Intel Server Board SE7320VP2 Memory Test List

Transcription

1 Intel Server Board SE7320VP2 Memory Test List Revision 54.0 September 200

2 Revision History Rev Modifications Sept/ Release revision. Oct/ dded * 256MB part. dded Infineon* and * 1GB parts. (In shaded area) Oct/ dded Infineon 256MB parts. dded TP*, Infineon and 512MB parts. (In shaded area) Nov/ dded TRS* 512MB, 1GB, and 2GB parts. dded TP and Smart* 512MB and 1GB parts. dded 1GB part. (In shaded area) Nov/ dded Ventura*, TRS and * 1GB parts. dded Ventura and Smart 2GB parts. (In shaded area) Dec/ dded pacer* 512MB and 1GB parts. dded TRS 1GB parts. (In shaded area) Dec/ dded Legacy* and Viking* 1GB parts. (In shaded area) Dec/04.0 dded 256MB part, 512MB part and Legacy 2GB parts. (In shaded area) Dec/04.0 dded Viking and pacer 2GB parts. (In shaded rea) Jan/ dded Legacy 512MB and Smart 1GB parts. (In shaded area) Jan/ dded Infineon 1GB and Smart 2GB parts. (In shaded area) Feb/ dded TP 2GB parts. (In shaded area) Feb/ dded * 256MB part. dded Legacy 1GB and TP 2GB parts. (In shaded area) Mar/ dded Ventura and 512MB parts. dded, Smart and TP 1GB parts. dded Infineon 2GB part. (In shaded area) Mar/ dded note on Lead free modules (these modules are now in bold text). dded Legend 256MB, 512MB and 1GB parts. dded Ventura, and Dane-elec* 1GB parts. dded Dataram* and Infineon 2GB parts. (In shaded area) pr/ dded Dataram, Ventura, Dane-Elec and 512MB parts. dded Dataram 1GB and 2GB parts. dded 2GB part. (In shaded area) pr/ dded 512MB and 2GB parts. dded 512MB parts. dded Ventura, Wintec*, and Dataram 1GB parts. (In shaded area) May/05.0 dded Simple* 512MB and 1GB parts. dded 512MB part. dded, and Infineon 1GB parts. dded Netlist* 2GB parts. (In shaded area) May/ dded vant* 512MB and 2GB parts. dded Dataram 1GB parts. (In shaded area) June/ dded support for D2-400 D II modules. dded Infineon, and D2 256MB parts. dded and Infineon D2 512MB parts. dded, Infineon and D2 1GB parts. dded, and Infineon D2 2GB parts. Replaced Low Profile column with. dded Dataram 1GB parts. dded vant 2GB parts. (In shaded area) Jun/ dded Wintec, and 512MB parts. dded and 1GB parts. dded Dataram and 2GB parts. dded 4GB part (In shaded area) 2

3 Rev Modifications ug/ dded 512MB parts. dded, Infineon,, Dataram and 1GB parts. 512MB, 1GB, 2GB and 4GB parts. (In shaded area) ug/ dded 1GB parts. dded Dataram 4GB parts. dded TRS 2GB parts. dded TP,, Legacy, Smart, Viking and Wintec D2 1GB parts. dded Smart, and Dataram D2 2GB parts. dded Viking, and Infineon D2 512MB parts. (In shaded area) Sept/ dded Wintec and 2GB part. dded 512MB part. (In shaded area) Oct/ dded Ventura and 512MB parts. dded Smart, Dataram and 1GB parts. (In shaded area) Oct/ dded Wintec, Dataram and D2 512MB parts. dded Legend and Legacy 1GB parts. dded Dataram, and D2 1GB parts. dded 2GB part. (In shaded area) Updated unleaded parts to correct shading. Nov/ dded 256MB parts. dded pacer, and 512MB parts. dded Dataram,, vant, and Legend 1GB parts. dded Smart,, and 2GB parts. dded Infineon 4GB part. (In shaded area) Nov/ Updated two 1GB parts with corrected M part numbers. (in shaded area) Dec/ dded Legend 1GB part. dded D 1GB part. dded Legacy D2 2GB part. dded Smart D2 4GB part. (In shaded area) Jan/ dded D2 4GB, 2GB and 512MB parts. dded TP D 4GB and D2 2GB parts. dded 1GB and 2GB parts. (In shaded area) Jan/ dded Legend 1GB part. dded Ventura D2 1GB part. dded pacer D2 512MB part. dded D1 256MB, 512MB, 1G & 2G parts. dded D2 2G part. dded D2 512MB, 1G & 4G parts. (In shaded area) Feb/ dded, Wintec and pacer D2 1GB parts. dded Infineon D1 512MB, 1G & 2G parts. dded D2 1G & 2G parts. (In shaded area) Mar/ dded Dataram 1GB part. dded TRS 2GB part. dded Smart and Legacy D2 1GB parts. dded Legacy and TP D2 512MB parts. dded Legend D2 2GB parts. (In shaded area) Mar/ dded TRS 512MB, 1GB and 2GB parts. dded Dataram 2GB part. dded TRS D2 512MB and 2GB parts. dded Legend D2 512MB part. dded Smart D2 1GB part. (In shaded area) May/ Infineon name change to effective May 1 st, dded TRS 512MB & 1G parts. Smart 512MB parts. dded and Dataram 1G, 2G & 4G parts. (In shaded area) June/06.0 dded Buffalo 512MB D1 part. dded Dataram 512MB, 1G and 2G D2 parts. dded 1G and 2G D2 parts. dded Smart 1G D2 part. (In shaded area) July/ dded TRS 512MB part. dded TRS,, and Smart 1GB parts. dded 2GB part. (In shaded area) July/ dded TRS 512MB part. dded TRS,, and Smart 1GB parts. dded 2GB part. (In shaded area) ug/ dded 512MB and 2GB parts. (In shaded area) 3

4 Rev Modifications ug/ dded TRS 2GB part. (In shaded area) Oct/ dded TRS and Super Talent Electronics 512MB parts. dded TRS, Super Talent Electronics, vant Technology, and 1GB parts. dded Super Talent Electronics 2GB part. (In shaded area) Nov/ dded 512MB, 1GB, and 2GB parts. (In shaded area) Jan/ dded 1GB part. dded, Smart, and TP Electronics 2GB parts. (In shaded area) Jan/ dded Smart Modular 4GB part. (In shaded area) Feb/ dded ll Components and TRS 1GB parts. dded 4GB part. Updated vendor contact information. (In shaded area) Mar/ Updated contact information. dded 512MB part. dded US Technology 1GB part. (In shaded area) May/ dded Dataram 512MB part. dded Dataram and 1GB parts. dded 2GB parts. (In shaded area) May/ dditional memory parts added. (In shaded area) Jul/ dditional memory parts added. (In shaded area) Nov/ dditional memory parts added. (In shaded area) Jan/ dditional memory parts added. (In shaded area) Mar/ dditional memory parts added. (In shaded area) May/ dditional memory parts added. (In shaded area) Sept dditional memory parts added. (In shaded area) 4

5 Disclaimer INTEL DISCLIMS LL LIBILITY FOR THESE DEVICES, INCLUDING LIBILITY FOR INFRINGEMENT OF NY PROPRIETRY RIGHTS RELTING TO THESE DEVICES OR THE IMPLEMENTTION OF INFORMTION IN THIS DOCUMENT. INTEL DOES NOT WRRNT OR REPRESENT THT SUCH DEVICES OR IMPLEMENTTION WILL NOT INFRINGE SUCH RIGHTS. INTEL IS NOT OBLIGTED TO PROVIDE NY SUPPORT, INSTLLTION, OR OTHER SSISTNCE WITH REGRD TO THESE DEVICES. THE INTEL PRODUCT REFERRED TO IN THIS DOCUMENT IS INTENDED FOR STNDRD COMMERCIL USE ONLY. CUSTOMERS RE SOLELY RESPONSIBLE FOR SSESSING THE SUITBILITY OF THE PRODUCT ND/OR DEVICES FOR USE IN PRTICULR PPLICTIONS. THE REFERENCED INTEL PRODUCT IS NOT INTENDED FOR USE IN CRITICL CONTROL OR SFETY SYSTEMS OR IN NUCLER FCILITY PPLICTIONS. Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by the sale of Intel products. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel retains the right to make changes to its test specifications and memory list at any time, without notice. The hardware vendor remains solely responsible for the design, sale and functionality of its product, including any liability arising from product infringement or product warranty. Only approved software drivers and accessories that are recommended for the revision number of the boards and system being operated should be used with Intel products. Please note that, as a result of warranty repairs or replacements, alternate software and firmware versions may be required for proper operation of the equipment. The Intel Server Board SE7320VP2 may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Copyright Intel Corporation 200. * Other brands and names are the property of their respective owners. Please Note: DIMM devices with gold contacts should NOT be placed into DIMM sockets with tin-lead contacts or vice-versa. Mixing dissimilar metal contact types has been shown to result in unreliable memory operation. Intel recommends similar manufacturer and similar speeds in each Rank on the memory module. Mixing of dissimilar memory manufacturer and similar speeds in each Rank on the memory module is NOT recommended. 5

6 Table of Contents 1. Overview of Memory Testing Paper Qualification Functional Testing Computer Memory Test Lab* Intel Server Board SE7320VP2 Memory Subsystem Memory Population Identifying Single Rank or Double Ranked DIMMs DIMM Capacity DIMM Organization SM Density SM Organization # SM Devices/rows/Ranks # ddress bits rows/ranks/column Ranked Tested Memory Registered ECC, D266 DIMM Modules 256MB Size (32M x 72) Registered ECC, D333 DIMM Modules MB Size (32M x 72) Registered ECC, D2-400 DIMM Modules MB Size (32M x 72) Registered, ECC, D266 DIMM Modules 512 MB Sizes (64Mx72) Registered, ECC, D333 DIMM Modules 512 MB Sizes (64Mx72) Registered, ECC, D333 DIMM Modules 512 MB Sizes (64Mx72) Registered, ECC, D2-400 DIMM Modules 512 MB Sizes (64Mx72)... Registered, ECC, D2-400 DIMM Modules 512 MB Sizes (64Mx72)... 1 Registered, ECC, D266 DIMM Modules GB Size (12M x 72) Registered, ECC, D333 DIMM Modules GB Size (12M x 72) Registered, ECC, D333 DIMM Modules GB Size (12M x 72) Registered, ECC, D333 DIMM Modules GB Size (12M x 72) Registered, ECC, D2-400 DIMM Modules GB Size (12M x 72) Registered, ECC, D2-400 DIMM Modules GB Size (12M x 72) Registered, ECC, D2-400 DIMM Modules

7 1GB Size (12M x 72) Registered, ECC, D266 DIMM Modules GB Size (256M x 72) Registered, ECC, D333 DIMM Modules GB Size (256M x 72)... 2 Registered, ECC, D2-400 DIMM Modules GB Size (256M x 72)... 2 Registered, ECC, D2-400 DIMM Modules GB Size (256M x 72) Registered, ECC, D266 DIMM Modules GB Size (256M x 72) Registered, ECC, D333 DIMM Modules GB Size (256M x 72) Registered, ECC, D2-400 DIMM Modules GB Size (256M x 72) Sales Information CMTL* (Computer Memory Test Labs)

8 1. Overview of Memory Testing The following test processes are used to qualify Dual In-Line Memory Modules (DIMMs) for use with the Intel Server Board SE7320VP2. Memory is a vital subsystem in a server. Intel requires that strict guidelines be met before a DIMM vendor is added to the Tested memory List. To be included on the list as a fully supported DIMM, the memory must undergo rigorous tests to ensure that the product will perform the intended server product functions. Memory qualification for Intel Server, Workstation, and RID Controller products is performed both by Intel s Memory Validation Lab (MVL) and by an independent external test lab, Computer Memory Test Lab* (CMTL). The Tested Memory Lists for Intel s server board, Workstation board, and RID controller products categorize memory modules as dvanced Tested. The dvanced Testing process includes a standard paper qualification and then is followed by two levels of functional testing. DIMMs that have completed and passed dvanced Testing are considered to be compatible with the product on which they were tested, and with the test software and operating systems that was used during the test process. 1.1 Paper Qualification paper qualification is performed to verify that the specifications of a given DIMM meet Intel s memory specifications for a given product. Specification criteria reviewed include: critical timings, electrical characteristics, timing requirements, environmental requirements, and packaging requirements. 1.2 Functional Testing fter a given DIMM passes the standard paper qualification, functionality of the DIMM is then tested with the intended Intel product. Two levels of functional testing is performed; Standard and dvanced. Standard functional testing requires that the given DIMM and Intel product combination operate with no failures for a period of no less than 24 hours for both minimum and maximum DIMM configurations. Testing is performed using a Microsoft Window* operating system and a custom test package. The test systems operate with standard voltage and at room temperature. dvanced functional testing requires that the given DIMM and Intel product combination operate with no failures for a period of no less than 24 hours for both minimum and maximum DIMM configurations. Testing is performed with multiple operating systems and various custom test packages. Each test configuration is tested with various voltage and temperature margin conditions. 1.3 Computer Memory Test Lab* Computer Memory Test Lab*, also known as CMTL, is a leading memory test organization responsible for testing a broad range of memory products. memory product, which receives a PSS after being tested by CMTL, means it functions correctly and consumers can use the product to perform the intended server functions. In order to pass these stringent standards, memory products must maintain the highest manufacturing procedures and pass an exacting battery of tests. Testing is performed with Intel supplied equipment and procedures defined by Intel s various functional testing levels. CMTL* Contact Info: Office: (4) Fax: (4) Computer Memory Test Lab (CMTL) 24 Hammond Suite F Irvine, C 26

9 2. Intel Server Board SE7320VP2 Memory Subsystem The Intel Server Board SE7320VP2 is capable of supporting either D266/333 or D2-400 memory technologies depending on which baseboard SKU is being used. NOTE: Industry naming conventions for equivalent memory technologies include the following: D266 = PC2100 D333 = PC2700 D2-400 = PC23200 The following maximum memory capacities are supported based on the number of DIMM slots provided and maximum supported memory loads by the chipset: 24GB maximum capacity for D266 16GB maximum capacity for D333 and D2-400 The minimum memory supported with the system running in single channel memory mode is: 256MB for D256, D333 and D Supported DIMM capacities are as follows: D266 Memory DIMM sizes include: 256MB, 512MB, 1GB, 2GB, and 4GB. D333 Memory DIMM sizes include: 256MB, 512MB, 1GB, 2GB, and 4GB. D2-400 Memory DIMM sizes include: 256MB, 512MB, 1GB, 2GB, and 4GB.

10 2.1 Memory Population The Intel Server Board SE7320VP2 has six DIMM slots, or three DIMM banks. Both DIMMs in a bank should be identical (same manufacturer, CS latency, number of rows, columns and devices, timing parameters etc.). lthough DIMMs within a bank must be identical, the BIOS supports various DIMM sizes and configurations allowing the banks of memory to be different. Memory sizing and configuration is guaranteed only for qualified DIMMs approved by Intel. MCH 3 3B 2 2B 1 1B Bank 3 Bank 2 Bank 1 Figure 1. Identifying Banks of Memory Mixing of D266, D333 and D2-400 DIMMs is supported between banks of memory. However, when mixing DIMM types, D333 will run at D266 speeds. The memory controller is capable of supporting up to 4 loads per channel for D333. Memory technologies are classified as being either single rank or dual rank depending on the number of M devices that are used on any one DIMM. single rank DIMM is a single load device, i.e.) Single Rank = 1 Load. Dual rank DIMMs are dual load devices, i.e.) Dual Rank = 2 loads. D266 and D333 DIMM population rules are as follows: (1) DIMM banks must be populated in order starting with the slots furthest from MCH (2) Single rank DIMMs must be populated before dual rank DIMMs (3) maximum of four DIMMs can be populated when all four DIMMs are dual rank D333 DIMMs. D2-400 DIMM population rules are as follows: (1) DIMMs banks must be populated in order starting with the slots furthest from MCH (2) Dual rank DIMMs are populated before single rank DIMMs (3) maximum of four DIMMs can be populated when all four DIMMs are dual rank D2-400 DIMMs 10

11 The following tables show the supported memory configurations: s/r = single rank d/r = dual rank E = Empty Table 1: Supported D266 DIMM Populations MCH Bank 3 DIMMs 3, 3B Bank 2 DIMMs 2, 2B Bank 1 DIMMs 1, 1B S/R S/R S/R E S/R S/R E E S/R D/R D/R D/R E D/R D/R E E D/R D/R S/R S/R D/R D/R S/R E D/R S/R Table 2: Supported D333 DIMM Populations MCH Bank 3 DIMMs 3, 3B Bank 2 DIMMs 2, 2B Bank 1 DIMMs 1, 1B S/R S/R S/R E S/R S/R E E S/R E D/R D/R E E D/R D/R S/R S/R E D/R S/R Table 3: Supported D2-400 DIMM Populations MCH Bank 3 DIMMs 3, 3B Bank 2 DIMMs 2, 2B Bank 1 DIMMs 1, 1B S/R S/R S/R E S/R S/R E E S/R E D/R D/R E E D/R E S/R D/R S/R S/R D/R Note: On the Intel Server Board SE7320VP2, when using all dual rank D333 or D2-400 DIMMs, a total of four DIMMs can be populated. Configuring more than four dual rank D333 or D2-400 DIMMs will result in the BIOS generating a memory configuration error. 11

12 2.2 Identifying Single Rank or Double Ranked DIMMs x = x Single-Ranked modules - have 5 Ms on the front and 4 Ms on the back with empty spots in between the Ms. x = x Double-Ranked modules - have Ms on each side for a total of (no empty slots) x4 = x4 Single-Ranked modules - have Ms on each side for a total of and look similar to x Double-Ranked x4 = x4 Double-Ranked modules - have (stacked) Ms on each side for a total of The table below lists the current supported memory types: D266 Registered SM Module Matrix DIMM Capacity DIMM Organization SM Density SM Organization # SM Devices/rows/Ranks # ddress bits rows/ranks/column Ranked 256MB 32M x 72 12Mbit 32M x 4 /1/4 12/2/11 Single Ranked 256MB 32M x 72 12Mbit 16M x /2/4 12/2/10 Double Ranked 256MB 32M x Mbit 32M x /1/4 13/2/10 Single Ranked 512MB 64M x Mbit 64M x 4 /1/4 13/2/11 Single Ranked 512MB 64M x Mbit 32M x /2/4 13/2/10 Double Ranked 512MB 64M x Mbit 64M x /1/4 13/2/11 Single Ranked 1GB 12M x Mbit 64M x 4 /2/4 13/2/11 Double Ranked 1GB 12M x Mbit 64M x /2/4 13/2/11 Double Ranked 1GB 12M x Mbit 12M x 4 /1/4 13/2/12 Single Ranked 2GB 256M x Mbit 12M x 4 /2/4 13/2/12 Double Ranked 4GB 512M x 72 1Gbit 512M x 72 /2/4 14/2/12 Double Ranked DIMM Capacity DIMM Organization D333 Registered SM Module Matrix SM Density SM Organization # SM Devices/rows/Ranks # ddress bits rows/ranks/column Ranked 256MB 32M x 72 12Mbit 32M x 4 /1/4 12/2/11 Double Ranked 256MB 32M x 72 12Mbit 16M x /2/4 12/2/10 Double Ranked 256MB 32M x Mbit 32M x /1/4 13/2/10 Single Ranked 512MB 64M x Mbit 64M x 4 /1/4 13/2/11 Single Ranked 512MB 64M x Mbit 32M x /2/4 13/2/10 Double Ranked 512MB 64M x Mbit 64M x /1/4 13/2/11 Single Ranked 1GB 12M x Mbit 12M x 4 /1/4 13/2/12 Single Ranked 1GB 12M x Mbit 64M x /2/4 13/2/11 Double Ranked 1GB 12M x 72 1Gbit 12M x 4 /1/4 14/2/11 Single Ranked 2GB 256M x 72 1Gbit 12M x 4 /1/4 14/2/12 Single Ranked 2GB 256M x 72 1Gbit 12M x /2/4 14/2/11 Double Ranked 4GB TBD TBD TBD TBD TBD TBD 12

13 DIMM Capacity DIMM Organization D2-400 Registered SM Module Matrix SM Density SM Organization # SM Devices/rows/Ranks # ddress bits rows/ranks/column Ranked 256MB 32M x Mbit 32M x /1/4 13/2/10 Single Ranked 512MB 64M x Mbit 64M x 4 /1/4 13/2/11 Single Ranked 512MB 64M x Mbit 32M x /2/4 13/2/10 Double Ranked 512MB 64M x Mbit 64M x /1/4 14/2/10 Single Ranked 1GB 12M x Mbit 12M x 4 /1/4 14/2/11 Single Ranked 1GB 12M x Mbit 64M x /2/4 14/2/10 Double Ranked 1GB 12M x 72 1Gbit 12M x /1/ 14/3/10 Single Ranked 2GB 256M x 72 1Gbit 256M x 4 /1/ 14/3/11 Single Ranked 2GB 256M x 72 1Gbit 12M x /2/ 14/3/10 Double Ranked 2GB 256M x 72 2Gbit 256M x /1/ 15/3/10 Single Ranked 4GB 512M x 72 2Gbit 256M x /2/ 15/3/10 Double Ranked 4GB 512M x 72 2Gbit 512M x 4 /1/ 15/3/11 Single Ranked 4GB 512M x 72 4Gbit 512M x /1/ TBD Single Ranked 13

14 3. Tested Memory The following tables list DIMM devices tested to be compatible with the Intel Server Board SE7320VP2. The list of tested memory is periodically updated as qualified memory is added during the production life of the Intel product. Intel strongly recommends the use of ECC memory in all server products. Memory modules not listed in the following tables have not been tested for compatibility and their use with the Intel Server Board SE7320VP2 may result in unpredictable operation and data loss. Caution: Third party memory vendors may use the same module part number with different M vendors and die revisions. To insure proper system operation, verify that each M vendor and die revision has been separately tested and qualified. Please notify CMTL if there is a discrepancy. This list is subject to change without notice. Note: This list is not intended to be all-inclusive. It is provided as a convenience to Intel s general customer base, but Intel does not make any representations or warranties whatsoever regarding the quality, reliability, functionality, or compatibility of these memory modules. 14

15 Intel Server Board SE7320VP2 Registered ECC, D266 DIMM Modules 256MB Size (32M x 72) Manufacturer Part M Part M Lead M Rank EOL - Organization MTVDDT3272G- * MT46V32M-6T G 10/1/04 (32Mx)* 265G3 L3272YC5- HY5DU5622BT-J rev R1U0 +Legend* Hyundai 3//05 (32Mx)* RU1HDC5B B - Registered ECC, D333 DIMM Modules 256MB Size (32M x 72) Manufacturer Part M Part M Lead M Rank EOL - Organization * M312L3223EG0- K4H5603E-G /12/04 (32Mx)* * HYS72D32300GB R-6-C HYB25D25600CC-6 10/25/04 (32Mx)* HYS72D32300GB R-6-B HYB25D25600BC-6 10/25/04 (32Mx)* MTVDDF3272G- 335G3 MT46V32MFG-6 12/17/04 (32Mx)* M312L3223EZ0- K4H5603E-Z 2/24/05 Yes (32Mx)* M312L3223EG3- K4H5603E-G 11/15/05 (32Mx)* M312L3223EZ3- K4H5603E-Z 11/15/05 Yes (32Mx)* Registered ECC, D2-400 DIMM Modules 256MB Size (32M x 72) Manufacturer Part M Part M Lead M Rank EOL - Organization HYS72T32000HR HYBT25600F /23/05 Yes (32Mx)* MTHTF3272Y- 40EB2 MT47H32MBP-37E 5/23/05 Yes (32Mx)* M33T3253FG0- K4T5603QF-G 5/23/05 (32Mx)* M33T3253FZ0- K4T5603QF-Z 5/23/05 Yes (32Mx)* M33T3253FG3- K4T5603QF-G 11/4/05 (32Mx)* M33T3253FZ3- K4T5603QF-Z 11/4/05 Yes (32Mx)* (+) This vendor is part of the CMTL Certification program. This means this part has/will been tested across all compatible Intel Server Boards. For further information contact Caution: Some modules on this list may contain stacked M parts. These parts may have thermal & physical limitations in some chassis configurations. It is advised to verify that your chassis configuration will support stacked parts before purchase. Verify that the M part number matches the M on this list before purchasing. 15

16 Intel Server Board SE7320VP2 Registered, ECC, D266 DIMM Modules 512 MB Sizes (64Mx72) Manufacturer Part M Part M +TRS* +TRS +TRS +Legend MTVDDT6472G -265G3 TRS21202 TRS21151 TRS21152 L6472YC5- RU1HDC5B HYMD264G726D4 M-H M312L6420ETS- CB0 M312L6420EUS- CB0 MT46V64M4-75 G /13/04 HYB25D256400CE-7 HYB25D256400BT-7 HYB25D25600BT-7 HY5DU5622BT-J rev B Hyundai M0530L1 11/4/04 M0530L1 11/10/04 M052L1 11//04 R1U0-3//05 HY5DU56422DT-H 4/6/05 K4H56043E-TCB0 4/13/05 K4H56043E-UCB0 4/13/05 Yes Registered, ECC, D333 DIMM Modules 512 MB Sizes (64Mx72) Manufacturer Part M Part M +TP Electronics* * +TP Electronics +TP Electronics +Smart Modular * HYS72D64300GB R-6-B B64L72L4BFB3C HYS72D64300GB R-6-C HYS72D64320GB R-6-C HYMD564G72BF N-J B64L72L4BFB3C B64L72L4BFB3S SM6472RD6H1 BGBC +pacer* Legacy Electronics Inc.* +Ventura Technology Group* HYMD264G726DF 4N-J S6JDGR-1NDG D52YCK44SV M312L6420EG0- HYB25D256400BC-6 HYB25D256400BC-5 HYB25D256400CC-6 HYB25D25600CC-6 HY5DU1222BF-J HYB25D256400BC-5 K4H56043E-G rev E HYB25D256400CC-6 HYB25D256400CC-6 /4/04 SB4L04L1 10/25/04 10/25/04 10/25/04 10/27/04 SB4L04L1 10/25/04 SB4L04L1 11// /1/ /24/04 HY5DU F-J 12/17/04 HYB25D256400BC6 K4H56043E-G rev E M Organiz ation (32Mx)* (32Mx)* (32Mx)* M Organiz ation (32Mx)* LEDDF 44RC 1/6/05 1G472B 2/22/05 K4H56043E-G 2/25/05 Rank Rank EOL EOL 16

17 Registered, ECC, D333 DIMM Modules 512 MB Sizes (64Mx72) Manufacturer Part M Part M +Dataram +Ventura Technology Group +Dane-Elec* +* SimpleTech* +vant Technology +Wintec Industries* + +TRS +TRS M312L6420EZ0- DTM676D D52YCK44MV K4H56043E-Z 2/25/05 Yes HYB25D256400CC-6 MT46V64M4FG-6 rev G 400 rev 3/16/05 1G472B 3/25/05 TRS21220 TRS210 KVR333S4R25/51 2I KVR333S4R25/5 12I HYB25D256400BC-6 HYB25D256400CC-6 HYB25D256400CF-5 HYB25D256400CF-5 M Organiz ation MT46V64M4FG-5B rev DLD333R072645H G 1G472B 3//05 KVR333S4R25/51 HYB25D256400CC I 001.B00 4/7/05 ST72E4K64ML- HYB25D256400CC-6 B06E //05 MTVDDF6472G -335G3 4GII DBJR 5/3/05 VM7264R3C533 MT46V64M4FG-5B rev RCE K6-MTG G 5/5/05 3C44646-L HYB25D256400CC-5 1G472B 6//05 KVR333S4R25/51 K4H56043E-G rev 2I E MTVDDF6472G- 335D3 MT46V64MFG /26/05 M312L6523CZ0- K4H5103C-Z 10/24/05 Yes HYMD564G726CF PN-J HY5DU1222CFP-J 10/25/05 M312L6420EG3- K4H56043E-G 11/15/05 M312L6420EZ3- K4H56043E-Z 11/15/05 Yes M312L6523CZ3- K4H5103C-Z 11/15/05 Yes HYS72D256320HB R-6-C HYB25D512400CF-6 1/31/06 Yes B00 na 7/15/05 M0545L1 3//06 M0545L1 3/15/ B00 na 3/20/07 Yes M x /23/0 Yes Rank EOL 17

18 Registered, ECC, D2-400 DIMM Modules 512 MB Sizes (64Mx72) Manufacturer Part M Part M +Viking* + +Ventura Technology Group +Dataram +Wintec Industries D2-52KC53SV-333 DTM C2124B-GL K4T5603QF-G 5/23/05 K4T5603QF-Z 5/23/05 Yes K4T56043QF-G 5/23/05 K4T56043QF-Z 5/23/05 Yes HYBT25600F5-6/6/05 Yes HYBT256400F5-6/6/05 Yes K4T5103QB-G 6/6/05 K4T5103QC-Z 6/20/05 Yes MT47H64M4BP-37E 6/20/05 Yes MT47H64MCB-5E 7//05 Yes MT47H64MCB-37E /26/05 K4T5103QB-Z /3/05 Yes HYBT51200C5 /15/05 HYBT51200C5 /15/05 Yes HYBT51200F37 K4T56043QF-ZCD5 rev F HYBT51200F5 rev K4T5103QB-ZCD5 rev B M Organiz ation (32Mx)* (32Mx)* (32Mx)* M33T6453FG0- M33T6453FZ0- M33T6450FG0- M33T6450FZ0- HYS72T64020HR- 5- HYS72T64001HR- 5- M33T6553BG0- M33T6553CZ0- MTHTF6472Y- 40EB2 MTHTF6472Y- 40EB2 VR5ER6472EB PL1 M33T6553BZ0- HYS72T64000GR- 5- HYS72T64000HR- 5- KVR400D2SR3/5 12I C00 na /13/05 D2R472 na /26/ rev 10/11/05 D2R72 na 10/4/05 HYMP564R72-E3 HY5PS1221-F-E3 10/12/05 +pacer G01 EDE510GSE-5C-E rev G /1/05 Yes K4T56043QF-Z 10/24/05 Yes K4T56043QF-G 11/4/05 K4T5603QF-Z 11/4/05 Yes K4T5603QF-G 11/4/05 K4T5103QC-Z 11/4/05 Yes NT5TU64ME-37B Nanya (32Mx)* (32Mx)* M33T6450FZ3- M33T6450FG3- M33T6453FZ3- M33T6453FG3- M33T6553CZ3- KVR400D2SR3/5 12I C00 na 12/14/05 Rank EOL

19 Registered, ECC, D2-400 DIMM Modules 512 MB Sizes (64Mx72) Manufacturer Part M Part M +pacer G02 +Legacy Electronics Inc. B557K4C2-50 +TP Electronics +Legend +TRS Smart Modular TRS Buffalo Dataram Dataram TRS Super Talent Electronics TRS HYMP564R72P- E3 HYMP564R72BP -E3 H64K72FBHC4 S L64723C7- R41H2H1F TRS31260 SG647R SC TRS31261 LEDD2F24 0RR rev 2/10/06 SH240F0K 2/2/06 Yes 1 na 104 3/10/06 Yes (0530,0534) M0551L1 3/24/06 Yes M33T6553 BG1 (KS- 04/05/06 Yes 11) M054L1 04/10/06 Yes 2F- 04/27/06 Yes B na rev 05/02/06 Yes rev 05/23/06 Yes M0551L1 7/3/06 Yes C00 na 7/12/06 Yes 200 /15/06 Yes rev F1.01 M054L1 /2/06 Yes M0551L1 /15/06 Yes C00 na 11/2/06 Yes rev 4/1/07 Yes D2R400- ES512MBJ DTM63312B DTM63311D TRS31260X KVR400D2SR3/5 12I T400R512/S12T RBHS TRS31261X K4T5103QC-ZCD /21/05 Yes HY5PS1221FP-E3 1/10/06 Yes HY5PS1221BFP-E3 1/10/06 Yes K4T5103QC-Z K4T5103QC-ZCD5 HY5PS1221FP-E3 rev 1st Gen. HYBT51200F5 rev K4T5103QC-Z HYBT256400F5 rev MT47H64MCB-5E rev B NT5TU64ME-37B HYBT256400F5 rev HYBT51200F5 E510G-5C-E rev G K4T5103QC-ZCD5 HYBT256400F5 rev (Infineon) Nanya (Infineon) (Infineon) TRS TRS31275 E510G-5C-E rev G Dataram KVR400D2SR3/5 12I DTM63312E E510GBG-6E-E rev G HY5PS1221CFP-Y5 M Organiz ation Rank EOL (+) This vendor is part of the CMTL Certification program. This means this part has/will been tested across all compatible Intel Server Boards. For further information contact Caution: Some modules on this list may contain stacked M parts. These parts may have thermal & physical limitations in some chassis configurations. It is advised to verify that your chassis configuration will support stacked parts before purchase. Verify that the M part number matches the M on this list before purchasing. 1

20 Manufacturer Part M Part +Ventura Technology Group +TRS +TRS +TRS +Legend +Dataram +Legend +Dataram Smart Modular Intel Server Board SE7320VP2 Registered, ECC, D266 DIMM Modules 1GB Size (12M x 72) M HYMD512G726B 4M-H HY5DU12422BT-H 10/1/04 HYMD512G726B 4M-H HY5DU12422BT-H 11/15/04 D54WYK42SV K4H5103B-T 1G72-11/1/04 TRS21174 HYB25D51200T- M052L1 7 11/17/04 TRS21171 HYB25D256400BC- M0533L1 7 11//04 TRS21203 HYB25D512400BE- M0530L1 7 11/22/04 L1272YC5- HY5DU1222T-H R1U0 Hyundai RU1HDH5-3/11/05 M312L22ET0- CB0 K4H51063E-TCB0 6/20/05 MTVDDT1272 MT46V12M4TG-6T G-265D2 6/20/05 DTM6C HYB25D512400BT( 4051 rev BE)-6 6/30/05 Yes M312L22EU0- K4H51063E-UCB0 /26/05 Yes CB0 L1272YC5-3HDD5 M312L220CUS- CB0 DTM653R SG1272RD3 0BTSC HY5DU56422S-H Hyundai 4RL rev 3 10/7/05 K4H51043C-UCB0 /21/05 Yes HYB25D256400CF- 6 K4H5103C-U 405 rev 2/7/06 Yes PG52G4N EBZ6RCL 05//06 Yes M Organizat ion * Rank EOL 20

21 Manufacturer Part M Part +TP Electronics +TP Electronics +Smart Modular +Smart Modular +TRS Registered, ECC, D333 DIMM Modules 1GB Size (12M x 72) HYS72D12320G BR-6-C HYB25D256400CC- 6 HYS72D12300G HYB25D512400BC- BR-6-B 6 B B2L72Y4BFB3 HYB25D256400BC- C 5 B2L72L4BFB3 HYB25D512400BC- C 6 SM1272RD6 H2BGIC SM1272RD6 H2BGS TRS2117 KVR333X72RC25 /1G +pacer Legacy Electronics Inc. +Viking +Smart Modular S6MDZR- 1NDG VI4CR27224DB KL2 SM1272RD6 H1BGI HYB25D256400CC- 6 K4H56043E-G rev E HYB25D512400BC- 6 M /1/04 10/1/04 SB4Y04L1 11/3/04 SB4L04L1 11/10/04 HYB25D256400CC- 6 HYB25D256400CC- 6 HYB25D512400BC- 6 HYB25D512400BC- 6 K4H56043E-G rev E P54G4NE SZBRCD rev B 11/5/04 P54G4NE SZBRCD 1/11/04 B M0533L1 11/12/ /16/ /24/04 LEDDF 44R 11/30/ B 12/2/04 P52G4NE SZBGX rev 12/21/04 HYS72D12321G HYB25D51200BC- 1/10/05 BR-6-B 6 B +Legacy Electronics S6JDGM- HYB25D256400BC6 Inc. 1NDG +Smart Modular SM1272RD6 HYB25D512400BC /23/05 H1BGBI 6 B2L72L4BFB3 MT46V12M4FN-5B +TP Electronics SB4L04L1 2//05 M rev D B2L72L4BFB3 K4H51043C-Z +TP Electronics SB4L04L1 2/22/05 S M312L220EG0- K4H51043B-G 3/2/05 +Ventura MT46V12M4FN-6 D54YFK44MV 1G472B 3/2/05 Technology Group rev D DLD333R07225 MT46V12M4FN-5B +Dane-Elec 1G472B 3/4/05 M rev D M Organizati on * LEDDF 44RRF 2/2/05 Rank EOL 21

22 Manufacturer Part M Part +Dataram +Ventura Technology Group Wintec Industries +Dataram SimpleTech +Dataram M312L220EG0- Registered, ECC, D333 DIMM Modules 1GB Size (12M x 72) M K4H51043B-G 3/2/05 DTM677F HYB25D256400CC- 405 rev 6 3/22/05 D54YFK44SV K4H51043C-Z 1G472B 3/30/05 3C54641D-L HYB25D256400CC- ZK406M4 5 RCJB 4/5/05 DTM677F HYB25D256400CC- 405 rev 6 3/22/05 ST72E4L12ML- HYB25D512400BC- B06E /20/05 M312L220CZ0- K4H51043C-Z 5/3/05 Yes MTVDDF1272 G-335G3 MT46V64M4FG-6 5/3/05 HYS72D12300G HYB25D512400BC- BR-6-B 6 B 5/3/05 DTM64B K4H51043C-Z 400 rev 5/16/05 M312L220EZ0- K4H51043B-G 6/22/05 Yes + KVR333S4R25/1 HYB25D512400BC GI na 7/5/05 MTVDDF1272 G-335D3 MT46V12M4FN-6 7//05 HYMD512G726B F4N-J HY5DU12422B-F-J 7/25/05 M312L223CZ0- K4H5103C-Z 7/25/05 Yes KVR333D4R25/1 K4H56043E-G GI rev E na 0/0/05 +Dataram DTM677F HYB25D256400CC- 405 rev 6 3/22/25 +Legacy Electronics B6MDZR- K4H51043C-Z LEDDF Inc. 1NDG 44R 10/14/05 +vant Technology VM722R53C53 NT5DS12M4BG- RCE Nanya 10/2/05 33K6-NYBP 6K HYMD512G726C FP4N-J HY5DU12422CFP-J 10/24/05 +Legend L1272YC6- K4H51043B-G M312L6420 PPXSDM1B G0 na 12/1/05 +Legend L1272YC6- K4H56043E-G 2G472B PPXSDD2E rev E na 1/11/06 M312L220CZ3-11/15/05 Yes M Organizati on 1 1 Rank EOL 22

23 Manufacturer Part M Part +TRS +TRS Registered, ECC, D333 DIMM Modules 1GB Size (12M x 72) M 11/15/05 Yes 11/15/05 11/15/05 Yes 1/31/06 Yes 1/31/06 Yes (Infineon) M312L223CZ3- M312L220EG3- M312L220EZ3- HYS72D12321H HYB25D51200CF- BR-6-C 6 HYS72D12300H HYB25D512400CF- BR-6-C 6 TRS2116 HYB25D256400BC- 6 TRS2122 HYB25D512400BC- 6 KVR333D4R25/1 HYB25D256400CF- GI 5 KVR333S4R25/1 K4H51043C-Z GI KVR333S4R25/1 K4H51043C-Z GI KVR333S4R25/1 HYB25D512400CF- GI 5 KVR333S4R25/1 HYB25D512400BF- GI 5 M0533L1 M0545L na na na na na 3/13/06 3/20/06 3/30/06 Yes /22/06 Yes 10/5/06 Yes 4/30/07 Yes /26/07 Yes M Organizati on Rank EOL 23

24 Manufacturer Part M Part +TP Electronics + +Legacy Electronics Inc. +Smart Modular +Legacy Electronics Inc. +Smart Modular +Viking +Wintec Industries +Smart Modular +Dataram + +Dataram Registered, ECC, D2-400 DIMM Modules 1GB Size (12M x 72) M MTHTF1272Y -40E2 MT47H64MBT-5E 5/23/05 Yes M33T250BG0- K4T51043QB- G 5/23/05 M33T250BZ0- K4T51043QB-Z 5/23/05 Yes M33T253BG0- K4T51030B-G 5/23/05 M33T253BZ0- K4T5103QB-Z 5/23/05 Yes M33T253CZ0- K4T51030C-Z 5/23/05 Yes HYS72T12000H R-5- HYBT512400F5 6/6/05 Yes HYS72T12020H HYBT51200F5 R /27/05 Yes MTHTF1272Y -40EB3 MT47H64MBT-5E 6/27/05 Yes M33T250CZ0- K45T1043QC-Z 6/27/05 Yes H2K72M4BHC K4T51043QB- SH240M04K 4S G 1 07/0/05 KVR400D2S4R3/ E5104E-5C-E rev GI E 001.B00 07/14/05 LEDD2F2 B51272M20- K4T51043QB- 404RRH rev 07//05 50 G SB127R I DTM63310 KVR400D2SR3/ 1GI M33T250CZ3- DTM63327 HYBT512400F5 HYBT512400F5 HYBT1G00F-5 PB54G240N ESUBRCC rev SB127R E E5104B-4-E rev B Z na 0//05 LEDD2F2 S51272M20- HYBT512400F( 404RRH rev 50 C)5 0/11/05 SB127R2124 HY5PS12421FP-E3 3-5-H 1st Generation E72 na 0/05/05 VR5ER272EB MT47H64MCB PL3 37E 0/01/05 K4T51043QB-Z 3C31344B-GL D2R472 na 0/03/ C00 /21/05 10/6/05 /2/05 K4T51043QC-Z 10/12/05 Yes HYBT51200F5 (Infineon) rev 10/2/05 M Organizati on (64Mx) * * * 1 Rank EOL (12Mx)* 24

25 Manufacturer Part M Part +Legend + +Ventura Technology Group + +Wintec Industries +pacer +Smart Modular +Legacy Electronics Inc. +Smart Modular TRS Dataram Dataram Registered, ECC, D2-400 DIMM Modules 1GB Size (12M x 72) M L12723C7- HY5PS1221F-E3 B62RRC RCH2HBF 11/7/05 HYMP512R724- E3 HY5PS12421-F-E3 10/24/05 M33T253CZ3- K4T51030C-Z 11/1/05 Yes KVR400D2S4R3/ HYBT512400F GI 001.B00 na 11/14/05 D2-54KF53SV- K4T51043QB-Z 333 D2R472 1//06 Yes HYMP512R72P4- E3 HY5PS12421FP-E3 1/10/06 Yes HYMP512R72P- E3 HY5PS1221FP-E3 1/10/06 Yes HYMP112R72P- E3 HY5PS1G31FP-E3 1/10/06 Yes KVR400D2S4R3/ HYBT512400F GI B00 na 1//06 Yes 3S31341-L HYBT512400F5 D2R472 1/23/06 Yes G02 K4T51043QC-ZCD /25/06 Yes HYMP512R72BP HY5PS12421BFP- 4-E3 E3 1/31/06 Yes HYMP512R72BP HY5PS1221BFP- -E3 E3 1/31/06 Yes SG127R264 35I B517M4C2H- 50 SG127R264 35SC TRS31265 DTM63310J KVR400D2SR3/ 1GI DTM63327B HYBT51200F3 7 K4T51043QC-Z K4T5103QC-ZCD5 HYBT512400F5 NT5TU12M4E-5 E110-5C-E rev NT5TU64ME-37B Nanya Nanya PG5G240N EBUB2RB LEDD2F2 404RRH rev PG5G240N EBUB2RB M054L rev C00 na rev 2/7/06 2/16/06 3/7/06 Yes 03/2/06 Yes 04/03/06 Yes 05/03/06 Yes 05/0/06 Yes M Organizati on 1 (12Mx)* Rank EOL 25

26 Manufacturer Part M Part Smart Modular TRS Super Talent Electronics Super Talent Electronics vant Technology TRS vant Technology TRS ll Components US Technology Dataram Dataram Dane-Elec Smart Modular Registered, ECC, D2-400 DIMM Modules 1GB Size (12M x 72) B00 na 6/6/06 Yes NTPCB0001 P 7/7/06 Yes M054L1 6/23/06 Yes 204 rev /11/06 H1.01 Yes 20 rev //06 G1.01 Yes B /24/06 Yes M054L1 /2/06 Yes B /6/06 Yes /12/06 Yes 001.B00 na C00 na 11/21/06 Yes (12Mx)* M054L1 2/15/07 Yes B 1 2/23/07 Yes B 1 3/24/07 Yes (12Mx)* 4/16/07 Yes 001.C00 na rev 1 4/1/07 Yes rev 4/20/07 Yes /2/07 Yes 001.B00 na D2R72 rev 1 7/16/07 Yes 1 PG54G240N ESUBRCC1 10/1/07 Yes KVR400D2S4R3/ 1GI NT5U12M4E-5 SG127R2124 NT5TU12M4E-5 35N TRS31267 K4T51043QC-Z T400R1G4/S1G K4T51043QC-ZCD5 TR4BHS T400RB1G/S1GT K4T5103QC-ZCD5 RCHS VF722R53E34 MT47H12M4CB- 00F0-MTB 5E TRS31265X HYBT512400F5 VF722R52E34 EDE510GBG-5C- 00F0-ELGP E rev G KVR400D2S4R3/ E5104G-5C-E rev 1GI G KVR400D2SR3/ E110B-6E-E rev 1GI B TRS31277X E5104G-5C-E rev G VF722R52E34 EDE510GBG-5C- 00F0-ELGP E rev G VF722R52E34 EDE510GBG-5C- 00F0-ELGP E rev G KVR400D2SR3/ MT47H12MHQ-3 1GI rev E DTM63327C HY5PS1221CFP- Y5 DTM63310N HY5PS12421CFP- Y5 KVR400D2S4R3/ E5104HSE-6E-E 1GI rev H DMD400R07223 EDE510ESK-5C- NG E rev E SG127R IB KVR400D2S4R3/ 1GI HYBT512400BF3 7 NT5TU12M4BE-3C M Nanya Nanya (Infineon) Nanya M Organizati on B00 12/1/07 Yes Rank EOL (+) This vendor is part of the CMTL Certification program. This means this part has/will been tested across all compatible Intel Server Boards. For further information contact Caution: Some modules on this list may contain stacked M parts. These parts may have thermal & physical limitations in some chassis configurations. It is advised to verify that your chassis configuration will support stacked parts before purchase. Verify that the M part number matches the M on this list before purchasing. 26

27 Manufacturer Part M Part +TRS +Ventura Technology Group +Viking +TP Electronics +vant Technology +Dataram +TRS +Dataram TRS21155 D56WXK2SV Intel Server Board SE7320VP2 Registered, ECC, D266 DIMM Modules HYB25D512400T- 7 K4H51043B-T 2GB Size (256M x 72) M M0531L1 11/12/04 V213 11//04 M Organizati on VI4CR567224EY K4H51043B-T /15/04 HL3 B56L72T4SHB0 K4H51043B-T SB4T04L3 1/25/05 S VM7256R53C52 MT46V12M4FN-6 E6014 5/31/05 66K7-MTD rev D DTM6D HYB25D512400BF( BC) /6/05 12M x 4 HYB25D512400BE- TRS212 7 M0531L1 0/02/05 MTVDDF25672 MT46V12M4FN 10/24/05 G-265D2 M312L562BT0- K4H1G063B-TCB0 7/2/05 CB0 M312L562CU0- K4H1G063C- /1/05 Yes CB0 UCB0 DTM6J HYB25D512400CF /22/06 Yes 6 Rank EOL 27

28 Manufacturer Part M Part +Smart Modular +Legacy Electronics Inc. +pacer +Smart Modular +TP Electronics +Dataram +Dataram + Netlist*, Incorporated +vant Technology + +TRS Dataram SM25672RD6 H2BGI L6MDGM- 1PDG SM25672RD6 H2BGBI Registered, ECC, D333 DIMM Modules 2GB Size (256M x 72) HYB25D512400BC- 6 BG12MX4DN C HYB25D512400BC- 6 HYB25D512400BC- 6 M Legacy P54G4NESZ B1RF 11/15/04 LEDDF44 RRF 12// rev 4 12/15/ /14/05 B56L72Z4BFB3 HYB25D512400BC- SB4Z04L1 1/31/05 C 6 3/2/05 MT46V12M4BN-6 DTM60H /25/05 rev D 3/2/05 HYB25D512400BF( DTM60F /15/05 C)-6 MTVDDF25672 MT46V12M4FN 4/6/05 G-335D2 KVR333D4R25/2 HYB25D512400BC /4/05 GI /27/05 B6R404 5/4/05 M312L5720CZ0- K4H51043C-Z 6/20/05 Yes KVR333D4R25/2 MT46V12M4FN /11/05 GI rev D na M312L5720CZ3- K4H51043C-Z 11/15/05 Yes M312L562BT0- K4H1G063B-TCB0 11/15/05 CB0 11/15/05 Yes 1/31/06 Yes HYB25D512400BC- M0546L1 rev TRS /2/ DTM60P /10/06 KVR333D4R25/2 K4H51043C-Z /25/06 Yes GI na KVR333D4R25/2 HYB25D512400CF /13/07 Yes GI na KVR333D4R25/2 HYB25D512400BF /25/07 Yes GI na HYS72D256320G HYS72D256320G NL257RD VM7256R53C53 M312L562CU0- HYS72D256320H HYB25D512400CF- HYB25D512400BC- HYB25D512400BC- K4H51043C-Z MT46V12M4FN-6 K4H1G063C- HYB25D512400CF- BR-6-B BR-6-B D27JSC 33K7-MTD CB0 BR-6-C 6 6 B 6 B rev D UCB0 6 (Infineon) M Organiz ation * * * * * * * * * * * * * * * * * * * * * * * Rank EOL 2

29 Manufacturer Part M Part +Smart Modular +Smart Modular +Smart Modular + +Dataram +Dataram +Wintec Industries +Smart Modular Registered, ECC, D2-400 DIMM Modules 2GB Size (256M x 72) M HYMP125R724- E3 HY5PS1G431F-E3 5/23/05 HYS72T256220H R-5- HYBT512400F5 5/23/05 Yes HYS72T256000H R-5- HYBT1G400F-5 6/6/05 Yes M33T5660MZ0- K4T1G044QM- Z 6/6/05 Yes MTHTF25672Y -40E2 6/27 Yes MTHTF25672Y -40EB1 7//05 Yes SB2567R212 35I SG2567R212 35I SM2567R I KVR400D2DR3/ 2GI DTM6330 DTM6330B 3C41441-L HYBT1G00F-5 HYBT512400F5 K4T51043QC- Z HYBT1G400F-5 K45T1043QC- Z M33T5750CZ0- SG2567R H HYBT512400F5 HYBT512400F5 HYBT1G400F-5 HY5PS1G421MP- E3 PB52G240NES UB1RJ PG52G240NES UB1RJ 07/22/05 07/12/ // na /16/ //05 D2R472 na /2/05 M Organizati on (256Mx4)* (256Mx4)* (256Mx4)* (256Mx4)* (256Mx4)* 0/23/05 12M x /20/05 Yes (0504-5,-3,- 1),(05-1,-2,- 3,-4,-6),(0516-1,-3) 10/26/05 Yes M33T5750BS0- K45T1043QB- S 11/1/05 M33T5750BY0- K45T1043QB-Z 11/1/05 Yes HYMP125R72P4- E3 HY5PS1G431FP-E3 11/1/05 M33T5750CZ3- K45T1043QC- Z 11/4/05 Yes M33T5660MZ3- K4T1G044QM- Z 11/4/05 Yes +Legacy B527M4C2BJ- K4T51043QC- LEDD2F240 Electronics Inc. 50 Z 4RRJ 11/21/05 +TP H56K72M4BJC4 HYBT1G400F-5 SH240M04K1 Electronics C na 12//05 Yes + KVR400D2D4R3/ HYBT512400F GI 001.B00 na 12/13/05 M33T5660Z3- K4T1G044Q- Z 11/15/05 Yes (256Mx4)* (256Mx4)* (256Mx4)* (256Mx4)* (256Mx4)* Rank EOL 2

30 Manufacturer Part M Part +Legend +TRS Dataram TRS Super Talent Electronics TP Electronics Smart Modular Dataram Smart Modular Registered, ECC, D2-400 DIMM Modules 2GB Size (256M x 72) M HYMP125R72P- E3 HY5PS1G31FP-E3 1/31/06 Yes HYMP525R72BP HY5PS12421BFP- 4-E3 E3 1/31/06 Yes L25723C7- HY5PS1G421MP- R41H2W2F E3 st Gen. 05 2/2/06 Yes TRS31270 HYBT1G400F-5 M054L1 rev 1 3/20/06 Yes KVR400D2D4R3/ HYBT512400F GI B00 na 04/17/06 Yes KVR400D2DR3/ E110-5C-E rev GI na 05/11/06 Yes DTM6330F NT5TU12M4E-5 Nanya /1/06 Yes KVR400D2D4R3/ NT5TU12M4E Nanya 2GI 001.B00 na 6/16/06 Yes TRS31270X HYBT1G400F-5 M054L1 rev (Infineon) 1 //06 Yes T400RB2G4/S2G K4T51043QC-ZCD5 TR4CHS B2RRCJ na /16/06 Yes KVR400D2D4R3/ E5104G-5C-E rev GI G 001.B00 na 10/10/06 Yes H56K72M4BJC4 HYBT1G400F-5 SH240M04K2 C (Infineon) na 11/2/06 Yes SG2567R2124 NT5TU12M4BE- PG52G240NES Nanya 35NB 3C UB3RJ 12/4/06 Yes KVR400D2DR3/ E110B-6E-E rev GI B na 12/7/06 Yes KVR400D2DR3/ MT47H12MHQ GI rev E na 4/13/07 Yes DTM6330J HY5PS12421CFP- Y /25/07 Yes KVR400D2D4R3/ E5104HSE-6E-E GI rev H 001.C00 na 5/3/07 Yes SG2567R2124 K4T51043QE-ZCE6 PG52G240NES 35SE rev E UB3RJ 10/23/07 Yes KVR400D2D4R3/ NT5TU12M4BE Nanya 2GI 3C 001.C00 na 12/20/07 Yes KVR400D2DR3/ HY5PS1G31CFP GI Y5 0 na 2/26/0 Yes KVR400D2D4R3/ HYBT512400F3 2GI 7 M Organizati on (12Mx)* (256Mx4)* (256Mx4)* (12Mx)* (256Mx4)* (256Mx4)* (12Mx)* (12Mx)* (12Mx)* C00 04//0 Yes (12Mx)* Rank EOL (+) This vendor is part of the CMTL Certification program. This means this part has/will been tested across all compatible Intel Server Boards. For further information contact Verify that the M part number matches the M on this list before purchasing. 30

31 Manufacturer Part M Part +Dataram +TP Electronics M312L512MT0- CB0 DTM67C B12L72P4SMB0 S Manufacturer Part M Part MTVDDT51272 G-2652 Intel Server Board SE7320VP2 Registered, ECC, D266 DIMM Modules 4GB Size (256M x 72) M K4H2G063M- TCB0 6/20/05 K4H1G043M- TCB0 rev M /04/05 K4H2G063M- M312L22T0B TCB0 rev M G-V01 12//05 Registered, ECC, D333 DIMM Modules 4GB Size (256M x 72) MT46V256M4TG- 75 Manufacturer Part M Part +Smart Modular + Dataram Smart Modular HYS72T512022H R-5- SG5127R I M 6/27/05 Registered, ECC, D2-400 DIMM Modules 4GB Size (256M x 72) HYBT2G402F- 5- HYBT1G400F-5 KVR400D2D4R3/ 4GI E E rev HYMP351R72MP HY5PS2G431MP- 4-E3 E3 KVR400D2D4R3/ K4T2G064Q- 4GI ZCD5 DTM63325 HYBT1G400F-5 SG5127R2256 HYBT1G400F-5 35RT KVR400D2D4R3/ E110BSH-E rev 4GI B M 11/1/05 Yes M Organiza tion (256Mx4) * (256Mx4) * (256Mx4) * M Organiza tion (256Mx4) * M Organiza tion (2x256Mx 4)* PG516G240NE SUC1RK 11/14/05 Yes (256Mx4) * na 12/16/05 1/10/06 Yes (Infineon) M33T1G6MG 1 na 04/07/06 Yes rev D 04/24/06 Yes XG5G240NES UB1TK 1//07 Yes Z10077 na 2/22/07 Yes (256Mx4) * (256Mx4) * (256Mx4) * (256Mx4) * Rank EOL Rank EOL Rank EOL (+) This vendor is part of the CMTL Certification program. This means this part has/will been tested across all compatible Intel Server Boards. For further information contact Caution: Some modules on this list may contain stacked M parts. These parts may have thermal & physical limitations in some chassis configurations. It is advised to verify that your chassis configuration will support stacked parts before purchase. Verify that the M part number matches the M on this list before purchasing. 31

32 4. Sales Information Name Web URL Direct Sales Info TP Electronics Tel (1) , ext 55 Fax TP Electronics -- Taiwan Inc. Tel Fax vant Technology Brad Scoggins Phone: (512) Fax: (512) ved Memory Products Buffalo Technology (00) Centon Electronics Tel: Fax: Corsair Tel: Fax: Dane-Elec Michal (4) or [email protected] Dataram Paul Henke, x223 in US [email protected] GoldenRM Jason M x7546 [email protected] or Michael E. x7512 [email protected] Hitachi Hyundai/ Semiconductor ex.htm ITUCOM JITCO CO LTD Seong Jeon Tel: [email protected] US.- Call (77) sia Call Europe Call Legacy Electronics Inc. U.S. Contact: Gary Ridenour, , Ext 350 European Contact: Legend cron.com/mktg/mbqual/qual_data.cfm MSC Vertriebs GmbH William Perrigo Fax: [email protected] Netlist, Inc Christopher Lopes tel fax [email protected] Peripheral Enhancements 32

33 Name Web URL Direct Sales Info For US customers go to: y/list_na.html Silicon Tech cts.shtml Simple Tech Ron (4) or SMRT Modular [email protected] Gene Patino (4) [email protected] Swissbit Tony Cerreta Tel: x240 Fax: [email protected] TechnoLinc Corporation David Curtis [email protected] TRS* Tele-Radio-Space GmbH Direct Sales Info: ndreas Gruendl Tel: Fax: [email protected] Unigen Ventura Technology Inc Sam Lewis ext. 103 Viking InterWorks drian Proctor Tel: [email protected] Virtium Technology Inc Tod (4) ext. 146 or [email protected] Wintec Industries Tel Fax

34 5. CMTL* (Computer Memory Test Labs) CMTL is a privately owned and operated memory testing organization responsible for testing a broad range of memory products. Memory devices tested by CMTL must undergo a rigorous battery of tests to ensure that the product will perform the intended server functions. Memory capability is a major factor your customers consider. CMTL has the ability to test and certify memory on Intel-based server platforms. The list of memory modules, which have undergone testing through the CMTL facility, should be referenced when considering modules for integration into this Intel server product. Stringent standards with regard to manufacturing procedures and quality must be met to pass the exacting tests required for qualification through the independent testing facility. Testing is performed by CMTL with Intel server products and test procedures defined by Intel s Memory Qualification Lab. Intel routinely audits the CMTL facility to ensure all procedures, process handling, and testing methodologies are met. IMPORTNT NOTE DIMM devices with gold contacts should NOT be placed into DIMM sockets with tin-lead contacts or viceversa. Mixing dissimilar metal contact types has been shown to result in unreliable memory operation. Intel recommends similar manufacturer and similar speeds in each Rank on the memory module. Mixing of dissimilar memory manufacturer devices or dissimilar memory device speeds is not recommended. This document contains information which is the proprietary property of Intel Corporation. Nothing in this document constitutes a guaranty, warranty, or license, express or implied. Intel has tested the following DIMMs for minimum electrical and functional compatibility with the Intel Server RID Controller. This listing is not intended to be all inclusive; it only represents the DIMMs Intel or CMTL has tested. Users of this list are reminded to check with the DIMM manufacturer or Distributor to ensure that a particular DIMM model is adequate for the intended purpose on the Intel Server RID Controller. Intel provides no indemnities for and expressly disclaims all liabilities for any and all such guaranties, representations, and warranties (oral or written) whether express or implied, related to DIMMs in a Intel Server RID Controller product, including without limitation to: fitness for a particular purpose; merchantability; noninfringement of intellectual property or other rights of any third party or of Intel. The reader is advised that third parties may have intellectual property rights which may be relevant to this document and the technologies discussed herein, and is advised to seek the advice of competent legal counsel, without obligation of Intel. Intel retains the right to make changes to this document at any time, without notice. Intel makes no warranty or representation with respect to the use of this document or reliance by the reader upon its contents, and assumes no responsibility for any errors which may appear in the document nor does it make a commitment to update the information contained herein. Product and corporate names listed in this document may be trademarks of their respective companies. 34