMOS (4). 4. Ensemble électronique selon la revendication 1, comprenant en outre :. Verfahren nach Anspruch, wobei der Bildsensorchip (4) einen CCD- oder CMOS-Bildsensor-Chip umfasst. - un ensemble de lentilles (200) monté sur le module de boîtier ; et - une couche conductrice opaque (220) disposée sur la paroi latérale de l ensemble de lentilles (200) et reliée électriquement à la première couche conductrice (117). 7

8 13 EP B1 14. Ensemble électronique selon la revendication 4, dans lequel la couche conductrice opaque (220) est en contact directement avec la portion exposée de la première couche conductrice (117). 6. Ensemble électronique selon la revendication 4, comprenant en outre : - une carte de circuits imprimés (300) montée sur le module de boîtier, comprenant une couche de mise à la masse (302) à l intérieur de celle-ci ; et - une bille de soudure (1) disposée sur le premier plot (117a) et reliée électriquement à la couche de mise à la masse (302). 7. Ensemble électronique selon la revendication 6, dans lequel le module de boîtier comprend en outre : - un plot de mise à la masse (3) sur la puce détecteur d images (4) ; - un deuxième plot (1a) sur la surface inférieure du substrat inférieur (0) ; - une deuxième couche conductrice (1) audessus d une deuxième paroi latérale (0b) du substrat inférieur (0), reliée électriquement entre le plot de mise à la masse (3) et le deuxième plot (1a) ; et - une deuxième couche protectrice (1) sur la deuxième couche conductrice (1) au-dessus de la deuxième paroi latérale (0b) du substrat inférieur (0). 8. Ensemble électronique selon la revendication 7, dans lequel les première et deuxième couches conductrices (117, 1) et les premier et deuxième plots (117a, 1a) comprennent respectivement une structure multicouche. 9. Ensemble électronique selon la revendication 4, dans lequel la puce détecteur d images (4) comprend une puce détecteur d images CCD ou CMOS.. Procédé de fabrication d un ensemble électronique pour un dispositif détecteur d images, comprenant : une première couche protectrice (130) sur la première couche conductrice (117) ; et - un premier plot (117a) sur la surface inférieure du substrat inférieur (0), relié électriquement à la première couche conductrice (117) ; - l enlèvement partiel de la première couche protectrice (130) pour exposer une portion de la première couche conductrice (117) au-dessus de la première paroi latérale (0a) du substrat inférieur (0) ; - le montage d un ensemble de lentilles (200) sur le module de boîtier ; - la formation d une couche conductrice opaque (220) sur la paroi latérale de l ensemble de lentilles (200) et directement sur la portion exposée de la première couche conductrice (117) ; et - le montage du module de boîtier avec l ensemble de lentilles (220) sur une carte de circuits imprimés (300) comprenant un plot de mise à la masse (301, 321) à l intérieur de celle-ci. 11. Procédé selon la revendication, comprenant en outre la formation d une bille de soudure (1) entre le premier plot (117a) et la carte de circuits imprimés (300) et reliée électriquement à la couche de mise à la masse (302). 12. Procédé selon la revendication, dans lequel le module de boîtier comprend en outre : - un plot de mise à la masse (3) sur la puce de capteur d images (4) ; - un deuxième plot (1a) sur la surface inférieure du substrat inférieur (0) ; - une deuxième couche conductrice (1) audessus d une deuxième paroi latérale (0b) du substrat inférieur (0), reliée électriquement entre le plot de mise à la masse (3) et le deuxième plot (1a) ; et - une deuxième couche protectrice (1) sur la deuxième couche conductrice (1) au-dessus de la deuxième paroi latérale (0b) du substrat inférieur (0). - la fourniture d un module de boîtier, comprenant : - un substrat inférieur et un substrat supérieur (0, 2) à l opposé l un de l autre ; - une puce détecteur d images (4) disposée entre les substrats inférieur et supérieur (0, 2) ; - une première couche conductrice (117) au-dessus d une première paroi latérale (0a) du substrat inférieur (0), isolée de la puce détecteur d images (4) ; Procédé selon la revendication 12, comprenant en outre la formation d une bille de soudure (111) entre le deuxième plot (1a) et la carte de circuits imprimés (300) et reliée électriquement à la couche de mise à la masse (302). 14. Procédé selon la revendication 12, dans lequel les première et deuxième couches conductrices (117, 1) et les premier et deuxième plots (117a, 1a) comprennent respectivement une structure multicouche. 8

9 EP B1 16. Procédé selon la revendication, dans lequel la puce détecteur d images (4) comprend une puce détecteur d images CCD ou CMOS

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16 EP B1 REFERENCES CITED IN THE DESCRIPTION This list of references cited by the applicant is for the reader s convenience only. It does not form part of the European patent document. Even though great care has been taken in compiling the references, errors or omissions cannot be excluded and the EPO disclaims all liability in this regard. Patent documents cited in the description US A1 [0003] 16