Intel Communications Chipsets 8925, 8950, and 8955

Transcription

1 Intel Communications Chipsets 8925, 8950, and 8955 Application Power Guidelines (APG) Addendum for Intelligent Systems January 2014 Revision 001 Document Number: US

2 Introduction INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to: Results have been estimated based on internal Intel analysis and are provided for informational purposes only. Any difference in system hardware or software design or configuration may affect actual performance. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling , or go to: Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Intel, Xeon, and the Intel logo are trademarks of Intel Corporation in the U.S. and/or other countries. *Other names and brands may be claimed as the property of others. Copyright 2014, Intel Corporation. All rights reserved. Application Power Guidelines Addendum January Document Number: US

3 Introduction Contents 1 Introduction Related Documents Reference Documents Terminology Application Power Guidelines APG for the Intel Communications Chipset APG for the Intel Communications Chipset APG for the Intel Communications Chipset Configuration Stresses APG Configuration Additional Information Figures Figure 1. Intel Communications Chipset 8925 APG... 8 Figure 2. Intel Communications Chipset 8950 APG... 9 Figure 3. Intel Communications Chipset 8955 APG Tables Table 1. Related Documents... 5 Table 2. Reference Documents... 5 Table 3. Terminology... 6 Table 4. Intel Communications Chipset 8925 APG... 8 Table 5. Intel Communications Chipset 8950 APG... 9 Table 6. Intel Communications Chipset 8955 APG Table 7. Stresses at Run-time January 2014 Application Power Guidelines Addendum Document Number: US 3

4 Introduction Revision History Date Revision Description January Initial release. Application Power Guidelines Addendum January Document Number: US

5 Introduction 1 Introduction This document provides power data on the Intel Communications Chipsets 8925, 8950, and 8955 while running industry standard benchmarks. This document complements the specifications published in the product Intel Communications Chipset 8900 Series - Datasheet (Document No ), but does not replace the specifications. Note: The Application Power Guidelines (APG) are for reference only. The power data provided in this document are not design points and should not be used as such. For additional information, refer to the documents listed in Table 1 and Table Related Documents Table 1. Related Documents Document Title Embedded Application Power Guideline Document No./Location Reference Documents Table 2. Reference Documents Document Title Document No./Location Intel Communications Chipset 8900 Series - Datasheet Intel Communications Chipset 8900 Series - Specification Update Intel Communications Chipset 8925, 8950, and Thermal Mechanical Design Guide Intel Communications Chipset 8925 to 8955 Series Software - Programmer s Guide Intel Communications Chipset 8925 to 8955 Series Software for Linux* - Getting Started Guide NOTE: Contact the local Intel representative for the most recent revision of these documents. January 2014 Application Power Guidelines Addendum Document Number: US 5

6 Introduction 1.3 Terminology Table 3. Terminology Term Description APG DC GUI PKE PTU SKU TDP Application Power Guidelines Data Compression Graphical User Interface Public-Key Encryption (Asymmetric Crypto) Power Thermal Utility Stock Keeping Unit Thermal Design Power Application Power Guidelines Addendum January Document Number: US

7 Application Power Guidelines 2 Application Power Guidelines The APG data listed in this document are intended to reflect typical use conditions. Factors such as temperature, platform configuration, and other variables may influence power usage. Specific information about platform and test configurations is also provided in this document to enable a repeatable power measurement. January 2014 Application Power Guidelines Addendum Document Number: US 7

8 Application Power Guidelines 2.1 APG for the Intel Communications Chipset 8925 Figure 1 shows the APG of various parameters for the Intel Communications Chipset 8925 with a 17W Thermal Design Power (TDP) specification. Table 4 interprets the data shown in the figure for each benchmark. Figure 1. Intel Communications Chipset 8925 APG Power (W) Idle Data Compression Symmetric Crypto Public-Key Encryption DC + Sym Crypto + PKE s Table 4. Intel Communications Chipset 8925 APG Benchmark Chipset Power (W) Junction Temperature ( C) Idle Data Compression Symmetric Crypto Public-Key Encryption DC + Sym Crypto + PKE s NOTES: 1. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark* and MobileMark*, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to 2. Test Configuration: The results presented are from a single sample. The data was not post-processed to account for part-to-part variation. 3. Processor: 1x Intel Xeon Processor E v GHz 4. Chipset: Intel Communications Chipset 8925, A0 5. BIOS Rev.: VCFRCLC Memory: 2x 1 GB Micron 1Rx8 PC E-9-10-D0 7. Operating System: Fedora* bit kernel A reference heat sink with fan was used while running these benchmarks. Application Power Guidelines Addendum January Document Number: US

9 Application Power Guidelines 2.2 APG for the Intel Communications Chipset 8950 Figure 2 shows the APG for various parameters for the Intel Communications Chipset 8950 with a 20W TDP specification. Table 5 interprets the data shown in the figure for each benchmark. Figure 2. Intel Communications Chipset 8950 APG Power (W) Idle Data Compression Symmetric Crypto Public-Key Encryption DC + Sym Crypto + PKE s Table 5. Intel Communications Chipset 8950 APG Benchmark Chipset Power (W) Junction Temperature ( C) Idle Data Compression Symmetric Crypto Public-Key Encryption DC + Sym Crypto + PKE s NOTES: 1. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark* and MobileMark*, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to 2. Test Configuration: The results presented are from a single sample. The data was not post-processed to account for part-to-part variation. 3. Processor: 1x Intel Xeon Processor E v GHz 4. Chipset: Intel Communications Chipset 8950, A0 5. BIOS Rev.: VCFRCLC Memory: 2x 1 GB Micron 1Rx8 PC E-9-10-D0 7. Operating System: Fedora* bit kernel A reference heat sink with fan was used while running these benchmarks. January 2014 Application Power Guidelines Addendum Document Number: US 9

10 Application Power Guidelines 2.3 APG for the Intel Communications Chipset 8955 Figure 3 shows the APG of various parameters for the Intel Communications Chipset 8955 with a 20W TDP specification. Table 6 interprets the data shown in the figure for each benchmark. Figure 3. Intel Communications Chipset 8955 APG Power (W) Idle Data Compression Symmetric Crypto Public-Key Encryption DC + Sym Crypto + PKE s Table 6. Intel Communications Chipset 8955 APG Benchmark Chipset Power (W) Junction Temperature ( C) Idle Data Compression Symmetric Crypto Public-Key Encryption DC + Sym Crypto + PKE s NOTES: 1. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark* and MobileMark*, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to 2. Test Configuration: The results presented are from a single sample. The data was not post-processed to account for part-to-part variation. 3. Processor: 1x Intel Xeon Processor E v GHz 4. Chipset: Intel Communications Chipset 8955, A0 5. BIOS Rev.: VCFRCLC Memory: 2x 1 GB Micron 1Rx8 DDR3 SDRAM 1RX8 PC E-9-10-D0 7. Operating System: Fedora* bit kernel A reference heat sink with fan was used while running these benchmarks. Application Power Guidelines Addendum January Document Number: US

11 Configuration 3 Configuration The APG data represent a typical or average processor SKU and do not include partto-part power variation. The APG data are not intended to replace TDP, or to be used for reliability assessments. Individual test results may vary. Temperature values are mean temperatures measured throughout the duration of each test. 3.1 Stresses Data were collected using workloads as described in the Intel Communications Chipset 8925 to 8955 Series Software - Programmer s Guide (Document No ). Table 7 shows the specific slices each workload stresses at run-time. Table 7. Stresses at Run-time Service Number of Slices Stressed Cipher Auth PKE Compression Data Compression Symmetric Crypto Public-Key Encryption DC + Sym Crypto + PKE s NOTES: 1. Although the maximum number of slices for each service is theoretically 64, too many slices executing simultaneously can increase the overhead of switching and decrease the payload, resulting in lower performance. 2. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark* and MobileMark*, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to January 2014 Application Power Guidelines Addendum Document Number: US 11

12 Configuration 3.2 APG Configuration Processor: 1x Intel Xeon Processor E v GHz. BIOS Rev.: VCFRCLC Memory: 2x 1 GB Micron 1Rx8 PC E-9-10-D0. Operating System: Fedora* bit kernel Benchmark: DH895xCC.L using an Intel QuickAssist Technology driver. A reference heat sink with fan was used while running these benchmarks. APG testing was conducted by Intel Corporation. APG configuration is provided for repeatability of the test. A Power Thermal Utility (PTU) tool is developed by Intel to generate TDP-like workloads on a chipset. The Intel Communications Chipset 89xx Series is most easily described as a PCH that includes both standard PC interfaces (e.g., PCI Express* Root Complex, SATA, USB, etc.) along with Intel QuickAssist Technology. The Idle Power reported above is while displaying the Linux* screen with the GUI disabled while the chipset is waiting for package handling. For more information, go to Additional Information In case of conflict, the Intel Communications Chipset 8900 Series: Datasheet (Document No ) supersedes this document. Application Power Guidelines Addendum January Document Number: US