Whitepaper Save power and improve efficiency in virtualized environment of datacenter by right choice of memory A cooperation of Microsoft Technology Center & Samsung Semiconductor Document Version: 2.1 Authors: Microsoft: Ramazan Can (Blog: http://ramazancan.wordpress.com); Frank Koch Samsung Semiconductor: Insu Choi (insu.choi@samsung.com), Insuk Suh, Huichung Byun, Peyman Blumstengel Contacts: Frank Koch, Microsoft Green IT Evangelist Europe, frankoch@microsoft.com Peyman Blumstengel, Samsung Semiconductor Europe, peyman.b@samsung.com Document Revision: 2.1 1 May 2011
Introduction This Whitepaper describes the results of a joint Proof of Concept (PoC) to verify the power savings achieved by leveraging advanced DRAM process technology within server systems used in a virtualized environment. For this purpose we have compared the power consumption behavior of two identical server systems populated with modules based on 50nm process technology (called in this document Non-Green DDR3) with those based on 30nm technology (hereafter called Samsung Green DDR3). We have populated the systems in three different configurations with 48GB, 96GB and 144GB of memory. Summary of Results Samsung Green DDR3, a leading edge DRAM technology, will reduce the total power consumption of server systems in a data center running virtualized environments up to 15% or 30W per system when compared to Non-Green DDR3 at a different deployment level per CPU in a server. In addition Samsung Green DDR3 can achieve a greater power reduction when it is populated with more DIMMs per channel. Our measurements show that the difference in power consumption between Samsung Green DDR3 and Non-Green DDR3 actually increases as more DIMMs are populated in each channel of a CPU. AC power measurements using the Windows -based program consume.exe show that the 30nm-class modules consume 6~11% less power than 50nm-class modules over all load levels. The higher the memory population the greater the relative power saving. SPECPower benchmark tests show the efficiency (Data throughput per consumed power) of servers based on 30nm DRAM modules are up to 10% better than the 50nm based platform over all system loadings and consume up to 30W less power. As the system is more densely populated with memory, the difference becomes more significant. Table 1. Analysis of a rack consisting of 30 systems in a data center with PUE =2 Samsung Green DDR3 vs. Non-Green DDR3 Saving on system level Saving in cooling Total saving in DC (PUE=2) Cost of energy Life cycle Total cost saving: 1 system 30 systems Value 30 W Not measured 60 Watt 1.5 Euro /Watt/anno 4 Years 360 Euro /life cycle 10800 Euro /life cycle Document Revision: 2.1 2 May 2011
Test Environment Test systems: two identical Dell PowerEdge R710 servers Intel Westmere-EP, two sockets CPU: 2x Intel Xeon X5670 6C/12T 2.93GHz 12MB Storage: ISCSI connected shared LUN with 900GB OS: Microsoft Windows Server 2008 R2 Enterprise with Hyper-V role and active power profile Balanced Memory: Seven configurations based on 8GB modules comprising 2Gb chips; 30nm vs. 50nm class Workload: Microsoft consume.exe (executed in each Virtual Machine (VM)) Total Memory Green Memory (30nm Class) Non-Green Memory (50nm Class) Memory Voltage 1.5V 1.35V 1.5V 1.35V 48GB (1DPC*) 1333Mbps 1333Mbps 1333Mbps 96GB(2DPC) 1333Mbps 1333Mbps 144GB(3DPC) 800Mbps 800Mbps * DPC :DIMM Per Channel Table 2. Summary of memory configurations tested. Hyper-V Host1 (Non-Green DDR3) Non-Green DDR3: 8GB 2Gb based 50nm class components, running at only 1.5V (Samsung Part number: M393B1K70BH1-CH9) - 1 x DPC: 6units x 8GB 2Rx4 1333Mbps 1.5V= 48GB total deployment - 2 x DPC: 12units x 8GB 2Rx4 1333Mbps 1.5V= 96GB total deployment - 3 x DPC: 18units x 8GB 2Rx4 800Mbps 1.5V= 144GB total deployment Hyper-V Host2 (Samsung Green DDR3) Samsung Green DDR3: 8GB 2Gb based 30nm class components, running at either 1.35V or 1.5V according to Intel POR (Samsung Part number: M393B1K70DH0-YH9) - 1 x DPC: 6units x 8GB 2Rx4 1333Mbps 1.35V= 48GB total deployment - 2 x DPC: 12units x 8GB 2Rx4 1333Mbps 1.5V= 96GB total deployment - 3 x DPC: 18units x 8GB 2Rx4 800Mbps 1.5V= 144GB total deployment Document Revision: 2.1 3 May 2011
Microsoft Windows Server 2008 R2 Enterprise with all available Windows Updates (01.28.2011) and Hyper-V role. Activated power saving profile Balanced The test scope is based on Microsoft Hyper-V hypervisor-based server virtualization technology. 10 VMs were created per Hyper-V host. The memory usage of the VMs can be increased depending on the available memory at the host system. The configurations for all VMs are: 4x vcpu, Dynamic Disk, Synthetic Network Card; OS: Windows 2008 R2; Roles/Features: none BIOS Settings Intel-VT and Disable Execution Bit enabled + Power Management Control is set to OS Control Document Revision: 2.1 4 May 2011
Test Results Total DIMM Power Consumption Total memory power consumption under each 1DPC/2DPC/3DPC configuration Power consumption difference: 30nm class memory consumes up to 50% less power Total System AC Power Consumption Total system AC power consumption under each 1DPC/2DPC/3DPC configuration Power consumption difference: 30nm class memory consumes up to 11% less power Document Revision: 2.1 5 May 2011
Workload analysis of consume.exe To simulate a workload with high memory load of the system, consume.exe from the Windows SDK was used. The SDK can be downloaded for free from the Microsoft download center. (see references) Consume.exe Pattern Analysis Result The CPU load of consume.exe is relatively low, compared to the normal load within a Data Center The CPU idle time is up to 90% (vs. normal Data Center workload: 60~70%) Document Revision: 2.1 6 May 2011
Spec power results: Six units x 8GB 2Rx4 Samsung Green DDR3 vs. Non-Green DDR3 Document Revision: 2.1 7 May 2011
12 units x 8GB 2Rx4 Samsung Green DDR3 vs. Non-Green DDR3 Document Revision: 2.1 8 May 2011
18 units x 8GB 2Rx4 Samsung Green DDR3 vs. Non-Green DDR3 Document Revision: 2.1 9 May 2011
Abbreviations and references used in this paper: SPEC and the benchmark name SPECpower are registered trademarks of the Standard Performance Evaluation Corporation. http://www.spec.org The Standard Performance Evaluation Corporation (SPEC) is a non-profit corporation formed to establish, maintain and endorse a standardized set of relevant benchmarks that can be applied to the newest generation of high-performance computers. SPEC develops benchmark suites and also reviews and publishes submitted results from our member organizations and other benchmark licensees. DPC: DIMM per Channel, number DRAM DIMMs modules populated into each available CPU Channel. In this set up the CPUs each have three channels for memory PUE: Power Usage Efficiency, a key performance indicator of a data center in terms of power consumption efficiency for IT. It is calculated as the ratio of total data-center power consumption to IT power consumption. Rank: memory rank is a specific memory area of 72 bits wide for RDIMMs that can be addressed by the CPU at one time. 8GB module based on 1Gb comprises 72 components. Each 18 units of DRAM components in x4 organization build a data width of 72 leading to four ranks. In other words, each separate area of memory discretely accessible with width of 72 bits is one rank. Consume.exe: part of the Microsoft Windows Software Development Kit (SDK) for Windows 7 and.net Framework 4 (ISO) http://www.microsoft.com/downloads/en/details.aspx?familyid=35aeda01-421d-4ba5-b44b-543dc8c33a20 About companies Microsoft Technology Center (MTC) Microsoft Technology Centers (MTCs) are collaborative environments that provide access to innovative technologies and world-class expertise, enabling you to envision, design, and deploy solutions to meet your exact needs. http://www.microsoft.com/mtc/ Samsung Samsung Electronics Co., Ltd. is a global leader in semiconductor, telecommunication, digital media and digital convergence technologies with 2010 consolidated sales of US$135.8 billion. Employing approximately 190,500 people in 206 offices across 68 countries, the company consists of eight independently operated business units: Visual Display, Mobile Communications, Telecommunication Systems, Digital Appliances, IT Solutions, Digital Imaging, Semiconductor and LCD. Recognized as one of the fastest growing global brands, Samsung Electronics is a leading producer of digital TVs, semiconductor chips, mobile phones and TFT-LCDs. For details on Samsung Memory visit: www.samsung.com/greenmemory Document Revision: 2.1 10 May 2011