Finishes Card Ejectors & Guides Thermal Greases and Epoxies

Transcription

1 Table of Contents General Information How to Use This Standard Part Catalog... Index by Part Number... 3 Index by Device and Thermal Resistance... 5 Index by Style and Thermal Resistance... How to Select a Heat Sink How to Read a Thermal Graph Board Mounted Heat Sinks Heat Sinks for IC Packages BGA DIP Surface Mount Discrete Semiconductor Packages D-PAK... 5 SO... SMT Footprints... Thru-Hole Discrete Semiconductor Packages TO TO- and TO TO-, TO-1, and TO TO- and TO TO-, TO-1, TO-7, and Multiwatt... 1 TO-1... TO TO SIP... 7 TO-9... TO TO TO Axial Lead Devices Bridge Rectifiers Options Table of Contents How to Decipher an Aavid 1 Digit Part Number... How to Decipher a "Thermalloy" Origin Part Number... 1 Index A, B, C = Aavid Standard Parts w/options... Index D = "Thermalloy" Origin Parts w/options... 5 Interface Materials In-Sil, Kondux, Grafoil Pads... Hi-Flow, Alignment Pads... 7 Double Sided Tape Options (Factory Applied)... Labor Saving Heat Sink to Board and Semiconductor Mounts Wave-On Mounts, Semiconductor Mounts, Shur-Lock Tabs, Solderable Tabs, Solderable Pins Solderable Nuts, Clinch Nuts, Solderable Studs, Device Studs Clips Kool-Klips Thermal Clips... 9 Accessories Insulating Shoulder Washers... 1 Insulators Thermalfilm and Thermalfilm MT Insulators Mica and Thermasil III Insulating Washers/Aluminum Oxide... 1 Insulating Stanchion Pads Insulating Covers... 1 Pads Finishes Card Ejectors Guides Thermal s and Epoxies TABLE OF CONTENTS USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 1

2 How to Use This Catalog Base part number Semiconductor device Style description for heat sink Icons indicate that a mounting kit, grease or epoxy can be used with the heat sink GENERAL INFORMATION TO- Heat Sinks 7 Channel style heat sink with folded back fins Semiconductor devices have been included in photos to assist in determining mounting position. Detailed description illustrates the heat sink s differentiating features. Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. Part Number Description Finish 7BG Channel heat sink with folded back fins Black anodize Thermal graphs show natural and forced convection based on black anodize finish. For information on how to use a thermal graph, please refer to page Ordering information will specify the base heat sink with available accessories. 7PBG Channel heat sink with folded back fins Pre-black anodize* 7B-MTG With solderable tabs Black anodize.9 (.11) 7PB-MTG With solderable tabs Pre-black anodize*.9 (.11) * Edges cut during the manufacturing process will be unfinished. See page XX for more information POPULAR OPTIONS: 7B- G Base part no. A RoHS Compliant Position Code Description Location Details A TC11-MT Insulated device mounting clip for T- and solderable tabs Hole X Page For additional options see page xx Hole for Tabs USA Tel: +1 (3) [email protected]. (.175) Italy Tel: [email protected] United Kingdom Tel: [email protected] 3 1 Aavid has a large selection of popular options to enhance your heat sink selection. This section will indicate the most popular options available. Detailed indexes are available to select additional options..3 (.19) 3.1 (.15).9 (.9) 9.5 (.375) 1.3 (.) Material and finish information is shown for each part x 3.1 (.15) x ø3.1 (.15).7 (.15) page11 Mechanical drawing dimensions as shown are mm (inches) 3.1 (.9) 5. (1.9) "X" TAB x.3 (.).1 (.951). (.) 1. (.57) Taiwan Tel: +() [email protected] 9.99 (1.9) Material: 1.7 (.5) Thick Aluminum Finish: See Table

3 Index by Part Number Part Number Page G G G G G G G G G 1 1-BRD1-1G 1 1-BRD1-3G 1 1-BRD1-G 1 1-BRD1-5G 1 1-BRD1-7G 1 1-BRD-1G 1 1-CLS1-1G 1 1-CLS-1G 1 1-LLB-3G 1 1-LLB-5G 1 1-LLB-11G 1 1-THMA-1G 1 1-TNT-1G 1 317B-EP11-BGS1G 1 319B-TACHG 17 31B-TACHG 17 37B-CP5G 1 37B-TACHG 1 33B-TACHG 17 33B-TACHG 17 3B-TACHG 17 51B-EP11-BGSG 1 519B-EP11-BGS5G 1 5B-EP-BGS5G 1 5B-EP-BGS5G 1 315BG 7 35BG 7 335BG BG 7 35BG B3G BG B3G BG B3G B3G B3G B3G BG B3G B35G B3G BG B3G B3G BG B3G B3G B3G BG 19 33B3G 17 3B3G 17 3B3G 1 371B3G B3G 1 37B3G 17 37B3G 1 379MG 1 373B3G B3G 1 373M3G M3G 17 37B3G 17 37B35G 1 37B3G 1 371B3G B35G 1 371B3G 1 37B3G 17 37B35G 1 37B3G 1 373B3G B35G 1 373B3G 1 Part Number Page 37B3G 17 37B35G 1 37B3G 1 375B3G B35G 1 375B3G 1 37B3G 17 37B35G 1 37BG 1 377B3G B35G 1 377BG 1 37B3G 17 37B35G 1 37BG 1 379B3G B35G 1 379BG 1 375B3G B35G 1 375BG B3G B35G BG 1 375B3G B35G 1 375B3G 1 513BG 7 53BG 7 533BG 7 53BG 7 51BG 51JG 511BG 3 51BG BG 7 513BG BG 7 513BG 7 517BG 7 51BG 7 519BG 7 5BG 7 51BG 3 5BG BG BG 7 553BG 7 53BG 9 53BG 3 59BG 1 57BG 1 571BG 1 57BG 1 573BG 3 573JG 3 55BG 3 5BG 3 57BG B5G 5 513B5G B5G B5G B5G 5 513B5G B5G B5G BG BG BG BG BG 9 53BG 9 539BG B5G 5 597B5G 5 591B5G 5 59B5G B5G 5 599B5G 5 531B5G 5 53B5G B1G 5 Part Number Page 5311B15G 5 531B1G 5 531B15G B1G 5 531B1G 5 531B1G B15G 55 53B1G 55 53B15G BG 5351UG 5313BG 531BG 5371BG 531B51G 5 531B515G 5 53B51G 5 53B515G 5 531B51G 5 53B51G 5 531B5G V5G B5G V5G B5G V5G B5G V5G 59 53B5G 5 537B5G 5 53B5G B551G B551G B551G B551G B551G B551G B551G B551G B55G B55G B55G B55G B55G B55G B55G B55G B55G B55G B55G B55G B55G B55G B55G B55G B55G B55G 5 53B55G 5 53B53G 37 53B353G 37 55BG 9 55DG 9 551BG 9 5BG 5WG 53BG 33 53DG 33 51BG 51B31G 51B3G 59BG 53 59B31G 53 59BG BG 71 59BG 5731DG 5731D1G 5733DG 5733D1G 573DG 5 573D1G 5 57BG 3 57UG 3 Part Number Page 571BG 5 571B33G 5 57BG 3 57B33G 3 57BG 5 57B3G 5 575BG 5 575B33G 5 57BG 5 57B33G 5 57BG 3 57B33G 3 579BG 5 579B33G 5 575BG DG BG 575BG 5753BG 575BG 5753BG BG BG BG 7 571BG 571BG 5713BG BG BG BG 73 57BG 33 57DG 33 57BG 5 57B31G 5 57BG 5 57VG 5 57V31G 5 57VG 5 57UG 5 57U31G 5 57UG 5 579BG 577BG 3 577BG BG BG 3 577BG 3 577BG BG 577BG 5775BG UG BG 5715BG BG BG BG BG 75 57B3G 5793BG BG VG 9 579BG 7 579VG BG 579BG 579BG 3 579B33G BG B33G 3 579BG 3 579B33G BG B33G 3 51BG 51WG 5BG 5WG 53BG 1 5BG 55BG 5BG 1 511B5G 1 Part Number Page 51B5G B5G 1 511B5G 1 511B5G 1 51B5G 1 5BG 7 5B35G 7 59PBG 3 591B3G 3 593B3G 3 591BG B31G BG BG BG BG B3G 595B3G 9 595U3G 9 599B3G B3G B3G 593B35G 5FG 75 DG 77 UG 77 1BG 3 1PBG 3 BG 7 PBG 7 5DG 3DG 7 3BG 3 3PBG 3 PBG 7PBG 9PBG 3 9PBG 3 19PBG 35 11PBG B5G 19 1PBG 75 PBG 75 3PBG 75 1PBG 3 BG 77 3BG 77 BG 77 5B-MTG 7 3DG 3 3B-MTG 3PB-MTG 3BG 39 3PBG 39 37BG 37PBG 3BG 37 3B-MTG 37 39B-MTG 37 BG 3 37BG 1 3BG 31BG 3BG 39BG 39B-PG 39BG 39B-PG 399BG 399B-PG BG B-PG 7353U11G BG 7 719B-MTG 7 719PBG 7 7BG 7 7B-MTG 7 71BG 71B-MTG 7BG 9 7B-MTG 9 7PBG 9 Part Number Page 7PB-MTG 9 73BG 73B-MTG 75BG 7 75B-MTG 7 73BG 7 793BG 19 71DG 71D/TRG 719DG 5 719D/TRG 5 71DG 3 713DG 713DG DG 7139DG 35 71DG 711DG 3 71DG 3 71DG DG DG B15G 19 9FG BW3-G 5 BW3-G 5 BW5-G 5 BW5-G 5 BW3-G 5 BW3-G 5 MLAAG 5 PF3G 5 PF33G 5 PF3G 5 PF35G 5 PF3G 5 PF53G 73 PF5G 73 PF57G 73 PF7G PF73G PF73G 5 PF73G 5 PF75G PF75G PF75G SW5-G 5 SW5-G 5 SW5-G 59 SW3-G 5 SW3-G 5 SW3-G 59 SW5-G 5 SW5-G 5 SW3-G 5 SW3-G 5 TV15G 3 TV155G 3 TV5G 3 TV35G 31 TVG 5 TVG 39 TVG 31 TV7G 31 TV5G 31 TV9G 53 TV97G 53 YB3-G 1 INDEX USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 3

4 Index by Device Cooled and Thermal Resistance Board Part Number θn Page Board Part Number θn Page Board Part Number θn Page Board Part Number θn Page INDEX AXIAL LEAD UG 15. V 77 DG 15. V 77 BRIDGE RECTIFIERS BG 9. V 77 3BG 9. V 77 BG 9. V 77 DIPS 51BG. H 3 511BG 7. H 3 51JG. H 51BG. H 53BG 39. H 1 5BG 39. H 55BG 3. H 3 5BG 3. H 3 51BG 3. H 51WG 3. H 57BG 7. H 3 BG 5. H 3 5BG. H 5WG. H 5BG. H 5WG. H 55BG. H 5BG. H 1 IC PACKAGES, BGA, PGA, QFP, LCC Bi Directional Air Flow H 19 Solder Anchor H 1 Push Pin H 1 Clip Attachment H 1 Tape Attachment H 1 MULTIWATT YB3-G. V 1 3BG. V 31BG 5. V 39BG 5. V 39B-PG 5. V 37BG 5. V 1 39BG. V 39B-PG. V 3BG. V 399BG 3.3 V 399B-PG 3.3 V BG.7 V B-PG.7 V SIPS 5351UG. V 5351BG. V 73BG 1. V 7 71DG 1. V 7 51BG 11.5 H-V 51B3G 11.5 V 51B31G 11.5 H 5BG 1. V 7 5B35G 1. V 7 3BG. V 31BG 5. V 3BG. V SMT D-PAK TO D1G 5. H 5731DG 5. H D PAK TO D1G 1. H 5733DG 1. H 719D/TRG 9. H 5 719DG 9. H 5 D PAK TO-3 SO-1 71D/TRG 1. H 71DG 1. H D 3 PAK TO- 573D1G 11. H 5 573DG 11. H 5 TO BG 15. H BG 13. H BG 1.5 H VG 1.5 H BG 1. H BG 11. H BG 11. H 7 PF53G 1.1 H BG 1. H BG 1. H BG 9. H 7 PF5G.9 H BG. H 7 513BG 7. H BG 7. H 7 PF57G 7. H BG 7. H BG 7. H 73 53BG 7. H 9 53BG. H 7 573BG. H BG. H BG. H BG. H BG 5. H 7 593BG 5.5 H BG 5. H BG 5.1 H 73 53BG 5. H BG. H BG.7 H 9 53BG.7 H 9 537BG.7 H BG. H 71 TO-5 315BG 3. V 7 35BG 3. V BG. V 7 35BG 57. V 7 335BG 5. V 7 1PBG 5. V 75 5FG 5. V 75 PBG 3. V BG. V BG 3. V 75 3PBG 3. V BG 35. V BG 31. V BG. V 75 TO- 579BG. H 7 579VG. H 7 517BG 1. H 7 51BG 9. H 7 519BG. H 7 5BG. H 7 TO-9 575BG. V 5753BG 5. V 575BG. V 9FG 3.1 V TO-1 PF73G 35. H-V 5 PF73G 35. H-V BG. V UG. V 5 TVG 1. H 5 KEY H = Horizontal mount V = Vertical mount H V = Either horizontal or vertical depending on device leads θn = Natural convection thermal resistance based on a 75 C heat sink temperature rise TO- 579BG 3. H V 57BG. V 3 57UG. V BG 7. H V PBG 5. V 7PBG 5. V 579BG. V 3 579B33G. V BG. V B33G. V 3 577BG. H V 57BG 1. V 3 57B33G 1. V 3 53BG 1. H V 3 531B5G 13. V V5G 13. V 59 SW5-G 13. V B5G 1. V V5G 1. V 59 SW3-G 1. V B5G. V V5G. V V5G 7.5 V B5G 7.5 V 59 TO-1 TV9G. H DG 3.1 V TV97G. H B5G 19. V B5G 1. V 1 511B5G 1. V B5G 13. V B551G 13. V 55 SW5-G 11. V 5 SW5-G 11. V B551G 11. V B5G 11. V 5 SW3-G 1. V 5 SW3-G 1. V B551G 9. V B5G 9. V 5 SW5-G. V 5 SW5-G. V B3G. V YB3-G. V B5G. V B551G. V B5G. V 5 BW3-G 7. V 5 BW3-G 7. V 5 BW3-G 7. V 5 SW3-G 7. V 5 SW3-G 7. V 5 3BG. V 591B3G. V 5311B1G.3 V B15G.3 V 5 531B51G.3 V 5 531B515G.3 V 5 531B1G.3 V B15G.3 V 55 31BG 5. V BW5-G 5. V 5 BW5-G 5. V B55G 5.7 V B55G 5.7 V 57 39BG 5. V 39B-PG 5. V 5971B5G 5.5 V 5 37BG 5. V B55G 5. V B55G 5. V B5G 5. V 5 BW3-G.7 V B5G.5 V B55G.5 V B55G.5 V B1G. V 5 531B51G. V 5 39BG. V 39B-PG. V 3BG. V 5331B55G 3. V B55G 3. V BG 3.3 V 399B-PG 3.3 V BG.7 V B-PG.7 V TO- 9PBG.5 H 3 PF73G 35. V 5 PF73G 35. V 5 717DG 35.7 V 35 9PBG 3.1 V 3 57VG 3. V 5 57UG 3. V 5 57V31G 3. H 5 57U31G 3. H 5 57VG 3. V 5 57UG 3. V 5 577BG 3. H V 3 577BG 3. V 3 TV5G 9.9 H V 31 PF7G.9 V PF73G.9 V 7139DG.3 H 35 57BG 7.3 V 5 57B31G 7.3 H 5 57BG 7.3 V 5 TVG 7.1 H V 31 TV7G 7.1 H V BG. H V B31G. H 51 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

5 Index by Device Cooled and Thermal Resistance Board Part Number θn Page Board Part Number θn Page Board Part Number θn Page Board Part Number θn Page 591BG. V BG. H V BG. V BG. H BG. V 3 579B33G. V BG. V B33G. V BG 5.9 H V BG 5.9 V DG 5. V 39 3BG 5. V 39 3PBG 5. V 39 37BG 5. H 37PBG 5. H 577BG. H V 3 577BG. V 3 573BG. H V 3 573JG. H V 3 55BG. H 9 55DG. H 9 TV9G. H 53 PF75G 3.7 V 571BG 3. H V 57BG 3. H V 5 57B3G 3. H 5 571BG 3. H V 5 571B33G 3. V 5 3PBG 3. V 3 595B3G. V 9 595U3G. V 9 57BG 1. H V 5 57B33G 1. V 5 575BG 1. H V 5 575B33G 1. V 5 11PBG 1. H V BG. H V 7137DG. V 71DG. H 57BG. H V 3 57B33G. V 3 PF75G.3 V 71DG.3 H 3 711DG.3 V BG.3 H V PF3G.3 V 5 PF33G.3 V 5 PF3G.3 H 5 PF35G.3 V 5 PF3G.3 H 5 59BG. V 1 TV97G. H V DG 19.7 V 35 71DG 19. V 3 59BG 1. H-V 53 59B31G 1. H 53 59BG 1. V 53 3BG 1. V 3 599B3G 17.9 V 33 5DG 17.9 V 5B-TTG 17.9 V MLAAG 17.9 H 5 51B5G 17. V 1 PF75G 17.3 V TV155G 17. V 3 19PBG 17. H V BG 1. H V 5793BG 1. V 579BG 1. V 511B5G 1. V 1 531BG 1.7 H V 5313BG 1.7 H V PBG 1.7 V 7 BG 1.7 V 7 57BG 1. V 33 57DG 1. V BG 1. H V 5 579B33G 1. V 5 51BG 15. H V 3 57BG 15. H V 1 571BG 15. H V 1 5B-MTG 15. V 7 TV15G 1. V 3 575BG 13. V DG 13. V 33 3BG 13. H V 37 3B-MTG 13. V 37 39B-MTG 13. V B3G 13. V 33 53B53G 13. V 37 53B353G 13. V B5G 13. V 5 531B5G 13. V V5G 13. V BG 13. V 57B3G 13. V TV5G 13. V 3 59PBG 13. V 3 53BG 13. V 33 53DG 13. V B55G 13. V 5 533B551G 13. V 55 SW5-G 13. V 59 51B5G 1. V 1 1BG 1.5 V 3 1PBG 1.5 V 3 NEED HIGHER PERFORMANCE? Aavid Thermalloy also offers the Max Clip System TM for discrete power semiconductors featuring simple assembly and high reliability. 1PBG 1.5 V 3 3DG 1.5 V 3 551BG 1. H 9 SW5-G 11. V 5 SW5-G 11. V 5 593B3G 11. V 3 719BG 11. V 7 719PBG 11. V 7 719B-MTG 11. V B55G 11. V B5G 11. V B551G 11. V B35G 1. V 5311B5G 1. V V5G 1. V 59 SW3-G 1. V 5 SW3-G 1. V 5 591B3G 1. V 3 3B-MTG 1. V 3PB-MTG 1. V SW3-G 1. V 59 TVG 9.9 H 39 57BG 9. H 1 53B55G 9. V 5 533B551G 9. V B5G 9. V 5 SW5-G. V 5 SW5-G. V 5 7BG.7 V 7 7B-MTG.7 V 7 YB3-G. V 1 3DG.3 V B551G. V B5G. V B5G. V V5G. V V5G 7.5 V B5G 7.5 V 59 TV35G 7. H 31 BW3-G 7. V 5 BW3-G 7. V 5 SW3-G 7. V 5 SW3-G 7. V 5 75BG. V 7 75B-MTG. V 7 71BG. V 71B-MTG. V 3BG. V 7BG.5 V 9 7PBG.5 V 9 7B-MTG.5 V 9 7PB-MTG.5 V 9 5BG. H 3 531B1G.3 V 5 531B15G.3 V 5 53B51G.3 V 5 53B515G.3 V 5 53B1G.3 V 55 53B15G.3 V 55 31BG 5. V BW5-G 5. V 5 BW5-G 5. V B55G 5.7 V B55G 5.7 V 57 /products/maxclip 39BG 5. V 39B-PG 5. V 59BG 5.5 H 53B5G 5.5 V 5 597B5G 5.5 V 5 37BG 5. V 1 533B55G 5. V B55G 5. V B5G. V 5 BW3-G.7 V 5 BW3-G.7 V 5 599B5G.5 V B55G.5 V 57 73BG. V 73B-MTG. V 531B1G. V 5 53B51G. V 5 39BG. V 39B-PG. V 53B5G. V 5 3BG. V 533B55G 3. V B55G 5. V BG 5. V 59B5G 3.7 V 5 399B-PG 3.3 V BG.7 V B-PG.7 V 5335B55G.7 V 57 53B5G. V 5 TO-7 TV9G. H 53 TV97G. H V B5G 13. V B551G 13. V 55 SW5-G 11. V 5 SW5-G 11. V B551G 11. V B5G 11. V 5 SW3-G 1. V 5 SW3-G 1. V B551G 9. V B5G 9. V 5 SW5-G. V 5 SW5-G. V 5 YB3-G. V B551G. V B5G. V B5G. V 5 BW3-G 7. V 5 BW3-G 7. V 5 SW3-G 7. V 5 SW3-G 7. V 5 3BG. V 5311B1G.3 V B15G.3 V 5 531B51G.3 V 5 531B515G.3 V 5 531B1G.3 V B15G.3 V 55 31BG 5. V BW5-G 5. V 5 BW5-G 5. V B55G 5.7 V B55G 5.7 V 57 39BBG 5. V 39B-PG 5. V 5971B5G 5.5 V 5 37BG 5. V B55G 5. V B55G 5. V B5G 5. V 5 BW3-G.7 V 5 BW3-G.7 V B5G.5 V B55G.5 V B55G.5 V 57 39BG. V 39B-PG. V 5311B1G. V 5 531B51G. V 5 3BG. V 5331B55G 3. V B55G 3. V BG 3.3 V 399B-PG 3.3 V BG.7 V B-PG.7 V TO- 57BG 7.3 H V 5 57VG 3. H V 5 57UG 3. H V 5 57B31G 7.3 H 5 57V31G 3. H 5 57U31G 3. H 5 57BG 7.3 V 5 57VG 3. V 5 57UG 3. V 5 591BG. H-V B31G. H BG. V BG. H-V BG. V BG. H 51 PF3G.3 V 5 PF33G.3 V 5 PF3G.3 H 5 PF35G.3 V 5 PF3G.3 H 5 59BG 1. H-V 53 59B31G 1. H 53 59BG 1. V 53 INDEX USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 5

6 Index by Device Cooled, Heat Sink Style, and Thermal Resistance Board Part Number θn Page Board Part Number θn Page Board Part Number θn Page AXIAL LEAD SMT TO-5 INDEX UG 15. V 77 DG 15. V 77 BRIDGE RECTIFIERS BG 9. V 77 3BG 9. V 77 BG 9. V 77 DIPS Extruded Heat Sinks 51BG. H 3 511BG 7. H 3 57BG 7. H 3 D-Pak TO D1G 15. H 5731DG 15. H D Pak TO D1G 1. H 5733DG 1. H 719D/TRG 11. H 5 719DG 11. H 5 D Pak TO-3 SO1 (MO-1) 71D/TRG 15. H 71DG 15. H D 3 Pak TO- 573D1G 1. H 5 573DG 1. H 5 Extruded Collar Heat Sinks 315BG 3. V 7 35BG 3. V BG. V 7 35BG 57. V 7 335BG 5. V 7 Low Cost Push On Heat Sink 5FG 5. V 75 Snap On Cooler Heat Sinks 5715BG. V BG 3. V BG 35. V BG 31. V BG. V 75 BG 5. H 3 55BG. H TO-3 Space Saving Collar Heat Sinks 1PBG 5. V 75 5BG. H 1 Slide On Heat Sinks 51JG. H 51BG. H 53BG 39. H 1 Diamond Shaped Basket Heat Sinks 5753BG 15. H BG 13. H BG 1. H 7 PBG 3. V 75 3PBG 3. V 75 TO- 5BG 39. H Diamond Shaped Basket Heat Sinks 55BG 3. H 3 5BG 3. H 3 51BG 3. H 51WG 3. H KEY H = Horizontal mount 517BG 1. H 7 51BG 9. H 7 519BG. H 7 5BG. H 7 5BG. H 5WG. H V = Vertical mount Space Saving Collar Heat Sinks 579BG. H 7 5BG. H 5WG. H IC PACKAGES, BGA, PGA, QFP, LCC Bi Directional Air Flow H 19 Solder Anchor H 1 H V = Either horizontal or vertical depending on device leads θn = Natural convection thermal resistance based on a 75 C heat sink temperature rise 579VG. H 7 TO-9 Clip On Style Heat Sink 9FG 3.1 V Push Pin H 1 Slip On Style Heat Sinks Clip Attachment H 1 575BG. V Tape Attachment H 1 MULTI-WATT 5753BG 11. H 7 PF53G 1.1 H BG 5. V 575BG. V Extruded Heat Sinks YB3-G. V 1 3BG. V 31BG 5. V 39BG 5. V 39B-PG 5. V 37BG 5. V 1 39BG. V 39B-PG. V 3BG. V 399BG 3.3 V 399B-PG 3.3 V BG.7 V B-PG.7 V SIPS Channel Style Heat Sinks 5351UG. V 5351BG. V Clip On Style Heat Sinks 5BG 1. V 7 5B35G 1. V 7 Extruded Heat Sinks 3BG. V 31BG 5. V 3BG. V Plug In Style Heat Sinks 51BG 11.5 H V 51B3G 11.5 V 51B31G 11.5 H Slide On Style Heat Sinks 73BG 1. V 7 71DG 1. V 7 513BG 1. H BG 9. H 7 PF5G.9 H BG. H 7 513BG 7. H 7 PF57G 7. H 73 Hat Section Heat Sink 53BG 7. H 9 Space Saving Collar Heat Sinks 57913BG 1.5 H VG 1.5 H 9 Square Basket Heat Sinks 5193BG 11. H BG 1. H BG 7. H 7 513BG 7. H BG 7. H 73 53BG. H 7 573BG. H BG. H BG. H BG. H BG 5. H 7 593BG 5.5 H BG 5. H BG 5.1 H 73 53BG 5. H BG. H BG. H 71 Two Piece Heat Sinks 539BG.7 H 9 53BG.7 H 9 537BG.7 H 9 TO-1 Channel Style Heat Sink TVG 1. H 5 Slip On Style Heat Sinks PF73G 35. H-V 5 PF73G 35. H-V BG. V UG. V 5 TO- Channel Style Heat Sinks 579BG 3. H V 5773BG 7. H V 577BG. H V Compact Slide On Heat Sinks PBG 5. V 7PBG 5. V Extruded Heat Sinks 531B5G 13. V V5G 13. V 59 SW5-G 13. V B5G 1. V V5G 1. V 59 SW3-G 1. V B5G. V V5G. V V5G 7.5 V B5G 7.5 V 59 Low Cost Slide On Heat Sinks 57BG. V 3 57UG. V 3 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

7 Index by Device Cooled, Heat Sink Style, and Thermal Resistance Board Part Number θn Page Board Part Number θn Page Board Part Number θn Page TO- CONTINUED Hat Section Heat Sinks TV9G. H 53 53B53G 13. V 3 53B353G 13. V 3 Low Cost Slide On Cooler Heat Sinks TV97G. H V BG 13. V 1 579BG. V 3 High Rise Style Heat Sinks 57B3G 13. V 1 579B33G. V B1G.3 V 5 53BG 13. V BG. V B15G.3 V 5 53DG 13. V B33G. V 3 531B51G.3 V 5 TV5G 13. V 3 57BG 1. V 3 531B515G.3 V 5 59PBG 13. V 3 57B33G 1. V 3 531B1G.3 V 55 1BG 1.5 V 3 Low Profile Hat Section Heat Sink 531B15G.3 V 55 1PBG 1.5 V 3 53BG 1. H V 3 Plug In Style Heat Sink 1PBG 1.5 V 3 Space Saving Staggered Heat Sink 3DG.3 V TO-1 Channel Style Heat Sink 59311B3G. V Dual Extruded Heat Sinks 53371B55G 5.7 V B55G 5. V B55G.5 V B55G 3. V 57 Dual High Rise Style Heat Sinks 5311B1G. V 5 531B51G. V 5 Extruded Heat Sinks 511B5G 19. V B5G 1. V B5G 13. V B551G 13. V B5G 1. V 1 SW5-G 11. V 5 SW5-G 11. V B551G 11. V B5G 11. V 5 SW3-G 1. V 5 SW3-G 1. V B551G 9. V B5G 9. V 5 SW5-G. V 5 SW5-G. V 5 YB3-G. V B551G. V B5G. V B5G. V 5 BW3-G 7. V 5 BW3-G 7. V 5 BW3-G 7. V 5 SW3-G 7. V 5 SW3-G 7. V 5 3BG. V BW5-G 5. V 5 BW5-G 5. V 5 31BG 5. V 53371B55G 5.7 V 57 39BG 5. V 39B-PG 5. V 5971B5G 5.5 V B55G 5. V B5G 5. V 5 BW3-G.7 V B5G.5 V B55G.5 V 57 39BG. V 39B-PG. V 3BG. V 5331B55G 3. V BG 3.3 V 399B-PG 3.3 V BG.7 V B-PG.7 V 37BG 5. V 1 591B3G. V Slide On Heat Sink 713DG 3.1 V TO- Channel Style Heat Sinks 717DG 35.7 V BG 3. V BG 3. H-V 35 TV5G 9.9 H-V DG.3 H 35 NEED HIGHER PERFORMANCE? Aavid Thermalloy also offers the Max Clip System TM for discrete power semiconductors featuring simple assembly and high reliability. /products/maxclip TVG 7.1 H V 31 TV7G 7.1 H V BG 5.9 H-V BG 5.9 V DG 5. V 39 3BG 5. V 39 3PBG 5. V BG. H-V BG. V BG. H-V JG. H-V BG 3. H-V 1 11PBG 1. H-V BG. H-V 1 71DG.3 H 3 711DG.3 V BG.3 H-V 1 713DG 19.7 V 35 71DG 19. V 3 3BG 1. V 3 599B3G 17.9 V 33 19PBG 17. H-V 35 TV155G 17. V 3 531BG 1.7 H-V BG 1.7 H-V 1 57BG 1. V 3 57DG 1. V 3 51BG 15. H V 39 TV15G 1. V 3 575BG 13. V 3 575DG 13. V 3 3BG 13. H V 37 3B-MTG 13. V 37 39B-MTG 13. V B3G 13. V 33 3DG 1.5 V 3 551BG 1. H 3 593B3G 11. V 3 719BG 11. V 7 719PBG 11. V 7 719B-MTG 11. V 7 591B3G 1. V 3 TVG 9.9 H 39 7BG.7 V 7 7B-MTG.7 V 7 TV35G 7. H 31 75BG. V 7 75B-MTG. V 7 71BG. V 71B-MTG. V 7BG.5 V 9 7PBG.5 V 9 7B-MTG.5 V 9 7PB-MTG.5 V 9 5BG. H 39 73BG. V 73B-MTG. V Clip On Style Heat Sinks 9PBG.5 H 3 9PBG 3.1 V 3 579BG. V 579B33G. V 5799BG. V 5799B33G. V 3PBG 3. V 3 57BG. H V 57B33G. V Dual Extruded Heat Sinks 3BG. V 31BG 5. V 5337B55G 5.7 V B55G 5. V 57 37BG 5. V 1 3BG. V 533B55G 3. V B55G.7 V 57 Dual High Rise Style Heat Sinks 531B1G. V 5 53B51G. V 5 Extruded Heat Sinks MLAAG 17.9 H 5 51B5G 17. V 1 511B5G 1. V 1 513B5G 13. V 5 531B5G 13. V V5G 13. V B55G 13. V 5 533B551G 13. V 55 SW5-G 13. V 59 51B5G 1. V 1 SW5-G 11. V 5 SW5-G 11. V B55G 11. V B551G 11. V B5G 11. V B5G 1. V V5G 1. V 59 INDEX USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 7

8 Index by Device Cooled, Heat Sink Style, and Thermal Resistance Board Part Number θn Page Board Part Number θn Page Board Part Number θn Page INDEX TO- CONTINUED SW3-G 1. V 5 SW3-G 1. V 5 SW3-G 1. V 59 53B55G 9. V 5 533B551G 9. V B5G 9. V 5 SW5-G. V 5 SW5-G. V 5 YB3-G. V B551G. V 55 53B5G. V B5G. V B5G. V V5G. V V5G 7.5 V B5G 7.5 V 59 BW3-G 7. V 5 BW3-G 7. V 5 SW3-G 7. V 5 SW3-G 7. V 5 BW5-G 5. V 5 BW5-G 5. V B55G 5.7 V 57 39BG 5. V 39B-PG 5. V 53B5G 5.5 V 5 597B5G 5.5 V 5 533B55G 5. V B5G. V 5 BW3-G.7 V 5 BW3-G.7 V 5 599B5G.5 V B55G.5 V 57 39BG. V 39B-PG. V 53B5G. V 5 533B55G 3. V 57 59B5G 3.7 V 5 399BG 3.3 V 399B-PG 3.3 V BG.7 V B-PG.7 V Hat Section Heat Sinks 37BG 5. H 37PBG 5. H TV9G. H DG. V 71DG. H 59BG. V TV97G. H V 53 57BG 15. H V 571BG 15. H V 57BG 9. H High Rise Style Heat Sinks 531B1G.3 V 5 531B15G.3 V 5 53B51G.3 V 5 53B515G.3 V 5 53B1G.3 V 55 53B15G.3 V 55 Plug In Style Heat Sinks 57BG 7.3 V 5 57VG 3. V 5 57UG 3. V 5 57B31G 7.3 H 5 57V31G 3. H 5 57U31G 3. H 5 57BG 7.3 V 5 57VG 3. V 5 57UG 3. V 5 591BG. H-V B31G. H BG. V BG. H-V BG. V BG. H 51 PF3G.3 V 5 PF33G.3 V 5 PF3G.3 H 5 PF35G.3 V 5 PF3G.3 H 5 59BG 1. H-V 53 59B31G 1. H 53 59BG 1. V 53 Slide On Heat Sinks PF73G 35. V 5 PF73G 35. V 5 PF7G.9 V PF73G.9 V PF75G 3.7 V 57BG 3. H-V 5 57B3G 3. H 5 571BG 3. H V 5 571B33G 3. V 5 57BG 1. H-V 5 57B33G 1. V 5 575BG 1. H-V 5 575B33G 1. V 5 PF75G.3 V PF75G 17.3 V 579BG 1. H-V 5 579B33G 1. V 5 Snap Down Style Heat Sinks 5751BG 1. H V 5793BG 1. V 579BG 1. V Space Saving Heat Sinks 55BG. H 9 55DG. H 9 595B3G. V 9 595U3G. V 9 5DG 17.9 V PBG 1.7 V 7 BG 1.7 V 7 5B-MTG 15. V 7 593B35G 1. V 3B-MTG 1. V 3PB-MTG 1. V 3DG.3 V 7 Square Basket Heat Sink 59BG 5.5 H TO-7 KEY H = Horizontal mount V = Vertical mount H V = Either horizontal or vertical depending on device leads θn = Natural convection thermal resistance based on a 75 C heat sink temperature rise Dual Extruded Heat Sinks 53371B55G 5.7 V B55G 5. V B55G.5 V B55G 3. V 57 Dual High Rise Style Heat Sinks 5311B1G. V 5 531B51G. V 5 Extruded Heat Sinks 5131B5G 13. V B551G 13. V 55 SW5-G 11. V 5 SW5-G 11. V B551G 11. V B5G 11. V 5 SW3-G 1. V 5 SW3-G 1. V B551G 9. V B5G 9. V 5 SW5-G. V 5 SW5-G. V 5 YB3-G. V B551G. V B5G. V B5G. V 5 BW3-G 7. V 5 BW3-G 7. V 5 SW3-G 7. V 5 SW3-G 7. V 5 3BG. V BW5-G 5. V 5 BW5-G 5. V 5 31BG 5. V 53371B55G 5.7 V 57 39BG 5. V 39B-PG 5. V 5971B5G 5.5 V B55G 5. V 57 37BG 5. V 1 591B5G 5. V 5 BW3-G.7 V 5 BW3-G.7 V B5G.5 V B55G.5 V 57 39BG. V 39B-PG. V 3BG. V 5331B55G 3. V BG 3.3 V 399B-PG 3.3 V BG.7 V B-PG.7 V Hat Section Heat Sinks TV9G. H 53 TV97G. H V 53 High Rise Style Heat Sinks 5311B1G.3 V B15G.3 V 5 531B51G.3 V 5 531B515G.3 V 5 531B1G.3 V B15G.3 V 55 TO- Plug In Style Heat Sinks 57BG 7.3 H V 5 57VG 3. H V 5 57UG 3. H V 5 57B31G 7.3 H 5 57V31G 3. H 5 57U31G 3. H 5 57BG 7.3 V 5 57VG 3. V 5 57UG 3. V 5 591BG. H-V B31G. H BG. V BG. H-V BG. V BG. H 51 59BG 1. H-V 53 59B31G 1. H 53 59BG 1. V 53 PF3G.3 V 5 PF33G.3 V 5 PF3G.3 H 5 PF35G.3 V 5 PF3G.3 H 5 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

9 How To Select a Heat Sink How to select a heat sink The basic equation for heat transfer or power dissipation may be stated as follows: P D = Δ T ΣR θ Where: P D = the power dissipated by the semiconductor device in watts. ΔT = the temperature difference of driving potential which causes the flow of heat. ΣR θ = the sum of the thermal resistances of the heat flow path across which ΔT exists. The above relationship may be stated in the following forms: T J T A T C T A P D = P D = R θjc + R θcs + R θsa R θcs + R θsa Where: T J = the junction temperature in C (maximum is usually stated by the manufacturer of the semiconductor device). T C = case temperature of the semiconductor device in C. T S = temperature of the heat sink mounting surface in thermal contact with the semiconductor device in C. T A = ambient air temperature in C. R θjc = thermal resistance from junction to case of the semiconductor device in C per watt (usually stated by manufacturer of semiconductor device). R θcs = thermal resistance through the interface between the semiconductor device and the surface on which it is mounted in C per watt. R θsa = thermal resistance from mounting surface to ambient or thermal resistance of heat sink in C per watt. P D = T S T A R θsa HOW TO SELECT A HEAT SINK The above equations are generally used to determine the required thermal resistance of the heat sink (R θsa ), since the heat dissipation, maximum junction and/or case temperature, and ambient temperature are known or set. Figure 1 indicates the location of the various heat flow paths, temperatures and thermal resistances. The common practice is to represent the system with a network of resistances in series as shown in Figure. FIGURE 1 FIGURE surface (cooler/dissipator) Interface Atmosphere or ambient Junction (heat source) T A T J T C T S T A P D P D Semiconductor case R θjc R θcs R θsa R θcs R θsa Heat flow path mounting surface to ambient, equation (3) R θjc T J T C T S Heat flow path case to ambient equation () Heat flow path junction to ambient, equation (1) T A USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 9

10 How To Select a Heat Sink Example A Example B HOW TO SELECT A HEAT SINK Find a space saving heat sink to keep a TO- device below the maximum 15 C junction temperature in natural convection. Device will be screw mounted with an electrically conductive interface. Given: P D = watts R θjc = 3 C/W (from semiconductor manufacturer) T J max = 15 C (from semiconductor manufacturer) T A max = 5 C A Kondux TM pad is a good choice for electrically conductive applications. Thermal resistance for Kondux TM can be determined from the following graph. R (ºC/W) CS Typical TO- Performance Screw Torque (in-lb) Find a heat sink to keep a TO- device below the maximum 15 C junction temperature in forced convection at ft/min. Device must be electrically insulated and mounted with a labor saving clip. Given: P D = 1 watts R θjc =.5 C/W (from semiconductor manufacturer) T J max = 1 C (from semiconductor manufacturer) T A max = 5 C A Hi-Flow pad works great with clip mounting and provides the necessary electrical insulation. Thermal resistance for Hi-Flow at low pressure is 1.15 C/W (from page 7). Using equation 1, solve for R θsa R θsa = ( ) = 3.5 C/W 1 Many styles are available. If board space is a concern, 533B551G (pg 55) meets the requirements. At in-lb of torque the thermal resistance is approximately R θcs =.5 C/W Using equation 1, solve for R θsa R θsa = ( 3 +.5) = 1.7 C/W The Index by Heat Sink Style on page lists space saving heat sinks. Several models are in the 1 C/W range. Choose the one that best fits the application and verify thermal resistance from graph. Part number 593B35G shows a C temperature rise at watts X 5333X According to the above graph, an airflow of ft/min results in a thermal resistance of 3 C/W. This is less than the required thermal resistance of 3.5 C/W and is therefore acceptable under these airflow conditions. If height is a concern, 5337B55G would meet the requirements and is only 1. tall Hi-Flow is a trademark of the Bergquist Company R θsa = = 1. C/W Which meets the above requirement in natural convection. 1 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

11 Reading a Thermal Performance Graph The performance graphs you will see in this catalog (see graph 579) are actually a composite of two separate graphs which have been combined to save space. The small arrows on each curve indicate to which axis the curve corresponds. Thermal graphs are published assuming the device to be cooled is properly mounted and the heat sink is in its recommended mounting position. 1 GRAPH A GRAPH B CONVERTING VOLUME TO VELOCITY Although most fans are normally rated and compared at their free air delivery at zero back pressure, this is rarely the case in most applications. For accuracy, the volume of output must be derated % % for the anticipation of back pressure. EXAMPLE: The output air volume of a fan is given as CFM. The output area is inches by inches or 3 in or 5 ft. To find velocity: Velocity (LFM) = Volume (CFM) area (ft ) Velocity =.5 = 3 Velocity is 3 LFM, which at %, derates to 5 LFM. READING A THERMAL PERFORMANCE GRAPH GRAPH A is used to show heat sink performance when used in a natural convection environment (i.e. without forced air). This graph starts in the lower left hand corner with the horizontal axis representing the heat dissipation (watts) and the vertical left hand axis representing the rise in heat sink mounting surface temperature above ambient ( C). By knowing the power to be dissipated, the temperature rise of the mounting surface can be predicted. Thermal resistance in natural convection is determined by dividing this temperature rise by the power input ( C/W). EXAMPLE A: Aavid Thermalloy part number 579 is to be used to dissipate 3 watts of power in natural convection. Because we are dealing with natural convection, we refer to graph A. Knowing that 3 watts are to be dissipated, follow the grid line to the curve and find that at 3 watts there is a temperature rise of 75 C. To get the thermal resistance, divide the temperature rise by the power dissipated, which yields 5 C/W. GRAPH B is used to show heat sink performance when used in a forced convection environment (i.e. with forced air flow through the heat sink). This graph has its origin in the top right hand corner with the horizontal axis representing air velocity over the heat sink LFM* and the vertical axis representing the thermal resistance of the heat sink ( C/W). Air velocity is calculated by dividing the output volumetric flow rate of the fan by the cross-sectional area of the outflow air passage. Velocity (LFM)* = Volume (CFM)** area (ft ) EXAMPLE B: For the same application we add a fan which blows air over the heat sink at a velocity of LFM. The addition of a fan indicates the use of forced convection and therefore we refer to graph B. This resistance of 9.5 C/W is then multiplied by the power to be dissipated, 3 watts. This yields a temperature rise of.5 C. DESIGN ASSISTANCE Aavid Thermalloy can assist in the design of heat sinks for both forced and natural convection applications. Contact us for help with your next thermal challenge. For more information, visit our web site at: * Linear feet per minute ** Cubic feet per minute USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 11

12 BGA Solder Anchor Solder anchor attachment HEAT SINKS FOR IC PACKAGES Aavid's unique Solder anchor attachment method uses two or four small Solder anchors attached to the circuit card and a wire spring clip to securely fasten the heat sink to the device. This method is rugged, compact and allows for easy removal in case of rework. All products include a phase change pad suitable for most IC package styles to optimize thermal performance. Models are available with a single or dual spring clips for additional thermal interface pressure. Solder anchors are ordered separately. IC Pkg Size (mm) IC Pkg Style Part Number W (mm) L (mm) H (mm) A (mm) θn 1 θf Finish Fig. PCB Fig. #Anchors 3 3 x 3 All 37B3G Black anodize 1 A 3 x 3 All 371B3G Black anodize 1 A 3 x 3 All 37B3G Black anodize 1 A 7 x 7 All 373B3G Black anodize 1 A 7 x 7 All 37B3G Black anodize 1 A 7 x 7 All 375B3G Black anodize 1 A 35 x 35 Flip chip G Black anodize C 35 x 35 Flip chip 1-THMA-1G Black anodize C 35 x 35 All 37BG Black anodize 1 B 35 x 35 All 377BG Black anodize 1 B 35 x 35 All 37BG Black anodize 1 B 37.5 x 37.5 Flip chip 1-BRD-1G Clear anodize B 37.5 x 37.5 Flip chip 1-BRD1-1G Black anodize B 37.5 x 37.5 Flip chip 1-BRD1-3G Black anodize 3 D 37.5 x 37.5 Flip chip 1-BRD1-G Black anodize B 37.5 x 37.5 Flip chip 1-BRD1-5G Clear anodize 3 D 37.5 x 37.5 Flip chip 1-BRD1-7G Clear anodize B x All 379BG Black anodize 1 B x All 375BG Black anodize 1 B x All 3751BG Black anodize 1 B.5 x.5 Flip chip 1-CLS1-1G Black anodize E.5 x.5 Flip chip 1-CLS-1G Black anodize E SOLDER ANCHOR Part Number PCB Thickness (mm) A Dim (mm) 157DG DG (.3).9 (.9) 5. (.) 7. (.3). (.5) 1. Natural convection thermal resistance based on a 75º C heat sink temperature rise.. Force convection thermal resistance based on an entering 1. m/s (LFM) airflow. 3. Solder anchors are sold separately refer to drawing above.. Solder anchor mechanical drawings and board mounting drawings see page USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

13 BGA Solder Anchor Solder anchor heat sinks mechanical drawings FIGURE 1 FIGURE 1.7 (.5) "H" FIGURE 3 "W" "L" 5.7 (.155) "W" "L" "H" 1.7 (.5) HEAT SINKS FOR IC PACKAGES 5. "W" (1.) 15. (.591) 15. (.591) "H" "L" Board mounting pattern information for solder anchor heat sinks FIGURE A 35.5 (1.) FIGURE B. (1.9) ø.97 ±.3 (.3 ±.1) PLATED THROUGH HOLES X.7 (1.5) 53.3 (.1) Ø.97.3 (.3.1) PLATED THROUGH HOLES X. (.) 33. (1.3) 17.7 (.7) 5. (.) X.13 (.95) 5. (.) x FIGURE C FIGURE D FIGURE E Ø.97.3 (.3.1) PLATED THROUGH HOLES X 5.7 (1.) 5. (.3). (1.9) X Ø.97 ±.3 (.3 ±.1) PLATED THROUGH HOLES X.13 (.95) Ø.97.3 (.3.1) PLATED THROUGH HOLES X 55. (.). (.). (.9) 9.1 (1.15) 5. (.)X 33. (1.3). (.) X 5. (.) X 7.9 (1.1) 33. (1.3) 5. (.) X USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 13

14 BGA Push Pin Attachment Push pin attachment HEAT SINKS FOR IC PACKAGES Push pin heat sinks require two 3.1mm holes in the circuit card to quickly attach the heat sink over the device. The one piece design makes assembly a snap. Pressure is maintained by the tension of the push pin coil springs to ensure even pressure across the device. Push pins provide a greater margin of reliability in applications where gravity or vibration may cause tapes or adhesives to fail. The addition of a phase change pad optimizes thermal performance. IC Pkg. Size (mm) Part Number W (mm) L (mm) H (mm) S (mm) T (mm) θn θf 3 Finish Fig. PCB Fig. 1 Pin Style Pad x 1-3-7G Black anodize 1 A Plastic Yes x 1-3-G Black anodize 1 A Brass Yes x G Black anodize A Plastic No 35 x 35 1-TNT-1G Black anodize 3 D Plastic No 37.5 x G Green anodize 5 B Plastic No 37.5 x G Gold anodize 5 B Plastic Yes 37.5 x G Gold anodize 5 B Brass Yes 37.5 x G Black anodize 5 B Plastic Yes 37.5 x G Black anodize 5 B Brass Yes 37.5 x MG Green anodize 5 B Plastic No 5 x 5 1-LLB-3G Black anodize C Plastic Yes 5 x 5 1-LLB-5G Black anodize C Brass Yes 5 x 5 1-LLB-11G Black anodize C Plastic No 1. Push pin mechanical drawings and board mounting drawings see page 15. Natural convection thermal resistance based on a 75 C heat sink temperature rise. 3. Forced convection thermal resistance based on an entering 1. m/s (LFM) airflow. 1 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

15 BGA Push Pin Attachment Mechanical drawings FIGURE 1 FIGURE FIGURE 3 "S" "W" FIGURE "T" "L" "S" "H" "T". (1.35) "L" "H" "W" "H" FIGURE 5 "S" "L" "T" "T" 1.7 (1.) "W" 1.5 (1.3) "H" HEAT SINKS FOR IC PACKAGES "L". (.7) "T" "L" "W" 1.9 (.1) "W" "H" Board mounting pattern information FIGURE A FIGURE B 3.95 (1.97) 1. (.9) 3.95 (1.97). (1.3) REF Ø (.1.1) THROUGH HOLES 1. (UNPLATED) X (.9).7 (.) 59. (.3) REF 1.7 (1.3) ø3.1 ±.3 (.1 ±.1) THROUGH HOLES (UNPLATED) X 1.7 (1.3).7 (.) FIGURE C FIGURE D. (.7) Ø 3.1 ±.3 ( Ø.1 ±.1) THROUGH HOLES (UNPLATED) X Ø 3.1 ±.3 (Ø.1 ±.1) THROUGH HOLES (UNPLA TED) X 1.5 (1.3) 1.1 (.39) 5. (.) 5. (1.).75 (.17) 1.7 (1.).5 (.1) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 15

16 BGA Tape Attachment Heat sinks for plastic BGA packages HEAT SINKS FOR IC PACKAGES Pressure sensitive, thermally conductive adhesive tape easily and reliably bonds a heat sink to an integrated circuit package. Tapes provide high thermal conductivity and exceptional bonding properties. Adhesives are formulated for plastic and metal/ceramic packages. "L" "W" "H" Material: Aluminum IC Pkg. Size (mm) IC Pkg. Style Part Number W (mm) L (mm) H (mm) θn θf 3 Finish Tape code 1 1 x 1 Plastic 3753B35G Black anodize x 15 Plastic 375B3G Black anodize 3 3 x 3 Plastic 37B35G Black anodize 35 3 x 3 Plastic 371B35G Black anodize 35 3 x 3 Plastic 37B35G Black anodize 35 5 x 5 Plastic 335B3G Black anodize 3 7 x 7 Plastic 373B35G Black anodize 35 7 x 7 Plastic 37B35G Black anodize 35 7 x 7 Plastic 375B35G Black anodize 35 x Plastic 373B3G Black anodize 3 x Plastic 37B-CP5G Black anodize 3 31 x 31 Plastic 335B3G Black anodize 3 35 x 35 Plastic 371B3G Black anodize 3 35 x 35 Plastic 37B35G Black anodize x 35 Plastic 377B35G Black anodize x 35 Plastic 37B35G Black anodize x 35 Plastic 37B3G Black anodize 3 x Plastic 379B35G Black anodize 35 x Plastic 3B3G Black anodize 3 x Plastic 375B35G Black anodize 35 x Plastic 3751B35G Black anodize For tape specifications see page. Natural convection thermal resistance based on a 75 C heat sink temperature rise. 3. Forced convection thermal resistance based on an entering 1. m/s (LFM) airflow. 1 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

17 BGA Tape Attachment Heat sinks for metal/ceramic BGA packages "L" "W" "H" HEAT SINKS FOR IC PACKAGES Material: Aluminum IC Pkg. Size (mm) IC Pkg. Style Part Number W (mm) L (mm) H (mm) θn θf 3 Finish Tape Code 1 1 x 1 Metal / Ceramic 375B3G Black anodize 3 3 x 3 Metal / Ceramic 37B3G Black anodize 3 3 x 3 Metal / Ceramic 371B3G Black anodize 3 3 x 3 Metal / Ceramic 37B3G Black anodize 3 5 x 5 Metal / Ceramic 335B3G Black anodize 3 7 x 7 Metal / Ceramic 3353B3G Black anodize 3 7 x 7 Metal / Ceramic 373B3G Black anodize 3 7 x 7 Metal / Ceramic 37B3G Black anodize 3 7 x 7 Metal / Ceramic 375B3G Black anodize 3 x Metal / Ceramic 373B3G Black anodize 3 x Metal / Ceramic 373M3G Green anodize 3 x Metal / Ceramic 37B-TACHG Black anodize 3 31 x 31 Metal / Ceramic 3357B3G Black anodize 3 31 x 31 Metal / Ceramic 335B3G Black anodize x 3.5 Metal / Ceramic 33B-TACHG Black anodize 3 35 x 35 Metal / Ceramic 371B3G Black anodize 3 35 x 35 Metal / Ceramic 37B3G Black anodize 3 35 x 35 Metal / Ceramic 377B3G Black anodize 3 35 x 35 Metal / Ceramic 37B3G Black anodize 3 35 x 35 Metal / Ceramic 37B3G Black anodize x 37.5 Metal / Ceramic 3733M3G Green anodize x 37.5 Metal / Ceramic 319B-TACHG Black anodize x 37.5 Metal / Ceramic 33B3G Black anodize 3 x Metal / Ceramic 379B3G Black anodize 3 x Metal / Ceramic 3B3G Black anodize 3 x Metal / Ceramic 375B3G Black anodize 3 x Metal / Ceramic 3751B3G Black anodize 3.5 x.5 Metal / Ceramic 31B-TACHG Black anodize 3.5 x.5 Metal / Ceramic 33B-TACHG Black anodize 3 5 x 5 Metal / Ceramic 3B-TACHG Black anodize Metal / Ceramic 333B-TACHG Black anodize 3 1. For tape specifications see page. Natural convection thermal resistance based on a 75 C heat sink temperature rise. 3. Forced convection thermal resistance based on an entering 1. m/s (LFM) airflow. USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 17

18 BGA Clip Attachment Clip attachment HEAT SINKS FOR IC PACKAGES Aavid's BGS Clip heat sinks provide a mechanical attachment alternative to tape applications where it is desirable to attach the heat sink directly to the device. The unique clip uses spring pressure to ensure even contact across the device while the end plates firmly engage the edge of the package, locking the heat sink in place. Each heat sink uses pre-applied thermal grease for optimum thermal performance. "L" "W" "H" Material: Aluminum IC Pkg. Size (mm) Part Number W (mm) L (mm) H (mm) IC Pkg. Style θn 1 θf Interface Clip 7 x 7 317B-EP11-BGS1G All EP11 BGS1 35 x 35 51B-EP11-BGSG All EP11 BGS.5 x.5 519B-EP11-BGS5G All EP11 BGS5.5 x.5 5B-EP-BGS5G All EP BGS5.5 x.5 5B-EP-BGS5G All.1.9 EP BGS5 1. Natural convection thermal resistance based on a 75 C heat sink temperature rise.. Forced convection thermal resistance based on an entering 1. m/s (LFM) airflow. THERMALCOTE TM GREASE "E" PULL TAB "D" TAPE TYPE AND INTERFACE MATERIAL INFORMATION Material Description Adhesive Thermal Resistance Color Carrier D Dim E Dim EP11 Thermalcote TM grease with release liner None.1 White None 13.3 (.55) 13.3 (.55) EP Thermalcote TM grease with release liner None.3 White None (1.5) (1.5) For more information on Thermalcote TM see page USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

19 BGA Bi Directional Bi Directional Designed for applications with airflow traveling in a single direction, these heat sinks are suitable for a variety of standard square IC packages. Models are available with pre-applied thermal tape for easy attachment to the IC. attach models are also available. "L" "W" "H" Material: Aluminum HEAT SINKS FOR IC PACKAGES IC Pkg Size IC Pkg Style Part Number W (mm) L (mm) H (mm) θn 3 θf Finish Attachment Tape Code 1 X 1 All 1553B5G Black anodize 1 N/A 1 X 1 All 793BG Black anodize 1 N/A X Metal 33511B3G Black anodize Tape 3 5 X 5 Metal 3351B3G Black anodize Tape 3 5 X 5 Metal 33511B3G Black anodize Tape 3 5 X 5 All 3351BG Black anodize 1 N/A 5 X 5 All 33511BG Black anodize 1 N/A 5 X 5 Plastic 3351B3G Black anodize Tape 3 7 X 7 Plastic 33531B35G Black anodize Tape 35 7 X 7 Metal 33531B3G Black anodize Tape 3 7 X 7 All 33531BG Black anodize 1 N/A X All 7353U11G Unfinished 1 N/A 3 X 3 All 3351BG Black anodize 1 N/A 3 X 3 All 33571BG Black anodize 1 N/A 3 X 3 Metal 3351B3G Black anodize Tape 3 3 X 3 Metal 33571B3G Black anodize Tape X 37.5 All 7993B15G Black anodize 1 N/A 37.5 X 37.5 All 3331BG Black anodize 1 N/A 1. ordered separately for information on see page 11,115.. For tape specifications see page. 3. Natural convection thermal resistance based on a 75 C heat sink temperature rise.. Forced convection thermal resistance based on an entering 1. m/s (LFM) airflow. USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 19

20 DIPS THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 51 Slide on heat sink with staggered fins Slide on heat sink with staggered fins attaches to pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. Available in two finishes. Part Number Finish 51BG Black anodize 51WG Black anodize with black paint on bottom side 51 Angle fin heat sink Angle fin heat sink is a simple low cost solution for cooling DIP devices. Suitable for 1 and 1 pin packages and available in two finish options. Easily attaches using thermal epoxy (.5) 1.5 (.15) 15.3 (.) REF LOCKING CATCH 11.3 (.5) 19.5 (.75) 15. (.).35 (.5) 5.33 (.1) Material:.3 (.5) Thick Aluminum Finish: See Table page11 Part Number Finish 51JG Pre black anodize* 51BG Black anodize * Edges cut during the manufacturing process will be unfinished. See page 11 for more information..35 (.5) 5.39 (.1) Material: 1.7 (.5) Thick Aluminum Finish: See Table 5, 5 Slide on heat sink with angled fins Slide on heat sink with angled fins attaches to 1 and 1 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. Available in two finishes (.1).1 (.9) 1.3 (.) LOCKING CATCH 5. (.) 15. (.) Part Number Device Pkg Style Finish A Dim 5BG Ceramic Black anodize 7.7 (.31) 5WG Ceramic Black anodize with black paint on bottom side 7.7 (.31) Material:.3 (.5) Thick Aluminum Finish: See Table 5BG Plastic Black anodize.35 (.5) 5WG Plastic Black anodize with black paint on bottom side.35 (.5) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

21 DIPS 5 Slide on heat sink with staggered fins Slide on heat sink with staggered fins attaches to pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. Part Number 5BG Description Slide on heat sink with staggered fins LOCKING CATCH.7 (1.) 37.7 (1.75) 5. (1.) 1.7 (.5) 13.7 (.5) 1. (.55) Material:.1 (.3) Thick Aluminum THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 53 Slide on heat sink with staggered fins Slide on heat sink with staggered fins attaches to 1 pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces (1.15) 3. (.93) LOCKING CATCH 5.33 (.1) 17.7 (.7).35 (.5) 1.1 (.55) Part Number Description 53BG Slide on heat sink with staggered fins Material:.3 (.5) Thick Aluminum USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 1

22 DIPS 5 Slide on heat sink with staggered fins THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Slide on heat sink with staggered fins attaches to pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. Part Number Description 5BG Slide on heat sink with staggered fins (1.15). (1.55) LOCKING CATCH 5.33 (.1) 17.7 (.7).35 (.5) 1.1 (.55) Material:.3 (.5) Thick Aluminum 55 Slide on heat sink with staggered fins Slide on heat sink with staggered fins attaches to pin DIP packages quickly and easily. The heat sink features double spring action and locking catch to firmly attach the device creating a thermal conduction path on both the top and bottom surfaces. Part Number Description 55BG Slide on heat sink with staggered fins LOCKING CATCH 37. (1.) 3.51 (1.) 5. (1.) 1.19 (.) 13.7 (.5) 1.73 (.5) Material:.1 (.3) Thick Aluminum USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

23 DIPS 55, 5, 57 Extruded epoxy attach on heat sink with straight fins Extruded epoxy attach on heat sink with straight fins attaches to,, and pin DIP packages quickly and easily. May be added before or after final board assembly. No additional board space is required. Part Number DIP Package A Dim 55BG pin (1.5) 5BG pin 3.3 (1.5) 57BG pin 5. (.) For epoxy information see pages Extruded epoxy attach heat sink Extruded epoxy attach heat sink which requires no additional board space is suitable for narrow DIP packages. May be added before or after final board assembly. No additional board space is required Attaches to pin DIP. 13. (.53) Part Number BG For epoxy information see pages Description Extruded epoxy attach heat sink for pin DIP 511, 51 Extruded epoxy attach heat sink with straight fins page11 page11 1. (.75) REF page11.3 (.19) 13. (.53) Material: Aluminum 3.3 REF (1.5) Material: Aluminum THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES FIGURE A FIGURE B.35 REF (.5).3 (.19) 19.5 (.75). REF (.19) 1.57 (.73).35 (.5) Extruded epoxy attach heat sink with straight fins attaches to 1 and 1 pin DIP packages quickly and easily. May be added before or after final board assembly. No additional board space is required. Available in two fin directions. Part Number Description Figure 511BG Extruded epoxy attach heat sink with straight fins A 51BG Extruded epoxy attach heat sink with straight fins B For epoxy information see pages Material: Aluminum USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 3

24 SMT THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5731 Surface mount heat sink for D-PAK (TO-5) package semiconductors Surface mount heat sink for D-PAK (TO-5) package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. Part Number Packaging 5731D1G 13" Reel, 5 per reel 5731DG Bulk, 5 per bag See page 5 for tape and reel information Part Number Packaging 5733D1G 13" Reel, 5 per reel 5733DG Bulk, 5 per bag Case Temp Rise Surface mount heat sink for D PAK (TO-3) package semiconductors Surface mount heat sink for D PAK (TO-3) package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. See page 5 for tape and reel information Case Temp Rise (.5) 1.1 (.). (.315) 1.1 (.) 1.3 (.5) 1.3 (.5).1 (1.3) 1.7 (.5). (.9) 1.1 (.1).13 (.3) Material:.3 (.5) Thick Copper Finish: Tin Plated Refer to Figure A and B on page for board footprint information 7.37 (.9) Material:.3 (.5) Thick Copper Finish: Tin Plated Refer to Figure A and B on page for board footprint information 71 Surface mount heat sink for D PAK (TO-3), power SO-1 (MO-1) and SO-1 package semiconductors Surface mount heat sink for D PAK (TO-3), power SO-1 (MO-1) and SO-1 package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. Part Number Packaging 71D/TRG 13" Reel, per reel 71DG Bulk, 5 per bag See page 5 for tape and reel information (.59) 7. (.3) 5.91 (1.) 1.1 (.) 9.5 (.375) Refer to Figure C on page for board footprint information 5.33 (.1) (.3) (.59) Material:.3 (.5) Thick Copper Finish: Tin Plated USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

25 SMT 719 Surface mount heat sink for D PAK (TO-3) package semiconductors Surface mount heat sink for D PAK (TO-3) package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. Part Number Packaging 719D/TRG 13" Reel, 15 per reel 719DG Bulk, 5 per bag See below for tape and reel information Surface mount heat sink for D 3 PAK (TO-) package semiconductors Surface mount heat sink for D 3 PAK (TO-) package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. Case Temp Rise (.5) 1.1 (.) 1.3 (.5) 5. (1.) 15. (.) 11.3 (.5) 3.99 (1.) (.9) 19.3 (.73) 11.3 (.5) Refer to Figure D on page for board footprint information Material:.3 (.5) Thick Copper Finish: Tin Plated 7.37 (.9) Refer to Figure A and B on page for board footprint information THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Part Number Packaging 573D1G 13" Reel, 5 per reel 573DG Bulk, 5 per bag See below for tape and reel information Material:.3 (.5) Thick Copper Finish: Tin Plated Tape and Reel information D A B C Part Number A Dim B Dim C Dim D Dim 71D/TRG. (1.73). (1.59). (.9). (.1) 719D/TRG. (1.73). (1.59) 3. (1.). (.1) 5731D1G. (1.73). (1.59) 1. (.3). (.1) 5733D1G. (1.73). (1.59). (.9). (.1) 573D1G. (1.73). (1.59). (.9). (.1) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 5

26 SMT Footprints THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES FIGURE A Recommended copper heat speader drain pad footprint Note: The thickness of the drain pad is variable depending on the amount of heat generated by the SMT device, design limitations and process. Part Number L W (.375) (.55) (.5) 1. (.) (.5) 1. (.3) W L FIGURE B Recommended heat sink solder mask opening. (.3) W 1 W L 1. (.) Part Number L W1 W (.355) 13. (.53).9 (.35) (.5) (.) 11.1 (.) (.5).57 (.1) 1. (.3) FIGURE C Recommended copper pad size for heat sink and device mounting footprint FIGURE D Recommended copper pad size for heat sink and device mounting footprint 1.7 (.) 15.9 (.1) 1.1 (.1).9 (.9) 7. (.3) 15.9 (.1) 1.7 (.) 1.7 (.).3 (.).5 (.1).5 (.1) For D Pak (TO-3) For MO-1 and SO-1 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

27 TO- Heat Sinks 75 Channel style heat sink with folded back fins Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. Part Number Description Hole for Tabs 75BG Channel heat sink with no solderable tabs 75B-MTG With solderable mounting tabs.9 (.11) For additional options see page 5 Part Number Description Finish 719BG Channel heat sink with no solderable tabs Black anodize Narrow channel style heat sink with folded back fins Narrow channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card Hole for Tabs (1.13) (.93). (.) 5. (1.) 1. (.57) TAB. (.9).3 (1.1). (1.9).7 (1.5) 11.9 (.7) 3.3 (1.55) (1.55) ø 3.1 THRU (.15) (.) (.57) TAB page11.13 (.95).5 (.1) ø 3.1 (.15) THRU.3 (.) 9.5 (.375) 19.5 (.75) 3.1 (.15).5 (.175).9 (.9) Material: 1.7 (.5) Thick Aluminum page11.3 (.19) (.15) (.) Material: 1. (.) Thick Aluminum Finish: See Table THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 719PBG Channel heat sink with no solderable tabs Pre black anodize* 719B-MTG With solderable tabs Black anodize.9 (.11) *Edges cut during the manufacturing process will be unfinished. See page 11 for more information For additional options see page 5 7 Narrow channel style heat sink with folded back fins page11 Narrow channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. Part Number Description 7BG Narrow channel heat sink with no solderable tabs 7B-MTG With solderable tabs.9 (.11) Hole for Tabs 3.3 (1.5) ø 3.1 x (.15) TAB 11.9 (.7) 33. (1.3) C L "x". (.) 31. (1.55) 17.7 (.7) 1. (.57) 7.7 (.31).1 (.).3 (.19) 3.1 (.15) Material: 1.7 (.5) Thick Aluminum POPULAR OPTIONS: 7B- G Base part no. A Position Code Description Location Details A TC1-MT Insulating device mounting clip Hole X Page 93, 9 and solderable tabs For additional options see page 5 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 7

28 TO- Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 71 Channel style heat sink with folded back fins Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. Part Number Description 71BG Channel heat sink with no solderable tabs 71B-MTG With solderable tabs.9 (.11) Hole for Tabs POPULAR OPTIONS: 71B- G Base part no. A Position Code Description Location Details A TC1-MT Locking device mounting clip and solderable tabs Hole X Page 93, (1.5) TAB 9.5 (.3). (.9).5 (1.75) "X". (.) 3.5 (1.95) 17.7 (.7) x ø 3.1 (.15) 1. (.57) 7.7 (.31).7 (.15) page11.3 (.19) 3.1 (.15) 5.5 (.) Material: 1.7 (.5) Thick Aluminum A MT5 Bifurcated tabs with.5 stand off Page 93 A MT Bifurcated tabs with.115 stand off Page 93 A TC1-MT5 Locking device mounting clip and bifurcated tabs Hole X Page 93, 9 For additional options see page 5 73 Channel style heat sink with folded back fins page11 Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card Part Number Description Hole for Tabs 73BG Channel heat sink with no solderable tabs 73B-MTG With solderable tabs.9 (.11) (1.95) 15.9 (.1) 1. (.57) TAB A A "X".3 (1.1). (1.9).7 (1.5) x ø 3.1 THRU (.15).3 (.19).13 (.95) 5. (.).5 (.1) 3.1 (.15).9 (.9) 19.5 (.75) SECTION A-A.5 (.175) Material: 1.7 (.5) Thick Aluminum POPULAR OPTIONS: 73B- G Base part no. A Position Code Description Location Details A TC-MT Locking device mounting clip and solderable tabs Hole X Page 93, 9 A TC7-MT Insulating device mounting clip and solderable tabs Hole X Page93, 9 For additional options see page 5 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

29 TO- Heat Sinks 7 Channel style heat sink with folded back fins Channel style heat sink with folded back fins for increased cooling surface area. Available with tin plated solderable tabs for easy attachment to the printed circuit card. Part Number Description Finish 7BG Channel heat sink with no solderable tabs Black anodize 7PBG Channel heat sink with no solderable tabs Pre black anodize* B-MTG With solderable tabs Black anodize.9 (.11) 7PB-MTG With solderable tabs Pre black anodize*.9 (.11) * Edges cut during the manufacturing process will be unfinished. See page 11 for more information Hole for Tabs 3 1. (.175).3 (.19) 3.1 (.15).9 (.9) 9.5 (.375) 1.3 (.) x 3.1 (.15) x ø3.1 (.15).7 (.15) page (.9) 5. (1.9) "X" TAB x.3 (.).1 (.951). (.) 1. (.57) 9.99 (1.9) Material: 1.7 (.5) Thick Aluminum Finish: See Table THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES POPULAR OPTIONS: 7B- G Base part no. A Position Code Description Location Details A TC11-MT Insulated device mounting clip for T- and solderable tabs Hole X Page 93, 9 For additional options see page High performance channel style heat sink with folded back fins page11 High performance channel style heat sink with folded back fins for greater cooling capacity in a minimum of space when mounted horizontally. Folded back fin design maximizes surface area without increasing the vertical space required by the heat sink (.53) (1.) 13. (.53) (.77) C L 3.3 (1.5) ø 3. THRU (.15) 9.91 (.39) 13.1 (.5) 13. (.53) Material: 1.7 (.5) Thick Aluminum Part Number 551BG Description High performance channel style heat sink with folded back fins POPULAR OPTIONS: 551B G Base part no. A Position Code Description Details A 1-3 Wave On threaded insert Page 9.1 stand off For additional options see page USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 9

30 TO- Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 1, 1 Channel style heat sink with straight fins Channel style heat sink with straight fins features integrated solderable tabs for easy mounting to the printed circuit card. Available with a single device mounting hole or slotted hole to accomodate varying device lead lengths. FIGURE A 9.97 (1.1) 5. (1.) 1. (.) "X". (.3).3 (.9) ø 3.3 (.133) 17.7 (.7) 3.1 (.15) 1 Part Number Description Finish Figure Hole for Tabs A Dim B Dim "B" 1.7 (.5) Material: 1. (.) Thick Aluminum Finish: See Table 1BG Channel heat sink with straight fins and integrated tabs Black anodize A.1 (.7) 1.1 (.) 1.7 (.7) 1PBG Channel heat sink with straight fins and integrated tabs Pre-black anodize* A.1 (.7) 1.1 (.) 1.7 (.7) 1PBG With slotted device mounting hole Pre-black anodize* B 3.1 (.15).99 (.75).5 (.1) * Edges cut during the manufacturing process will be unfinished. See page 11 for more information FIGURE B 3.1 WIDE X (.15) 9.5 LONG SLOT (.375) 9.97 (1.1) 17.7 (.7) 5. (1.) 1. (.). 3. (.3) (.15).59 (.9) page11 "B" 1.7 (.5) POPULAR OPTIONS: 1- - G Available on the 1 only Base part no. A B Position Code Description Location Details A B Black anodize A PB Pre-black anodize* B SF1 - UNC-A device mounting stud Hole X Page 9 For additional options for part 1 see page 5 3 Copper channel style heat sink with straight fins page11 Copper channel style heat sink with straight fins features integrated tabs which can be twisted to attach the heat sink to the board prior to wave solder Part Number Description Hole for Tabs 3DG Channel heat sink with straight fins and integrated tabs 3. (.11) 9.97 (1.1) 17.7 (.7) 5. (1.) 3.1 (.15) 9.53 (.375) 1.7 (.5).5 (.1) 3.1 (.15).9 (.75) Material:.3 (.5) Thick Copper Finish: Tin Plated 3 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

31 TO- Heat Sinks TV35 Narrow channel style heat sink features twisted fins for increased air turbulence and better cooling. Mounts horizontally to accommodate two TO- devices. Part Number TV35G Narrow channel style heat sink features twisted fins Description Channel style heat sink with twisted fins C L 5. (.95) 1. (.39) 3. (1.97) X. ø THRU (.15) 1. (.55) page11. (1.55) 35. (1.3) Material:.1 (.3) Thick Aluminum THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TV, TV7, TV5 Narrow channel style heat sink features twisted fins page11 Narrow channel style heat sink features twisted fins for increased air turbulence and better cooling. Can be mounted vertically or horizontally. Air Velocity Feet Per Minute TV5 Heat Dissipated Watts TV, TV7 C L 19. (.79). ø THRU (.157) B. (.7) MAX Part Number A Dim B Dim TVG 13. (.51) 9.5 (.37) TV7G 13. (.51).3 (.) TV5G 11. (.33).3 (.) 11. (.33) MIN Material:.1 (.3) Thick Aluminum USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 31

32 TO- Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TV5, TV15, TV155 Channel style heat sink features twisted fins for increased air turbulence and better cooling. Can be mounted vertically or horizontally. Models are available with integrated twist tabs or mounting solderable tabs. Channel style heat sink features twisted fins TV15 TV155 Part Number Description Figure TV5G Channel style heat sink with twisted fins and solderable tabs A.39 (.9) TV15G Channel style heat sink with twisted fins B TV155G With integrated twist tabs B 3.3 (.13) Hole for Tabs TV 5 TAB TV155 ONLY 5. (1.77) FIGURE A.5 (.177) 1.9 (.75) 1.15 (.) FIGURE B 1.7 (.5) 1.7 (.5).5 (.1) 5. (.) R 1.9 (.75) 5. (.) 15. (.) 1. (.7) page11 3. (1.11).1 (.7) C L.75 (.3) 5. (1.) 3. (1.11) C L.13 (.95) 15. (.) 5. (.) R1.9 (.75) 3. (1.17) 3. (.15) Material: 1.7 (.5) Thick Aluminum 59 Channel style heat sink features solderable tabs and twisted fins page11 Channel style heat sink features solderable tabs and twisted fins for increased air turbulence for better cooling. For ease of assembly use with clip 771 (sold separately) to attach device. See page 97 for clip information (1.) 11.1 (.37) 1.5 (.9) 5. (.197) 1.9 (.75) 5.1 (.1) 15. (.59) 3. (1.197) 3.1 (.15) C L. (.953) 5. (.9) Slots for clip attach. (.31) Part Number Description Hole for Tabs 59PBG Channel style heat sink with twisted fins and solderable tabs. (.9) Material: 1.19 (.7) Thick Aluminum Finish: Pre Black Anodize* * Edges cut during the manufacturing process will be unfinished. See page 11 for more information. 3 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

33 TO- Heat Sinks 599, 593 Channel style heat sink featuring twisted fins Channel style heat sink features twisted fins for increased air turbulence for better cooling. Two heights are available and include wave solderable tin plated tabs for easy attachment to the PC board. Part Number A Dim Hole for Tabs 599B3G.9 (.9).3 (.93) 593B3G 9.97 (1.1).3 (.93) POPULAR OPTIONS: 59 B3 G Base part no. A Position Code Description Location Details A 5 - male semiconductor mount.3 LG Hole X Page 9 For additional options see page , 57 Channel style heat sink featuring three integrated tabs ø 3.1 (.15) THRU 17.7 (.7) "X".1 (.3) 3.93 (.9) page (.75) 1.7 (.5).7 (.17) 1.1 (.) Material: 1.7 (.5) Thick Aluminum page11 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Channel style heat sink features three integrated tabs for greater stability and slotted mounting hole to accommodate a variety of device lead lengths. Available in two heights. tabs are designed for either soldering (tin finish) or twisted Part Number A Dim Finish Hole for Tabs 53BG 9.97 (1.1) Black anodize 3.1 (.1) (.375) 5. (1.) C L 3.1 (.15) 17.7 (.7) 5. (.).5 TYP (.1) 1.7 (.5).9 (.35) Material: 1.7 (.5) Thick Aluminum Finish: See Table 53DG 9.97 (1.1) Tin plated 3.1 (.1) 57BG.13 (.95) Black anodize 3.1 (.1) 57DG.13 (.95) Tin plated 3.1 (.1) 575 Channel style heat sink with two integrated tabs page11 Channel style heat sink features two integrated tabs and slotted mounting hole to accommodate a variety of device lead lengths. tabs are designed for either soldering (tin finish) or twisted. Part Number Finish Hole for Tabs (.375) 3.1 (.15) 5. (1.) C L 17.7 (.7) 9.97 (1.1) 5. (.).5 (.1) 1.7 (.5) 1.1 (.) Material: 1.7 (.5) Thick Aluminum Finish: See Table 575BG Black anodize 3.1 (.1) 575DG Tin plated 3.1 (.1) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 33

34 TO- Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 591 Channel style heat sink featuring recessed lower fins Channel style heat sink features recessed lower fins to allow closer component spacing and longer upper fins for maximum cooling. Includes two solderable tabs for easy attachment to the PC card. Part Number Description Hole for Tabs 591B3G High performance heat sink with recessed lower fins.9 (.115) For additional options see page Channel style heat sink features slotted mounting hole to accommodate a variety of devices and lead lengths. Includes two solderable tabs for easy attachment to the PC card (.) 5. (.).5 (1.75) 1.7 (.5) 593 Channel style heat sink featuring slotted mounting hole Part Number Description Hole for Tabs 593B3G High performance heat sink with solderable tabs.9 (.115) For additional options see page.5 (1.75) 11.3 (.5) 5. (1.) 1.7 (.5).5 (.1).5 (.1) 3.5 (.95) ø 3.9 x 9.53 SLOT C L (.15)(.375) 17.7 (.7) page11 5. (1.) 3.9 (.9) Material: 1.7 (.5) Thick Aluminum page C L (.5).9 (.9) ø 3.9 x 9.5 (.15) (.375) 17.7 (.7).1 (.3) Material: 1.7 (.5) Thick Aluminum 577, 5771, 577 Slim low cost channel style heat sink page11 Slim low cost channel style heat sink is ideal where space and cost are limited. Available in 3 fin heights with or without solderable mounting tab Part Number Description A Dim Hole for Tabs TAB.1 (.3) 19.5 (.75) (.55).35 (.5) 13.1 (.5) C L 1.7 (.) ø 3.1 (.15) THRU 1.7 (.5) 577BG Slim, low cost channel style heat sink with no solderable tabs.35 (.5) 577BG With solderable tab.35 (.5) 1.73 (.) 5771BG Slim, low cost channel style heat sink with no solderable tabs 9.5 (.375) 5771BG With solderable tab 9.5 (.375) 1.73 (.) 577BG Slim, low cost channel style heat sink with no solderable tabs 1.7 (.5) Material: 1.7 (.5) Thick Aluminum 577BG With solderable tab 1.7 (.5) 1.73 (.) POPULAR OPTIONS: 577 B G Base part no. A Position Code Description Details A 3 In-Sil- TM pad Page For additional options see page 3 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

35 TO- Heat Sinks 19, 11 Low cost channel style heat sink featuring integrated alignment tabs Low cost channel style heat sink features integrated alignment tabs to prevent the device from rotating while applying torque to the mounting hardware. Available in two lengths with a pre-black anodized finish. ø 3.1 (.15) 11. (.) Part Number Description Figure 19PBG Low cost channel heat sink with device locating tabs A 11PBG Low cost channel heat sink with device locating tabs B * Edges cut during the manufacturing process will be unfinished. See page 11 for more information POPULAR OPTIONS: Position Code Description Details A MT Solderable mounting tabs Page 93 For additional options see page 5 1 PB - G Base part no. A FIGURE A 5. (1.) AT BASE.9 (.35) 1.9 (.3) 1.7 (.5) 9.97 (1.1) 717 Copper narrow channel style heat sink with a single integrated tab FIGURE B 1.3 (.71) Material: 1.7 (.5) Thick Aluminum Finish: Pre-Black Anodize* (.5) 1.9 (.3) page11 5. (1.) AT BASE C L page (.5).9 (.35) ø3.1 (.15) THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Copper narrow channel style heat sink includes a single integrated tab to allow easy attachment to the PC board. Tin plated finish ensures easy solderability. Part Number Description Hole for Tabs 717DG Narrow channel copper heat sink.5 (.1) (.75) 13.3 (.55).35 (.5) ø 3.1 (.15) 3.1 (.15) 13.1 (.5) AT BASE C L 1.7 (.5). (.) 3.1 (.15) 9.5 (.375) Material:.3 (.5) Thick Copper Finish: Tin Plated 713, 7139 Copper channel style slide on heat sink featuring integrated mounting clip FIGURE A FIGURE B Top is cut away to show detail 1.5 (.) x.79 (.11) 17.7 (.7) (.7) 1. (.5) (.5) Copper channel style slide on heat sink features integrated mounting clip for easy no hardware attachment to the device. Also includes solderable mounting tabs for easy attachment to the PC board. x 1.7 x 1.7 (.5) (.5).19 (.15) 13. (.515) Part Number Description Figure Hole for Tabs 713DG Vertical mount A.5 (.1) 7139DG Horizontal mount B.5 (.1) 13.1 (.5) (.515).3 (.) Material:.3 (.5) Thick Copper Finish: Tin Plated (.5).79 (.11) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 35

36 TO- Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 71 Copper channel style heat sink with integrated clip Copper channel style heat sink with integrated clip and locking tab for secure attachment to the device. Narrow profile uses less board space. Includes tin plated solderable tabs for easy attachment to the printed circuit card. Case Temp Rise Part Number Description Hole for Tabs 71DG Slide on channel heat sink with integrated clip and locking tabs.9 (.115) 3 Channel style heat sink with integrated clip Channel style heat sink with integrated clip and locking tab for secure attachment to the device. Tabs can be bent for mounting Thermal Resistance From Case to Ambient C/Watt 7.9 (1.1).3 (.) 1.7 (.5) 9.5 (.375) 9.97 (1.1) 1.9 (.7) 1.7 (.5). (.) Top is cut away to show detail.1 (.1) (.5) (.) 1.7 (.) 31. (1.3).35 (.5) (.1) (.5). (.35).5 (.1) 1.7 (.5) ( ).7 (.17) 5.31 (.9) Material:.3 (.5) Thick Copper Finish: Tin Plated 5.9 (.3) 1.1 (.) Part Number Description Hole for Tabs 3BG Slide on channel heat sink with integrated clip and locking tabs 3.1 (.15) 11.3 (.5) 5. (1.) AT BASE Material:.1(.3) Thick Aluminum 71 Narrow channel style heat sink with integrated clip Narrow channel style heat sink with integrated clip and locking tab for secure attachment to the device. Device can be mounted horizontally using a single center tab that can be soldered directly to the PC board. Case Temp Rise Above Ambient C Thermal Resistance From Case to Ambient C/Watt 19.1 (.7) 13. (.515) C L 13.1 (.5) Top is cut away to show detail. (.5).79 (.11).5 (.1) (.55) (.5) Material:.3 (.5) Thick Copper Finish: Tin Plated Part Number Description Hole for Tabs 71DG Slide on narrow channel heat sink with integrated clip and locking tabs 3.1 (.15) 3 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

37 TO- Heat Sinks 3, 39 Channel style heat sink with integrated clip Channel style heat sink with integrated clip features strong spring tension and device locking tab to attach device securely to the heat sink. Available with solderable tabs for vertical mount or without tabs for mounting horizontally..7 (.15). (.) 15.9 (.1) 1. (.5).3 (.9) 1.51 (.5) 5.53 (1.5) AT BASE Part Number Description A Dim 3BG Channel heat sink with integral clip, no solderable tab 3B-MTG With solderable mounting tabs 1.1 (.).9 (.11) 39B-MTG With solderable mounting tabs.99 (.75).9 (.11) For additional options see page 5 TAB Hole for Tabs B B 5. (.). (.315) 3.17 (.15) 1.9 (.75) 19.5 (.75) SECTION B-B Material: 1. (.) Thick Aluminum THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 53 Channel style heat sink with convenient clip page11 FIGURE A CLIP 53 FIGURE B 5. (1.) 13. (.55) 3.9 (.15) 1. (.75) 5. (1.) 1.1 (.55) A 3.17 (.15) 1.1 (.55) A Channel style heat sink features a dittin to locate the device and a convenient clip to eliminate the need for mounting hardware. The twisted fins increase cooling efficiency. Available in two solderable mounting tab styles. Can be ordered without the ditton if electrical isolation is required or for mounting tabless packages (.7) 3.1 (.13) C L.35 (.) 9.7 (.35) 1..7 (.3) (.3) 1.7 (.5) 9.97 (1.1) 9.7 (.35) 17.7 (.7) Material: 1.7 (.5) Thick Aluminum C L 9.7 (.35) (.3) (.75) (.17) 3.93 (.9) 1.7 (.5) 9.97 (1.1) 1.1 (.) Part Number Description Figure A Dim 53B53G With Shur-Lock TM tabs and clip A Dia 3.5(.1) x.(.5) High Dittin.39 (.9) 53B353G With solderable mounting tabs and clip B Dia 3.5(.1) x.(.5) High Dittin.39 (.9) 535B53G With Shur-Lock TM tabs and clip A No Dittin.39 (.9) 535B353G With solderable mounting tabs and clip B No Dittin.39 (.9) For additional options see page Hole for Tabs USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 37

38 TO- Heat Sinks 711 Copper narrow channel style heat sink with integrated clip THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Copper narrow channel style heat sink with integrated clip and locking tab for secure attachment to the device. Single center tab can be soldered directly to the PC board. Economy, narrow base, low profile channel style heat sink is perfect for use on printed circuit boards with.5 inch centering. When mounted horizontally, the total height of the heat sink is just.3. Case Temp Rise Above Ambient C Part Number Description Hole for Tabs 711DG Narrow channel heat sink with integrated clip.77 (.19) Economy, narrow base, low profile channel style heat sink Thermal Resistance From Case to Ambient C/Watt 19.1 (.7) 1.51 (.5) ø 3.1 (.15) THRU 13.3 (.55) 5.7 (.5) 1.7 (.5) 3.1 (.15) 13. (.515) 13.1 (.5) 19.5 (.75) LC "X" 9.5 (.375) Top is cut away to show detail 3.5 (.1) 19.5 (.75).5 (.1) MAX Material:.3 (.5) Thick Copper Finish: Tin Plated page (.3) Part Number Finish 573BG Black anodize 573JG Pre-black anodize* * Edges cut during the manufacturing process will be unfinished. See page 11 for more information Material: 1.7 (.5) Thick Aluminum Finish: See Table POPULAR OPTIONS: 573 _ G Base part no. A Position Code Description Location Details A 9 Stud x.35 LG Hole X Page 9 For additional options see page 51, 5 Economy, narrow base, low profile channel style heat sink page11 FIGURE A "X" ø 3. THRU (.1) FIGURE B ø 3. THRU TYP (.1) 17. (.7) 13. (.53) "X" "X" 9.91 (.39) 19.1 (.7) Economy, narrow base, low profile channel style heat sink is perfect for use on printed circuit boards with tight component spacing. Models are available for single and dual device mounting. Part Number Description Figure 51BG Economy, narrow base channel style heat sink A 5BG For dual devices B 1. (.5) 19. (.7) POPULAR OPTIONS: 5 BG Base part no. A Position Code Description Location Details A 1-3 Wave On threaded insert.1 stand off Hole X Page 9 For additional options see page 13.7 (.53) Material: 1. (.) Thick Aluminum (1.5) 13.7 (.53) 1.59 (.5) 1 3 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

39 TO- Heat Sinks TV Narrow channel style heat sink features twisted fins for increased air turbulence and better cooling. Mounts horizontally to accommodate two TO- devices. Part Number TVG Narrow channel style heat sink features twisted fins Description Narrow channel style heat sink with twisted fins Copper channel style heat sink featuring two integrated tabs 1 C L. (.) 13. (.51) 3. (1.97). (.3) page11. (.15) X THRU. (1.13) Material:.1 (.3) Thick Aluminum page11 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Copper channel style heat sink features two integrated tabs. The heat sink is tin plated and can be soldered to the PC board ø 3.1 (.15) THRU 19.5 (.75) 13.3 (.55) 9.5 (.375) 19.5 (.75) (.15) (.5) 3.1 (.15) 1.7 (.5).11 (.1) Part Number Description Hole for Tabs 7173DG Copper channel style heat sink.5 (.1) Material:.3 (.5) Thick Copper Finish: Tin Plated 3 Channel style heat sink featuring an integrated device retaining clip Channel style heat sink features an integrated device retaining clip that eliminates the need for attachment hardware. Available in two finish options (.7) 1.95 (.51) C L Locking Catch Top is cut away to show detail 1. (.5).5 (.1) Part Number Finish 13.1 (.5) Material: 1. (.) Thick Aluminum Finish: See Table 3BG Black anodize 3PBG Pre-black anodize* * Edges cut during the manufacturing process will be unfinished. See page 11 for more information. USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 39

40 TO- Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 53, 537, 57 Channel style heat sink with wide mounting surface Lightweight, low cost channel style heat sink with wide mounting surface and selection of lengths to accept a variety of packages. Models accomodate one or two devices. Part Number Figure A Dim B Dim C Dim 5313BG B 1.19 (.) 1.1 (.) 531BG A 9.97 (1.1) 11. (.) 1.7 (.5) 5371BG A 1.3 (.71) 1.3 (.5) 1.7 (.5) 571BG A. (.9) 11.3 (.5) 9.5 (.3) 571BG A. (.9).13 (.3) 9.5 (.3) For additional options see page FIGURE A "C" "B" C L 5. (1.) AT BASE ø 3.1 (.15) THRU FIGURE B 9.97 (1.1) Material: 1.7 (.5) Thick Aluminum 1.7 (.5) "B" page11 5. (1.) AT BASE ø 3.1 (.15) THRU X , 5371 or or 531 C L 5779, 57 Twin channel style heat sink page11 FIGURE A 9.5 (.3) TYP ø 3.1 THRU (.15) TYP FIGURE B ø3.1 THRU (.15) TYP 1.7 (.5) 3.15 (1.17) 19.3 (.7).1 (1.3) 19.3 (.7) 5. (1.) Twin channel style heat sink vertically mounts two TO- devices to a single heat sink. Center fins increase cooling capacity. Available with integrated twist tabs or staked on solder tabs for easy attachment to the PC board (.1) TYP (1.) 1.7 (.5).5 (.1) 5. (.) Material: 1.7 (.5) Thick Aluminum 1.99 (.59) 35.5 (1.) (1.) 9.5 (.3) TYP 1.7 (.5) 1.57 (.) 5.59 (.) 3.3 (.135) Part Number Description Figure Hole for Tabs 5779BG Twin channel style heat sink with integrated tabs A 3.1 (.1) 57B3G With staked on solderable tabs B 1.91 (.75) For additional options see page USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

41 TO- Heat Sinks 59, 57, 571, 57 Hat section style heat sink Hat section style heat sinks are low profile and perfect for use on printed circuit cards with.5 inch centering between boards. For higher power applications the 571 hat can be added to the 57 or 57 for double sided cooling of a TO- device. Part Number Description Figure A Dim 59BG Hat section heat sink A (1.5) 57BG Wide hat section heat sink A.5 (1.75) 571BG Hat section heat sink with cut out C 57BG Dual device hat section heat sink B POPULAR OPTIONS: 5 _B G Base part no. A Position Code Description Details A 1 Kon Dux TM pad Page For additional options see page FIGURE A 17.7 (.7) 13. C L (.53) 9.5 (.375) 17.7 (.7) ø 3. (.1) THRU with 571 attached Material: 1. (.) Thick Aluminum FIGURE B 1.1 (.) (.535) 9.5 (.375) FIGURE C 1.9 (.5) 13. (.53) ø 3. (.1) ø 3. C (.1) L THRU TYP 17.7 (.7).5 (1.75).5 (1.75) 1.7 (.) 1.7 (.5) 37.3 (1.7) 1.7 (.5) page (.7) THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 7137, 71 Copper, hat section, slide on heat sink FIGURE A Top is cut away to show detail FIGURE B 1.5 (.) 19.5 (.75) 17.7 (.7) 11.5 (.35) Copper, hat section, slide on heat sink features integrated mounting clip for easy no hardware attachment to the device. Also included are solderable mounting tabs for easy attachment to the PC card. Part Number Description Figure Hole for Tabs 7137DG Vertical mount A.5 (.1) 71DG Horizontal mount B.5 (.1) 9.5 (.375). (.9) 13.1 (.5).5 (.1) Material:.3 (.5) Thick Copper Finish: Tin Plated (.375). (.9) 13.1 (.5) 3.5 (.1) 1.57 (.) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 1

42 TO- Heat Sinks 37 Hat section style heat sink featuring an integrated clip THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Hat section style heat sink features an integrated clip for secure attachment to the device without added hardware. Available in two finishes. Part Number Finish 37BG Black anodize 37PBG Pre-black anodize* * Edges cut during the manufacturing process will be unfinished. See page 11 for more information (.7) 9.5 (.375). (.9) 13.1 (.5) Top is cut away to show detail 1. (.5).5 (.1) Material: 1. (.) Thick Aluminum Finish: See Table 59 High power, square basket heat sink with folded back fins page11 High power, square basket heat sink accommodates two TO- devices. Features folded back fins for increased surface area for maximum cooling. Part Number 59BG Description High power, square basket, folded back fin heat sink POPULAR OPTIONS: 59B G Base part no. A Position Code Description Location Details A 1 3 Wave On threaded insert,.1 stand off. Bd Hole X Page BASE.3 (.19) R1.9 (.7) TYP "X" C L 1.1 (.95) C L 1 "X" 1.73 TYP (.5) C L 11.1 (.) SEE DETAIL C L.19 TYP (.15) ø 3.5 (.1) TYP 1.7 TYP (.7) DETAIL-A 7.9 (1.9) REF.35 (.5) REF ø 3. THRU (.1) TYP 15.9 (.1) REF 33.7 (1.31) REF. SQ. (1.3) REF Material: 1. (.3) Thick Aluminum For additional options see page USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

43 TO- Heat Sinks 57, 579, 5799 Clip on style heat sink featuring an integrated clip Clip on style heat sink features an integrated clip to retain the device meaning no mounting hardware is required. Models have fins on both sides, left or right side and are available with solderable tabs for easy attachment to the PC board. Part Number Description Figure Hole for Tabs 57BG Clip on heat sink, left right side fins, no solderable tabs A 57B33G Left right side fins with solderable tabs A 1.91 (.75) 579BG Left side fin, no solderable tabs B 579B33G Left side fin with solderable tab B 1.91 (.75) 5799BG Right side fin, no solderable tabs B 5799B33G Right side fin with solderable tab B 1.91 (.75) For additional options see page 5.97 (.) TAB FIGURE A ø3.1 LOCKING CATCH (.15).5 (.) 5.15 (.99) 5.91 (1.). (.9) 5. (.) 1.7 (.) 9.5 (.3) 1.57 (.) FIGURE B TAB 19.5 (.75) 1.7 (.) Material:.3 (.5) Thick Aluminum ø 3.1 LOCKING CATCH (.15) 13.5 (.53).51 (.) 1.7 (.). (.9) 5. (.) 9.5 (.375) 1.57 (.) Note: Fins on left or right. Right hand side model shown THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 3, 9, 9 Low cost, clip on style heat sink featuring a locking tab Low cost, clip on style heat sink features a locking tab to prevent the device from dislodging from the heat sink. Also includes slide runners to ensure proper device alignment. Available in a pre-black anodize finish "D" "E" "B" "C" Material:.3 (.5) Thick Aluminum Finish: Pre-Black Anodize* Part Number A Dim B Dim C Dim D Dim E Dim 3PBG 5. (1.) 1.51 (.5) 1.1 (.).3 (.).1 (.) 9PBG 5. (1.) 1.51 (.5) 1.1 (.) (.55).1 (.) 9PBG (.77) 1.73 (.5) 1.9 (.3).3 (.).5 (.5) *Edges cut during the manufacturing process will be unfinished. See page 11 for more information USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 3

44 TO- Heat Sinks PF75, PF75 Slip on heat sink featuring integrated tabs THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Slip on heat sink is tin plated and has integrated tabs for soldering to the PC board. Locating features provide simple device alignment and spring action holds the device for good thermal contact. PF75 PF75 Part Number Description A Dim B Dim PF75G Slip on heat sink with tabs 19.(.7) 3.(.11) PF75G Slip on heat sink with tabs.(.95) 5.(.5) PF75 Slip on heat sink Slip on heat sink has locating features for simple device alignment. Spring action holds the device for good thermal contact (.33) 11. (.33) 11. (.33). (.) 1.7 (.1). (.) 9.5 (.37) "B" 1.7 (.7) Material:.71 (.) Thick Aluminum Finish: Tin Plate 19. (.7) 3. (.11) 15. (.59) 5. (.197) Material:.71 (.) Thick Aluminum Part Number Description PF75G Slip on heat sink PF7, PF73 Slip on heat sink Slip on heat sink has locating features for simple device alignment. Spring action holds the device for good thermal contact. Available with or without solderable mounting tabs Heat Dissipated Watts.5 (.177).1 (.319).1 (.3) 3. (.11) 1. (.3) TAB 19. (.71) 1. (.5) 1.3 (.7) DIA 3. (.11). (.77) 1.3 (.51) Material:.71 (.) Thick Aluminum Finish: Pre-Black Paint* Part Number Description PF7G Slip on heat sink, no solderable tabs PF73G With solderable tabs * Edges cut during manufacturing process will be unfinished USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

45 TO- Heat Sinks 57, 575, 57, 579 Low cost, labor saving, slide on heat sink featuring spring action Low cost, labor saving, slide on heat sink features spring action to firmly hold the device tab to the heat sink providing maximum metal to metal contact and good thermal conduction. Available with solderable tabs for horizontal or vertical mounting to the PC board. DITTIN 1. (.3) 1. (.) 11.1 (.5) HOLDING TABS ø 3.1 (.15) 3.1 (.15) 9. (.355) (.59) (.395) Part Number Description Figure A Dim Hole for Tabs 57BG Low cost slide on heat sink, no solderable tabs A 19.5 (.75) 57B3G With solderable tabs for horizontal mounting A 19.5 (.75) 1.91 (.75) 575BG Low cost slide on heat sink, no solderable tabs B 19.5 (.75) 575B33G With solderable tabs for vertical mounting B 19.5 (.75) 1.91 (.75) 57BG Low cost slide on heat sink, no solderable tabs B (.9) 57B33G With solderable tabs for vertical mounting B (.9) 1.91 (.75) 579BG Low cost slide on heat sink, no solderable tabs B 35.5 (1.3) 579B33G With solderable tabs for vertical mounting B 35.5 (1.3) 1.91 (.75) For additional options see page FIGURE A 9.5 (.375) 1.57 (.).19 (.15) 571 Low cost, labor saving, slide on heat sink featuring spring action DITTIN Material:.3 (.5) Thick Aluminum FIGURE B TAB (.).57 (.1) HOLDING TABS 9. (.355) (.5) (.59) 9.5 (.375) 5.33 (.1) (.) 1.3 (.) THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Low cost, labor saving, slide on heat sink features spring action to firmly hold the device tab to the heat sink providing maximum metal to metal contact and good thermal conduction. Includes a clearance hole in the top side to allow the use of optional hardware to attach device and heat sink to circuit board or other surface. Also available with solderable tabs for vertical mounting to the PC board. Part Number Description 571BG Low cost slide on heat sink, no solderable tabs 571B33G With solderable tabs 1.91 (.75) 1 1 Hole for Tabs (.3) CLEARANCE DITTIN TAB 1. (.).57 (.1) 9. (.355) ø 3.1 (.15) THRU 11.1 (.5) 1.99 (.59) 5.33 (.1) 1.3 (.395) 19.5 (.75) 9.5 (.375) 1.57 (.) POPULAR OPTIONS: 571B G Base part no. A Position Code Description Details Material:.3 (.5) Thick Aluminum A 37 Solderable tab with step to limit insertion depth Page 9 For additional options see page USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 5

46 TO- Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5751, 5793, 579 Snap down style heat sink featuring two side fins Snap down style heat sink features two side fins that act as springs to hold the semiconductor firmly to the heat sink. Models include an integrated clip and device locking catch for more robust applications. Available for both standard and bevel edged TO- packages. Part Number Description Figure 5751BG Snap down heat sink A 5793BG With integrated clip and locking catch B 579BG With integrated clip and locking catch B for TO- with beveled edge For additional options see page FIGURE A 1.3 (.5) ø 3.1 (.15) THRU 19.5 (.75) 1. (.5).5 (1.1) 11.1 (.) FIGURE B 19.5 (.75) Material:.3 (.5) Thick Aluminum (.9) View A-A 5793 ø 3.15 (.1) LOCKING CATCH 11.1 (.) View A-A (.) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

47 TO- Heat Sinks 5 Space saving staggered fin heat sink Space saving staggered fin heat sink for vertical mounting TO- devices. Features solderable mounting tabs for easy attachment to the PC board. Part Number Description Hole for Tabs 5B-MTG Space saving staggered fin heat sink.9 (.11) For additional options see page Copper, space saving staggered fin heat sink Copper, space saving staggered fin heat sink for vertical mounting TO- devices. Features solderable mounting tabs for easy attachment to the PC board. Part Number Description Hole for Tabs 7.1 (1.7) ø3.1 (.15) THRU 5. (.) 15.1 (.597) 5. (1.).75 (.17). (.97) 3.1 (.15) 17.7 (.7).1 (1.) 35.5 (1.3) 5. (1.) page11. (.315).3 (.19). (.9) Material: 1. (.) Thick Aluminum page (.5) ø 3.1 x (.15) 1. (.7). (.) THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 3DG Copper space saving staggered fin heat sink 3.1 (.1) Material: 1.7 (.5) Thick Copper Finish: Tin Plated Space saving staggered fin heat sink page11 Space saving staggered fin heat sink for vertical mounting TO- devices. Features staked on solderable mounting tabs for easy attachment to the PC board. Part Number Finish Hole for Tabs (1.1) 1.5 (.73) 1.7 (.).79 (.11).3 (.75) 17.7 (.7).35 (.5) ø 3.1 (.15) 1.7 (.7) PBG Pre-black anodize*.3 (.93) BG Black anodize.3 (.93) Material: 1. (.) Thick Aluminum Finish: See Table *Edges cut during the manufacturing process will be unfinished. See page 11 for more information For additional options see page 5 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 7

48 TO- Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 3 Space saving staggered fin heat sink Space saving staggered fin heat sink for vertical mounting TO- devices. Features solderable mounting tabs with triangular base for easy attachment to the PC board. Part Number Finish Hole for Tabs 3B-MTG Black anodize 3.1 (.1) 3PB-MTG Pre-black anodize* 3.1 (.1) *Edges cut during the manufacturing process will be unfinished. See page 11 for more information For additional options see page 5 Copper, space saving staggered fin heat sink for vertical mounting TO- devices. Features integrated solderable mounting tabs for easy attachment to the PC board. 5 Copper, space saving staggered fin heat sink Part Number Description Hole for Tabs 5DG Copper, space saving staggered fin heat sink with solderable tabs.5 (.1) 1 ø 3.1 x (.15) 5. (1.77). (.79) 13.3 (.55).3 (.5).9 (.35) 35. (1.37) 5. (1.) 1.7 (.) ø 3.1 (.15) THRU 17.7 (.7) page11.3 (.19).9 (.9) (1.5) 19.5 (.77) 3.9 (.15) 1.57 (.) 13. (.51) 1.7 (.5).7 (.15) Material: 1.7 (.5) Thick Aluminum Finish: See Table page11. (.75) Material: 1.7 (.5) Thick Copper Finish: Tin Plated For additional options see page Space saving twisted fin heat sink page11 Space saving twisted fin heat sink for vertical mounting TO- devices. Features solderable mounting tabs for easy attachment to the PC board Part Number Description Hole for Tabs 593B35G Space saving twisted fin heat sink with solderable tabs. (.11) POPULAR OPTIONS: 593B G Base part no. A Position Code Description Details A 3 Solderable tab for.9 plated thru hole Page 9 5. (.).75 (.17) 5. (1.) 35.5 (1.3) 1.51 (.5) C L. (.97) 5. (1.) 1. (.) ø 3.17 (.15) THRU TYP 1.3 (.7).1 (.3) Material: 1.7 (.5) Thick Aluminum For additional options see page USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

49 TO- Heat Sinks 55 Space saving staggered fin heat sink Space saving staggered fin heat sink for vertical mounting TO- devices. Features integrated solderable mounting tabs that can be twisted for attachment to the PC board. Heat sink is also available with tin plating for soldering directly to the PC board. Part Number Finish Hole for Tabs 55BG Black anodize.39 (.9) 55DG Tin plated.39 (.9) For additional options see page ø 3.17 (.15) THRU.9 (.35) 1.7 (.) 17.7 (.7). (.75) 19.5 (.77) 3.9 (.15) 1.57 (.).35 (.5) page (1.5) 1.7 (.5) Material: 1.7 (.5) Thick Aluminum Finish: See Table THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 595 Space saving twisted fin heat sink page11 Space savings twisted fin heat sink for vertical mounting TO- devices. Features staked on solderable mounting tabs for easy attachment to the PC board (1.5) 19.5 (.77) ø 3.17 THRU (.15). (.75) C L.35 (.5) Part Number Finish Hole for Tabs 595B3G Black anodize.39 (.9) 595U3G Unfinished.39 (.9) For additional options see page 17.7 (.7) 1.91 x 5.3 (.75) (.19) Material: 1.7 (.5) Thick Aluminum Finish: See Table USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 9

50 TO- Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 533, 5339, 53 Extruded heat sink with radial fins Extruded heat sink with radial fins and channel clip attach feature make device attachment easy. Includes clip and two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in three heights for TO- devices. Part Number A Dim Hole for Pins 533B55G 5. (1.).7 (.15) 5339B55G 3.1 (1.5).7 (.15) 53B55G 5. (.).7 (.15) For additional options see page (.) 1.9 (.7) 1.7 (.5) 53, 537, 53 High power extruded heat sink with large radial fins High power extruded heat sink with large radial fins and increased fin count for additional cooling capacity. Solderable pins allow vertical mounting without stress on the device leads. Available in three heights for TO- devices. Part Number A Dim Hole for Pins 53B5G 3.1 (1.5).7 (.15) 537B5G 5. (.).7 (.15) 53B5G 3.5 (.5).7 (.15) For additional options see page (.5) 11.1 (.37) ø.3 (.93) 5. (1.) 15. (.5) 3.93 (1.375) 19.5 (.75) (.5) (1.) ø 3.1 x.3 (.15) (.5) HIGH DITTIN.3 (.93) ø 1.7 x 1.19 (.7) (.1) SLOT TYP 9.91 (.39) 3.1 (.15) 3.9 (.15) 5. (1.).5 (.1) 11. (.) 1.91 (1.5).9 (.5) 7.9 (.31) ø 3. (.1) THRU page (.15).1 x (.95) 1.9 (.3) page11 1. (.5) CLIP 5.3 (.9) 1.5 (.) 3.1 (.15) Material: Aluminum Material: Aluminum MLAA Extruded channel style heat sink featuring serrated fins page11 Extruded channel style heat sink features serrated fins for increased cooling capacity. The base of the heat sink is notched to clear the device leads when mounted horizontally on the printed circuit card. Narrow channel accommodates a TO- device. Part Number Description MLAAG Extruded channel style heat sink (.79).15 (.5) 19.5 (.7) 7.9 (.95). (.3) 15. (.591) 1.3 (.). (.77) ø 3.15 (.1) THRU 5. (.9) Material: Aluminum 5 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

51 TO- TO- Heat Sinks 591 Plug in style heat sink featuring four spring action clips Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Available with solderable mounting tabs for both horizontal and vertical mounting to the PC board..1 (.3) 15. (.) (.5) (.1) 3.1 (.15) Part Number Description Figure Hole for Tabs 591BG Plug in style heat sink, no mounting tab A 591B31G With horizontal mounting tab A 1.73 (.) 591BG With vertical mounting tab B 1.75 (.9) For additional options see page FIGURE A 1. (.57) MAX 1.7 (.5) 1.7 (.5) Material:.1 (.3) Thick Aluminum FIGURE B (.) TAB.1 (.3) 1.7 (.5) 1.7 (.5). (.5) 1. (.57) MAX 1.7 (.5) THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5913 Plug in style heat sink featuring four spring action clips FIGURE A FIGURE B 1.7 (.5) TAB 1. (.) MAX 1. (.57) 1. (.) 3.15 (.1) 1. (.57) MAX Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Includes integrated standoffs to steady the heat sink during wave soldering. Available with solderable mounting tabs for vertical mounting to the PC board. 1.7 (.5) 19.5 (.75) 3.15 (.1).7 (.15) 1.7 (.5) 1.7 (.5) Material:.1 (.3) Thick Aluminum 19.5 (.75).1 (.3). (.5) 1.7 (.5) Part Number Description Figure Hole for Tabs 5913BG Plug in style heat sink with integrated standoffs, no mounting tab B 5913BG With Shur-Lock TM tab for vertical mounting A 1.73 (.) 5913BG With tab for vertical mounting B 1.75 (.9) For additional options see page USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 51

52 TO- TO- Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 57 Plug in style heat sink featuring four spring action clips Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Available with solderable mounting tabs for both horizontal and vertical mounting to the PC board. FIGURE A 19.5 (.75).13 (.3).19 (.15) 1.7 (.5). (.1) Part Number Description Figure Finish 57BG Slim plug in heat sink, no mounting tab A Black anodize 57VG Slim plug in heat sink, no mounting tab A AavSHIELD 3 57UG Slim plug in heat sink, no mounting tab A Unfinished 1. (.57) MAX 1.7 (.5) Hole for Tabs 57B31G With single tab for horizontal mounting A Black anodize 1.73 (.) 57V31G With single tab for horizontal mounting A AavSHIELD (.) 57U31G With single tab for horizontal mounting A Unfinished 1.73 (.) 57BG With single tab for vertical mounting B Black anodize 1.75 (.9) 57VG With single tab for vertical mounting B AavSHIELD (.9) 57UG With single tab for vertical mounting B Unfinished 1.75 (.9) 1.7 (.5) 19.5 (.75).1 (.3) FIGURE B Material:.1 (.3) Thick Aluminum Finish: See Table. (.5) TAB 1.7 (.5) 1.7 (.5) 1. (.57) MAX 1.7 (.5) B 57V 579U For additional options see page PF3, PF33, PF3, PF35, PF3 Plug in style heat sink features pre-blackened finish Plug in style heat sink features pre-blackened finish and two spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Available with solderable mounting tabs for both horizontal and vertical mounting to the PC board. FIGURE A Part Number Description Figure Dim A 1. (.1) 1.7 (.5) 19.5 (.7) 5. (.197). (.1) 7.5 (.95) PF3G Plug in style heat sink with solderable tab, vertical mount A. (.) 1. (.3) PF33G With vertical mount no tab A FIGURE B PF3G With solderable tab, horizontal mount B 1. (.3) PF35G With solderable tab, vertical mount A 9.5 (.37) 1. (.3) PF3G With solderable tab offset from center, horizontal mount C 1. (.3) *Edges cut during the manufacturing process will be unfinished. See page 11 for more information 19.5 (.7) TAB 1.3 (.51). (.1) ø3. (.11) 1. (.7) 1.7 (.5) 5.7 (.) 13. (.51) ø3. (.11) Material:.71 (.) Thick Aluminum Finish: Pre-Black Anodize* Hole for Tabs Case Temp Rise Above Ambient C. (.157) 13. (.51) 1.3 (.51) FIGURE C. (.157) 1.7 (.5) 19.5 (.7).5 (.11) 7.5 (.95).7 (.1) ø3. (.11) Thermal Resistance From Case to Ambient C/Watt 13. (.51) 5 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

53 TO- TO- Heat Sinks 59 Plug in style heat sink with folded back fins Plug in style heat sink with folded back fins for extra cooling capacity. Features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal thermal contact. Available with or without solderable mounting tabs for both horizontal and vertical mounting to the PC board. Part Number Description Figure 59BG Plug in style heat sink with no mounting tab A FIGURE A. (.1) 1.59 (.5).1 (.3) 1. (.55) Hole for Tabs 59B31G With horizontal mounting tab A 1.73 (.) 59BG With vertical mounting tab B 1.75 (.9) For additional options see page 5. (1.) 1.7 (.5) 1.7 (.5) C L 1.7 (.5) TAB FIGURE B 1.59 (.5).1 (.3) Material:.1 (.3) Thick Aluminum TAB 1.7 (.5) 5. (1.). (.5) 1.7 (.5) 1.7 (.5) THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES TV9, TV97 Hat section heat sink with twisted fins TO- TO-1 TO-7 Heat Sinks page11 Hat section heat sink with twisted fins is low profile and perfect for use on circuit cards with.5 spacing. The twisted fins increase air turbulence for better thermal performance. TV9 TV (.) 17. (.71) ø 3. (.1) 17. (.71) C L 13.5 (.531) Material:.99 (.39) Thick Aluminum Part Number A Dim TV9G 31.7 (1.) TV97G. (1.7) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 53

54 TO- TO-1 TO-7 Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 531 High rise style heat sink features twisted fins and Wave-On TM solderable mounts High rise style heat sink features twisted fins and Wave-On TM solderable mounts for easy attachment to the PC card. Models include thru holes on one side to attach devices using standard hardware and dittins with special slots on the other for easy device attachment using a convenient spring clip. Dual models use two dittins and clips to locate and attach devices. Part Number Description Device Figure A Dim Hole for Tabs 5311B1G Heat sink twisted fin TO-1, TO-7 1. (.3).75 (.17) 5311B15G With device clip #5 TO-1, TO-7 A 1. (.3).75 (.17) 531B1G Heat sink twisted fin TO- 1.9 (.7).75 (.17) 531B15G With device clip #5 TO- A 1.9 (.7).75 (.17) 5311B1G With two device clips # Dual TO-1, TO-7 B 1. (.3).75 (.17) 531B1G With two device clips # Dual TO- B 1.9 (.7).75 (.17) For additional options see page 53 High rise style heat sink features twisted fins and solderable tabs High rise style heat sink features twisted fins and solderable tabs for easy attachment to the PC card. Models include thru holes on one side to attach devices using standard hardware and dittins with special slots on the other for easy device attachment using a convenient spring clip. Dual models use two dittins and clips to locate and attach devices..5 (1.75) ø.95 THRU x (.11) RECOMMENDED HOLE PATTERN 3.13 (1.9) 7. (.3) 1.1 (.).5 (.1) 3. (.11) 5.7 (1.) (.59) (.59).9 (.9).7 (1.1) ø 3. (.1) 3. (.137).5 (.1) 3.1 (1.5) Part Number Description Device Figure A Dim Hole for Tabs 531B51G Heat sink twisted fin and solderable tabs TO-1, TO-7 1. (.3).95 (.11) 531B515G With device clip #5 TO-1, TO-7 A 1. (.3).95 (.11) 53B51G Heat sink twisted fin and solderable tabs TO- 1.9 (.7).95 (.11) 53B515G With device clip #5 TO- A 1.9 (.7).95 (.11) 531B51G With two device clips # Dual TO-1, TO-7 B 1. (.3).95 (.11) 53B51G With two device clips # Dual TO- B 1.9 (.7).95 (.11) For additional options see page.5 (1.75) 1.1 (.) 7..5 (.3) (.1) 3. (.11). (.17) 7.5 (.95) 1.99 (.59) BASE PART.13 (.95).5 (1.75) BASE PART ø 3. (.1) THRU 3. (.137) 1.99 (.59) FIGURE A CLIP 5. (.1) TYP ø.79 x.7 (.11) (.3) HIGH DITTIN 1.57 (.) 1.5 (.9) Material: 1. (.3) Thick Aluminum FIGURE A Material: 1. (.3) Thick Aluminum ø.79 x.7 (.11) (.3) HIGH DITTIN 1.5 (.9) or or (.5) (.).5 (.1) page11 FIGURE B 3.1 (1.5) CLIP page11 FIGURE B 3.1 (1.5) 3.1 (1.5) CLIP 5. (.1) 1.7 (.5) CLIP TYP. (.) Ø.79 x.7 (.11) (.3) X HIGH DITTIN 1.57 (.) 1.5 (.9). (.1) TYP ø.79 X.7 (.11) (.3) X HIGH DITTIN 1.5 (.9). (.1) TYP or or (.5) (.) 1.7 (.5). (.) 5 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

55 TO- TO-1 TO-7 Heat Sinks 53 High rise style heat sink features staggered fins and Wave-On TM solderable mounts High rise style heat sink features staggered fins and Wave-On TM solderable mounts for easy attachment to the PC card. Models include thru holes on one side to attach devices using standard hardware and dittins with special slots on the other for easy device attachment using a convenient spring clip Part Number Description Device A Dim 531B1G High rise style heat sink staggered fins TO-1, TO-7 1. (.3).75 (.17) 531B15G With device clip #5 TO-1, TO-7 1. (.3).75 (.17) 53B1G High rise style heat sink staggered fins TO- 1.9 (.7).75 (.17) 53B15G With device clip #5 TO- 1.9 (.7).75 (.17) For additional options see page 533, 5331, 533, 5333 Extruded heat sink with radial fins 3 1 Hole for Tabs 1.1 (.).5 (1.75).5 (.1) 3. (.11). (.17) 1.99 (.59).13 (.95).5 (1.75) ø 3. THRU (.1) 7.9 (.95) 7. (.3) 3. (.137) 1.99 (.59) 3.1 (1.5) CLIP 5 page (.).5 (.1). TYP (.1) 19.5 (.75) 1.5 (.9) 1.7 (.5). (.) ø.79 x.7 (.11) (.3) HIGH DITTIN Material: 1. (.3) Thick Aluminum page11 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Extruded heat sink with radial fins and clip attach feature makes device attachment easy. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in four heights for TO-, TO-1 and TO-7 devices. 533X 5331X 533X 5333X "B" NOTCH FOR CLIP x 1.7 (.5).3 x (.93) 5. (1.) "C" 3.9 (1.375) 39.1 (1.5) ø 3.1 X. (.15) (.5) HIGH DITTIN 3.9 x (.15) 13.5 (.53). (.) Part Number Device A Dim B Dim C Dim Hole for Pins 5331B551G TO-1, TO-7 5. (1.) 1.59 (.5) 17. (.7).7 (.15) 533B551G TO- 5. (1.) 1.9 (.7) 15. (.5).7 (.15) 53311B551G TO-1, TO (1.5) 1.59 (.5) 17. (.7).7 (.15) 5331B551G TO- 3.1 (1.5) 1.9 (.7) 15. (.5).7 (.15) 5331B551G TO-1, TO-7 5. (.) 1.59 (.5) 17. (.7).7 (.15) 533B551G TO- 5. (.) 1.9 (.7) 15. (.5).7 (.15) 53331B551G TO-1, TO (.5) 1.59 (.5) 17. (.7).7 (.15) 5333B551G TO- 3.5 (.5) 1.9 (.7) 15. (.5).7 (.15) For additional options see page 3 CLIP 51 Material: Aluminum USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 55

56 TO- TO-1 TO-7 Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES SW5, SW3, SW5, SW3 Extruded heat sink with unequal channel widths front and back can accommodate a TO-, TO-1, or TO-7 devices. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in three heights. Version without hole uses clip 591 (sold separately) to attach device. See page 97 for clip information. Extruded heat sink with unequal channel widths SW5 SW3 SW5 SW Part Number Description A Dim Holes SW5-G Extruded heat sink with unequal channel widths front and back 5. (.9) No 3. (.11) SW5-G With device mounting holes 5. (.9) Yes 3. (.11) SW3-G Extruded heat sink with unequal channel widths front and back 3. (1.9) No 3. (.11) SW3-G With device mounting holes 3. (1.9) Yes 3. (.11) SW5-G Extruded heat sink with unequal channel widths front and back 5. (1.9) No 3. (.11) SW5-G With device mounting holes 5. (1.9) Yes 3. (.11) SW3-G Extruded heat sink with unequal channel widths front and back 3. (.) No 3. (.11) SW3-G With device mounting holes 3. (.) Yes 3. (.11) 1 Hole for Pins.5 (.) 1.5 (.9) 5. (.9) 19.9 (.73) 15. (.591) 3.5 (1.35). (.79) page11. (.157).5 (.9) 5. (1.) SEE NOTE 1 NOTE 1: This hole not present in SW5 model ø3. (.1) TYP Material: Aluminum 597, 59, 599, 53 Extruded heat sink with large radial fins page11 Extruded heat sink with large radial fins features equal channel widths on both sides for single or dual device mounting. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in four heights for TO-, TO-1, and TO-7 devices. 597X 59X 599X 53X Part Number Device A Dim B Dim C Dim Hole for Pins "B" 3.1 (.15) 1. (.5) 5. (1.).9 (.5) 13.7 (.5) 5. (1.) 1.57 (.) "C" 3.9 (.15) x ø.3 (.93) x 5971B5G TO-1, TO-7 5. (1.) 1.59 (.5) 3. (.1).7 (.15) 597B5G TO- 5. (1.) 1.9 (.7) 3.17 (.15).7 (.15) 591B5G TO-1, TO (1.5) 1.59 (.5) 3. (.1).7 (.15) 59B5G TO- 3.1 (1.5) 1.9 (.7) 3.17 (.15).7 (.15) 17. (.7) 1.91 (1.5) 5991B5G TO-1, TO-7 5. (.) 1.59 (.5) 3. (.1).7 (.15) 599B5G TO- 5. (.) 1.9 (.7) 3.17 (.15).7 (.15) 531B5G TO-1, TO (.5) 1.59 (.5) 3. (.1).7 (.15) Material: Aluminum 53B5G TO- 3.5 (.5) 1.9 (.7) 3.17 (.15).7 (.15) For additional options see page 3 5 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

57 TO- TO-1 TO-7 Heat Sinks 533, 5335, 533, 5337 Extruded heat sink with large radial fins Extruded heat sink with large radial fins and channel clip attach feature makes device attachment easy. Includes clip and two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in four heights for TO-, TO-1, and TO-7 devices. 5335XX 533XX SEE NOTE XX 533XX SEE NOTE NOTE 1: Graph depicts single device models. Dual device models exhibit a 15% performance increase A "B" 3.17 (.15) 5. (1.) 5. (1.) 13.7 (.5) 5. (1.) VIEW A-A SINGLE HEAT SINK DEVICE 17. (.7) 1.91 (1.5) VIEW A-A DUAL HEAT SINK DEVICE 1.7 (.5) 17. (.7) 1.91 (1.5) ø 3.1 (.15) X. (.5) HIGH DITTIN x 3.9 (.15) x ø.39 (.93) page11 A 5.5 (1.1) REF 1.51 (.5) CLIP 5. (.) 7. (.3) Material: Aluminum THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Part Number Device Description A Dim B Dim Hole for Pins 5331B55G TO-1, TO-7 Extruded heat sink with radial fins and device clip #5 3.1 (1.5) 1.59 (.5).7 (.15) 533B55G TO- Extruded heat sink with radial fins and device clip #5 3.1 (1.5) 1.9 (.7).7 (.15) 5331B55G Dual TO-1, TO-7 With device clips #5 3.1 (1.5) 1.59 (.5).7 (.15) 533B55G Dual TO- With device clips #5 3.1 (1.5) 1.9 (.7).7 (.15) 53351B55G TO-1, TO-7 Extruded heat sink with radial fins and device clip #5 5. (.) 1.59 (.5).7 (.15) 5335B55G TO- Extruded heat sink with radial fins and device clip #5 5. (.) 1.9 (.7).7 (.15) 53351B55G Dual TO-1, TO-7 With device clips #5 5. (.) 1.59 (.5).7 (.15) 5335B55G Dual TO- With device clips #5 5. (.) 1.9 (.7).7 (.15) 5331B55G TO-1, TO-7 Extruded heat sink with radial fins and device clip #5 3.5 (.5) 1.59 (.5).7 (.15) 533B55G TO- Extruded heat sink with radial fins and device clip #5 3.5 (.5) 1.9 (.7).7 (.15) 5331B55G Dual TO-1, TO-7 With device clips #5 3.5 (.5) 1.59 (.5).7 (.15) 533B55G Dual TO- With device clips #5 3.5 (.5) 1.9 (.7).7 (.15) 53371B55G TO-1, TO-7 Extruded heat sink with radial fins and device clip #5 5. (1.) 1.59 (.5).7 (.15) 5337B55G TO- Extruded heat sink with radial fins and device clip #5 5. (1.) 1.9 (.7).7 (.15) 53371B55G Dual TO-1, TO-7 With device clips #5 5. (1.) 1.59 (.5).7 (.15) 5337B55G Dual TO- With device clips #5 5. (1.) 1.9 (.7).7 (.15) For additional options see page 3 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 57

58 TO- TO-1 TO-7 Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES BW3, BW5, BW3 Wide extruded heat sink with unequal channel widths on front and back can accommodate a TO-, TO-1, or TO-7 device. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in three heights. Versions without hole use clip 1 (sold separately) to attach device. See page 97 for clip information. Wide extruded heat sink with unequal channel BW3 BW5 BW Part Number Description A Dim Holes Hole for Pins BW3-G Extruded heat sink with unequal channel widths front and back 3. (1.9) No 3. (.11) BW3-G With device mounting hole 3. (1.9) Yes 3. (.11) BW5-G Extruded heat sink with unequal channel widths front and back 5. (1.9) No 3. (.11) ø 3. (.1) 1.7 (.5) 5. (1.) 3.9 (1.375) page11. (.79) 1. (.5).. (.11) (.157) 5. (1.) Material: Aluminum BW5-G With device mounting hole 5. (1.9) Yes 3. (.11) BW3-G Extruded heat sink with unequal channel widths front and back 3. (.) No 3. (.11) BW3-G With device mounting hole 3. (.) Yes 3. (.11) 513, 5131, 513, 5133 Extruded heat sink with radial fins page11 Extruded heat sink with radial fins feature equal channel widths on both sides for single or dual device mounting. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in four heights for TO-,TO-1, and TO-7 devices. 513X 5131X 513X 5133X Part Number Device A Dim B Dim C Dim D Dim E Dim Hole for Pins 5131B5G TO-1, TO-7 5. (1.) 1.59 (.5) 3. (.1) 17. (.7) 13.7 (.5).7 (.15) 513B5G TO- 5. (1.) 1.9 (.7) 3.17 (.15) 15. (.5) 11.1 (.37).7 (.15) 51311B5G TO-1, TO (1.5) 1.59 (.5) 3. (.1) 17. (.7) 13.7 (.5).7 (.15) 5131B5G TO- 3.1 (1.5) 1.9 (.7) 3.17 (.15) 15. (.5) 11.1 (.37).7 (.15) 5131B5G TO-1, TO-7 5. (.) 1.59 (.5) 3. (.1) 17. (.7) 13.7 (.5).7 (.15) 513B5G TO- 5. (.) 1.9 (.7) 3.17 (.15) 15. (.5) 11.1 (.37).7 (.15) 51331B5G TO-1, TO (.5) 1.59 (.5) 3. (.1) 17. (.7) 13.7 (.5).7 (.15) 5133B5G TO- 3.5 (.5) 1.9 (.7) 3.17 (.15) 15. (.5) 11.1 (.37).7 (.15) For additional options see page "B" 3.1 (.15) 1.7 (.5) 17. (.) "E" 5. (1.) 1.57 (.) "D" 3.9 (1.375) "C" x 3.9 (.15) x ø.37 (.93) Material: Aluminum 5 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

59 TO- TO- Heat Sinks 531, 5311, 531, 5313 Extruded heat sink with radial fins notched base Extruded heat sink with radial fins and notched base features equal channel widths on both sides and mounting holes to accomodate TO- and TO- devices. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Available in four heights Part Number A Dim Finish Hole for Pins 531B5G 5. (1.) Black anodize.7 (.15) 531V5G 5. (1.) AavSHIELD 3.7 (.15) 5311B5G 3.1 (1.5) Black anodize.7 (.15) 5311V5G 3.1 (1.5) AavSHIELD 3.7 (.15) 531B5G 5. (.) Black anodize.7 (.15) 531V5G 5. (.) AavSHIELD 3.7 (.15) 5313B5G 3.5 (.5) Black anodize.7 (.15) 5313V5G 3.5 (.5) AavSHIELD 3.7 (.15) For additional options see page (1.) 1.9 (.7) 13. (.53) 9. (.37) 1.7 (.5) 17. (.) 11.1 (.37) 5. (1.) 1.57 (.) 15. (.5) 3.9 (1.375) NOTE 1: This hole not present in 531 series page11 3x ø3.1 (.15) x 3.9 (.15) x ø.37 (.93) SEE NOTE 1 Material: Aluminum Finish: See Table THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES SW5-, SW3- Extruded heat sink with unequal channel widths page11 Extruded heat sink with unequal channel widths front and back can accommodate a TO- or TO- device. Includes two solderable mounting pins which permit vertical mounting and eliminate stress on device leads. Clip 591 (sold separately) can be used to attach device. See page 97 for clip information. SW5 SW Part Number Description A Dim SW5-G Extruded heat sink with unequal channel widths front and back 5. (.9) 3. (.11) SW3-G Extruded heat sink with unequal channel widths front and back. 3. (1.9) 3. (.11) Hole for Pins.5 (.) 1.5 (.9) 5. (.9) 19.9 (.73) 15. (.591). (.157).5 (.9) 3.5 (1.35). (.79) NOTCH 11mm DEEP 1.mm WIDE 5. (1.) NOTE 1: This hole not present in SW5 series SEE NOTE 1 ø3. (.1) TYP Material: Aluminum USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 59

60 TO- TO-1 TO-7 Multiwatt Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 39, 39, 399, High power extruded heat sink with large radial fins High power extruded heat sink with large radial fins and solderable shoulder pins allows vertical mounting without stress on the device leads. Available with shoulder pins to provide fixed clearance between the bottom of the heat sink and the board. Available in four heights for TO-, TO-1, TO-7and multiwatt devices Part Number Description A Dim Hole for Pins 39BG Extruded heat sink with large radial fins and straight pins 5. (1.).9 (.11) 39B-PG With solderable shoulder pins 5. (1.) 3.1 (.1) 39BG Extruded heat sink with large radial fins and straight pins 3.1 (1.5).9 (.11) 39B-PG With solderable shoulder pins 3.1 (1.5) 3.1 (.1) 399BG Extruded heat sink with large radial fins and straight pins 5. (.).9 (.11) 399B-PG With solderable shoulder pins 5. (.) 3.1 (.1) BG Extruded heat sink with large radial fins and straight pins 3.5 (.5).9 (.11) B-PG With solderable shoulder pins 3.5 (.5) 3.1 (.1) (.75) 3.9 (.15).1 (.7) 5. (1.) DETAIL A P MODEL ONLY. REF (.97) 5. (1.) 1.91 (1.5).7 (.31) 1.57 (.) page (.5).1 (.95) 5.9 REF (.1) ø 3.1 (.15) SEE DETAIL A P MODEL ONLY Material: Aluminum For additional options see page 5 3, 31, 3 High power extruded heat sink page11 High power extruded heat sink for SIP packages. Solderable pins allow vertical mounting without stress on the device leads. Available in three heights. Can also be used for dual TO-, TO-1, TO-7 and multiwatt devices Part Number Description A Dim Hole for Pins 3BG Extruded heat sink with solderable pins 5. (1.).9 (.11) 31BG Extruded heat sink with solderable pins 3.1 (1.5).9 (.11) 3BG Extruded heat sink with solderable pins 5. (.).9 (.11) For additional options see page (.7) 3.9 (.15).1 (.7) (.9). (.1) 9.93 (.391) 19. (.7) 33.5 (1.31) 31.7 (1.5) 1.5 (.).7 (1.13) 1.91 (1.5) ø 3.1 (.15) 5. (1.) Material: Aluminum USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

61 TO- TO-1 TO-7 Multiwatt Heat Sinks 37 Extruded heat sink for SIP packages Extruded heat sink for SIP packages. Solderable pins allow vertical mounting without stress on the device leads. Can also be used for dual TO-, TO-1, TO-7, and multiwatt devices. Part Number Description Hole for Pins 37BG Extruded heat sink with solderable pins.9 (.11) For additional options see page 5 YB3- High power flat back extruded channel style heat sink features a wide channel to accommodate several devices. Includes two solderable pins to allow vertical mounting without stress on the device leads. Can be used with TO-, TO-1, TO-7, and multiwatt devices (.7) 1. (.3). (.315) High power flat back extruded channel style heat sink Part Number Description Hole for Pins YB3-G High power flat back extruded heat sink 3. (.137) X. (.157) 1. (.3) 19. (.7). (.315) 17.5 (.9) Ø 3.1 THRU (.1) ø 3.1 (.15) X.3 (.9) SEE DETAIL A (.3) 3.1 (1.5) 3. (1.) 3.3 (1.5) 3. (1.). (.3) page11 page (1.5) 3.9 (.15).9 (.115) DETAIL A Material: Aluminum 3. (1.) X 3. (.11).7 (.15) Material: Aluminum.1 (.) THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 51, 511, 51 Flat back extruded heat sink featuring solderable pins Flat back extruded heat sink features solderable pins which allow vertical mounting without stess on the device leads. Available in three heights for TO- and TO-1 devices X 511X 51X "B".13 (.3) page11 # - 3 UNC THRU Part Number Device A Dim B Dim Hole for Pins 511B5G TO-1 5. (1.) 1.59 (.5).7 (.15) 3.9 (.15) 1.9 (.5).3 (.93) TYP 51B5G TO- 5. (1.) 1.9 (.7).7 (.15) 5111B5G TO (1.5) 1.59 (.5).7 (.15) 511B5G TO- 3.1 (1.5) 1.9 (.7).7 (.15) 1. (.) 3.5 (.13) 511B5G TO-1 5. (.) 1.59 (.5).7 (.15) 51B5G TO- 5. (.) 1.9 (.7).7 (.15) For additional options see page 3 1. (.) Material: Aluminum USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 1

62 TO-1 Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 59 Plug in style heat sink Plug in style heat sink requires no hardware to attach to the device. The four spring action clips apply even pressure eliminating gaps between the heat sink and device which rob thermal performance Part Number Description Hole for Tabs 591B3G High power plug in heat sink with folded back fins.39 (.9) and solderable mounting tabs For additional options see page 5931 Channel style heat sink with folded back fins Channel style heat sink with folded back fins for extra cooling capacity. The heat sink features solderable tabs for easy attachment to the PC board (.75) 1. (1.). (.5) 1.7 (.5) 5. (.) 1.7 (.5) 11.9 (.7).5 (1.5) 5. (1.97) C L.77 (.975) 3.1 (1.7) 5. (1.) 9.53 (1.95).9 (.9) ø3.1 THRU (.15).57 (.1) 5. (.).1 (.3).5 (.1) 1.7 (.5) 1. (.).1 (.3) Material: 1.7 (.5) Thick Aluminum page11 1. (.) 1.7 (.5) Part Number Description Hole for Tabs.9 (.35) 59311B3G Channel style heat sink with folded back fins.9 (.115) and solderable tabs Material: 1.7 (.5) Thick Aluminum POPULAR OPTIONS: 59311B G Base part no. A Position Code Description Details A 1 Kon-Dux TM pad Page A 3 In-Sil- TM pad Page For additional options see page 713 Copper slide on heat sink Copper slide on heat sink requires no hardware to attach the device. In addition, the copper heat sink is tin/lead plated to allow easy soldering to the PC board (1.5) 15.9 (.1) 1.51 (.5) Top cut away to show detail (.75) 3.1 (.15) 1.7 (.5) 1.7 (.5) 9.5 (.375).79 (.11) Part Number Description Hole for Tabs 713DG Slide on, channel style heat sink with integrated tabs.5 (.1) 5.53 (1.5) Material:.3 (.5) Thick Copper Finish: Tin Plated USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

63 TO- Heat Sinks 53 Low profile hat section heat sink Low profile hat section heat sink has a total height of.375 making it perfect for mounting to printed circuit boards with.5 centering between boards. Part Number Description 53BG Hat section heat sink For additional options see page 57 Low cost slide on heat sink Low cost slide on heat sink provides positive retention with an integral locking tab. The spring tension ensures excellent thermal contact for maximum performance. Requires no hardware to mount (.53) 9. (.37).5 (1.75) 1.1 (.1) ø3. (.1) THRU 7.7 (.7).3 (.) 1.1 (.) page11 NOTCH IS.1 WIDE X. DEEP 7.75 (.35) 9.5 (.375) ø.3 (.93) DITTIN 5.59 (.) 17.7 (.7) 1. (.577) Material: 1. (.) Thick Aluminum.35 (.5) THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Part Number Finish Material:.3 (.5) Thick Aluminum Finish: See Table 57BG Black anodize 57UG Unfinished 57, 579, 5797 Low cost slide on cooler heat sink FIGURE A FIGURE B ø.3 (.93). (.9) (.) 15. (.9) (.3) Low cost slide on cooler heat sink is easy to assemble to the device and requires no mounting hardware. Models have fins on both sides, or the left or right. Available with or without staked on solderable tab for easy board mounting (.99) 5.91 (1.) 1.7 (.).51 (.) 1.7 (.) REF TAB 1.57 (.) 9.5 (.3) Material:.3 (.5) Thick Aluminum 1.5 (.73) 1.9 (.75) 1.7 (.).51 (.) 1.7 (.) REF TAB 1.57 (.) 9.5 (.3) Note: Fins on Left or Right. Right hand fin model shown. Part Number Description Figure Hole for Tabs 57BG Low cost slide on cooler, no solderable tabs A 57B33G With solderable tabs A 1.91 (.75) 579BG With left side fin only, no solderable tabs B 579B33G With left side fin only and solderable tabs B 1.91 (.75) 5797BG With right side fin only, no solderable tabs B 5797B33G With right side fin only and solderable tabs B 1.91 (.75) For additional options see page USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 3

64 TO- Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 579, 5773, 577 Slim low profile channel style heat sink Slim low profile channel style heat sink is notched to accommodate the TO- center tab packages. Available in 3 heights. Part Number A Dim 579BG.35 (.5) 5773BG 9.53 (.375) 577BG 1.7 (.5) For additional options see page Space saving staggered fin heat sink Space saving heat sink features staggered fins for increased cooling efficiency. This verticle mount heat sink features integrated matte tin plated tabs to solder directly to the PC board. Part Number Description Hole for Tabs 3DG Space saving staggered fin heat sink with 3.1 (.1) integrated tin plated tabs 5. (.) 17.7 (.7). (.97) ø 3.1 THRU (.15) 13.3 (.55) 19.5 (.75) REF 5. (1.) 35.5 (1.3) 3.15 (.1) 3.1 (.15) page (.3).75 (.17) 13.1 REF (.5) Material: 1.7 (.5) Thick Aluminum page (.5) 1.7 (.5) Material: 1.7 (.5) Thick Copper Finish: Tin Plated, 7 Compact slide on heat sink FIGURE A 7. O.D. (.3) FIGURE B 7. O.D. (.3) Compact slide on heat sink makes assembly easy. The features a positive device catch to lock the heat sink to the device. Part Number Description Figure PBG With device catch A 7PBG Compact slide on heat sink B *Edges cut during the manufacturing process will be unfinished. See page 11 for more information. 15. (.) SECTION A A 1.59 (.5) REF.35 (.5) 1.1 (.1) 15. (.) Material:.3 (.5) Thick Aluminum Finish: Pre-Black Anodize* SECTION A A (.5) REF.35 (.5) 1.1 (.1) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

65 TO-1 Heat Sinks 5775 Slip on heat sink Slip on heat sink requires no hardware to attach to the device. Spring pressure ensures excellent retention. May be assembled before or after the device is attached to the board. Part Number 5775BG 5775UG TV Finish Black anodize Unfinished Narrow channel style heat sink features twisted fins for increased air turbulance for better cooling. Can be mounted horizontally or vertically Narrow channel style heat sink featuring twisted fins (.7).3 (.5) 7.7 (.31) C L 13.1 (.5).13 (.3). (.15) 19. (.79) 1.7 (.) Material:.3 (.5) Thick Aluminum Finish: See Table page11. (.) THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Part Number TVG Description Narrow channel style heat sink with twisted fins 19. (.79) 13. (.5) Material: 1.3 (.) Thick Aluminum PF73, PF73 Slip on heat sink FIGURE A FIGURE B 13. (.5) 3. (.1).1 (.319) 13. (.5).1 (.319) Slip on heat sink has locating features for simple device alignment. Spring action holds the device for good thermal contact. The tabbed version is made from tin plated copper and the no tab version is lightweight aluminum. 3. (.11). (.157) 11.5 (.53) Part Number Description Material Finish Figure PF73G Slip on heat sink Aluminum Black anodize B PF73G With solderable tabs Copper Tin plated A (.33) (.75) TAB 1.3 (.511) 3. (.139) 3. (.11). (.157) Rise Above Ambient C 11.5 (.53). (.33) 19.7 (.775) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 5

66 SIPS THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5 Plug in style heat sink Plug in style heat sink features four spring action clips to firmly hold the device to the heat sink ensuring maximum metal to metal contact. Available with or without solderable tabs for horizontal or vertical mounting to the PC board. FIGURE A Part Number Description Figure 51BG Plug in style heat sink, no solderable tabs B 3.99 (1.) Hole for Tabs 51B31G With solderable tab for horizontal mounting B 1.73 (.) 51B3G With solderable tabs for vertical mounting A.39 (.9) POPULAR OPTIONS: 51B G Base part no. A Position Code Description Details A Solderable Shur-Lock TM Tab for vertical mounting Page 91 TAB C L. (.9).1 (.3) 1.91 (.75).13 (.3) 5.3 (.19) 1.7 (.5) 5. (1.) Material: 1.7 (.5) Thick Aluminum FIGURE B 1.7 (.) 1.7 (.5) 15.. (.5) (.1) 1. C L (.75) 3.99 (1.) 5. (1.) (.5) For additional options see page 535 Channel style heat sink with integrated clip Channel style heat sink with integrated clip features strong spring tension and device locking catch to attach device securely to the heat sink. Available in two finishes (.). (.5) C L 1.7 (.5) 1. (.5) ø3.3 (.13) LOCKING CATCH 3.73 (.17) 9.5 (.3) 3.1 (.15) Material:.1 (.3) Thick Aluminum Finish: See Table Part Number Finish 5351UG Unfinished 5351BG Black anodize USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

67 SIPS 73 Channel style slide on heat sink featuring an integrated clip and device retaining tab Channel style slide on heat sink features an integrated clip and device retaining tab to hold the heat sink to the device. Small footprint consumes less board space. Part Number 73BG Description Channel style slide on heat sink 71 Copper channel style slide on heat sink featuring an integrated clip and solderable tabs Copper channel style slide on heat sink features an integrated clip and solderable tabs. Includes a device retaining tab to securely hold the heat sink to the device. Small footprint consumes less board space. Part Number Description Hole for Tabs 71DG Slide on heat sink with integrated clip.5 (.1) (.3) 9.5 (.3) 15. (.) 3. (.915) A A 3. (.915) MAX AT BASE A A (.).35 (.5) 15. (.).19 (.795) 1.9 (.75). (.1) MAX (.11) - (.15) 13. (.53) SECTION A A SECTION A A E DETAIL E 3.1 (.15) 1.5 (.5) 3.95 (.155) Material:.1 (.3) Thick Aluminum 17.7 (.7) 5. (.) 1.7 (.5) Material:.1 (.3) Thick Copper Finish: Tin Plated THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 5 Clip on heat sink featuring louvers Clip on heat sink features louvers to provide excellent cooling in natural or forced air convection. Spring action provides strong clamping force to securely hold the heat sink to the device. Available with or without solderable tabs. Part Number Description Hole for Tabs 1 ø 3.1 (.15) DITTIN TYP TAB. (.97) (1.5) 9.91 (.39) 9.1 (1.15) 5. (.3) 3.1 (.15) 9.91 (.39) 3.1 (1.7).1 (.3) Material: 1. (.) Thick Aluminum 5BG Clip on heat sink. no solderable tabs 5B35G With solderable tabs for vertical mounting. (.11) For additional options see page USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 7

68 TO-9 Heat Sinks 575, 5753, 575 Low cost slip on heat sink THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Low cost slip on heat sink features an expandable collar that tightly grips the device meaning no extra mounting hardware is required. Three heights to choose from. Part Number A Dim 575BG 1.9 (.7) 5753BG. (.97) 575BG 3.99 (1.) (.) 5.59 (.) Material:.3 (.5) Thick Aluminum 9F Low cost brass clip on heat sink Low cost brass clip on heat sink requires no hardware to attach to the device. Includes integrated tabs that can be soldered or twisted to attach the heat sink to the board reducing stress on the device leads. Rise Above Ambient C Air Velocity Feet Per Minute Heat Dissipated Watts 1 5 Surface to Ambient C/Watt 13. (.53) 1. (.39) 13.7 (.539) 1.1 (.) 11. (.9). (.1).7 (.39).5 (.335).5 (.9) Material:.3 (.15) Thick Brass Finish: Unfinished Part Number Description Hole for Tabs 9FG Brass clip on heat sink 1.73 (.) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

69 TO-3 Heat Sinks 53 Two piece heat sink Two piece heat sink adds extra cooling in the same amount of board space as other solutions. Base and top can be ordered separately. øx.7 (.1) THRU 1.9 (.3) 5. (.15).3 (.171) Part Number Description Figure 537BG Two piece heat sink assembly, base and top 53BG Top only B 539BG Base only A For additional options see page FIGURE A øx 5.5 (.1) THRU 5791 Space saving expandable collar heat sink 1.9 (.5) 3.15 (1.17) 3. (1.53) (1.5) 1.7 (.5) FIGURE B 1.17 (.55) 3.71 (.1) THRU TYP Material: 1. (.3) Thick Aluminum 9.7 (.35) (1.53) 3.5 (1.) 1.3 (.) page11. (.1) THRU TYP 7.7 (.31).1 (.11) 1 THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Space saving expandable collar heat sink has the same footprint as the device being cooled meaning no extra board space is required to fit the heat sink. The expandable collar tightly grips the device meaning no extra hardware is required. May also be used with any diamond or square basket heat sink to form a two piece heat sink for additional cooling. Available in conductive AavSHIELD 3 or black anodize finish. Part Number Finish 57913BG Black anodize 57913VG AavSHIELD 3 5 Low profile hat section heat sink (1.17) 39.1 (1.5) REF ø. x.3 (.1) (.19) SLOT.57 (1.15).1 (.7) 9.91 (.39) Material: 1.7 (.5) Thick Aluminum Finish: See Table page11 Low profile hat section heat sink is ideal for applications where low component heights are required such as card cages with PCBs mounted on.5 centers. Part Number Description 53BG Low profile hat section heat sink For additional options see page (1.) x ø 5.5 (.1) THRU 1. (.7) 3.15 (1.17) C L 1 5. (.) 15. (.593) C L 5. (.15) 1.9 (.3) x ø.7 (.1) THRU 9.5 (.375).5 (1.75) Material: 1.7 (.5) Thick Aluminum USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 9

70 TO-3 Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 575, 5757, 575, 5759 Space saver diamond shaped basket heat sink Space saver diamond shaped basket heat sink featuring a narrow base with slanted fins to increase air turbulence in natural and forced convection applications. Made from heavy gauge material. Four heights to choose from. Part Number A Dim 5753BG 1.7 (.5) 57573BG 19.5 (.75) 5753BG 5. (1.) 57593BG (1.5) POPULAR OPTIONS: 575_3B G Base part no. A B Position Code Description Location Details A 1 Kon-Dux TM pad Page A 3 In-Sil- TM pad Page B 1-3 Wave-On TM threaded insert Hole X Page 9.1 stand off For additional options see page C L "X" C L 1 "X" 5. (.15) 1.9 (.3) 3.77 (1.9) ø.7 (.1) TYP 15.7 (.59) page (1.17) 1.3 (.7) 5.5 (.1) TYP 1. (1.3) Material:.9 (.9) Thick Aluminum 513, 51, 515, 51 Low cost diamond shaped basket heat sink page11 Low cost diamond shaped basket heat sink with straight fins. High fin count enhances efficiency. Four heights to choose from. Part Number A Dim 5133BG 1.7 (.5) 513BG 19.5 (.75) 5153BG 5. (1.) 513BG (1.5) (.59) 3.15 (1.17) 1.3 (.7) C L "X" "X" ø.75 (.17) TYP ø5.5 (.1) TYP 7.75 C L (1.) AT BASE 35.5 (1.) 5. AT BASE (.15) 1.9 (.3) Material: 1. (.3) Thick Aluminum POPULAR OPTIONS: 51_3B G Base part no. A B C Position Code Description Location Details A 1 Kon-Dux TM pad Page B 1-3 Wave-On TM threaded insert.1 stand off Hole X Page 9 C -3 x.35 Solderable stud Hole X Page 9 For additional options see page 7 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

71 TO-3 Heat Sinks 5197, 519, 5199, 51 Heavy gauge square basket heat sink Heavy gauge square basket heat sink provides excellent performance by using 1/ thick aluminum to maximize efficiency. Available in heights. Part Number A Dim 51973BG 3.1 (1.5) 5193BG.5 (1.75) 51993BG 5. (.) 513BG 31.1 (1.5) POPULAR OPTIONS: 5 _3B G Base part no. A B Position Code Description Location Details A 1 Kon-Dux TM pad Page B 1-3 Wave-On TM theaded insert.1 stand off Hole X Page 9 For additional options see page (.1) ø.75 (.17) C TYP L 15.9 (.59) 1. (.) "X" C L 1 "X" ø 5.5 (.1) TYP 3. (1.3) 5. (.15) page (.7) (1.17) 1.9. (.3) BASE Material: 3.17 (.15) Thick Aluminum (1.55) THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 59, 579 Square basket heat sink features folded back fins page11 Square basket heat sink features folded back fins to increase surface area and power dissipation. Two heights are available ø.3 (.19) THRU TYP 1.9 (.3) C L 5. (.15) 1.7 (.7) 3.3 (1.19) C L ø 5.59 THRU (.) TYP (.595) 7.9 (1.9) REF.35 (.5) REF ø 3. THRU (.1) TYP. SQ. (1.3) REF Part Number A Dim 593BG 33.7 (1.31) 5793BG 5. (1.) Material: 1. (.3) Thick Aluminum POPULAR OPTIONS: 5_93B G Base part no. A Position Code Description Details A 1 Kon-Dux TM pad Page A 3 In-Sil- TM pad Page For additional options see page USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 71

72 TO-3 Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 51, 5, 53, 5 Square basket heat sink featuring slanted fins Square basket heat sink featuring a slanted fin design for increased air turbulence and four integrated mounting holes. Four heights to choose from. Part Number A Dim 513BG 1.7 (.5) 53BG 19.5 (.75) 533BG 5. (1.) 53BG (1.5) POPULAR OPTIONS: 5_3B G Base part no. A Position Code Description Details (1.17) ø 5.5 (.1) TYP 5. (.15) 1.9 (.3) C L (1.5) ø 3.1 (.15) THRU TYP ø.7 (.1) TYP CL page (.593) 1.3 (.7) Material:.9 (.9) Thick Aluminum 5.97 SQ. (1.1) A 1 Kon-Dux TM pad Page A 3 In-Sil- TM pad Page For additional options see page 551, 553, 55 Square basket heat sink featuring straight fins page11 Square basket heat sink features straight fins and.9 thick aluminum for increased cooling capacity. Three heights to choose from ø 5.5 (.1) TYP 1.9 (.3) "X" C L 1 5. (.15) "X" ø.7 (.1) TYP C L 1.3 (.7) 15. (.593) 3.15 (1.17) 5.1 (1.7) Part Number A Dim 5513BG 1.7 (.5) 5533BG 5. (1.) 553BG (1.5) Material:.9 (.9) Thick Aluminum POPULAR OPTIONS: 55_3B G Base part no. A Position Code Description Location Details A 1-3 Wave-On TM threaded insert.1 stand off Hole X Page 9 For additional options see page 7 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

73 TO-3 Heat Sinks 571, 57, 573, 57 Square basket heat sink featuring slanted vane fins Square basket heat sink features slanted vane fins for efficient heat dissipation. Air movement from any direction is diverted into the center of the heat sink to create turbulence and improve heat transfer. Four heights to choose from. Part Number A Dim 5713BG 1.7 (.5) 573BG 19.5 (.75) 5733BG 5. (1.) 573BG (1.5) POPULAR OPTIONS: 57 _ 3B G Base part no. A B Position Code Description Location Details A 1 Kon-Dux TM pad Page B 1-3 Wave-On TM theaded insert Hole X Page 9.1 stand off ø 5.5 (.1) TYP 1.3 (.5) 1.9 (.3) 1.3 (.5) 5. (.15) "X" C L 1 "X" 1.3 (.7) ø.77 (.1) TYP (1.17) Surface to Ambient C/Watt C L 15.9 (.59) page (1.1) REF Material:.9 (.9) Thick Aluminum THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES For additional options see page PF53, PF5, PF57 Diamond shaped heat sink 3. (.13) DIA.9 (.9) Approx DIA.(.315) area flat around holes 3.15 (1.19) CTRS. (1.) Diamond shaped heat sink is the same profile as the device which saves space on the board. This rugged design is made from cast aluminum and is available in three different heights. DIA. (.15).1 (.11) TYP ().9 (1.) Material: Cast Aluminum Part Number A Dim PF53G 1.5 (.9) PF5G 19. (.7) PF57G 5. (.9) PF53 PF5 PF USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 73

74 TO- Heat Sinks THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 517, 51, 519, 5 Low cost diamond shaped basket heat sink Low cost diamond shaped basket heat sink with straight fins. High fin count enhances efficiency. Four heights to choose from. Part Number A Dim 517BG 1.7 (.5) 51BG 19.5 (.75) 519BG 5. (1.) 5BG (1.5) (.9) 1.19 (.).5 (.1) C L 1. BASE 5. (.).5 (.1) ø 3.9 (.15) TYP C L page BASE Material: 1. (.3) Thick Aluminum 579 Space saving expandable collar heat sink Space saving expandable collar heat sink has the same footprint as the device being cooled meaning no extra board space is required to fit the heat sink. The expandable collar tightly grips the device (.1) 13.7 (.5) ø11. (.).3 (.9) 31. (1.) 9.7 (.35) ø3.9 x.95 (.15)(.195) SLOT. (.175) Material: 1.7 (.5) Thick Aluminum Finish: See Table Part Number Finish 579BG Black anodize 579VG AavSHIELD 3 7 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

75 TO-5 Heat Sinks 571, 57, 573, 57, 575 Snap on cooler heat sink Snap on cooler features easy no tools installation. Folded back fins provide maximum surface area while preserving valuable board space. Part Number A Dim 5715BG 3.9 (.15) 575BG.35 (.5) 5735BG 1.7 (.5) 575BG 19.5 (.75) 5755BG 5. (1.) ø.3 (.31) 1. (.3) 1.3 (.395) (.5) Material:.3 (.5) Thick Aluminum THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES 1,, 3 Space saving expandable heat sink Space saving expandable heat sink features a collar that tightly grips the device meaning no extra hardware is required. Heat sinks are constructed of pre-black anodize material to lower cost. Part Number A Dim # Fins 1PBG.35 (.5) (.5) 3.51 (1.) ø.3 I.D. (.31) PBG 1.7 (.5) 3PBG 19.5 (.77) 3 * Edges cut during the manufacturing process will be unfinished. See page 11 more more information Material:.3 (.5) Thick Aluminum Finish: Pre Black Anodize* 5F Low cost push on heat sink Low cost push on heat sink uses spring pressure to firmly grip the device case creating a good thermal interface. Part Number Description Rise Above Ambient C ø 1. (.3) ø 7.9 (.311) 1.7 (.5) Material: Aluminum 5FG Low cost push on heat sink USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 75

76 TO-5 Heat Sinks 357, 3 Extruded collar style heat sink with radial fins THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Extruded collar style heat sink with radial fins. The split collar design provides a press fit between the transistor and the heat sink creating an excellent thermal conduction path. Available in two heights. Part Number A Dim 3575BG.35 (.5) 35BG 9.53 (.375) , 3 Extruded collar style heat sink with swept back fins Extruded collar style heat sink with swept back fins for increased surface area in a small volume. The split collar design provides a press fit between the transistor and the heat sink creating an excellent thermal conduction path. Available in two inside diameters (.5) ø.7 (.31) THRU.35 (.5) 1.7 (.5) Material: Aluminum Material: Aluminum Part Number A Dim 315BG.7 (.31) 35BG 7.75 (.35) 33 Extruded collar style heat sink with mounting hole Extruded collar style heat sink with mounting hole for hardware attachment to the circuit card. The heat sink includes a mount boss that will accept a - screw for secure mounting in high vibration environments. The split collar design provides a press fit between the transistor and the heat sink creating an excellent thermal conduction path ø. (.31) ø 3.17 (.15) 19.5 (.75) R 7. (.3).35 (.5) Material: Aluminum Part Number Description 335BG Extruded collar style heat sink with mounting boss 7 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

77 Axial Lead Devices Copper heat sink for axial lead devices Copper heat sink for axial lead device requires no extra board space to mount. One lead of the heat sink is soldered to the device while the other solders to the PC board. Available in two finishes. Part Number Description Finish UG Heat sink for axial lead device Unfinished See figure A DG Heat sink for axial lead device Tin plated* See figure A * See page 11 for more information Hole for Tabs 15. REF (.) 5. (1.) C SYM L 1. (.559) FIGURE A.3 (.) 15. (.).3 (.93) 5. (1.).35 BASE 3. (1.) REF 1.9 (.75) DIA as required for lead size 7.3 (1.75) 1.7 (.5) Material:.53 (.1) Thick Copper Finish: See Table THRU HOLE DISCRETE SEMICONDUCTOR PACKAGES Bridge Rectifiers, 3, Square basket style heat sink for bridge rectifiers Square basket style heat sink for bridge rectifiers uses no additional board space. Available with three different mounting hole diameters (1.5).9 (1.) SQ 15. (.) Material: 1.7 (.5) Thick Aluminum Part Number A Dim BG 3.1 (.1) Dia Thru 3BG.1 (.13) Dia Thru BG.77 (.1) Dia Thru USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 77

78 OPTIONS ACCESSORIES CONTENTS Thermal solutions go beyond the heat dissipator itself. Aavid Thermalloy offers a total solution package, which includes a number of options and accessory items described in this section of the catalog. A total thermal solution includes an efficient thermal interface and means of mechanical attachment. Aavid Thermalloy has a full-line of interface materials that can be pre-applied or supplied as an accessory item. Mechanical assembly options include attachment of semiconductors to heat sinks, heat sinks to printed circuit boards, and heat sinks to sockets of CPUs. Aavid Thermalloy offers the most complete line of value added options of any supplier in the industry. Our full line of accessories includes mounting kits, shoulder washers, insulators, mounting pads, and various grease products and epoxies, which are sold separately, and can be used with a variety of Aavid heat sinks. This section will provide the most complete solution to your thermal requirement. CONTENTS How to decipher or construct an Aavid 1 digit part number... How to decipher or construct a "Thermalloy" origin part number... 1 Indexes... Interface Materials Pads In-Sil- TM Pads... Kon-Dux TM /Grafoil Pads... Hi-Flow Pads... 7 Alignment Pads... 7 Double Sided Tape Options (factory applied) T1... T5R... T1... T11... T1R... Labor Saving Heat Sink to Board and Device to Heat Sink Mounts Wave-On TM Mounts... 9 Semiconductor Mounts... 9 Shur-Lock TM Tabs Solderable Staked on Tabs Solderable Tabs Solderable Pins... 9 Solderable Nuts... 9 Clinch Nuts Solderable Studs... 9 Device Studs... 9 Clips Aavid Kool-Klips TM Thermal Clips USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]

79 CONTENTS Accessories TO-/TO Insulating Shoulder Washers Polyphenylene Sulfide (PPS) Shoulder Washers... 1 Nylon Shoulder Washers...1 Insulators Thermalfilm TM Polymide Plastic Films...11 Thermalfilm TM / Thermalfilm TM MT... 1 Mica, Thermalsil TM lll Aluminum Oxide Ceramic Insulators... 1 Stanchion Pads...15 Insulating Covers TO-3 Insulating Covers... 1 Teflon-Filled Acetal Insulators... 1 Teflon-Filled Acetal Bushings...1 Pads (TO-5, TO-1, IC, Universal, TO-1 Lead Conversion, Lead Conversion) Finishes...11 Card Ejectors Snap-On Ejectors Standard Ejectors OPTIONS ACCESSORIES CONTENTS Thermal s and Epoxies Sil-Free TM Ther-O-Link TM Ultrastick TM ThermalCote TM ThermalCote TM II Ther-O-Bond TM Ther-O-Bond TM Ther-O-Bond TM Thermalbond TM USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 79

80 How to decipher an Aavid standard 1 digit part number HOW TO DECIPHER A 1 DIGIT PART NUMBER Aavid Thermalloy's standard product line in most cases consists of a 1-digit part number sequence. In most standard offerings, Digits 1 through, define the model basic part number. Digits 5 and designate the package style that a particular heat sink is designed to cool. The 7th digit determines the finish, and the th identifies the interface material, if one can be used for that particular style heat sink. The 9th and 1th digits define the PC board mounting method, and the 11th and 1th digits define the method of attachment of the package to the heat sink. For digits,9,1,11 and 1, the absence of any of those options is always designated by a zero in those positions. Important NOTE: The 1 digit part number sequence is a general format. Due to the different variations and styles of heat sinks, we have included an Option Index on pages to show available options and accessories for the products covered in this catalog. Standard board level: To order most Aavid Thermalloy heat sinks, you must use a 1 digit part number using the following options: Digits 5-: Package style CODE DEVICE Blank 1 TO-1 TO-, TO-1, TO-17 3 TO-3 TO- 5 TO-5, TO-39 TO- TO-7 1 Multiwatt/SIP 1 Dual TO-1 Dual TO- Digits 9-1: PC Board mounting Solderable Wave-On mounts CODE STAND-OFF THREAD 1.1 #-3.1 #- 3.5 #- *.1 # # mm 9. # #-3 *.9 PCB (others. ) For additional information see page 9 Digits 11-1: Package mounting 57 B 37 G A B C D E F G Digit 7: Finish CODE DESCRIPTION B Black Anodize D Solderable 1% Tin Finish J Pre-Black Anodize M Green Anodize U Unfinished V AavSHIELD 3 W Black Anodize w/black Paint For additional information see page 11 Solderable pins for board mounted extrusions CODE DESCRIPTION 1 Solid Pin with Stand Off Shoulder.5 5 Solid Solderable Pin For additional information see page 9 Solderable nut CODE DESCRIPTION LENGTH 13 SNE- -3 UNC-B.35 1 SNE-1 - UNC-B.35 For additional information see page 9 A = Base Part Number B = Package Style C = Finish D = Interface Material E = PC Board F = Package G = RoHS Compliant Digit : Interface material CODE DESCRIPTION None 1 One Kon-Dux Pad Two Kon-Dux Pads 3 One In-Sil- Pad Two In-Sil- Pad 7 One Hi-Flow Pad Two Hi-Flow Pads For additional information see pages and 7 Solderable staked on **tabs CODE DESCRIPTION Shur-Lock Tab (.13 for. PC Boards) 31 Centered Horizontal (.5 W x.13 L) 3 Centered Horizontal (.5 W x.13 L) 33 Centered Vertical (. W x.3 L) 3 Vertical Pair L R (.75 W x.17 L) 35 Vertical Pair L R (.97 W x. L) 3 Centered Vertical (.1 W x.15 L) 37 Centered Step (. W x.5 L with.15 wide step) 39 Centered Vertical (.5 W x.375 L) Centered Vertical (.5 W x.5 L) 3 Centered Step (.5 W x.375 L) Centered Vertical (. W x. L) 53 MT Tab Vertical Pair (.9 W x.15 L) 5 MT Tab Vertical Pair (.9 W x.15 L) 55 MT3 Tab Vertical Pair (.9 W x.15 L) 5 Bifurcated Tab Vertical Pair (.11 W x.15 with.19 step) 57 Bifurcated Tab Vertical Pair (.11 W x.15 with.1 step) For additional information see pages ** For additional tab options, please contact Application Engineering at (3) -99 Semiconductor mounts CODE DESCRIPTION LENGTH 1 #-3 Female #- Female 3 M-3 Female #-3 Male.3 5 #- Male.3 For additional information see page 9 Standard clips Kool-Klips Sold separately CODE PART# For additional information see page 97 Thermal clips Factory applied to heat sink CODE PART# 3 TC-1 33 TC-1 3 TC TC-1 For additional information see page 9 Studs CODE DESCRIPTION LENGTH SE- Stud #-3.5" 7 SM-3 M-3 Male.35 SE-1 Stud #-3.35" 9 SE-3 Stud #-.35" 11 SF-1 M3 x.5.3" 1 SE- Stud #-3.35" 17 SM-1M-3 Male.35" For additional information see page 9 Clinch nuts CODE DESCRIPTION 1 CNE- - Clinch nut 13 CNM-1 M3 X.5 Clinch nut For additional information see page 95 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]

81 How to decipher a Thermalloy origin part number? Aavid Thermalloy features a variety of Thermalloy origin standard products that consist of a different part number sequence than the standard Aavid 1 digit part numbering system. In most cases, digits 1 through, designate the basic model number of the heat sink. Digits 5-, designate the finish of the heat sink. Digits -13 can designate any number of different options that come with a specific model number. (Please refer to Option Index D on page 5 to see Aavid Thermalloy s offerings per base number.) To order most Thermalloy origin heat sinks you must use the basic part numbering system below: Standard board level: 1 - G A B C Popular finishes* (followed after base number in location B above) B=Black Anodize PB= Pre-Black Anodized D=Tin Plated U=Clean, No Finish V=AavSHIELD 3 *For additional information see page 11 D E A = Model Number B = Finish C = Productivity Enhancement (if applicable) D = Second Productivity Enhancement (if applicable) E = RoHS Compliant Suffix Popular productivity enhancing options: Digits (Figure C-D above) P_= Solderable Roll Pins (see page 9) TC = Thermal Clip (see page 9) CNE = Clinch Nuts (see page 95) CNM_= Clinch Nuts Metric (see page 95) MT= Tabs (see page 93) 3-CL3,1-CL11 = Alignment Pad (see page 7) SE-_= Solderable Studs (see page 9) SF_= Studs (see page 9) G_= Grafoil Pad (see page ) SNM_= Solderable Nuts Metric (see page 9) SNE= Solderable Nuts (see page 9) BGS_= BGS Clip (page 1) HOW TO DECIPHER A THERMALLOY ORIGIN PART NUMBER Note: For a wide range of part number specific options, please see our Aavid Option Index D on page 5 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected] 1

82 Option Index A Available option codes for Aavid 1 digit part numbers. For additional information on option codes see "How to decipher an Aavid 1 digit part number" on page. To find the appropriate Option Index for a selected part number please refer to the main product section in the front of the catalog or "How to use this catalog" on page. Ordering Codes Base part Finishes Solderable tabs Clips Wave-On TM mounts Kondux TM pads In-Sil- TM pads Hi-Flow pads Semiconductor mnts Studs (page 11) (page 91 93) (page 97) (page 9) (page ) (page ) (page 7) (page 9) (page 9) OPTION INDEX 51 B U B U B U B U J B U J 57 B U J V B U J V B U V B U B U B U B U B U B U J V B U J B U V B U B U B U B U B U B U B U J D B U B U J D 3 59 B U B U B U B U V B U B U B U B U D 5751 B U V B U V B U V B U D B U V B U V B U J V B U V 57 B U V B U 579 B U 579 B U B U B U B U B U B U B U B U V B U B U V USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]

83 Option Index B Available Option codes for Aavid 1 digit part numbers. For additional information on option codes see "How to decipher an Aavid 1 digit part number" on page. To find the appropriate Option Index for a selected part number please refer to the main product section in the front of the catalog or "How to use this catalog" on page. Ordering Codes Base part Finishes Clips Kondux TM pads In-Sil- TM pads Hi-Flow pads Semiconductor mounts Solderable pins Studs Clinch nuts (page 11) (page 97 9) (page ) (page ) (page 7) (page 9) (page 9) (page 9) (page 95) 5131 B U B U B U B U B U B U V B U B U V B B B B B B B U B U B U V B U V B U V B U V B B B B U B U B U B U B U B U B U B U B B B B B B B B B B B B B B B B B U B U B U B U B U V B U B U B U B U OPTION INDEX USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 3

84 Option Index C Available option codes for Aavid 1 digit part numbers. For additional information on option codes see "How to decipher an Aavid 1 digit part number" on page. To find the appropriate Option Index for a selected part number please refer to the main product section in the front of the catalog or "How to use this catalog" on page. OPTION INDEX Base part Finishes Wave-On TM mounts Kondux TM In-Sil- TM Semiconductor Solderable Solderable Solderable (page 11) pads pads mounts tabs nuts studs (page 9) (page ) (page ) (page 9) (page 91 93) (page 9) (page 9) 513 B U B U B U B U B U B U B U V B U V B U B U B U B U B U B U B U B U V B U V B U V 539 B U V 51 B U B U B U V B U B U V B U B U B U B U V B U V B U B U V B U V B U B U B U V B U 5 Ordering Codes 579 B U B U B U B U B U USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]

85 Option Index D Available option codes for Thermalloy origin part numbers. For additional information on option codes see "How to decipher a Thermalloy Origin part number" on page 1. To find the appropriate Option Index for a selected part number, refer to the main product section in the front of the catalog or "How to use this catalog" on page. Ordering Codes Base Finishes Clips Solderable Device Clinch Solderable Alignment Grafoil part tabs studs pins mtg. studs nuts nuts pads pads (page 11) (page 93) (page 9) (page 9 9) (page 9) (page 95) (page 9) (page 7) (page ) 1 B U PB SF1 CNM1 G5 B U PB SF1 SF CNM1 5 PB D TC-1 SF1 SF3 CNE G5 19 B U PB MT MT5 TC-1 SE3 SE1 SF1 CNE G5 11 B U PB MT SE1 SM3 CNE 5 B U PB MT TC-1 SF1 G5 3 B U PB D 3 B U PB MT MT3 MT5 TC-1 SF1 G5 3 B U PB MT MT5 MT G5 39 B U MT 37 B P 3 B P CNE 39 B P P3 CNM1 CNM 39 B TC- P CNE CNE3 G7 399 B TC- P CNM G7 B P 719 B U PB MT MT SE3 SF1 SNM1 7 B U MT MT MT5 MT TC-1 TC-11 TC-1 SE3 CNM1 CNE 3-CL3 G5 G 71 B U MT MT5 MT TC-1 TC-11 TC-1 CNE 3-CL3 G5 7 B U PB MT MT5 TC-1 TC-11 TC-1 SE3 SF1 1-CL11 3-CL3 73 B U MT MT5 TC-1 TC- TC-7 TC-1 SNE G 75 B U MT MT3 MT TC-1 SE3 3-CL3 OPTION INDEX USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected] 5

86 Interface Material/Pads In-Sil- TM These silicone based pads provide both thermal conductivity and electrical isolation. In-Sil- TM pads have a fiberglass carrier that withstands the rigors of assembly, harsh environments and aging under continuous use. In-Sil- TM pads install faster than traditional mica and grease and will not contaminate solder baths. Screw mounting is recommended to achieve the best thermal performance. TO-3 TO- TO (1.5) X ø 3.5 (.1) 19.5 (.75) 1.7 (.5) 3.73 DIA (.17) 1.3 (.53) 1. (.) 1. (.7).9 DIA (.1) 1.7 (.) INTERFACE MATERIALS example 1 digit part 57B _ G Ordering code X ø.3 (.93) The shape and hole pattern of the heat sink will determine the shape and hole pattern of the pad. If you are ordering a heat sink which mounts to a semiconductor on both sides, the ordering code for two pads should be used. To order additional In-Sil TM pads separate, or factory applied variations please contact an Aavid sales rep for inquiries. Ordering code Description No pads 3 One In-Sil- TM pad.9 (1.1) MATERIAL PROPERTIES Color Grey Thickness.1 (.7) Breakdown voltage 35 Dielectric constant 5.5 TO-3 TO- TO-1 Thermal resistance (approx.) Screw size Torque in lbs Two In-Sil- TM pads KonDux / Grafoil Conducta-Pad** Kondux interface pads are a cost effective alternative to thermally conductive grease compounds. Kondux pads are electrically conductive and ideal for use with small, discrete semiconductors. Aavid pre-applies Kondux to your heatsink to enhance heat conductance from the semiconductor case and speed your manufacturing process. Figure A 1.91 (1.5) X ø 3.5 (.1) Figure B "B" "C" example 1 digit part 57573B _ G Ordering code The shape and hole pattern of the heat sink will determine the shape and hole pattern of the pad. If you are ordering a heat sink which mounts to a semiconductor on both sides, the ordering code for two pads should be used. X ø.3 (.93).9 (1.1) Ordering code Device Figure Dim "B" Dim "C" Dim 1 or * TO-3 A 1 or * TO-1 B 19.5 (.75).57 (.1) 15. (.) 1 or * TO- B 15. (.5). (.15) 1.7 (.) *Factory applied only One KonDux TM pad example Thermalloy origin part Suffix Device Figure Dim "B" Dim "C" Dim G1 TO-3 A 19B - A G TO-1 B 19.3 (.7).3 (.19) (.) G5 TO- B 1.51 (.5) 3.3 (.135) 1.7 (.) G7 Multiwatt B (.9).9 (.115).7 (.79) B G C A = Model number B = Grafoil pad C = RoHS compliant MATERIAL PROPERTIES Color Black (metallic) Thickness.13 (.5) Thermal resistance See Graph pg 1 Electrical resistivity 15 x 1 - Ohms Compression strength: 5 psi for 1% reduction in thickness Tensile strength 5 psi Ultimate compression strength 15 psi Service temperature - C to +3 C Liner None ** The Grafoil name was originally marketed by Thermalloy and is the same material as Kondux TM Grafoil is a registered trademark of the Union Carbide Company USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]

87 Interface Material/Pads Hi-Flow * Aavid Thermalloy has added a phase change pad to its line-up. These pads provide low thermal resistance and electrical isolation for low pressure spring mount applications. Above the phase change temperature the material flows to fill in surface irregularities and maximize the heat conduction path. TO-3 TO- TO (1.5) X ø 3.5 (.1) 19.5 (.75) 1.7 (.5) 3.73 DIA (.17) 1.3 (.53) 1. (.) 1. (.7).9 DIA (.1) 1.7 (.) example 1 digit part 5311B _ 515G X ø.3 (.93) Ordering code The shape and hole pattern of the heat sink will determine the shape and hole pattern of the pad. If you are ordering a heat sink which mounts to a semiconductor on both sides, the ordering code for two pads should be used. To order additional Hi-Flow pads separate, or factory applied variations please contact an Aavid sales rep for inquiries. Ordering code Description.9 (1.1) MATERIAL PROPERTIES Reinforcement carrier Polymide Thickness.17 (.5) Continuous use temp ( C) 15 Phase change temp( C) 55 Dielectric breakdown voltage (Vac) 5 Dielectric constant (1 Hz).5 Volume resistivity (Ohm-meter) 11 INTERFACE MATERIALS No pads 7 One Hi-Flow pad Two Hi-Flow pads Thermal impedance vs. pressure Pressure TO- Thermal performance (ºC/W) * Hi-Flow is a registered trademark of the Bergquist Company Alignment Pads Solderable alignment pads are an innovative way to attach the heat sink to your transistor that could cut your assembly time by more than half. Alignment pads provide cost effective solderability, while providing numerous additional benefits. Alignment pads are factory applied and can be bought separately as well. Please refer to accessory Index D on page 5. example Thermalloy origin part Suffix Device Figure 3-CL3G TO- B 1-CL11G TO-1 A 7B 3 CL3 G A B A = Model number B = Alignment pad C = RoHS compliant C Figure A 5. (.95) 3. (1.) 3.1 (.1) 5. (1.) 13.1 (.5).7 (.3) (.)(.) 3.5 (.1) 9. (.37) Figure B 1. (.5) 7. (.3) 11. (.) 17. (.7).7 (.3).51 (.) 3.1 TYP THK (.15).7 (.79) 5. (.) 1. (.) Typical installation Shown with part number 1-CL11 Recommended hole pattern for 3-CL3G Recommended hole pattern for 1-CL11G PLATED THRU HOLE PER DEVICE MANUFACTURERS RECOMMENDATION.95 DIA PLATED (.11) THRU HOLE 1. DIA PLATED (.3) THRU HOLE TYP(3).95 DIA PLATED (.11) THRU HOLE TYP() C L 1 CLIP ASSEMBLY.5 (.1) 7.37 (.9) 1.73 (.5).5 (.1) 5. (.15) 1.7 (.5) 5. (1.) 5. (.15) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected] 7

88 Interface Material / Double Sided Tape Double-sided thermal tapes adhere the heat sink to the device and offer good thermal characteristics. They are easy to apply, require no curing time, can be electrically conductive or isolating, and need no mechanical support to provide thermal or physical contact between the device and the heat sink. Aavid can apply one side to a heat sink. example 1 digit part Ordering code Tape option 31 T1 3 T5R 33 T1 3 T1R 35 T11 375B G Ordering code T1 for ceramic or metal packages T5R for ceramic or metal packages INTERFACE MATERIALS Uses a.1 inch (.3 mm) Kapton MT TM filled polymide film coated on both sides with high-bond strength, pressuresensitive acrylic adhesive that is loaded with aluminum oxide particles. This provides both good thermal performance and excellent electrical isolation. Color Electrical function Beige Insulating Thickness.17 mm (.5) Carrier Kapton MT TM Thermal impedance. C-in /w Thermal conductivity Breakdown voltage Volume resistivity.37 w/m-k 5 VAC 5 x 1 15 Ohm-cm Lap shear adhesion 15 (.) psi Die shear adhesion Aluminum 5 C 15 psi Aluminum 15 C 15 psi Creep adhesion 5 1psi >5 days 15 1psi >1 days Uses a. inch (.5 mm) aluminum foil core coated on both sides with high-bond strength, pressure-sensitive acrylic adhesive that is loaded with aluminum oxide particles. The aluminum foil provides added thermal conductivity for applications where electrical isolation is not required. The combination of filter, expanded metal and embossed surface enhances both tape conformability and thermal performance. Color Electrical function White Conductive Thickness. (.15) Carrier Aluminum Thermal impedance.5 C-in /w Thermal conductivity Breakdown voltage Volume resistivity.5 w/m-k N/A UL flammability 9V- Rating 3 x 1- Ohm-cm U.L.9 Lap shear adhesion 13 psi Die shear adhesion Aluminum 5 C 15 psi Aluminum 15 C 55 psi Alum.oxide 5 C 15 psi Alum.oxide 15 C psi Creep adhesion 5 1 psi >5 days 15 1 psi >5 days T1 for ceramic or metal packages Uses an expanded foil carrier coated on both sides with high-bond strength, pressure sensitive acrylic that is loaded with titanium diboride particles. The combination of filter, expanded metal and embossed surface enhances both tape conformability and thermal performance. Color Electrical function Grey Conductive Thickness.9 (.3 ) Carrier Expanded aluminum Thermal impedance.5 C-in /w Thermal conductivity Breakdown voltage Volume resistivity UL flammability 1. w/m-k N/A N/A N/A Lap shear adhesion 7 psi Die shear adhesion Aluminum 5 C 135 psi Aluminum 15 C 5 psi Alum.oxide 5 C 15 psi Alum.oxide 15 C psi Creep adhesion 5 1 psi >5 days 15 1 psi >1 days Note: Double Sided Tapes are factory applied only. T1R / T11 for plastic packages T1R thermally conductive tape consists of a high bond strength, pressure sensitive acrylic adhesive loaded with aluminum oxide and coated onto a. inch (.5mm) aluminum foil carrier. The other side of the foil carrier has a silicone pressure sensitive adhesive which provides excellent adhesion to silicone-contaminated plastics and other low energy surfaces. T11 thermally conductive tape consists of a high bond strength, pressure sensitive adhesive with an aluminum mesh carrier layer. The mesh carrier allows the tape to conform to curved surfaces of plastic molded IC packages, providing a high adhesive strength attachment for heat sinks. The high performance silicone PSA allows adhesion to silicone-contaminated plastics and other low energy surfaces. Typical properties T1R T11 Construction Acrylic Silicone Adhesive (to heat sink side) Color White Clear (silver) Carrier Aluminum foil Aluminum mesh Adhesive (onto component side) Silicone Silicone Color (to component side) Clear (Silver) Clear (Silver) Thickness, mm (inch).1 (.7). (.11) Thermal psi C-cm /w ( C-in /w) 7.1 (1.1).5 (1.) Operating temperature range, C -5 to to + 15 Lap shear adhesion, psi (MPa) (.1) 1 (.9) Die shear adhesion, psi (MPa) steel/fr 5 C 17 (1.17) (.55) 15 C (.7) (.13) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]

89 Wave-On TM Mounts Wave-On TM Mounts Solderable mounts can be factory installed to practically every board-mountable heat sink and flat sided extrusion. The female threaded through holes permit pre-assembly to the semiconductor via machine screws, allowing the heat sink/semiconductor package to be treated as one unit when fitted in PC board through holes for wave soldering. FEATURES Saves production time and cost Cuts production steps by half Factory installation eliminates steps Permits soldering in one step All the benefits of female threaded mount Automated fastening Excellent solderability Better thermal performance Built in stand-off adds air space between PCB and heat sink for improved air flow and easier cleaning No lockwashers, nuts or separate mounts with various thread lengths example part 57B G Ordering code Ordering code Model A Dim B Dim C Dim D Dim Threaded thru holes 1 E.3 (.17).5 (.1).5 (.1).9 (.3) #-3 EA 3.3 (.135).5 (.1).5 (.1).9 (.3) #- 3 EG 3.3 (.135).5 (.1) 1.1 (.5).9 (.3) #- EH.3 (.17) 3.3 (.135).5 (.1).9 (.3) #-3 5 EK.3 (.17).5 (.1) 1.1 (.5).9 (.3) #-3 7 EM.3 (.17).5 (.1).5 (.1).9 (.3) 3.5MM 9 ER.3 (.17).5 (.1) 5. (.).9 (.3) #-3 Typical Wave-On TM mount installation 7.9 (.31) HEAT SINK DIM "T" PC BOARD DIM "C" STAND-OFF LENGTH "D" "C" "B" LABOR SAVING HEAT SINK TO BOARD DEVICE TO HEAT SINK MOUNTS Model plated thru hole PCB thickness T EA, EG 3. (.15) 1.57 (.) E, EK, EM, ER.75 (.17) 1.57 (.) EH.75 (.17).9 (.9) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected] 9

90 Semiconductor Mounts LABOR SAVING HEAT SINK TO BOARD DEVICE TO HEAT SINK MOUNTS Female Semiconductor Mounts Fastens semiconductor to heat sink fast and efficiently Up to 1 times faster than fastening with standard nuts and bolts Used with most JEDEC case sizes, factory installed example 1 digit part Ordering code Thread A Dim B Dim C Dim D Dim 1 # (.).75 (.17) 1.7 (.7).7 (.1) #-.35 (.5).19 (.15) 1.7 (.7).7 (.1) 3 3. (.11).35 (.5). (.1) 1.5 (.59).7 (.97) Male Semiconductor Mounts 55B G Ordering code Captive male studs for semiconductor attachments Used with most JEDEC case sizes, factory installed MALE SEMICONDUCTOR MOUNT "B" "C" "D" INSTALL MOUNT "C" 9.5 (.3).3 (.5) example 1 digit part 573B G Ordering code Ordering code Thread #-3 5 #- 9 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]

91 Tabs TM Shur-Lock TM Tabs Aavid s Shur-Lock self locking stand-off tab (U.S. Patent #5,37,51) positively secures any heat sink to the printed circuit board. This Shur-Lock tab exhibits many unique design features. The rounded and bifurcated tip of the Shur-Lock solderable tab has been designed to easily snap into any.93 diameter hole. Once through the hole, the tab provides a positive resistance to backing or falling out of the hole. In addition, the spring action between the tab and the plated through hole prevents leaning or lift-off of the heat sink prior to or during the soldering process. The tip extension of the Shur-Lock tab has been designed to protrude less than. beyond the back of a standard.5 PC board, which is below the normal lead trimming allowance for assembled PCBs. Shur-Lock s stand-off design facilitates the cleaning of assembled PCBs and permits electrical traces to be routed under the heat sink. The wide base supports of the tab further improve the stability of the heat sink assembly. example 1 digit part PRODUCT INFORMATION Material Spring steel Finish Tin plating over a copper flash Pull-out force* 7 lbs/tab minimum Recommended PCB hole diameter.9.9 PCB thickness.5. Variations of the above specifications are possible. Contact Aavid Thermalloy for additional details for use with thicker PCB sizes, such as.93 or other hole diameters. *Vertical force applied to the sink-tab joint. TM Solderable Staked on Tabs 57B G Ordering code Aavid solderable tabs stake onto heat sinks for solder mounting into the PC board. The tabs are available in a variety of lengths, widths and thicknesses. Tabs are factory applied for both vertical and horizontal mountings including: step tabs, which keep the heat sink elevated above the board, and tabs with a triangular base for extra stability. Many of Aavid s tabs are customized. Below are examples of standard tabs. Please consult Aavid s customer service department for information about other tab options..35 (.5) FEATURES Positive PCB engagement Integrated PCB stand-off Quick snap-in assembly design Reduces installed assembly cost Designed for rugged shock and vibration environments Can be installed on a variety of stamped and extruded board level heat sinks Factory applied only Tab ordering code.35 (.5) 1.1 (.1) 1.5 (.).7 (.3).7 (.15) LABOR SAVING HEAT SINK TO BOARD DEVICE TO HEAT SINK MOUNTS example 1 digit part 57B G Ordering code Tab ordering code 31 Tab ordering code (.1).35 (.5) 1.7 (.5).1 (.) 1.57 (.).1 (.).51 (.) 1. (.).7 (.3).37 (.17) 9.53 (.375).79 (.11). (.1) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected] 91

92 Tabs LABOR SAVING HEAT SINK TO BOARD DEVICE TO HEAT SINK MOUNTS Tab ordering code 33 Tab ordering code 3.1 C (.) L 15. (.15).9 (.35).7 R (.3) 1.57 (.).51 (.).1 (.).1 (.3) 7.7 (.31) 7.11 (.) 1.1 (.7) Note: The drawing above shows the right hand of a matched pair which are supplied mounted to the heat sink. Tab ordering code 35 Tab ordering code 3.1 (.) 7.11 (.) 1.95 (.51). (.97) 5. (.).9 (.35).7 (.3) 5.3 (.19) 5. (.). (.5) 1.9 (.75) 1.75 (.9).1 (.95).1 (.3) 1.3 (.).1 (.3) 1.7 (.7) Tab ordering code 37 Tab ordering code (.375).35 (.5).51 (.) 15. (.5) 9.53 (.375).35 (.5) (.15) (.3) 1. (.).35 (.5) 15. (.5) 1.7 (.5).1 (.3) 1.3 (.) 9 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]

93 Tabs Tab ordering code Tab ordering code 3.35 (.5).1 (.3) Solderable Tabs Heat sinks ordered with solderable mounting tabs have tin-plated spring steel tabs permanently locked onto the heat sink to provide wave solderability. The solderable tabs are mounted on the heat sink after anodizing, thus eliminating any special coating or handling. The result is a wave solderable heat sink with black anodized performance. example 1 digit part C L example Thermalloy origin part 1.57 (.95) 57B G Ordering code 7B G A.3 (.5) B C 1.7 (.5) 1.3 (.) FIGURE A "B" 3.1 (.15) A = Model number B = tab suffix C = RoHS compliant 7. (.3). (.9).3 (.19) MT3 ONLY 7.7 (.31).35 (.5) 1. (.).3 (.) BEVELED CORNERS MT3 ONLY Typical Installation.35 (.5) 15. (.5) FIGURE B "B" 3.1 (.15) 3.1 (.15) 7. (.3) 7.7 (.31) SEE DETAIL B (.15) (.5).51 (.).79 (.11) 3.9 (.1) DETAIL B LABOR SAVING HEAT SINK TO BOARD DEVICE TO HEAT SINK MOUNTS ADD TO HEIGHT OF PART REF TRIANGULAR TAB Recommended PCB plated Suffix Ordering code Stand-off height Features A Dim B Dim Figure thru hole: MT (.5) Solderable mounting tab 15. (.5).3 (.19) A.9 ±.1 (.11 ±.) MT 5.51 (.335) Solderable mounting tab 19.1 (.755).13 (.3) A.9 ±.1 (.11 ±.) MT (.5) 5 degree beveled corners on stand-off portion reducing board footprint 15. (.5).3 (.19) A.9 ±.1 (.11 ±.) from 7.7 (.31) to.3 (.19) width. Only tab with this feature. MT (.5) Bifurcated tabs in lieu of triangular shape 15. (.5).3 (.19) B.95 ±.5 (.11 ±.) MT 57.9 (.115) Bifurcated tabs in lieu of triangular shape (.535).5 (.1) B.95 ±.5 (.11 ±.) Notes: tabs have unique locking features built into their design. Aavid Thermalloy adds to standard and custom heat sinks. For this reason, the tabs are factory applied, and cannot be sold separately. Please see page 5 for additional tab options. USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected] 93

94 Solderable Pins / Solderable Nuts LABOR SAVING HEAT SINK TO BOARD DEVICE TO HEAT SINK MOUNTS Solderable Pins Vertically mounted, extruded heat sinks are converted to wave solderable with the addition of solderable roll pins. Roll pins are available with stand-off shoulders in different heights for easier cleaning after wave soldering. example 1 digit part example Thermalloy origin part Solderable Nuts 599B G 39B G Solderable nuts are permanently swaged into the heat sink for quick pre-assembly with the transistor. Screws are used to mount to the heat sink and are installed from the top. Solderable nuts feature a closed end that prevents solder from wicking into threads and trapping contaminants or flux. Heat sink and transistor are then handled as a single component and dropped into plated-thru holes in the PC board for wave soldering. (Solderable nuts require slightly larger printed circuit board hole sizes) A Ordering code B C FIGURE A A = Model number B = Solid pin suffix C = RoHS compliant ø 5.9 ø. (.1) (.97).1 (.95) Pin 5 Suffix Ordering code Description A Dim Figure P 1 Solid pin w/stand-off shoulder.5".5 A P3 N/A Solid pin w/stand-off shoulder.15".15 A N/A 5 Solid solderable pin B 3.9 (.15) 1.7 (.5) 5.9 (.1) REF Pin P-P3 FEATURES 1.7 (.5) Pre-mounted to heat sink at factory Ease of pre-assembly in production Mechanical and electrical integrity Wave solderability.1 (.95) REF. (.97) REF FIGURE B.3 (.9).5 (.175) Typical installation P-P3 1.7 (.5) Heat sink PC Board Stand-Off Shoulder example 1 digit part example Thermalloy origin part 53B G Ordering code 719B G A B C Suffix Ordering code thru hole Thread A = Model number B = Solderable nut suffix C = RoHS compliant.3 (.17) 3.5 (.1) 3. (.19) ø 7. (.3) SNM-1 N/A.95 (.195) M3X.5 SNE (.195) - UNC-B SNE (.195) -3 UNC-B Note: If a part number requires solderable nuts, simply add a "/" after the solderable nut character suffix on Thermalloy origin parts (.35) THREAD Mechanical drawings showing heat sinks with solderable nuts 1.7 (.5) 3. (.19) ø.3 (.17) C L SOLDERABLE NUT 3.5 (.1) ø.3 (.17) 3.5 (.1) 1.5 (.5) 3. (.19) SOLDERABLE NUT 9 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]

95 Clinch Nuts Clinch Nuts Clinch nuts are threaded nuts that allow quick assembly of the transistor to the heat sink. A single screw mounts the transistor to the heat sink, reducing your hardware requirements. Clinch nuts are permanently pressed into the heat sink, and come in a variety of English and Metric threads CNE designates an English thread, and CNM designates a Metric thread. FIGURE A 1.7 (.7) example 1 digit part example Thermalloy origin part SECTION A-A Suffix Ordering code Thread A Dim B Dim Figure CNE 1 - UNC-B.9 (.3) A CNE3 N/A - UNC-B 1.37 (.5) A 591B G Ordering code 719B G A B.35 (.5 C A = Model number B = Clinch nut suffix C = RoHS compliant FIGURE B 1.5 (.59) "B" CLINCH NUT.3 (.) Mechanical drawing showing heat sink with clinch nut CLINCH NUT INSTALLED LABOR SAVING HEAT SINK TO BOARD DEVICE TO HEAT SINK MOUNTS CNM1 13 M3 X.5.7 (.3). (.1) B CNM N/A M3 X.5.9 (.3). (.1) B USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected] 95

96 Studs LABOR SAVING HEAT SINK TO BOARD DEVICE TO HEAT SINK MOUNTS Solderable Studs Threaded solderable studs are permanently swaged in place for quick pre-assembly with the transistor. The device is placed over the stud (s) followed by the lock washer and nut. This entire component is then dropped into plated-thru holes in the printed circuit board for wave soldering. The end of the stud is tin-plated for excellent solderability and extends only." below a." PC board to clear lead trimming saws. example 1 digit part example Thermalloy origin part Suffix Ordering code thru hole A Dim B Dim C Dim Figure SE-1 3. (.15).9 (.35) (.5-.5) A SE- 3. (.15) 1.3 (.5) (.5-.5) A SE (.15).9 (.35) (.5-.5) A SE (.15).9 (.35) (.1) B SM (.15).9 (.35) M3 x (.1) B SM (.15).9 (.35) M3 x (.5-.5) A Note: Factory installed only Device Studs 5133B G Ordering code 7B G A B C Device mounting studs for "Thermalloy-origin" items are available as options on certain vertical and board mount heat sinks as a labor-saving aid for mounting semiconductors. This optional feature speeds production assembly time and reduces hardware requirements. A = Model number B = Stud suffix C = RoHS compliant ø 5.9 (.1) HEAT SINK "D" "C" PC BOARD "B" Typical installation FIGURE A "C" HEAT SINK "C" FIGURE B PC BOARD "C" "B" example 1 digit part example Thermalloy origin part 591B G Ordering code 719B G A B C A = Model number B = Stud suffix C = RoHS compliant Mechanical drawing showing heat sink with device mounting studs Suffix Ordering code A Dim B Dim C Dim D Dim SF (.31) - UNC-A.5 (.1).75 (.17) SF N/A. (.315) M3 x.5.5 (.1). (.11) SF3 N/A 7.9 (.31) -3 UNC-A.5 (.1) 5.3 (.) Note: Factory installed only Device Stud C L 9 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]

97 Clips Aavid Kool-Klips TM These one piece stainless steel clips eliminate the need for screws, lock washers and nuts in the assembly process, therefore reducing assembly time and cost. These can be bought separately, or found in the 11th or 1th position when deciphering an Aavid Standard product. Please reference Indexes to see which clips are popular with which product offering. To order clips seperately use part number below. To order a clip as an option use ordering code. example 1 digit part 5311B G Ordering code Part number Transistor case style Ordering code 115FG TO-, TO FG TO-, TO FG TO-, TO FG TO-, TO FG TO- 5 11FG TO-, TO-1 591G TO-, TO-1, TO-7 Sold separately only 1G TO-, TO-1, TO-7 Sold separately only 771G TO- Sold separately only 3. (1.5).7 (.3) 1.7 (.5) 1G 591G 771G.75 (.17) 37.1 (1.1) 37. (1.) 1. (.3) 115FG Code FG Code (1.5) 11. (.33). (.) 1.5 (.51) 7. (.5) 13.5 (.53) 7.5 (.97) 3.99 (.157). (.) LABOR SAVING HEAT SINK TO BOARD DEVICE TO HEAT SINK MOUNTS. (.) 115FG Code FG Code 53. (.) 13. (.55) 3.1 (.15) 5.5 (1.1) 1. (.75) 7. (.3) 115FG Code 5 11FG Code 7.9 (.31) 3.1 (1.5). (.).9 (.3) 1.7 (.5) 1.9 (.3) 5.97 (.35) 1. (.5) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected] 97

98 Clips LABOR SAVING HEAT SINK TO BOARD DEVICE TO HEAT SINK MOUNTS Thermal Clips Factory-Installed ONLY thermal clips, available on many standard heat sinks (shown below) eliminate the use of screws and nuts in assembling the heat sink and transistor. Plastic case transistors slip into place for easy assembly. Thermal clips are available in a variety of configurations. Locking clips have an internal tab to lock the transistor permanently in place. example 1 digit part example Thermalloy origin part Suffix Ordering code Transistor case style Clip/Cover features TC1 3 TO- Locking TC 3 TO-1,TO-, Multiwatt Locking TC7 N/A TO-1,TO-, Multiwatt Insulated TC1 33 TO-, TO-1 Locking TC11 3 TO- Insulated TC1 35 TO-1, TO- Locking 17.7 (.7) 11. (.5) 19.9 (.73). (1.137) 53B G 73B G A B C Ordering code.35 (.5) A = Model number B = Clip suffix C = RoHS compliant TC-1 Code 3 TC- Code (.155) 17.7 (.7) 11. (.5).9 (1.13) 1.1 (.) 5.13 (.) TC-7 Code N/A TC-1 Code (.7) 1.1 (.) 1.1 (.).35 (.5) 1.7 (.5) 19.5 (.75).91 (1.13) 5. (.7) 11.1 (.5).91 (1.13) TC-11 Code 3 TC-1 Code (.).35 (.5) 1.1 (.).35 (.5).9 (.75) 1.7 (.5) 19.5 (.75).91 (1.13) 1.7 (.5).9 (1.13) 9 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]

99 FEATURES Pre-packaged in heat-sealed plastic bags for use on assembly line. Stock mounting hardware using one number for better control and identification. Three different insulating materials available: Low cost Thermalfilm TM High temperature Mica High performance Thermalsil TM lll Other insulator materials available for special order include: hard anodized aluminum and aluminum oxide. Individually packaged for convenient stocking and handling of mounting hardware. contain all hardware necessary to electrically isolate the transistor from the heat sink. TO- kit part number ACCESSORIES Part number Description G MG SG Kit with Thermalfilm TM Kit with Mica Insulator Kit with Thermalsil TM III 5 TRANSISTOR NOT INCLUDED EACH KIT INCLUDES: Part number Item Qty Description 1 1 Insulator Thermalfilm TM (see page 11) (5-77-9) Mica (see page 13) ( ) Thermalsil TM III (see page 13) 771-7PPS 1 Shoulder washer MS Flat washer # No. - UNC-B MS359-1 Hex nut No. - UNC-A X MS / Long phillips pan head screw MS Lock washer, No. Note: Smooth side of flat washer should be placed against insulator when using the kit. 3 1 TO-3 kit part number Part number Description G MG Kit with Thermalfilm TM Kit with Mica Insulator 5 TRANSISTOR NOT INCLUDED SG Kit with Thermalsil TM III EACH KIT INCLUDES: Part number Item Qty Description 1 1 Insulator 3-3- Thermalfilm TM (see page 11) (5-3-) Mica (see page 13) (53-3-) Thermalsil TM III (see page 13) 771-5PPS Shoulder washer MS Flat washer # MS359- No. -3 UNC-B Hex nut MS No. -3 UNC-A X 1/ Long phillips pan head screw MS Lock washer, No Solder lug Note: Smooth side of flat washer should be placed against insulator when using the kit USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected] 99

100 Insulating Shoulder Washers FEATURES Available in nylon or polyphenylene sulfide Chemically inert [no known solvents under C (39 F)] Maximum recommended service temperature of C (5 F) Recommended torque is.55nm to.7nm (5 to inch-pounds) on all shoulder washers except 7, which has recommended torque of.5nm ( inch-pounds) Polyphenylene Sulfide PPS Shoulder Washers ACCESSORIES FIGURE A FIGURE B "E" DIA 5.59 (.) "D" DIA "B" "C" "E" Note: This figure is common to figures A and B Part number A Dim B Dim C" Dim "D" Dim "E" Dim Screw size Figure 771-1PPSG 7.11 (.) 3.1 (.15) 1.7 (.). (.11) 3.1 (.15) A 771-PPSG 7.11 (.).7 (.15) 1.7 (.). (.11) 3.1 (.15) A 771-3PPSG 7.11 (.) 3.1 (.15) 1.7 (.). (.11) 3.5 (.1) A 771-5PPSG 7.9 (.31).79 (.31) 1.19 (.7) 3. (.1).5 (.177) A 771-PPSG 7.11 (.).79 (.31) 1.19 (.7) 3. (.11) 3. (.15) A 771-7PPSG* 5. (.15).1 (.3) 1. (.).95 (.11) 3.3 (.135) A 771-1PPSG 7. (.3).1 (.95) 1. (.55).97 (.117) 3.5 (.1) ** B Note: A single gate extension, not to exceed. (.5) in length, is allowable on the outside of all shoulder washers. * Design allows insertion in the tab of a TO-. ** Also for M3 screw. Nylon Shoulder Washers "E" "C" Shoulder Washer "D".33 (.13) "B" Material is nylon type Part number A Dim B Dim "C" Dim "D" Dim "E" Dim NG 7./.5 (.37/.317).7/3. (.113/.11) 3.5/3.1 (.1/.15) 3.7/3.9 (.1/.153) 1.9/1.35 (.3/.53) NG 5.9/.5 (.3/.3).7/3. (.113/.11) N/A 3.3/3.5 (.135/.1) 1.19/1. (.7/.55) NG 5.59/.1 (./.).9/.95 (.11/.11) 1.73/1.91 (./.75) 3.3/3.5 (.135/.1).51/. (./.5) 1 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]

101 Thermalfilm and Thermalfilm MT Thermalfilm Polyimide Plastic Films Thermalfilm and Thermalfilm MT are low cost polymide plastic insulating films designed to be an improved replacement for mica. These insulators have a distinctive amber color and can be easily recognized and assembled on a production line. Thermalfilm MT, made from high performance Kapton MT material, provides thermal conductivity nearly -5 times greater than standard Thermalfilm. Both insulators have an extremely high resistance to flow or thin out under high compressive stresses, particularly at elevated temperatures. Excellent physical, mechanical and electrical properties remain nearly constant over a wide range of temperatures and frequencies. They are radiation resistant, have no melting points, and have no known organic solvents. The polymide plastic film is UL listed as a component in UL s publication Component Plastic Material dated September 1, 199. The UL card number is E3955R, Guide QMFZ filed by E. I. du Pont de Nemours Co., Inc. Thermalfilm TM is rated 9-V/. For standard pre-cut sizes of Thermalfilm TM and Thermafilm TM MT see page 1. ACCESSORIES ELECTRICAL TYPICAL 5 C PROPERTY Dielectric strength Dielectric constant Dissipation factor Volume resistivity Surface resistivity Corona start voltage.5mm (1-mil) Insulation resistance Material thickness Ultimate tensile strength (MD) Bursting strength test (Mullen) Tear strength initial Density Folding endurance (MIT) Melting point Zero strength temperature Cut through temperature Service temperature Thermal conductivity Flammability THERMALFILM.3mm (1-mil) x 1 3 volts/mm (,1 volts/mil) ohm-cm 1 1 ohms 5 volts 1. megohm mfds..5mm (. ) 1.7 x 1 Pa (5, psi) 3.1 x 1 5 Pa (5 psi) 7,559 gm/mm (7 gm/mil) 1. gm/cm 3 (.7 lb/ft 3 ) >1, cycles NONE 15 º C (199 º F) 35 º C (15 º F) 55 º C (977 º F) - º C to º C (-3 º F to º F).15W/m º C (.9 BTU/hr-ft-ºF) V-, UL E card E3955 PHYSICAL THERMALFILM MT 177. x 1 3 volts/mm (5 volts/mm) ohm-cm 1 1 ohms 5 volts 1. megohm mfds..5mm (. ) 13 MPa (15 psi).31 MPa (5 psi) 35,33 gm/mm (9 gm/mil) 1.7 gm/cm 3 (111.1 lb/ft 3 ) >1, cycles THERMAL NONE 15 º C (199 º F) 35 º C (15 º F) 55 º C (977 º F) - º C to º C (-3 º F to º F).379 W/m º C (.19 BTU/hr-ft- º F) V-, UL E card E3955 TEST METHOD ASTM D19- ASTM D15-T ASTM D15-T ASTM D57-1 ASTM D57-1 ASTM D1-1T Based on.5 mfd wound capacitor using.5 mm (1-mil) Film ASTM D-T ASTM 77-3 ASTM D1-1 ASTM D155-3T ASTM D17-3T Hot Bar (Du Pont test) Weighted probe on heated film (Du Pont test) Model TC-1 twin heatmeter Comparative tester UL 9 Notes: One mil equals.1 inch Dimensional tolerances are ±.3mm (.15 ), hole diameters are ±.5mm (.1 ) and angularity is ± 1 1/ unless otherwise specified. USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected] 11

102 Insulators Thermalfilm and Thermalfilm MT Thermalfilm for TO-3 Part number A Dim B Dim C Dim D Dim 3-3-G. (1.55) 7. (1.3) 3.9 (.15) 1.57 (.) 3-3-G 39.7 (1.53).7 (1.5) 3.5 (.1) 1.57 (.) Thermalfilm TM information on page 11 Dimensional tolerances are ±.3mm (.15), hole diameters are ±.5mm (.1) and angularity is ± 1 1/ unless otherwise specified. "D" DIA TYP () "C" DIA TYP () 1.3 (.7) 3.15 (1.17) 1.9 (.3) "B" ACCESSORIES Thermalfilm for TO-5 and TO-1 Part number Device Figure A Dim B Dim C Dim 3-5-1G TO-5 A 9.91 (.39) 5. (.).91 (.3) 3-5-G TO-5 B 9.91 (.39) 5. (.).91 (.3) 3-1-1G TO-1 A.35 (.5).5 (.1).91 (.3) Thermalfilm TM information on page 11 Dimensional tolerances are ±.3mm (.15), hole diameters are ±.5mm (.1) and angularity is ± 1 1/ unless otherwise specified. FIGURE A FIGURE B "C" DIA TYP () "C" DIA TYP (3) "B" "B" Thermalfilm for TO-, TO-1, Case 77, Case 199, Case 9, TO-1 and TO-3P Part number Device A Dim B Dim C Dim D Dim G TO-1, Case (.37) 7.9 (.31) 3.5 (.1).3 (.93) 3-77-G Case 9, Case (.7) 1.7 (.5) 5.5 (.1) 3.1 (.15) 3-77-G Case 9, Case (.75) 13. (.55) 5.3 (.1) 3.1 (.15) G TO- 1. (.75) 13.1 (.5).3 (.17).9 (.115) "D" DIA "B" -77-9G* TO- 1. (.75) 13.1 (.5).3 (.17).9 (.115) 3-77-G TO-, TO-1, TO-3P 3. (.915) 1. (.7).9 (.75) 3. (.1) * Thermalfilm TM MT part numbers begin with "C" Thermalfilm TM information on page 11 Dimensional tolerances are ±.3mm (.15), hole diameters are ±.5mm (.1) and angularity is ± 1 1/ unless otherwise specified. 1 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: +() [email protected]

103 Insulators Mica and Thermalsil TM III Mica and Thermalsil TM III Thermalsil III provides excellent thermal conductivity and electrical resistance. It is used as an electrically-isolating interface material composed of silicone elastomer binder with a thermally conductive filler. It is reinforced with glass cloth to resist tearing and cut-through due to burrs on transistors or heat sinks. Thermalsil III eliminates the need for grease application and conforms to mounting surfaces under clamping pressure for optimum heat conduction. The finely woven glass cloth provides the thinnest possible matrix for enhanced thermal resistance. Thermalsil III is available in any configuration with adhesive backing. Mica insulators provide high maximum operating temperatures (55 C) and excellent electrical properties. "D" DIA TYP () "C" DIA TYP () FIGURE A 1.3 (.7) Part number Description Device Dim "B" Dim "C" Dim "D" Dim Figure 3.15 (1.17) 1.9 (.3) "B" "D" DIA FIGURE B "C" "B" ACCESSORIES G Mica TO- 1. (.75) 13.1 (.5).3 (.17).9 (.115) B 5-3-G Mica TO-3. (1.55) 7. (1.3) 3.9 (.15) 1.57 (.) A G Thermalsil TM III TO- 1. (.75) 13.1 (.5).3 (.17).9 (.115) B 53-3-G Thermalsil TM III TO-3. (1.55) 7. (1.3) 3.9 (.15) 1.57 (.) A TYPICAL PROPERTIES FOR MICA INSULATORS Property Electrical Dielectric strength 17 X 1 3 volts/mm (5 volts/mil).5 mm to.7 mm thick in air (1 to 3 mils thick in air) Dielectric constant.5 to.7 Dissipation 1 Hz Volume resistivity 1 15 ohm-cm Physical Modules of elasticity in tension 17 X 1 3 Mpa (5 X 1 ) psi Tensile strength 31 Mpa (5, psi) Hardness mohs, shore 3., 115 Compressive strength.1 X 1 Pa (3, psi) Specific gravity.9 Thermal Thermal conductivity.5 W/(m C ) (.3 Btu/hr-ft F) Coefficient of thermal expansion 3. X 1-5 C (1. X 1-5 F) Specific heat. KJ/Kg C (. Btu/Lb F) Melting point 175 C (37 F) Max. operating temperature 55 C (1 ºF) TYPICAL PROPERTIES FOR THERMALSIL TM III Property Typical value 5 C Test method Electrical Dielectric constant.5@5 Hz ASTM D-15.5@1 3 Hz.5@1 Hz Dielectric breakdown voltage.3 x 1 3 volts/mm (7 volts/mil) ASTM D-19 Volume resistivity 5.7 x 1 15 ohm-cm ASTM D-57 Dielectric dissipation factor.@5 Hz ASTM 3 Hz Physical Thickness.15mm (. inch) Color Tensile strength Hardness, shore A 7 Elongation Thermal conductivity Gray-Green.1 x 1 7 Pa (7 psi) % or less Thermal.9 W/(m C ) (.53 Btu/hr. ft F) Flame resistance UL 9V- UL card #E-51 (S) Service temperature - C to 1 C (-7 F to 35 F) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected] 13

104 Insulators Aluminum Oxide Aluminum Oxide ACCESSORIES Aluminum oxide has unique thermal conductivity qualities and features low loss factors at high frequencies. It has high compressive strength, high volume resistivity, low thermal expansion and resists radiation. Aluminum oxide insulating washers have a dielectric strength of approximately 1.7 x 1 3 volts/mm for.7mm material (55 volts/mil for.3 inch material) and 1.9 x 1 3 volts/mm for 1.57mm material (3 volts/mil for. inch material). The thermal conductivity of aluminum oxide is 15.W/(m C) at 75 C. PROPERTY A1 3 Dielectric constant 5 C (77 F) Dissipation factor 5 C (77 F) Electrical resistivity 5 C (77 F) Dielectric strength (AC) Density Hardness Flexural strength 5 C (77 F) Modules of elasticity Poisson s ratio Tensile strength 5 C (77 F) Compressive strength 5 C (77 F) Coefficient of thermal expansion Thermal conductivity Specific heat (1 C) Melting point Maximum temperature for continuous use CHEMICAL TYPICAL VALUE 9% nominal ELECTRICAL.9 (1MHz).9 (1GHz).1 (MHz).1 (1GHz) >1 1 ohm-cm. x 1 3 volts/mm (.35mm thick) [ volts/mil (.5 thick)] 1.73 x 1 3 volts/mm (1.7mm thick) [5 volts/mil (.5 thick)].35 x 1 3 volts/mm (.5mm thick) [7 volts/mil (.1 thick)] PHYSICAL 3. g/cm 3 ( lb/ft 3 ) 7 (Rockwell 5 N) MECHANICAL 3.17 x 1 Pa (minimum) [. psi (minimum)] 3.5 x 1 Pa (typical) [51, psi (typical)].3 x 1 11 Pa (1 x 1 psi) x 1 Pa (, psi).1 x 1 9 Pa (35, psi) THERMAL 7.9 x 1 / C (. x 1 / F) 1.1 W/(m 5 C 1. W/(m 1 C 79.5 W/(m C.79 x 1 KJ/kg C [.1 x 1 Btu/lb F] >3 C (51 F) 17 C (31 F) TEST METHOD Spectrographic analysis (1%-% by wt. of total metallic impurity) ASTM D15-7 ASTM D5-7 ASTM D15-7 ASTM D5-7 ASTM D19- ASTM D11-9 ASTM C-7 ASTM E1-7 ACMA Test # ASTM C3-9T ASTM C3-9T ACMA Test # ASTM C5-3T ASTM C37-5 ASTM C-5 ASTM C351-1 Aluminum Oxide for TO-3 Part number Thickness A Dim B Dim C Dim D Dim E Dim 3. (.15) DIA TYP () 1.3 (.7) "C" RAD TYP () 13G* 1.91 (.75) 39.7 (1.53).7 (1.5) 13.3 (.55).75 (.17) 3. (1.197) 1G* 1.7 (.7).5 (1.75) (1.5) 15. (.5) 7.1 (.) 3.15 (1.17) 5. (.15) 1.9 (.3) "B" "D" RAD TYP () "E" 15.9 (.59) Aluminum Oxide Ceramic for TO- "D" "C" Part number Thickness A Dim B Dim C Dim D Dim E Dim 19G* 1.57 (.) 19.3 (.7) (.55).7 (.1).9 (.75) 3. (.15) 17G** 1.7 (.7) 19.3 (.7) (.55).7 (.1).9 (.75) 3. (.15) 171G** 1.7 (.7) 1.51 (.5) 1.7 (.5).3 (.17).35 (.5) 3.1 (.15) 177G** 1.7 (.7) 17.5 (.7) 1.7 (.5) 5.5 (.1) 7.1 (.1) 3.1 (.15) "E" DIA "B" Aluminum Oxide Ceramic for TO-1, TO-7, and TO-3P "B" "D" Part number Thickness A Dim B Dim C Dim D Dim E Dim 1G* 1.7 (.7) 3. (.915) 1. (.7).9 (.75) 9. (.37) 3.9 (.15) "C" "E" 1 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]

105 Insulators Stanchion Pads 93-1, 93-, 9 Stanchion Pads FEATURES Reduces stress on leads during wave solder and post-soldering operations Provides stable mount to resist shock and vibration damage to leads 93-1, 93-, and 9 fit the TO- Part number A Dim B Dim C Dim SEE DETAIL "D" (9 ONLY) 1. (.) 1.5 (.).5 (.1).5 (.1) DETAIL "D" (9 ONLY). (.1).3 (.) DIATHRU TYP (3) 93-1G.5 (.1).3 (.). (.315) 93-G 1.7 (.5) 19.5 (.75). (.315) 9G 1.7 (.5) 19.5 (.75) 7.7 (.31) Note: Tolerances ±.5 (.1) unless otherwise specified. Material is nylon / rated 9 V-O 3.5 (.1) 1.1 (.) 1. (.55) ACCESSORIES. (.35) 3.5 (.1) "B" 11.1 (.) 1.5 (.) SQ TYP () "C" USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected] 15

106 Insulating Covers TO-3 Insulating Covers Insulating covers are designed to provide protection from accidental shock during field service or repair. Pan head screws not provided MS or equivalent recommended secure the cover to the TO-3. At the typical mounting screw torque of..9 Nm (- inch pounds), the TO-3 cover material cold-flows around the screw head to securely fasten the cover. Included are No. split washers as inserts to provide electrical connection of mounting screws to the TO-3 collector and an insulating snap-in cover for the screw heads. A test probe hole is provided in the top of the cover. ACCESSORIES The 93VB is made from thermoplastic polyester that meets the requirements of UL Bulletin 9 V-O. In addition to its excellent flammability rating, thermoplastic polyester offers resistance to most chemical environments, heat deflection temperature to 15. C ( F) and UL continuous use temperature of 13 C ( F). Part number Material Color Flammability standards 93NWG Nylon White Self-extinguishing UL 9 V- 93VBG Thermoplastic polyester Black Self-extinguishing UL 9 V- UL 9 Type 1.5 (1.1) 1.91 (1.5) 3.3 (1.19) 1.19 (.7) DIA THRU. (.5) DIA THRU TYP ().57 (.1) 9.91 (.39).1 (.9) 39. (1.57) Teflon-filled Acetal Insulators for TO-3 Part number Fits notch A Dim 13G.3 (.19).9 (.193) 1.7 (.5) 19G.35 (.5).35 (.5) Ø 3.5 Ø 9.5 (.11) (.375) 5.5 (.1) Teflon-filled Acetal Bushings for TO-3 Part number I.D. O.D. T 11G 5.3/5.1(.19/.5).1/.9 (./.75) 1.57/1. (./.55) 113G.3/. (.53/.) 7./. (.3/.315) 1.57/1. (./.55) "O.D." "I.D." "T" 1 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]

107 Pads FEATURES Prevent heat damage during soldering Facilitate board clean-up Prevent solder bridges Assure uniform device height PRODUCT INFORMATION MAXIMUM OPERATING TEMPERATURE Suffix Base material Continuous Deflection Color NG Nylon base resin 11. C 5 F 3.3 C 7 F Natural per ASTM STD D--PA111 DAPG* Diallyl Phthalate. C F. C 5 F Black only per MIL-M-1G type SDG * All DAP mounting pads meet UL 9 V- Note: Please specify material for each mounting pad: N = nylon; DAP = Diallyl Phtalate. Example: NG, 7717-DAPG Index of Semiconductor Lead Conversion Pads Converts lead Part number spacing from To # of Leads Outside dia Thickness For epoxy transistors G.5 In-Line TO-9 TO (.3) 1. (.) For TO G TO-1 TO (.) 3.1 (.17) 7717-G TO-1 TO (.33) 3.5 (.1) 7717-G TO-1 TO (.35) 3.1 (.15) ACCESSORIES See pages 1 and 19 for mechanical drawings Index of Semiconductor Pads Part number Leads Outside dia Thickness 7717-G 3 For TO-5.71 (.33) 1.91 (.75) G 3.9 (.35).53 (.1) G 3 9. (.355).97 (.3) G 3. (.3) 1.91 (.75) G.9 (.35).51 (.) G.9 (.35) 3.1 (.15) 7717-G 9.53 (.375) 1.91 (.75) G For TO-1 5. (.).51 (.) G 5. (.).5 (.1) G 5.1 (.3) 1.7 (.7) G.35 (.5).3 (.) G.35 (.5) 3.1 (.15) G For integrated circuits 9.7 (.35) 1.7 (.7) 7717-G 9.53 (.375) 1.91 (.75) G x 11.3 (.75 x.5) 1.7 (.5) Misc. mounting pads G Crystal Can Relay 1.1/.3 (. x.) 1.7 (.5) See pages 1 and 19 for mechanical drawings USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected] 17

108 Pads G 7717-G Ø. (.3).13 (.5) 1.9 (.75) 1. (.55) 1.7 (.5).5 (.1) TYP Ø 5. (.) Ø 1.5 DIA (.) TYP () Ø 9.5 (.375) Ø 5. (.). (.5) 1.91 (.75) Ø.91 (.3) TYP () Ø 1.7 (.5) C SINK TYP (). (.5) G G ACCESSORIES Ø 5. (.) Ø 1.9 (.75) TYP() Ø 1.7 (.5) C SINK TYP () Ø.71 (.) TYP ().51 (.). (.5) 3.1 (.15) 1.7 (.5).9 (.35) ø.5 (.1) B.C..35 (.5).51 (.) TYP ø.71 (.) TYP 3.1 (.15) MAX 1.7 (.5) ø 1.5 (.5) TYP 7717-G G 1.9 (.75) 1. (.55).51 (.) Ø.91 (.3) TYP () Ø 1.5 (.) Ø 5. TYP () (.) B.C. 9.5 (.375) Ø 1.7 (.5) TYP (). (.5) Ø 5. (.) Ø.91 (.3) TYP ().9 (.35) G G Ø.5 (.1) B.C..51 (.) Ø.91 (.3) TYP () 5. (.) Ø. (.5) TYP () THRU Ø (.) Ø (.).51 (.).5 (.1) Ø 1. (.) 1. (.) 7717-G Lead Conversion 7717-G Lead Conversion Ø 5. (.).71 (.33) 1.1 (.5) Ø 1.57 (.) TYP () 1. (.55) TYP 3.5 (.1) Ø. (.55) B.C. Ø.3 (.33) THRU TYP () Ø 5. (.) B.C..51 (.) 1. (.).51 (.) Ø 1. (.) OPP TYP ().7 (.15) 7.75 (.35).5 (.1).51 (.) 1 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]

109 Pads G 7717-G.3 (.17).5 (.1) Ø 1.57 (.) TYP (3).7 (.3) Ø 5. (.) Ø 1.7 (.5) TYP () Ø 9. (.355) Ø 1.1 (.5) Ø 1.5 (.).97 (.3) Ø 5. (.) Ø 1.1 (.5) TYP (3).51 (.) 1.9 (.75) DIA TYP (3) Ø.7 (.3) 1.91 (.75) G G Ø 1.5 (.) OPP TYP () Ø.7 (.1) Ø.71 (.) TYP () Ø.5 (.1) B.C. Ø 1.7 (.5) C SINK TYP () 1.1 (.5).3 (.).35 (.5).5 (.) Ø. (.5) THRU TYP ().39 (.9).7 (.15).39 (.9).7 (.15) Ø 1. (.55) TYP ().5 (.1) 1. (.) 5.1 (.3).51 (.) 1.7 (.7) Ø 1. (.) TYP Ø.79 (.31) TYP ACCESSORIES G G Transistors Ø 5. (.) Ø. (.315) B.C. Ø 1. (.) TYP ().7 (.3) 1.7 (.7) 9.7 (.35).13 (.5) Ø.3 (.5) TYP (3) Ø 1. (.) TYP () 5. (.3) MAX.5 (.1). (.5).71 (.) TYP () 1. (.).51 (.) G G Ø 1.57 (.) TYP ().35 (.5) 1.7 (.5) 1.3 (.5) 7. (.3) 9. (.3) Ø.9 (.35) THRU TYP (1).5 (.1) TYP PLCS Ø 1.7 (.5) C SINK TYP (1) 1.7 (.5).51 (.) 19.5 (.75) 5. (.) TYP 5. (.) TYP Ø.9 (.35) THRU TYP () 1.1 (.).19 (.15).5 (.1) Ø1.57 (.) TYP ().5 (.1) TYP Ø 1.7 (.5) TYP () C SINK.51 (.).7 (.3).3 (.).51 (.) G G Lead Conversion Ø 1.5 (.) C SINK TYP (3) Ø 5. (.).53 (.1).5 (.1) Ø.9 (.35).35 (.5) 5. (.) P.C..5 (.) Ø 7.11 (.) 3.1 (.15).5 (.1) Ø 1. (.) BOSSES Ø 1.1 (.5) THRU TYP (3).3 (.).51 (.) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected] 19

110 Finishes Finish Aavid Code Thermalloy Suffix Description Black Anodize B B Recommended for increased thermal performance. Anodize is electrically isolating and does not provide electrical insulation. AavSHIELD 3 V V For corrosion protection or painting only. Color variation may be expected with this finish. Chromate is electrically conductive. Does not provide electrical insulation. ACCESSORIES Tin Plating D D Allows heat sink to be soldered to the PC Board. Pre-Black Anodized J PB Edges cut during the manufacturing process will be unfinished. Green Anodize M Alternative finish to Black anodize. Recommended for increased thermal performance. Electrically isolating but does not provide electrical insulation. Unfinished U U Clean, no finish. Black Anodize w/black Paint W Paint on mounting surface prevents metal from contacting the circuit thus avoiding shorts. Aavid Thermalloy code Finish option must be noted by one of the above letters in the 7th position. Aavid's standard finish is black anodize (B) unless otherwise noted. example 1 digit part 531BG A B C A = Base part B = Finish code C = RoHS compliant Thermalloy origin suffix The suffixes should be added after the model number to indicate the desired finish. example Thermalloy origin part 39B G A B C A = Model number B = Finish suffix C = RoHS compliant Note : All thermal graphs reflect black anodize finish. 11 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]

111 Card Ejectors Snap-On Ejectors / Pullers FEATURES Saves time no roll pin required Excellent for retrofit applications Material is nylon per ASTM D-PA1F11 Cost no more than conventional ejector/puller Rated at.5n (5 lbs.) / ejector force per pair One piece no assembly required 51NG Ejector (.7) (.1) (.55) (1.5) 1. (.37) Ø.9 (.9) May be heat stamped Part number 51NG Standard Ejectors / Pullers.9 (.35).7 (.15) 7. (.5).51 (.) ACCESSORIES FEATURES Lever action releases card from its connector safely and quickly Cards, their components and connectors are less frequently damaged when extracting PC boards No special extraction tools are needed for board removal Material is nylon per ASTM D- PA1B13F, UL 9 V-O rated (natural color) Roll pins are provided (NAS 51-P3-) FIGURE A 55-9NG PULLER * 11.1 (.3) Part number 55-9NG 55-NG 55-5NG Figure A B C. (.75) 9.5 (.375) 1.9 (.75) 3.1 (.15) DIA TYP ().55 (.5) *No roll pins provided 3.5 (.5) 5. (.) 11.1 (.3).7 (.15) FIGURE B 55-NG SLIM FACE/ FLAT FIGURE C 55-5NG COMBINATION EJECTOR/PULLER Ø. (.97) (1.5) 11.1 (.37) 7.1 (.1) 7. (.5) 1.7 (.5) 1.57 (.) 15. (.5) 3.5 (.1) ø.3 (.93) 3. (1.) 7.1 (.1). (1.75) 1.7 (.7).35 (.5) USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected] 111

112 Sil-Free TM ACCESSORIES Sil-Free TM 1 is a metal-oxide-filled, silicone-free synthetic grease specially formulated to enhance heat transfer across the interface between the semiconductor case and the heat sink without the migration or contamination associated with silicone-based products. Dry interface case-to-sink thermal resistance is typically reduced 5% to 75% with proper application of Sil-Free TM 1. This virtually "no-bleed", high-performance compound will not dry out, harden, melt, or run, even after long-term continuous exposure to temperatures up to C. Even in a vacuum atmosphere (1-5 Torr, hours@1 C), Sil-Free TM 1 exhibits virtually "no bleed" or evaporation. Part number Package Size 117FG Syringe 3 grams (1.5 oz) 11FG Tube 57 grams (. oz) 119FG Jar 57 grams (. oz) 1FG Tube 13 grams (5. oz) 11FG Jar 57 grams (1. oz) PRODUCT INFORMATION Color Thermal conductivity Operating temperature range White.79 W/(m- C) - C to + C Volume 1 1 Ohm-cm.3 ±.5 Weight Dielectric strength Consistency Bleed 7.5 grams 5 volts/mil Paste.9 max % after C Specific gravity. ±. Shelf life Indefinite (unopened)* * It is recommended that the containers be turned over every months to minimize settling for ease of mixing Ther-O-Link TM Ther-O-Link TM is a silicone-based thermal compound that cost effectively enhances the heat transfer between a semiconductor case and a heat sink. Easy to apply, Ther-O-Link TM substantially reduces dry interface thermal resistance, while providing long life under a variety of conditions. Part number Package Size 1FG Ampule 1 gram (.3 oz) 11FG Syringe 35.7 grams (1.5 oz) 1FG Tube 57 grams (. oz) 15FG Tube 13 grams (5. oz) 1FG Tube. grams (. oz) 11FG Can.5 kg (1 lb) 1FG Can.7 kg (5 lb) 13FG Can 9.7 kg ( lb) PRODUCT INFORMATION Color White Thermal conductivity Operating temperature range Volume resistivity Dielectric strength Consistency Bleed.73 W/(m- C) - C to + C 1. x 1 15 Ohm-cm 5 volts/mil Paste. max Specific gravity. Shelf life Indefinite (unopened)* * It is recommended that the containers be turned over every months to minimize settling for ease of mixing Ultrastick TM Aavid's Ultrastick TM is a unique phase-change thermal interface material that surpasses grease in thermal performance and long-term stability. This solid, silicone-free, paraffinbased thermal compound changes phase at C, with a concurrent volumetric expansion that fills gaps between the mating surfaces. Ultrastick TM comes in a convenient applicator bar, allowing for neat, fast application to both heat sink and component surfaces. One cost-effective application leaves a thin, film-like deposit, providing excellent heat transfer and low interface thermal resistance. Part number Package Size 13FG Bar 7.5 grams (.1 oz) PRODUCT INFORMATION Temperature range Volume resistivity Dielectric strength Consistency Bleed - C to + C 1. X Ohm-cm 5 volts/mil Paste. max Specific gravity. Color Thermal resistance Shelf life Opaque White.3 C/W per square psi. C/W per square 1 psi Indefinite* * Recommended max. storage temperature: ºC (15ºF) 11 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]

113 Thermalcote TM Thermalcote TM is a superior thermal joint compound of thermally loaded silicone based grease for use with all heat sinks. It improves the transfer of thermal energy across the metal to metal interfaces between the transistor or rectifier case and the heat sink. Thermalcote TM conducts heat approximately 15 times better than air and more than times better than unloaded silicone grease. It is non-toxic, extremely stable, and neither cakes or runs from - to C (- F to 399 F). Part number Net weight 9G grams (1 oz) tube 5G 57 grams ( oz) tube 51G.5 kg (1 lb) can 5G.7kg (5 lb) can 53G.5 kg(1 lb) can PRODUCT INFORMATION Color Operating temperature range Thermal conductivity Dielectric strength Cleaning solvent Opaque white - C to C (- F to 399 F).75W/(m C )(. Btu/hr ft F) 11. x 1 3 volts/mm (3 volts/mil) 1.7 mm gap (.5" gap) Mineral spirits or turpentine Specific gravity 1. Evaporation hours@ C (39 F), wt% 1 Shelf life Indefinite (unopened)* * It is recommended that the containers be turned over every months to minimize settling for ease of mixing ACCESSORIES Thermalcote TM ll Thermalcote II was developed as the sensible alternative to silicone-based thermal greases. Thermalcote TM II employs a highly conductive synthetic base fluid that enables the finished product to exhibit the same thermal characteristics as the silicone-based products. Thermalcote II contains no silicone. The high lubricity of the base oil permits efficient application to both semiconductor case or heat sink, and it will effectively fill the microscopic air gaps on the metal-to-metal mating surfaces. It is non-toxic, extremely stable, and neither cakes or runs from - to C (- F to 39 F). Part number 39G 35G 351G Net weight grams (1 oz) tube 57 grams ( oz) jar.5 kg (1 lb) can PRODUCT INFORMATION Color Operating temperature range Thermal conductivity Dielectric strength Cleaning solvent Blue - C to C (- F to 39 F).99W/(M C) (. Btu/hr ft F) 7.9 x 1 3 volts/mm (volts/mil) 1.7 mm gap (.5" gap) Mineral spirits or turpentine Specific gravity.93@ F (15. C) Evaporation, hours@ C (39 F), wt%. max Shelf life Indefinite (unopened)* * It is recommended that the containers be turned over every months to minimize settling for ease of mixing USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected] 113

114 Ther-O-Bond TM Adhesive Part number Description Package/Kit Size 1599FG Ther-O-Bond TM 15 Resin and hardener.9 liter (1 qt) 11FG Ther-O-Bond TM 1 -Part plastic kit 1gm (.35 oz) 1FG Ther-O-Bond TM 1 -Part plastic kit gm (1. oz) FG Ther-O-Bond TM Adhesive syringe 5ml Activator bottle 13ml Ther-O-Bond TM 15 Ther-O-Bond TM 1 ACCESSORIES Ther-O-Bond TM 15 is a versatile epoxy casting system developed for high performance, production potting and encapsulating applications where low shrinkage and rapid air evacuation are required. This formulation has a very low surface tension and a flowable viscosity, which affords excellent air release. Ther-O-Bond TM 15 adhers to rigid plastics and laminates, metals and ceramics, has a low coefficient of thermal expansion and is readily machined and shaped with ordinary shop tools. The fully cured epoxy system is an excellent electrical insulator which provides good resistance to electrolysis, leakage and corrosion room water, weather, gases and chemical compounds. For smaller applications, Ther-O-Bond TM 1 produces a stable, durable, high-impact bond, with good heat transfer characteristics. It is a thixotropic (smooth paste) thermally conductive epoxy system used for staking thermistors, diodes, resistors, integrated circuits and other heat sensitive components to printed circuit boards. This two-part adhesive develops strong, durable, high impact bonds at room temperature, which improve heat transfer while maintaining electrical insulation. Ther-O-bond TM 1 bonds readily to itself, to metals, silica, steatie, alumina, sapphire and other ceramics, glass, plastics and many other materials because its coefficient of thermal expansion provides a good match for those materials over a fairly wide temperature range. HANDLING CHARACTERISTICS Mix ratio by weight, 1 to 15 resin to hardener: Mixed 5 C, cps: C Gel 5 C Cure 5 C Cure 5 C Cure 1 C 5 Minutes 3- Hours Hours 1 Hour.5 Hour HANDLING CHARACTERISTICS Mix ratio by weight, 1 to 5 resin to hardener: Mixed 5 C, cps: 33, 5 C Gel 5 C Cure 5 C Cure 5 C Cure 1 C 5 Minutes 3- Hours Hours 1 Hour.5 Hour PHYSICAL PROPERTIES Color Black Specific gravity 1.5 Operating temp, C - to 155 Heat distortion temp, C 1 Hardness, shore D: Thermal 1. conductivity W/(m C) Compressive strength, psi 1, Dissipation factor,.1 Self extinguishing: yes C.T.E. (ppm/ C) 5 Tensile strength (@5 C) 9 psi Dielectric Shelf life 1 months* * Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will have less than 1 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life. Please adjust order quantity so all product will be consumed within 3 months of date of shipment. PHYSICAL PROPERTIES Color Blue Specific gravity:.3 Operating temp, C -7 to 115 Hardness, shore D: 9 Izod impact, F1 Lbs/Inch of notch.9 Thermal.5 conductivity W/(m- C) C.T.E. (ppm/ C) 5 Tensile strength (@5 C) 9 psi Tensile lap shear, psi 9 Dielectric strength (volts/mil) 1 Dielectric constant (1 5 C) 5.9 Dissipation factor, KH@ 5 C 5.9 Shelf life 1 months* Ther-O-Bond TM Ther-O-Bond TM acrylic adhesive cures rapidly at room temperature, while providing a repairable, thermally conductive bond. PRODUCT INFORMATION Color White Thermal. conductivity W/(m- C) C.T.E. (ppm/ C) 5 Tensile strength (@5 C) 3 psi Dielectric strength (volts/mil) Shelf life 1 months* * Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will have less than 1 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life. Please adjust order quantity so all product will be consumed within 3 months of date of shipment. 11 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]

115 Thermalbond Thermalbond is a thermally conductive, high strength epoxy adhesive. It provides exceptional adhesion to copper, aluminum, steel, glass, ceramics, and most plastics. Thermalbond TM also has a coefficient of thermal expansion compatible with aluminum, copper, and brass, making it particularly well suited for thermally bonding semiconductors and other components to chassis or heat sinks. Part number 99G 95G 951G 95G 953G Net weight. oz (5 gram kit) 1.7 oz (5 gram kit) 3.5 oz (1 gram kit) 7. oz ( gram kit) lbs (11 grams) MIXING INSTRUCTIONS Mix resin thoroughly before removing material. Add 7.1 parts of RT-7 hardener to 1 parts of resin by weight, or 17 parts of RT-7 hardener to 1 parts of resin by volume. Adhesive will set up in: hrs at 5 C (77 F) 1 hr. at 1 C (1 F) hrs. at 5 C (19 F) 3min. at 13 C ( F) Note: For maximum electrical and physical properties, a post cure is neccessary. Post cure at room temperature for days or for hours at 93 C ( F). HANDLING CHARACTERISTICS Typical electrical and physical properties at room temperature with RT-7 hardener Color Green Specific gravity.35 Working viscosity 5, cps Thermal conductivity 1.3W/(m C) (.77 Btu/hr ft F) Thermal resistivity 9. C in/watt Tensile strength.3 x 1 7 Pa (9, psi) Compressive strength 1. x 1 Pa (,9 psi) Bond shear strength 3.17 x 1 7 Pa (, psi) aluminum to aluminum, 5.mm (1") 5 C, (77 F) Thermal coefficient of expansion x 1 - / C (1.3 x 1 - / F) Water absorption, % after 1 days@ 5 C (77 F). Hardness, Shore D Volume resistivity 1. x 1 1 Dielectric strength 59.1 x 1 3 volts/mm (15 volts/mil) Dielectric constant@5 C (77 F) 1KHz.1 Dielectric factor@5 C (77 F) 1KHz. Operating temperatures -5 C to 155 C (-5 F to 311 F) Linear shrinkage. in/in Shelf life 1 months* Pot life@5 C (77 F) -3 hours Suggested stripping agent Miller-Stephenson MS 111 Cleaning solvent Acetone ACCESSORIES * Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will have less than 1 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life. Please adjust order quantity so all product will be consumed within 3 months of date of shipment. USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected] 115

116 THE TOTAL INTEGRATED SOLUTION FOR COOLING ELECTRONICS The Total Integrated Solution for Cooling Electronics Aavid Thermalloy has the expertise to design and manufacture cooling solutions spanning the entire range of thermal efficiency and mechanical complexity. The board level products displayed in this catalog represent only a fraction of our capabilities. Most applications require custom solutions, which is why so many leading electronics companies partner with Aavid Thermalloy. For demanding applications Aavid Thermalloy can design and validate custom innovative solutions utilizing the most advanced engineering resources saving you precious development time. Our manufacturing facilities, located in strategic markets around the globe, deliver cost effective products providing you a competitive advantage. From concept to production, Aavid Thermalloy can enable your design anywhere in the world. Experts at solving cooling challenges ranging from networking, telecom and consumer electronics, to power and biomedical devices. Our clients include Cisco, Nortel, HP, Apple, Sun, Bio-Rad, Mitsubishi and other industry leading companies worldwide. Utilizing the latest CFD/FEA and experimental techniques we can: Perform conjugate analyses with conduction, convection and radiation Optimize venting and fan placement Increase power density Reduce noise, cost and size. Increase MTBF Dedicated thermal engineers characterize your system and provide the most advanced and effective cooling solutions, saving thousands in engineering resources, thermal modeling software, and test hardware. There are cooling mechanisms that Aavid Thermalloy and Applied Thermal Technologies take pride in having expertise in: natural convection, forced convection, fluid phase change and liquid cooling. The above graph is a starting point to determine which technology can be used for your system configuration. For more information regarding any of these cooling mechanisms, please contact Aavid Thermalloy at: 11 USA Tel: +1 (3) [email protected] Italy Tel: [email protected] United Kingdom Tel: [email protected] Taiwan Tel: + () [email protected]