Finishes Card Ejectors & Guides Thermal Greases and Epoxies

Transcription

1 Table of Contents General Information How to Use This Standard Part Catalog... Index by Part Number... 3 Index by Device and Thermal Resistance... 5 Index by Style and Thermal Resistance... How to Select a Heat Sink How to Read a Thermal Graph Board Mounted Heat Sinks Heat Sinks for IC Packages BGA DIP Surface Mount Discrete Semiconductor Packages D-PAK... 5 SO... SMT Footprints... Thru-Hole Discrete Semiconductor Packages TO TO- and TO TO-, TO-1, and TO TO- and TO TO-, TO-1, TO-7, and Multiwatt... 1 TO-1... TO TO SIP... 7 TO-9... TO TO TO Axial Lead Devices Bridge Rectifiers Options Table of Contents How to Decipher an Aavid 1 Digit Part Number... How to Decipher a "Thermalloy" Origin Part Number... 1 Index A, B, C = Aavid Standard Parts w/options... Index D = "Thermalloy" Origin Parts w/options... 5 Interface Materials In-Sil, Kondux, Grafoil Pads... Hi-Flow, Alignment Pads... 7 Double Sided Tape Options (Factory Applied)... Labor Saving Heat Sink to Board and Semiconductor Mounts Wave-On Mounts, Semiconductor Mounts, Shur-Lock Tabs, Solderable Tabs, Solderable Pins Solderable Nuts, Clinch Nuts, Solderable Studs, Device Studs Clips Kool-Klips Thermal Clips... 9 Accessories Insulating Shoulder Washers... 1 Insulators Thermalfilm and Thermalfilm MT Insulators Mica and Thermasil III Insulating Washers/Aluminum Oxide... 1 Insulating Stanchion Pads Insulating Covers... 1 Pads Finishes Card Ejectors Guides Thermal s and Epoxies TABLE OF CONTENTS USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw 1

2 How to Use This Catalog Base part number Semiconductor device Style description for heat sink Icons indicate that a mounting kit, grease or epoxy can be used with the heat sink GENERAL INFORMATION TO- Heat Sinks 7 Channel style heat sink with folded back fins Semiconductor devices have been included in photos to assist in determining mounting position. Detailed description illustrates the heat sink s differentiating features. Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. Part Number Description Finish 7BG Channel heat sink with folded back fins Black anodize Thermal graphs show natural and forced convection based on black anodize finish. For information on how to use a thermal graph, please refer to page Ordering information will specify the base heat sink with available accessories. 7PBG Channel heat sink with folded back fins Pre-black anodize* 7B-MTG With solderable tabs Black anodize.9 (.11) 7PB-MTG With solderable tabs Pre-black anodize*.9 (.11) * Edges cut during the manufacturing process will be unfinished. See page XX for more information POPULAR OPTIONS: 7B- G Base part no. A RoHS Compliant Position Code Description Location Details A TC11-MT Insulated device mounting clip for T- and solderable tabs Hole X Page For additional options see page xx Hole for Tabs USA Tel: +1 (3) info@aavid.com. (.175) Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com 3 1 Aavid has a large selection of popular options to enhance your heat sink selection. This section will indicate the most popular options available. Detailed indexes are available to select additional options..3 (.19) 3.1 (.15).9 (.9) 9.5 (.375) 1.3 (.) Material and finish information is shown for each part x 3.1 (.15) x ø3.1 (.15).7 (.15) page11 Mechanical drawing dimensions as shown are mm (inches) 3.1 (.9) 5. (1.9) "X" TAB x.3 (.).1 (.951). (.) 1. (.57) Taiwan Tel: +() sales@aavid.com.tw 9.99 (1.9) Material: 1.7 (.5) Thick Aluminum Finish: See Table

3 Index by Part Number Part Number Page G G G G G G G G G 1 1-BRD1-1G 1 1-BRD1-3G 1 1-BRD1-G 1 1-BRD1-5G 1 1-BRD1-7G 1 1-BRD-1G 1 1-CLS1-1G 1 1-CLS-1G 1 1-LLB-3G 1 1-LLB-5G 1 1-LLB-11G 1 1-THMA-1G 1 1-TNT-1G 1 317B-EP11-BGS1G 1 319B-TACHG 17 31B-TACHG 17 37B-CP5G 1 37B-TACHG 1 33B-TACHG 17 33B-TACHG 17 3B-TACHG 17 51B-EP11-BGSG 1 519B-EP11-BGS5G 1 5B-EP-BGS5G 1 5B-EP-BGS5G 1 315BG 7 35BG 7 335BG BG 7 35BG B3G BG B3G BG B3G B3G B3G B3G BG B3G B35G B3G BG B3G B3G BG B3G B3G B3G BG 19 33B3G 17 3B3G 17 3B3G 1 371B3G B3G 1 37B3G 17 37B3G 1 379MG 1 373B3G B3G 1 373M3G M3G 17 37B3G 17 37B35G 1 37B3G 1 371B3G B35G 1 371B3G 1 37B3G 17 37B35G 1 37B3G 1 373B3G B35G 1 373B3G 1 Part Number Page 37B3G 17 37B35G 1 37B3G 1 375B3G B35G 1 375B3G 1 37B3G 17 37B35G 1 37BG 1 377B3G B35G 1 377BG 1 37B3G 17 37B35G 1 37BG 1 379B3G B35G 1 379BG 1 375B3G B35G 1 375BG B3G B35G BG 1 375B3G B35G 1 375B3G 1 513BG 7 53BG 7 533BG 7 53BG 7 51BG 51JG 511BG 3 51BG BG 7 513BG BG 7 513BG 7 517BG 7 51BG 7 519BG 7 5BG 7 51BG 3 5BG BG BG 7 553BG 7 53BG 9 53BG 3 59BG 1 57BG 1 571BG 1 57BG 1 573BG 3 573JG 3 55BG 3 5BG 3 57BG B5G 5 513B5G B5G B5G B5G 5 513B5G B5G B5G BG BG BG BG BG 9 53BG 9 539BG B5G 5 597B5G 5 591B5G 5 59B5G B5G 5 599B5G 5 531B5G 5 53B5G B1G 5 Part Number Page 5311B15G 5 531B1G 5 531B15G B1G 5 531B1G 5 531B1G B15G 55 53B1G 55 53B15G BG 5351UG 5313BG 531BG 5371BG 531B51G 5 531B515G 5 53B51G 5 53B515G 5 531B51G 5 53B51G 5 531B5G V5G B5G V5G B5G V5G B5G V5G 59 53B5G 5 537B5G 5 53B5G B551G B551G B551G B551G B551G B551G B551G B551G B55G B55G B55G B55G B55G B55G B55G B55G B55G B55G B55G B55G B55G B55G B55G B55G B55G B55G 5 53B55G 5 53B53G 37 53B353G 37 55BG 9 55DG 9 551BG 9 5BG 5WG 53BG 33 53DG 33 51BG 51B31G 51B3G 59BG 53 59B31G 53 59BG BG 71 59BG 5731DG 5731D1G 5733DG 5733D1G 573DG 5 573D1G 5 57BG 3 57UG 3 Part Number Page 571BG 5 571B33G 5 57BG 3 57B33G 3 57BG 5 57B3G 5 575BG 5 575B33G 5 57BG 5 57B33G 5 57BG 3 57B33G 3 579BG 5 579B33G 5 575BG DG BG 575BG 5753BG 575BG 5753BG BG BG BG 7 571BG 571BG 5713BG BG BG BG 73 57BG 33 57DG 33 57BG 5 57B31G 5 57BG 5 57VG 5 57V31G 5 57VG 5 57UG 5 57U31G 5 57UG 5 579BG 577BG 3 577BG BG BG 3 577BG 3 577BG BG 577BG 5775BG UG BG 5715BG BG BG BG BG 75 57B3G 5793BG BG VG 9 579BG 7 579VG BG 579BG 579BG 3 579B33G BG B33G 3 579BG 3 579B33G BG B33G 3 51BG 51WG 5BG 5WG 53BG 1 5BG 55BG 5BG 1 511B5G 1 Part Number Page 51B5G B5G 1 511B5G 1 511B5G 1 51B5G 1 5BG 7 5B35G 7 59PBG 3 591B3G 3 593B3G 3 591BG B31G BG BG BG BG B3G 595B3G 9 595U3G 9 599B3G B3G B3G 593B35G 5FG 75 DG 77 UG 77 1BG 3 1PBG 3 BG 7 PBG 7 5DG 3DG 7 3BG 3 3PBG 3 PBG 7PBG 9PBG 3 9PBG 3 19PBG 35 11PBG B5G 19 1PBG 75 PBG 75 3PBG 75 1PBG 3 BG 77 3BG 77 BG 77 5B-MTG 7 3DG 3 3B-MTG 3PB-MTG 3BG 39 3PBG 39 37BG 37PBG 3BG 37 3B-MTG 37 39B-MTG 37 BG 3 37BG 1 3BG 31BG 3BG 39BG 39B-PG 39BG 39B-PG 399BG 399B-PG BG B-PG 7353U11G BG 7 719B-MTG 7 719PBG 7 7BG 7 7B-MTG 7 71BG 71B-MTG 7BG 9 7B-MTG 9 7PBG 9 Part Number Page 7PB-MTG 9 73BG 73B-MTG 75BG 7 75B-MTG 7 73BG 7 793BG 19 71DG 71D/TRG 719DG 5 719D/TRG 5 71DG 3 713DG 713DG DG 7139DG 35 71DG 711DG 3 71DG 3 71DG DG DG B15G 19 9FG BW3-G 5 BW3-G 5 BW5-G 5 BW5-G 5 BW3-G 5 BW3-G 5 MLAAG 5 PF3G 5 PF33G 5 PF3G 5 PF35G 5 PF3G 5 PF53G 73 PF5G 73 PF57G 73 PF7G PF73G PF73G 5 PF73G 5 PF75G PF75G PF75G SW5-G 5 SW5-G 5 SW5-G 59 SW3-G 5 SW3-G 5 SW3-G 59 SW5-G 5 SW5-G 5 SW3-G 5 SW3-G 5 TV15G 3 TV155G 3 TV5G 3 TV35G 31 TVG 5 TVG 39 TVG 31 TV7G 31 TV5G 31 TV9G 53 TV97G 53 YB3-G 1 INDEX USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw 3

4 Index by Device Cooled and Thermal Resistance Board Part Number θn Page Board Part Number θn Page Board Part Number θn Page Board Part Number θn Page INDEX AXIAL LEAD UG 15. V 77 DG 15. V 77 BRIDGE RECTIFIERS BG 9. V 77 3BG 9. V 77 BG 9. V 77 DIPS 51BG. H 3 511BG 7. H 3 51JG. H 51BG. H 53BG 39. H 1 5BG 39. H 55BG 3. H 3 5BG 3. H 3 51BG 3. H 51WG 3. H 57BG 7. H 3 BG 5. H 3 5BG. H 5WG. H 5BG. H 5WG. H 55BG. H 5BG. H 1 IC PACKAGES, BGA, PGA, QFP, LCC Bi Directional Air Flow H 19 Solder Anchor H 1 Push Pin H 1 Clip Attachment H 1 Tape Attachment H 1 MULTIWATT YB3-G. V 1 3BG. V 31BG 5. V 39BG 5. V 39B-PG 5. V 37BG 5. V 1 39BG. V 39B-PG. V 3BG. V 399BG 3.3 V 399B-PG 3.3 V BG.7 V B-PG.7 V SIPS 5351UG. V 5351BG. V 73BG 1. V 7 71DG 1. V 7 51BG 11.5 H-V 51B3G 11.5 V 51B31G 11.5 H 5BG 1. V 7 5B35G 1. V 7 3BG. V 31BG 5. V 3BG. V SMT D-PAK TO D1G 5. H 5731DG 5. H D PAK TO D1G 1. H 5733DG 1. H 719D/TRG 9. H 5 719DG 9. H 5 D PAK TO-3 SO-1 71D/TRG 1. H 71DG 1. H D 3 PAK TO- 573D1G 11. H 5 573DG 11. H 5 TO BG 15. H BG 13. H BG 1.5 H VG 1.5 H BG 1. H BG 11. H BG 11. H 7 PF53G 1.1 H BG 1. H BG 1. H BG 9. H 7 PF5G.9 H BG. H 7 513BG 7. H BG 7. H 7 PF57G 7. H BG 7. H BG 7. H 73 53BG 7. H 9 53BG. H 7 573BG. H BG. H BG. H BG. H BG 5. H 7 593BG 5.5 H BG 5. H BG 5.1 H 73 53BG 5. H BG. H BG.7 H 9 53BG.7 H 9 537BG.7 H BG. H 71 TO-5 315BG 3. V 7 35BG 3. V BG. V 7 35BG 57. V 7 335BG 5. V 7 1PBG 5. V 75 5FG 5. V 75 PBG 3. V BG. V BG 3. V 75 3PBG 3. V BG 35. V BG 31. V BG. V 75 TO- 579BG. H 7 579VG. H 7 517BG 1. H 7 51BG 9. H 7 519BG. H 7 5BG. H 7 TO-9 575BG. V 5753BG 5. V 575BG. V 9FG 3.1 V TO-1 PF73G 35. H-V 5 PF73G 35. H-V BG. V UG. V 5 TVG 1. H 5 KEY H = Horizontal mount V = Vertical mount H V = Either horizontal or vertical depending on device leads θn = Natural convection thermal resistance based on a 75 C heat sink temperature rise TO- 579BG 3. H V 57BG. V 3 57UG. V BG 7. H V PBG 5. V 7PBG 5. V 579BG. V 3 579B33G. V BG. V B33G. V 3 577BG. H V 57BG 1. V 3 57B33G 1. V 3 53BG 1. H V 3 531B5G 13. V V5G 13. V 59 SW5-G 13. V B5G 1. V V5G 1. V 59 SW3-G 1. V B5G. V V5G. V V5G 7.5 V B5G 7.5 V 59 TO-1 TV9G. H DG 3.1 V TV97G. H B5G 19. V B5G 1. V 1 511B5G 1. V B5G 13. V B551G 13. V 55 SW5-G 11. V 5 SW5-G 11. V B551G 11. V B5G 11. V 5 SW3-G 1. V 5 SW3-G 1. V B551G 9. V B5G 9. V 5 SW5-G. V 5 SW5-G. V B3G. V YB3-G. V B5G. V B551G. V B5G. V 5 BW3-G 7. V 5 BW3-G 7. V 5 BW3-G 7. V 5 SW3-G 7. V 5 SW3-G 7. V 5 3BG. V 591B3G. V 5311B1G.3 V B15G.3 V 5 531B51G.3 V 5 531B515G.3 V 5 531B1G.3 V B15G.3 V 55 31BG 5. V BW5-G 5. V 5 BW5-G 5. V B55G 5.7 V B55G 5.7 V 57 39BG 5. V 39B-PG 5. V 5971B5G 5.5 V 5 37BG 5. V B55G 5. V B55G 5. V B5G 5. V 5 BW3-G.7 V B5G.5 V B55G.5 V B55G.5 V B1G. V 5 531B51G. V 5 39BG. V 39B-PG. V 3BG. V 5331B55G 3. V B55G 3. V BG 3.3 V 399B-PG 3.3 V BG.7 V B-PG.7 V TO- 9PBG.5 H 3 PF73G 35. V 5 PF73G 35. V 5 717DG 35.7 V 35 9PBG 3.1 V 3 57VG 3. V 5 57UG 3. V 5 57V31G 3. H 5 57U31G 3. H 5 57VG 3. V 5 57UG 3. V 5 577BG 3. H V 3 577BG 3. V 3 TV5G 9.9 H V 31 PF7G.9 V PF73G.9 V 7139DG.3 H 35 57BG 7.3 V 5 57B31G 7.3 H 5 57BG 7.3 V 5 TVG 7.1 H V 31 TV7G 7.1 H V BG. H V B31G. H 51 USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw

5 Index by Device Cooled and Thermal Resistance Board Part Number θn Page Board Part Number θn Page Board Part Number θn Page Board Part Number θn Page 591BG. V BG. H V BG. V BG. H BG. V 3 579B33G. V BG. V B33G. V BG 5.9 H V BG 5.9 V DG 5. V 39 3BG 5. V 39 3PBG 5. V 39 37BG 5. H 37PBG 5. H 577BG. H V 3 577BG. V 3 573BG. H V 3 573JG. H V 3 55BG. H 9 55DG. H 9 TV9G. H 53 PF75G 3.7 V 571BG 3. H V 57BG 3. H V 5 57B3G 3. H 5 571BG 3. H V 5 571B33G 3. V 5 3PBG 3. V 3 595B3G. V 9 595U3G. V 9 57BG 1. H V 5 57B33G 1. V 5 575BG 1. H V 5 575B33G 1. V 5 11PBG 1. H V BG. H V 7137DG. V 71DG. H 57BG. H V 3 57B33G. V 3 PF75G.3 V 71DG.3 H 3 711DG.3 V BG.3 H V PF3G.3 V 5 PF33G.3 V 5 PF3G.3 H 5 PF35G.3 V 5 PF3G.3 H 5 59BG. V 1 TV97G. H V DG 19.7 V 35 71DG 19. V 3 59BG 1. H-V 53 59B31G 1. H 53 59BG 1. V 53 3BG 1. V 3 599B3G 17.9 V 33 5DG 17.9 V 5B-TTG 17.9 V MLAAG 17.9 H 5 51B5G 17. V 1 PF75G 17.3 V TV155G 17. V 3 19PBG 17. H V BG 1. H V 5793BG 1. V 579BG 1. V 511B5G 1. V 1 531BG 1.7 H V 5313BG 1.7 H V PBG 1.7 V 7 BG 1.7 V 7 57BG 1. V 33 57DG 1. V BG 1. H V 5 579B33G 1. V 5 51BG 15. H V 3 57BG 15. H V 1 571BG 15. H V 1 5B-MTG 15. V 7 TV15G 1. V 3 575BG 13. V DG 13. V 33 3BG 13. H V 37 3B-MTG 13. V 37 39B-MTG 13. V B3G 13. V 33 53B53G 13. V 37 53B353G 13. V B5G 13. V 5 531B5G 13. V V5G 13. V BG 13. V 57B3G 13. V TV5G 13. V 3 59PBG 13. V 3 53BG 13. V 33 53DG 13. V B55G 13. V 5 533B551G 13. V 55 SW5-G 13. V 59 51B5G 1. V 1 1BG 1.5 V 3 1PBG 1.5 V 3 NEED HIGHER PERFORMANCE? Aavid Thermalloy also offers the Max Clip System TM for discrete power semiconductors featuring simple assembly and high reliability. 1PBG 1.5 V 3 3DG 1.5 V 3 551BG 1. H 9 SW5-G 11. V 5 SW5-G 11. V 5 593B3G 11. V 3 719BG 11. V 7 719PBG 11. V 7 719B-MTG 11. V B55G 11. V B5G 11. V B551G 11. V B35G 1. V 5311B5G 1. V V5G 1. V 59 SW3-G 1. V 5 SW3-G 1. V 5 591B3G 1. V 3 3B-MTG 1. V 3PB-MTG 1. V SW3-G 1. V 59 TVG 9.9 H 39 57BG 9. H 1 53B55G 9. V 5 533B551G 9. V B5G 9. V 5 SW5-G. V 5 SW5-G. V 5 7BG.7 V 7 7B-MTG.7 V 7 YB3-G. V 1 3DG.3 V B551G. V B5G. V B5G. V V5G. V V5G 7.5 V B5G 7.5 V 59 TV35G 7. H 31 BW3-G 7. V 5 BW3-G 7. V 5 SW3-G 7. V 5 SW3-G 7. V 5 75BG. V 7 75B-MTG. V 7 71BG. V 71B-MTG. V 3BG. V 7BG.5 V 9 7PBG.5 V 9 7B-MTG.5 V 9 7PB-MTG.5 V 9 5BG. H 3 531B1G.3 V 5 531B15G.3 V 5 53B51G.3 V 5 53B515G.3 V 5 53B1G.3 V 55 53B15G.3 V 55 31BG 5. V BW5-G 5. V 5 BW5-G 5. V B55G 5.7 V B55G 5.7 V 57 /products/maxclip 39BG 5. V 39B-PG 5. V 59BG 5.5 H 53B5G 5.5 V 5 597B5G 5.5 V 5 37BG 5. V 1 533B55G 5. V B55G 5. V B5G. V 5 BW3-G.7 V 5 BW3-G.7 V 5 599B5G.5 V B55G.5 V 57 73BG. V 73B-MTG. V 531B1G. V 5 53B51G. V 5 39BG. V 39B-PG. V 53B5G. V 5 3BG. V 533B55G 3. V B55G 5. V BG 5. V 59B5G 3.7 V 5 399B-PG 3.3 V BG.7 V B-PG.7 V 5335B55G.7 V 57 53B5G. V 5 TO-7 TV9G. H 53 TV97G. H V B5G 13. V B551G 13. V 55 SW5-G 11. V 5 SW5-G 11. V B551G 11. V B5G 11. V 5 SW3-G 1. V 5 SW3-G 1. V B551G 9. V B5G 9. V 5 SW5-G. V 5 SW5-G. V 5 YB3-G. V B551G. V B5G. V B5G. V 5 BW3-G 7. V 5 BW3-G 7. V 5 SW3-G 7. V 5 SW3-G 7. V 5 3BG. V 5311B1G.3 V B15G.3 V 5 531B51G.3 V 5 531B515G.3 V 5 531B1G.3 V B15G.3 V 55 31BG 5. V BW5-G 5. V 5 BW5-G 5. V B55G 5.7 V B55G 5.7 V 57 39BBG 5. V 39B-PG 5. V 5971B5G 5.5 V 5 37BG 5. V B55G 5. V B55G 5. V B5G 5. V 5 BW3-G.7 V 5 BW3-G.7 V B5G.5 V B55G.5 V B55G.5 V 57 39BG. V 39B-PG. V 5311B1G. V 5 531B51G. V 5 3BG. V 5331B55G 3. V B55G 3. V BG 3.3 V 399B-PG 3.3 V BG.7 V B-PG.7 V TO- 57BG 7.3 H V 5 57VG 3. H V 5 57UG 3. H V 5 57B31G 7.3 H 5 57V31G 3. H 5 57U31G 3. H 5 57BG 7.3 V 5 57VG 3. V 5 57UG 3. V 5 591BG. H-V B31G. H BG. V BG. H-V BG. V BG. H 51 PF3G.3 V 5 PF33G.3 V 5 PF3G.3 H 5 PF35G.3 V 5 PF3G.3 H 5 59BG 1. H-V 53 59B31G 1. H 53 59BG 1. V 53 INDEX USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw 5

6 Index by Device Cooled, Heat Sink Style, and Thermal Resistance Board Part Number θn Page Board Part Number θn Page Board Part Number θn Page AXIAL LEAD SMT TO-5 INDEX UG 15. V 77 DG 15. V 77 BRIDGE RECTIFIERS BG 9. V 77 3BG 9. V 77 BG 9. V 77 DIPS Extruded Heat Sinks 51BG. H 3 511BG 7. H 3 57BG 7. H 3 D-Pak TO D1G 15. H 5731DG 15. H D Pak TO D1G 1. H 5733DG 1. H 719D/TRG 11. H 5 719DG 11. H 5 D Pak TO-3 SO1 (MO-1) 71D/TRG 15. H 71DG 15. H D 3 Pak TO- 573D1G 1. H 5 573DG 1. H 5 Extruded Collar Heat Sinks 315BG 3. V 7 35BG 3. V BG. V 7 35BG 57. V 7 335BG 5. V 7 Low Cost Push On Heat Sink 5FG 5. V 75 Snap On Cooler Heat Sinks 5715BG. V BG 3. V BG 35. V BG 31. V BG. V 75 BG 5. H 3 55BG. H TO-3 Space Saving Collar Heat Sinks 1PBG 5. V 75 5BG. H 1 Slide On Heat Sinks 51JG. H 51BG. H 53BG 39. H 1 Diamond Shaped Basket Heat Sinks 5753BG 15. H BG 13. H BG 1. H 7 PBG 3. V 75 3PBG 3. V 75 TO- 5BG 39. H Diamond Shaped Basket Heat Sinks 55BG 3. H 3 5BG 3. H 3 51BG 3. H 51WG 3. H KEY H = Horizontal mount 517BG 1. H 7 51BG 9. H 7 519BG. H 7 5BG. H 7 5BG. H 5WG. H V = Vertical mount Space Saving Collar Heat Sinks 579BG. H 7 5BG. H 5WG. H IC PACKAGES, BGA, PGA, QFP, LCC Bi Directional Air Flow H 19 Solder Anchor H 1 H V = Either horizontal or vertical depending on device leads θn = Natural convection thermal resistance based on a 75 C heat sink temperature rise 579VG. H 7 TO-9 Clip On Style Heat Sink 9FG 3.1 V Push Pin H 1 Slip On Style Heat Sinks Clip Attachment H 1 575BG. V Tape Attachment H 1 MULTI-WATT 5753BG 11. H 7 PF53G 1.1 H BG 5. V 575BG. V Extruded Heat Sinks YB3-G. V 1 3BG. V 31BG 5. V 39BG 5. V 39B-PG 5. V 37BG 5. V 1 39BG. V 39B-PG. V 3BG. V 399BG 3.3 V 399B-PG 3.3 V BG.7 V B-PG.7 V SIPS Channel Style Heat Sinks 5351UG. V 5351BG. V Clip On Style Heat Sinks 5BG 1. V 7 5B35G 1. V 7 Extruded Heat Sinks 3BG. V 31BG 5. V 3BG. V Plug In Style Heat Sinks 51BG 11.5 H V 51B3G 11.5 V 51B31G 11.5 H Slide On Style Heat Sinks 73BG 1. V 7 71DG 1. V 7 513BG 1. H BG 9. H 7 PF5G.9 H BG. H 7 513BG 7. H 7 PF57G 7. H 73 Hat Section Heat Sink 53BG 7. H 9 Space Saving Collar Heat Sinks 57913BG 1.5 H VG 1.5 H 9 Square Basket Heat Sinks 5193BG 11. H BG 1. H BG 7. H 7 513BG 7. H BG 7. H 73 53BG. H 7 573BG. H BG. H BG. H BG. H BG 5. H 7 593BG 5.5 H BG 5. H BG 5.1 H 73 53BG 5. H BG. H BG. H 71 Two Piece Heat Sinks 539BG.7 H 9 53BG.7 H 9 537BG.7 H 9 TO-1 Channel Style Heat Sink TVG 1. H 5 Slip On Style Heat Sinks PF73G 35. H-V 5 PF73G 35. H-V BG. V UG. V 5 TO- Channel Style Heat Sinks 579BG 3. H V 5773BG 7. H V 577BG. H V Compact Slide On Heat Sinks PBG 5. V 7PBG 5. V Extruded Heat Sinks 531B5G 13. V V5G 13. V 59 SW5-G 13. V B5G 1. V V5G 1. V 59 SW3-G 1. V B5G. V V5G. V V5G 7.5 V B5G 7.5 V 59 Low Cost Slide On Heat Sinks 57BG. V 3 57UG. V 3 USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw

7 Index by Device Cooled, Heat Sink Style, and Thermal Resistance Board Part Number θn Page Board Part Number θn Page Board Part Number θn Page TO- CONTINUED Hat Section Heat Sinks TV9G. H 53 53B53G 13. V 3 53B353G 13. V 3 Low Cost Slide On Cooler Heat Sinks TV97G. H V BG 13. V 1 579BG. V 3 High Rise Style Heat Sinks 57B3G 13. V 1 579B33G. V B1G.3 V 5 53BG 13. V BG. V B15G.3 V 5 53DG 13. V B33G. V 3 531B51G.3 V 5 TV5G 13. V 3 57BG 1. V 3 531B515G.3 V 5 59PBG 13. V 3 57B33G 1. V 3 531B1G.3 V 55 1BG 1.5 V 3 Low Profile Hat Section Heat Sink 531B15G.3 V 55 1PBG 1.5 V 3 53BG 1. H V 3 Plug In Style Heat Sink 1PBG 1.5 V 3 Space Saving Staggered Heat Sink 3DG.3 V TO-1 Channel Style Heat Sink 59311B3G. V Dual Extruded Heat Sinks 53371B55G 5.7 V B55G 5. V B55G.5 V B55G 3. V 57 Dual High Rise Style Heat Sinks 5311B1G. V 5 531B51G. V 5 Extruded Heat Sinks 511B5G 19. V B5G 1. V B5G 13. V B551G 13. V B5G 1. V 1 SW5-G 11. V 5 SW5-G 11. V B551G 11. V B5G 11. V 5 SW3-G 1. V 5 SW3-G 1. V B551G 9. V B5G 9. V 5 SW5-G. V 5 SW5-G. V 5 YB3-G. V B551G. V B5G. V B5G. V 5 BW3-G 7. V 5 BW3-G 7. V 5 BW3-G 7. V 5 SW3-G 7. V 5 SW3-G 7. V 5 3BG. V BW5-G 5. V 5 BW5-G 5. V 5 31BG 5. V 53371B55G 5.7 V 57 39BG 5. V 39B-PG 5. V 5971B5G 5.5 V B55G 5. V B5G 5. V 5 BW3-G.7 V B5G.5 V B55G.5 V 57 39BG. V 39B-PG. V 3BG. V 5331B55G 3. V BG 3.3 V 399B-PG 3.3 V BG.7 V B-PG.7 V 37BG 5. V 1 591B3G. V Slide On Heat Sink 713DG 3.1 V TO- Channel Style Heat Sinks 717DG 35.7 V BG 3. V BG 3. H-V 35 TV5G 9.9 H-V DG.3 H 35 NEED HIGHER PERFORMANCE? Aavid Thermalloy also offers the Max Clip System TM for discrete power semiconductors featuring simple assembly and high reliability. /products/maxclip TVG 7.1 H V 31 TV7G 7.1 H V BG 5.9 H-V BG 5.9 V DG 5. V 39 3BG 5. V 39 3PBG 5. V BG. H-V BG. V BG. H-V JG. H-V BG 3. H-V 1 11PBG 1. H-V BG. H-V 1 71DG.3 H 3 711DG.3 V BG.3 H-V 1 713DG 19.7 V 35 71DG 19. V 3 3BG 1. V 3 599B3G 17.9 V 33 19PBG 17. H-V 35 TV155G 17. V 3 531BG 1.7 H-V BG 1.7 H-V 1 57BG 1. V 3 57DG 1. V 3 51BG 15. H V 39 TV15G 1. V 3 575BG 13. V 3 575DG 13. V 3 3BG 13. H V 37 3B-MTG 13. V 37 39B-MTG 13. V B3G 13. V 33 3DG 1.5 V 3 551BG 1. H 3 593B3G 11. V 3 719BG 11. V 7 719PBG 11. V 7 719B-MTG 11. V 7 591B3G 1. V 3 TVG 9.9 H 39 7BG.7 V 7 7B-MTG.7 V 7 TV35G 7. H 31 75BG. V 7 75B-MTG. V 7 71BG. V 71B-MTG. V 7BG.5 V 9 7PBG.5 V 9 7B-MTG.5 V 9 7PB-MTG.5 V 9 5BG. H 39 73BG. V 73B-MTG. V Clip On Style Heat Sinks 9PBG.5 H 3 9PBG 3.1 V 3 579BG. V 579B33G. V 5799BG. V 5799B33G. V 3PBG 3. V 3 57BG. H V 57B33G. V Dual Extruded Heat Sinks 3BG. V 31BG 5. V 5337B55G 5.7 V B55G 5. V 57 37BG 5. V 1 3BG. V 533B55G 3. V B55G.7 V 57 Dual High Rise Style Heat Sinks 531B1G. V 5 53B51G. V 5 Extruded Heat Sinks MLAAG 17.9 H 5 51B5G 17. V 1 511B5G 1. V 1 513B5G 13. V 5 531B5G 13. V V5G 13. V B55G 13. V 5 533B551G 13. V 55 SW5-G 13. V 59 51B5G 1. V 1 SW5-G 11. V 5 SW5-G 11. V B55G 11. V B551G 11. V B5G 11. V B5G 1. V V5G 1. V 59 INDEX USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw 7

8 Index by Device Cooled, Heat Sink Style, and Thermal Resistance Board Part Number θn Page Board Part Number θn Page Board Part Number θn Page INDEX TO- CONTINUED SW3-G 1. V 5 SW3-G 1. V 5 SW3-G 1. V 59 53B55G 9. V 5 533B551G 9. V B5G 9. V 5 SW5-G. V 5 SW5-G. V 5 YB3-G. V B551G. V 55 53B5G. V B5G. V B5G. V V5G. V V5G 7.5 V B5G 7.5 V 59 BW3-G 7. V 5 BW3-G 7. V 5 SW3-G 7. V 5 SW3-G 7. V 5 BW5-G 5. V 5 BW5-G 5. V B55G 5.7 V 57 39BG 5. V 39B-PG 5. V 53B5G 5.5 V 5 597B5G 5.5 V 5 533B55G 5. V B5G. V 5 BW3-G.7 V 5 BW3-G.7 V 5 599B5G.5 V B55G.5 V 57 39BG. V 39B-PG. V 53B5G. V 5 533B55G 3. V 57 59B5G 3.7 V 5 399BG 3.3 V 399B-PG 3.3 V BG.7 V B-PG.7 V Hat Section Heat Sinks 37BG 5. H 37PBG 5. H TV9G. H DG. V 71DG. H 59BG. V TV97G. H V 53 57BG 15. H V 571BG 15. H V 57BG 9. H High Rise Style Heat Sinks 531B1G.3 V 5 531B15G.3 V 5 53B51G.3 V 5 53B515G.3 V 5 53B1G.3 V 55 53B15G.3 V 55 Plug In Style Heat Sinks 57BG 7.3 V 5 57VG 3. V 5 57UG 3. V 5 57B31G 7.3 H 5 57V31G 3. H 5 57U31G 3. H 5 57BG 7.3 V 5 57VG 3. V 5 57UG 3. V 5 591BG. H-V B31G. H BG. V BG. H-V BG. V BG. H 51 PF3G.3 V 5 PF33G.3 V 5 PF3G.3 H 5 PF35G.3 V 5 PF3G.3 H 5 59BG 1. H-V 53 59B31G 1. H 53 59BG 1. V 53 Slide On Heat Sinks PF73G 35. V 5 PF73G 35. V 5 PF7G.9 V PF73G.9 V PF75G 3.7 V 57BG 3. H-V 5 57B3G 3. H 5 571BG 3. H V 5 571B33G 3. V 5 57BG 1. H-V 5 57B33G 1. V 5 575BG 1. H-V 5 575B33G 1. V 5 PF75G.3 V PF75G 17.3 V 579BG 1. H-V 5 579B33G 1. V 5 Snap Down Style Heat Sinks 5751BG 1. H V 5793BG 1. V 579BG 1. V Space Saving Heat Sinks 55BG. H 9 55DG. H 9 595B3G. V 9 595U3G. V 9 5DG 17.9 V PBG 1.7 V 7 BG 1.7 V 7 5B-MTG 15. V 7 593B35G 1. V 3B-MTG 1. V 3PB-MTG 1. V 3DG.3 V 7 Square Basket Heat Sink 59BG 5.5 H TO-7 KEY H = Horizontal mount V = Vertical mount H V = Either horizontal or vertical depending on device leads θn = Natural convection thermal resistance based on a 75 C heat sink temperature rise Dual Extruded Heat Sinks 53371B55G 5.7 V B55G 5. V B55G.5 V B55G 3. V 57 Dual High Rise Style Heat Sinks 5311B1G. V 5 531B51G. V 5 Extruded Heat Sinks 5131B5G 13. V B551G 13. V 55 SW5-G 11. V 5 SW5-G 11. V B551G 11. V B5G 11. V 5 SW3-G 1. V 5 SW3-G 1. V B551G 9. V B5G 9. V 5 SW5-G. V 5 SW5-G. V 5 YB3-G. V B551G. V B5G. V B5G. V 5 BW3-G 7. V 5 BW3-G 7. V 5 SW3-G 7. V 5 SW3-G 7. V 5 3BG. V BW5-G 5. V 5 BW5-G 5. V 5 31BG 5. V 53371B55G 5.7 V 57 39BG 5. V 39B-PG 5. V 5971B5G 5.5 V B55G 5. V 57 37BG 5. V 1 591B5G 5. V 5 BW3-G.7 V 5 BW3-G.7 V B5G.5 V B55G.5 V 57 39BG. V 39B-PG. V 3BG. V 5331B55G 3. V BG 3.3 V 399B-PG 3.3 V BG.7 V B-PG.7 V Hat Section Heat Sinks TV9G. H 53 TV97G. H V 53 High Rise Style Heat Sinks 5311B1G.3 V B15G.3 V 5 531B51G.3 V 5 531B515G.3 V 5 531B1G.3 V B15G.3 V 55 TO- Plug In Style Heat Sinks 57BG 7.3 H V 5 57VG 3. H V 5 57UG 3. H V 5 57B31G 7.3 H 5 57V31G 3. H 5 57U31G 3. H 5 57BG 7.3 V 5 57VG 3. V 5 57UG 3. V 5 591BG. H-V B31G. H BG. V BG. H-V BG. V BG. H 51 59BG 1. H-V 53 59B31G 1. H 53 59BG 1. V 53 PF3G.3 V 5 PF33G.3 V 5 PF3G.3 H 5 PF35G.3 V 5 PF3G.3 H 5 USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw

9 How To Select a Heat Sink How to select a heat sink The basic equation for heat transfer or power dissipation may be stated as follows: P D = Δ T ΣR θ Where: P D = the power dissipated by the semiconductor device in watts. ΔT = the temperature difference of driving potential which causes the flow of heat. ΣR θ = the sum of the thermal resistances of the heat flow path across which ΔT exists. The above relationship may be stated in the following forms: T J T A T C T A P D = P D = R θjc + R θcs + R θsa R θcs + R θsa Where: T J = the junction temperature in C (maximum is usually stated by the manufacturer of the semiconductor device). T C = case temperature of the semiconductor device in C. T S = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in C. T A = ambient air temperature in C. R θjc = thermal resistance from junction to case of the semiconductor device in C per watt (usually stated by manufacturer of semiconductor device). R θcs = thermal resistance through the interface between the semiconductor device and the surface on which it is mounted in C per watt. R θsa = thermal resistance from mounting surface to ambient or thermal resistance of heat sink in C per watt. P D = T S T A R θsa HOW TO SELECT A HEAT SINK The above equations are generally used to determine the required thermal resistance of the heat sink (R θsa ), since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set. Figure 1 indicates the location of the various heat flow paths, temperatures and thermal resistances. The common practice is to represent the system with a network of resistances in series as shown in Figure. FIGURE 1 FIGURE surface (cooler/dissipator) Interface Atmosphere or ambient Junction (heat source) T A T J T C T S T A P D P D Semiconductor case R θjc R θcs R θsa R θcs R θsa Heat flow path mounting surface to ambient, equation (3) R θjc T J T C T S Heat flow path case to ambient equation () Heat flow path junction to ambient, equation (1) T A USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw 9

10 How To Select a Heat Sink Example A Example B HOW TO SELECT A HEAT SINK Find a space saving heat sink to keep a TO- device below the maximum 15 C junction temperature in natural convection. Device will be screw mounted with an electrically conductive interface. Given: P D = watts R θjc = 3 C/W (from semiconductor manufacturer) T J max = 15 C (from semiconductor manufacturer) T A max = 5 C A Kondux TM pad is a good choice for electrically conductive applications. Thermal resistance for Kondux TM can be determined from the following graph. R (ºC/W) CS Typical TO- Performance Screw Torque (in-lb) Find a heat sink to keep a TO- device below the maximum 15 C junction temperature in forced convection at ft/min. Device must be electrically insulated and mounted with a labor saving clip. Given: P D = 1 watts R θjc =.5 C/W (from semiconductor manufacturer) T J max = 1 C (from semiconductor manufacturer) T A max = 5 C A Hi-Flow pad works great with clip mounting and provides the necessary electrical insulation. Thermal resistance for Hi-Flow at low pressure is 1.15 C/W (from page 7). Using equation 1, solve for R θsa R θsa = ( ) = 3.5 C/W 1 Many styles are available. If board space is a concern, 533B551G (pg 55) meets the requirements. At in-lb of torque the thermal resistance is approximately R θcs =.5 C/W Using equation 1, solve for R θsa R θsa = ( 3 +.5) = 1.7 C/W The Index by Heat Sink Style on page lists space saving heat sinks. Several models are in the 1 C/W range. Choose the one that best fits the application and verify thermal resistance from graph. Part number 593B35G shows a C temperature rise at watts X 5333X According to the above graph, an airflow of ft/min results in a thermal resistance of 3 C/W. This is less than the required thermal resistance of 3.5 C/W and is therefore acceptable under these airflow conditions. If height is a concern, 5337B55G would meet the requirements and is only 1. tall Hi-Flow is a trademark of the Bergquist Company R θsa = = 1. C/W Which meets the above requirement in natural convection. 1 USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw

11 Reading a Thermal Performance Graph The performance graphs you will see in this catalog (see graph 579) are actually a composite of two separate graphs which have been combined to save space. The small arrows on each curve indicate to which axis the curve corresponds. Thermal graphs are published assuming the device to be cooled is properly mounted and the heat sink is in its recommended mounting position. 1 GRAPH A GRAPH B CONVERTING VOLUME TO VELOCITY Although most fans are normally rated and compared at their free air delivery at zero back pressure, this is rarely the case in most applications. For accuracy, the volume of output must be derated % % for the anticipation of back pressure. EXAMPLE: The output air volume of a fan is given as CFM. The output area is inches by inches or 3 in or 5 ft. To find velocity: Velocity (LFM) = Volume (CFM) area (ft ) Velocity =.5 = 3 Velocity is 3 LFM, which at %, derates to 5 LFM. READING A THERMAL PERFORMANCE GRAPH GRAPH A is used to show heat sink performance when used in a natural convection environment (i.e. without forced air). This graph starts in the lower left hand corner with the horizontal axis representing the heat dissipation (watts) and the vertical left hand axis representing the rise in heat sink mounting surface temperature above ambient ( C). By knowing the power to be dissipated, the temperature rise of the mounting surface can be predicted. Thermal resistance in natural convection is determined by dividing this temperature rise by the power input ( C/W). EXAMPLE A: Aavid Thermalloy part number 579 is to be used to dissipate 3 watts of power in natural convection. Because we are dealing with natural convection, we refer to graph A. Knowing that 3 watts are to be dissipated, follow the grid line to the curve and find that at 3 watts there is a temperature rise of 75 C. To get the thermal resistance, divide the temperature rise by the power dissipated, which yields 5 C/W. GRAPH B is used to show heat sink performance when used in a forced convection environment (i.e. with forced air flow through the heat sink). This graph has its origin in the top right hand corner with the horizontal axis representing air velocity over the heat sink LFM* and the vertical axis representing the thermal resistance of the heat sink ( C/W). Air velocity is calculated by dividing the output volumetric flow rate of the fan by the cross-sectional area of the outflow air passage. Velocity (LFM)* = Volume (CFM)** area (ft ) EXAMPLE B: For the same application we add a fan which blows air over the heat sink at a velocity of LFM. The addition of a fan indicates the use of forced convection and therefore we refer to graph B. This resistance of 9.5 C/W is then multiplied by the power to be dissipated, 3 watts. This yields a temperature rise of.5 C. DESIGN ASSISTANCE Aavid Thermalloy can assist in the design of heat sinks for both forced and natural convection applications. Contact us for help with your next thermal challenge. For more information, visit our web site at: * Linear feet per minute ** Cubic feet per minute USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw 11

12 BGA Solder Anchor Solder anchor attachment HEAT SINKS FOR IC PACKAGES Aavid's unique Solder anchor attachment method uses two or four small Solder anchors attached to the circuit card and a wire spring clip to securely fasten the heat sink to the device. This method is rugged, compact and allows for easy removal in case of rework. All products include a phase change pad suitable for most IC package styles to optimize thermal performance. Models are available with a single or dual spring clips for additional thermal interface pressure. Solder anchors are ordered separately. IC Pkg Size (mm) IC Pkg Style Part Number W (mm) L (mm) H (mm) A (mm) θn 1 θf Finish Fig. PCB Fig. #Anchors 3 3 x 3 All 37B3G Black anodize 1 A 3 x 3 All 371B3G Black anodize 1 A 3 x 3 All 37B3G Black anodize 1 A 7 x 7 All 373B3G Black anodize 1 A 7 x 7 All 37B3G Black anodize 1 A 7 x 7 All 375B3G Black anodize 1 A 35 x 35 Flip chip G Black anodize C 35 x 35 Flip chip 1-THMA-1G Black anodize C 35 x 35 All 37BG Black anodize 1 B 35 x 35 All 377BG Black anodize 1 B 35 x 35 All 37BG Black anodize 1 B 37.5 x 37.5 Flip chip 1-BRD-1G Clear anodize B 37.5 x 37.5 Flip chip 1-BRD1-1G Black anodize B 37.5 x 37.5 Flip chip 1-BRD1-3G Black anodize 3 D 37.5 x 37.5 Flip chip 1-BRD1-G Black anodize B 37.5 x 37.5 Flip chip 1-BRD1-5G Clear anodize 3 D 37.5 x 37.5 Flip chip 1-BRD1-7G Clear anodize B x All 379BG Black anodize 1 B x All 375BG Black anodize 1 B x All 3751BG Black anodize 1 B.5 x.5 Flip chip 1-CLS1-1G Black anodize E.5 x.5 Flip chip 1-CLS-1G Black anodize E SOLDER ANCHOR Part Number PCB Thickness (mm) A Dim (mm) 157DG DG (.3).9 (.9) 5. (.) 7. (.3). (.5) 1. Natural convection thermal resistance based on a 75º C heat sink temperature rise.. Force convection thermal resistance based on an entering 1. m/s (LFM) airflow. 3. Solder anchors are sold separately refer to drawing above.. Solder anchor mechanical drawings and board mounting drawings see page USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw

13 BGA Solder Anchor Solder anchor heat sinks mechanical drawings FIGURE 1 FIGURE 1.7 (.5) "H" FIGURE 3 "W" "L" 5.7 (.155) "W" "L" "H" 1.7 (.5) HEAT SINKS FOR IC PACKAGES 5. "W" (1.) 15. (.591) 15. (.591) "H" "L" Board mounting pattern information for solder anchor heat sinks FIGURE A 35.5 (1.) FIGURE B. (1.9) ø.97 ±.3 (.3 ±.1) PLATED THROUGH HOLES X.7 (1.5) 53.3 (.1) Ø.97.3 (.3.1) PLATED THROUGH HOLES X. (.) 33. (1.3) 17.7 (.7) 5. (.) X.13 (.95) 5. (.) x FIGURE C FIGURE D FIGURE E Ø.97.3 (.3.1) PLATED THROUGH HOLES X 5.7 (1.) 5. (.3). (1.9) X Ø.97 ±.3 (.3 ±.1) PLATED THROUGH HOLES X.13 (.95) Ø.97.3 (.3.1) PLATED THROUGH HOLES X 55. (.). (.). (.9) 9.1 (1.15) 5. (.)X 33. (1.3). (.) X 5. (.) X 7.9 (1.1) 33. (1.3) 5. (.) X USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw 13

14 BGA Push Pin Attachment Push pin attachment HEAT SINKS FOR IC PACKAGES Push pin heat sinks require two 3.1mm holes in the circuit card to quickly attach the heat sink over the device. The one piece design makes assembly a snap. Pressure is maintained by the tension of the push pin coil springs to ensure even pressure across the device. Push pins provide a greater margin of reliability in applications where gravity or vibration may cause tapes or adhesives to fail. The addition of a phase change pad optimizes thermal performance. IC Pkg. Size (mm) Part Number W (mm) L (mm) H (mm) S (mm) T (mm) θn θf 3 Finish Fig. PCB Fig. 1 Pin Style Pad x 1-3-7G Black anodize 1 A Plastic Yes x 1-3-G Black anodize 1 A Brass Yes x G Black anodize A Plastic No 35 x 35 1-TNT-1G Black anodize 3 D Plastic No 37.5 x G Green anodize 5 B Plastic No 37.5 x G Gold anodize 5 B Plastic Yes 37.5 x G Gold anodize 5 B Brass Yes 37.5 x G Black anodize 5 B Plastic Yes 37.5 x G Black anodize 5 B Brass Yes 37.5 x MG Green anodize 5 B Plastic No 5 x 5 1-LLB-3G Black anodize C Plastic Yes 5 x 5 1-LLB-5G Black anodize C Brass Yes 5 x 5 1-LLB-11G Black anodize C Plastic No 1. Push pin mechanical drawings and board mounting drawings see page 15. Natural convection thermal resistance based on a 75 C heat sink temperature rise. 3. Forced convection thermal resistance based on an entering 1. m/s (LFM) airflow. 1 USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw

15 BGA Push Pin Attachment Mechanical drawings FIGURE 1 FIGURE FIGURE 3 "S" "W" FIGURE "T" "L" "S" "H" "T". (1.35) "L" "H" "W" "H" FIGURE 5 "S" "L" "T" "T" 1.7 (1.) "W" 1.5 (1.3) "H" HEAT SINKS FOR IC PACKAGES "L". (.7) "T" "L" "W" 1.9 (.1) "W" "H" Board mounting pattern information FIGURE A FIGURE B 3.95 (1.97) 1. (.9) 3.95 (1.97). (1.3) REF Ø (.1.1) THROUGH HOLES 1. (UNPLATED) X (.9).7 (.) 59. (.3) REF 1.7 (1.3) ø3.1 ±.3 (.1 ±.1) THROUGH HOLES (UNPLATED) X 1.7 (1.3).7 (.) FIGURE C FIGURE D. (.7) Ø 3.1 ±.3 ( Ø.1 ±.1) THROUGH HOLES (UNPLATED) X Ø 3.1 ±.3 (Ø.1 ±.1) THROUGH HOLES (UNPLA TED) X 1.5 (1.3) 1.1 (.39) 5. (.) 5. (1.).75 (.17) 1.7 (1.).5 (.1) USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw 15

16 BGA Tape Attachment Heat sinks for plastic BGA packages HEAT SINKS FOR IC PACKAGES Pressure sensitive, thermally conductive adhesive tape easily and reliably bonds a heat sink to an integrated circuit package. Tapes provide high thermal conductivity and exceptional bonding properties. Adhesives are formulated for plastic and metal/ceramic packages. "L" "W" "H" Material: Aluminum IC Pkg. Size (mm) IC Pkg. Style Part Number W (mm) L (mm) H (mm) θn θf 3 Finish Tape code 1 1 x 1 Plastic 3753B35G Black anodize x 15 Plastic 375B3G Black anodize 3 3 x 3 Plastic 37B35G Black anodize 35 3 x 3 Plastic 371B35G Black anodize 35 3 x 3 Plastic 37B35G Black anodize 35 5 x 5 Plastic 335B3G Black anodize 3 7 x 7 Plastic 373B35G Black anodize 35 7 x 7 Plastic 37B35G Black anodize 35 7 x 7 Plastic 375B35G Black anodize 35 x Plastic 373B3G Black anodize 3 x Plastic 37B-CP5G Black anodize 3 31 x 31 Plastic 335B3G Black anodize 3 35 x 35 Plastic 371B3G Black anodize 3 35 x 35 Plastic 37B35G Black anodize x 35 Plastic 377B35G Black anodize x 35 Plastic 37B35G Black anodize x 35 Plastic 37B3G Black anodize 3 x Plastic 379B35G Black anodize 35 x Plastic 3B3G Black anodize 3 x Plastic 375B35G Black anodize 35 x Plastic 3751B35G Black anodize For tape specifications see page. Natural convection thermal resistance based on a 75 C heat sink temperature rise. 3. Forced convection thermal resistance based on an entering 1. m/s (LFM) airflow. 1 USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw

17 BGA Tape Attachment Heat sinks for metal/ceramic BGA packages "L" "W" "H" HEAT SINKS FOR IC PACKAGES Material: Aluminum IC Pkg. Size (mm) IC Pkg. Style Part Number W (mm) L (mm) H (mm) θn θf 3 Finish Tape Code 1 1 x 1 Metal / Ceramic 375B3G Black anodize 3 3 x 3 Metal / Ceramic 37B3G Black anodize 3 3 x 3 Metal / Ceramic 371B3G Black anodize 3 3 x 3 Metal / Ceramic 37B3G Black anodize 3 5 x 5 Metal / Ceramic 335B3G Black anodize 3 7 x 7 Metal / Ceramic 3353B3G Black anodize 3 7 x 7 Metal / Ceramic 373B3G Black anodize 3 7 x 7 Metal / Ceramic 37B3G Black anodize 3 7 x 7 Metal / Ceramic 375B3G Black anodize 3 x Metal / Ceramic 373B3G Black anodize 3 x Metal / Ceramic 373M3G Green anodize 3 x Metal / Ceramic 37B-TACHG Black anodize 3 31 x 31 Metal / Ceramic 3357B3G Black anodize 3 31 x 31 Metal / Ceramic 335B3G Black anodize x 3.5 Metal / Ceramic 33B-TACHG Black anodize 3 35 x 35 Metal / Ceramic 371B3G Black anodize 3 35 x 35 Metal / Ceramic 37B3G Black anodize 3 35 x 35 Metal / Ceramic 377B3G Black anodize 3 35 x 35 Metal / Ceramic 37B3G Black anodize 3 35 x 35 Metal / Ceramic 37B3G Black anodize x 37.5 Metal / Ceramic 3733M3G Green anodize x 37.5 Metal / Ceramic 319B-TACHG Black anodize x 37.5 Metal / Ceramic 33B3G Black anodize 3 x Metal / Ceramic 379B3G Black anodize 3 x Metal / Ceramic 3B3G Black anodize 3 x Metal / Ceramic 375B3G Black anodize 3 x Metal / Ceramic 3751B3G Black anodize 3.5 x.5 Metal / Ceramic 31B-TACHG Black anodize 3.5 x.5 Metal / Ceramic 33B-TACHG Black anodize 3 5 x 5 Metal / Ceramic 3B-TACHG Black anodize Metal / Ceramic 333B-TACHG Black anodize 3 1. For tape specifications see page. Natural convection thermal resistance based on a 75 C heat sink temperature rise. 3. Forced convection thermal resistance based on an entering 1. m/s (LFM) airflow. USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw 17

18 BGA Clip Attachment Clip attachment HEAT SINKS FOR IC PACKAGES Aavid's BGS Clip heat sinks provide a mechanical attachment alternative to tape applications where it is desirable to attach the heat sink directly to the device. The unique clip uses spring pressure to ensure even contact across the device while the end plates firmly engage the edge of the package, locking the heat sink in place. Each heat sink uses pre-applied thermal grease for optimum thermal performance. "L" "W" "H" Material: Aluminum IC Pkg. Size (mm) Part Number W (mm) L (mm) H (mm) IC Pkg. Style θn 1 θf Interface Clip 7 x 7 317B-EP11-BGS1G All EP11 BGS1 35 x 35 51B-EP11-BGSG All EP11 BGS.5 x.5 519B-EP11-BGS5G All EP11 BGS5.5 x.5 5B-EP-BGS5G All EP BGS5.5 x.5 5B-EP-BGS5G All.1.9 EP BGS5 1. Natural convection thermal resistance based on a 75 C heat sink temperature rise.. Forced convection thermal resistance based on an entering 1. m/s (LFM) airflow. THERMALCOTE TM GREASE "E" PULL TAB "D" TAPE TYPE AND INTERFACE MATERIAL INFORMATION Material Description Adhesive Thermal Resistance Color Carrier D Dim E Dim EP11 Thermalcote TM grease with release liner None.1 White None 13.3 (.55) 13.3 (.55) EP Thermalcote TM grease with release liner None.3 White None (1.5) (1.5) For more information on Thermalcote TM see page USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw

19 BGA Bi Directional Bi Directional Designed for applications with airflow traveling in a single direction, these heat sinks are suitable for a variety of standard square IC packages. Models are available with pre-applied thermal tape for easy attachment to the IC. attach models are also available. "L" "W" "H" Material: Aluminum HEAT SINKS FOR IC PACKAGES IC Pkg Size IC Pkg Style Part Number W (mm) L (mm) H (mm) θn 3 θf Finish Attachment Tape Code 1 X 1 All 1553B5G Black anodize 1 N/A 1 X 1 All 793BG Black anodize 1 N/A X Metal 33511B3G Black anodize Tape 3 5 X 5 Metal 3351B3G Black anodize Tape 3 5 X 5 Metal 33511B3G Black anodize Tape 3 5 X 5 All 3351BG Black anodize 1 N/A 5 X 5 All 33511BG Black anodize 1 N/A 5 X 5 Plastic 3351B3G Black anodize Tape 3 7 X 7 Plastic 33531B35G Black anodize Tape 35 7 X 7 Metal 33531B3G Black anodize Tape 3 7 X 7 All 33531BG Black anodize 1 N/A X All 7353U11G Unfinished 1 N/A 3 X 3 All 3351BG Black anodize 1 N/A 3 X 3 All 33571BG Black anodize 1 N/A 3 X 3 Metal 3351B3G Black anodize Tape 3 3 X 3 Metal 33571B3G Black anodize Tape X 37.5 All 7993B15G Black anodize 1 N/A 37.5 X 37.5 All 3331BG Black anodize 1 N/A 1. ordered separately for information on see page 11,115.. For tape specifications see page. 3. Natural convection thermal resistance based on a 75 C heat sink temperature rise.. Forced convection thermal resistance based on an entering 1. m/s (LFM) airflow. USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw 19

20 DIPS THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 51 Slide on heat sink with staggered fins Slide on heat sink with staggered fins attaches to pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. Available in two finishes. Part Number Finish 51BG Black anodize 51WG Black anodize with black paint on bottom side 51 Angle fin heat sink Angle fin heat sink is a simple low cost solution for cooling DIP devices. Suitable for 1 and 1 pin packages and available in two finish options. Easily attaches using thermal epoxy (.5) 1.5 (.15) 15.3 (.) REF LOCKING CATCH 11.3 (.5) 19.5 (.75) 15. (.).35 (.5) 5.33 (.1) Material:.3 (.5) Thick Aluminum Finish: See Table page11 Part Number Finish 51JG Pre black anodize* 51BG Black anodize * Edges cut during the manufacturing process will be unfinished. See page 11 for more information..35 (.5) 5.39 (.1) Material: 1.7 (.5) Thick Aluminum Finish: See Table 5, 5 Slide on heat sink with angled fins Slide on heat sink with angled fins attaches to 1 and 1 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. Available in two finishes (.1).1 (.9) 1.3 (.) LOCKING CATCH 5. (.) 15. (.) Part Number Device Pkg Style Finish A Dim 5BG Ceramic Black anodize 7.7 (.31) 5WG Ceramic Black anodize with black paint on bottom side 7.7 (.31) Material:.3 (.5) Thick Aluminum Finish: See Table 5BG Plastic Black anodize.35 (.5) 5WG Plastic Black anodize with black paint on bottom side.35 (.5) USA Tel: +1 (3) info@aavid.com Italy Tel: sales.it@aavid.com United Kingdom Tel: sales.uk@aavid.com Taiwan Tel: +() sales@aavid.com.tw