LM811 WiFi and Dual Mode Bluetooth Combination Module Host Controller Interface (HCI) via USB Interface
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1 WiFi and Dual Mode Bluetooth Combination Module Android XP Vista 7 8 Revised 5/DEC/ mm 2mm 25mm Features WiFi 802. b/g/n Bluetooth v4.0 (Backwards compatible with Bluetooth v2.0, v2. and v3.0) WPA, WPA-PSK, WPA2, WPA2 -PSK and WEP (64bit & 28bit) encryption schemes Full speed Bluetooth Piconet and Scatternet supported 5V IC Antenna or 3V3 IPEX Connector module options USB 2.0 (Full Speed) and PCM interface Support sophisticated WiFi/Bluetooth coexistence mechanism to enhance performance Support Bluetooth adaptive power management mechanism Linux (Kernel v4.3.6), Android 4.4 and Windows XP 0 compatible 25mm x 2mm x 2mm IC, FCC and SIG Certified Solution RoHS, REACH and WEEE Compliant Solution Overview The combination module offers coexistence for Bluetooth (Dual Mode) and WiFi operations. Allowing the host computer to wirelessly communicate with other Bluetooth and WiFi enabled devices. This cost effective module saves valuable PCB space within your product. module fully supports IEEE 802.b/g/n/d/e/h/i standards and Bluetooth v2.0, v2., v3.0 and v4.0 standards. Compatible with Linux (Kernel v4.3.6), Android 4.4 and Windows XP 0 platforms. The module also offers low power consumption and an intelligent coexistence mechanism, ideal for communicating with many wireless devices such as tablets, smart phones and laptops. Page of
2 WiFi and Dual Mode Bluetooth Combination Module General Specification Wireless Wireless Standard WiFi: 802. b/g/n/d/e/h/i v2.+edr/v3.0+hs/v4.0 Module Type Host Controller Interface (HCI) OS Compatibility Linux, Android and Windows XP 0 Security WiFi; WPA, WPA-PSK, WPA2, WPA2 -PSK and WEP (64bit & 28bit) Bluetooth ; Simple Paring Network Architecture WiFi; Ad hoc mode (Peer-to-Peer) and Infrastructure mode Software AP; WiFi Direct Bluetooth ; Pico Net; Scatter Net Hardware Chipset Realtek Antenna Onboard Chip Antenna or IPEX Connector Interfaces USB 2.0 (Full Speed) and PCM RF Characteristics Tx Output WiFi; 7dBm 802.b@Mbps 5dBm 802.g@6Mbps 4dBm 802.g@54Mbps 3dBm 802.n@MCS0_HT20 3dBm 802.n@MCS7_HT20 3dBm 802.n@MCS0_HT40 3dBm 802.n@MCS7_HT40 Maximum 0dBm Rx Sensitivity WiFi; -82dBm 802.b@Mbps -7dBm 802.g@54MBps -67dBm 802.n@MCS7_HT20-64dBm n@MCS7_HT40-89dBm@Mbps -90dBm@2Mbps -83dBm@3Mbps Page 2 of
3 WiFi and Dual Mode Bluetooth Combination Module General Specification (Continued) RF Characteristics Range (in open space) WiFi: Up to 80m Up to 0m Data Transfer Rate WiFi: 802.b:, 2, 5.5, Mbps; 802.g: 6, 9, 2, 8, 24, 36, 48, 54Mbps; 802.n MCS0 to 7 for HT20MHz, MCS0 to 7 for HT40MHz Basic Rate Mbps; Enhanced Rate 2, 3Mbps; High Speed 6, 9, 2, 8, 24, 36, 48, 54Mbps Frequency 2.4GHz to GHz Modulation Scheme WiFi: 802.b: CCK, DQPSK, DBPSK 802.g: 64QAM, 6QAM, QPSK, BPSK 802.n: 64QAM, 6QAM, QPSK, BPSK 8DPSK, π/4 DQPSK, GFSKFSK Spread Spectrum WiFi: IEEE 802.b: DSSS (Direct Sequence Spread Spectrum) IEEE 802.g/n: OFDM (Orthogonal Frequency Division Multiplexing) FHSS (Frequency Hopping Spread Spectrum) Operating Channel WiFi (2.4GHz): : (Ch. -) United States 3: (Ch. -3) Europe 4: (Ch. -4) Japan Bluetooth (2.4GHz): Ch. 0 to 78 Physical Characteristics Operating Temperature 0 C to +60 C ambient temperature 0 to 95 % (non-condensing) Storage Temperature -20 C to +70 C ambient temperature 0 to 95 % (non-condensing) Dimensions (L x W x H) 25mm x 2mm x 2mm Weight 0.82 g Certifications CE, FCC, IC, TELEC and SIG Compliance RoHS, REACH and WEEE Page 3 of
4 WiFi and Dual Mode Bluetooth Combination Module Consumption DC power for 5V Performance DC power for 3.3V Performance Description Typ Off 0 Units Description Typ Units ua Off 6 ua Unassociated idle 40 Unassociated idle 90 Associated idle for 2.4GHz band 70 Associated idle for 2.4GHz band 4 Data transfer for 2.4GHz 03 Data transfer for 2.4GHz 68 Note: Data transfer test using the Linux driver: Linux_v4.3.6_ Note: Data transfer test using the Linux driver: Linux_v4.3.6_ DC Input Module Min Typical Max Unit DC 5V (IC Antenna) V DC 3.3V (IPEX Connector) V Important: 3.3V IPEX connector products must only use 3.3V 5V IC Antenna products must only use 5V Warning: Do NOT use the wrong voltage on your module. Page 4 of
5 WiFi and Dual Mode Bluetooth Combination Module Pin Outs RF Type 2: IC Antenna Module RF Type : IPEX Connector Module Pin Assignments Pin Signal Type Description WO-WLAN Output Chip Wake Host function 2 GND Ground 3 USB D+ I/O USB D+ signal 4 USB D- I/O USB D- signal 5 VCC Supply DC 3.3V for (IPEX Connector Module) / Supply DC 5V for (IC Antenna Module) 6 SUSPEND Input Host Wake Chip function. 7 GND Ground 8 ANT - WiFi/Bluetooth RF port (if you are NOT using the IPEX connector) 9 GND Ground 0 GND Ground ANT - No Connection 2 GND Ground 3 BT_PCM_IN Input PCM data Input. This pin is also shared with GPIO0 and 3DG_SEL_A 4 BT_PCM_OUT Output PCM data Output. This pin is also shared with GPIO and 3DG_SYNC_A. 5 BT_PCM_SYNK I/O PCM frame Synchronization. This pin is also shared with GPIO2. 6 BT_PCM_CLK I/O PCM Clock. This pin is also shared with GPIO3. 7 EXT_XIN - No Connection Page 5 of
6 WiFi and Dual Mode Bluetooth Combination Module Physical Dimensions TOP VIEW 25mm Sheilding 23.6mm 2mm FRONT VIEW 2mm x mm 2mm SIDE VIEW PCB Footprint The recommended layout pads for module are shown below. TOP VIEW 25mm 0.7 3mm x4 0.6 Page 6 of 0.7 High limit 0mm.2. PCB 0.8mm BOTTOM VIEW mm x mm.4 7.6mm 2mm 0.9mm 0.7 3
7 WiFi and Dual Mode Bluetooth Combination Module Design-in Guidelines Wake Function - Pin Supend Function - Pin 6 Place WO-WLAN (Chip Wake Host) function. PIN6. Place SUSPEND (Host Wake Chip) VD33 VD33 R23 NP 00KR JP3 PU 2 3 WOLAN JP4 PU 2 3 SUSPEND PD NP JUMPER R24 0KR R25 NP 00KR PD NP JUMPER R26 0KR A A 2.60± ± ± ± ø2.00± ø.85±0.050 RF Connector Dimensions A MAX A B ø.70±0.050 ø ø0.50±0.050 B SECT A-A Contact Page 7 of ±0.05 Housing 0.05 Ground Contact ±0.050 A 0.25±0.050 A 0.60
8 WiFi and Dual Mode Bluetooth Combination Module PCB Drying Conditions This module is MSL-3 surface mount device; please refer below conditions for drying before solder reflow processes. If your PCB was baked at the below temperatures you need to follow the below guidelines (extracted from IPC/JEDEC J-STD-033B.) o 25 C By > 72h By 72h 9 hours 7 hours o o 90 C By > 72h By 72h 33 hours 40 C By > 72h By 72h 23 hours 3 days 9 days Temperature Analysis Report Temperature Curve Chart Temperature Probe Name Time (s) Name Max Min Length Probe Liquidus Line Rising # #2 #3 #4 # Page 8 of Zone Speed: 70 cm/min Zone Zone Zone Zone Zone Maximum / Minimum Above Max Zone Zone Slope Min Positive Negative
9 WiFi and Dual Mode Bluetooth Combination Module Tape and Reel Packaging.50mm 4.0mm 40mm 25.6mm 6mm 44mm 2.0mm 20.2mm.75mm Tape Dimensions 0.3mm 2.60mm 2.4mm Reel Dimensions 330mm Notes Carton Dimensions (L x W x H): 395mm x 360mm x 305mm Quantities 500 modules per Tape 5 Boxes per Carton 7500 modules per carton 49.4mm 00mm Page 9 of
10 WiFi and Dual Mode Bluetooth Combination Module Packaging for Tape & Reel / Tray The trays/reels are stacked and inserted into an anti-static vacuum bag and the Anti-Static Label, Model Name Label and Moisture Sensitive Labels stuck on. drying agent Humidity Indicator Card Reels are place within a vacuum bag. Anti-static aluminium vacuum bag. Trays are stacked up with an empty tray on the top. The vacuum bag is placed inside the box and a Model Name Label stuck on the front-side of each box. Model name label Anti-static aluminium vacuum bag. box ) b ox carton carton label Each carton contains 4 boxes. Page 0 of
11 WiFi and Dual Mode Bluetooth Combination Module See Below Packaging Options V Module with IPEX Connector x SMT HCI 802.n BT4.0 50Mbps USB 3.3V IPEX Module Tray V Module with IPEX Connector x SMT HCI 802.n BT4.0 50Mbps USB 3.3V IPEX Module Tape & Reel V Module with IC Antenna x SMT HCI 802.n BT4.0 50Mbps USB 5V IC ANT Module Tray V Module with IC Antenna x SMT HCI 802.n BT4.0 50Mbps USB 5V IC ANT Module Tape & Reel User Guides, Manuals and Configuration Software can be downloaded via our website - Page of
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