GBIC CWDM 40km Part no: 7025770264 Description General The GBIC CWDM 40 transceiver is small form factor pluggable module with standard SC duplex connector for fiber communications. This module is designed for single mode fiber and operates at a nominal wavelength of CWDM with the cost effective and high performance characteristics. There are eight central wavelengths available at present: 1470nm, 1490nm, 1510nm, 1530nm, 1550nm, 1570nm, 1590nm and 1610nm. eceiver Section The receiver contain of an InGaAs PIN photodiode coupled to a high sensitivity transimpedance amplifier (TIA) in an OSA. This OSA combination is mated to a post amplifier IC that provides the post amplification and LOS (Loss of Signal) indication circuit, which provides LVTTL logic high state output when a unusable input optical signal level is detected. Transmitter Section The transmitter consists of a highperformance MQW DFB structure laser in the optical subassembly (OSA), which is housed within a metal package. In addition, this component is also class 1 laser compliant with according to International Safety Standard IEC60825 Features + 3.3 V / +5V Power Up to 1.25Gbps & CWDM 8 channels GigaBit Interface Converter MSA Compliant SC Duplex Connector EEPOM with serial ID functionality Class 1 Laser International Safety Standard IEC 60825 Compliant Temperature anges: 0 to +70 ohs Compliant Applications Gigabit Ethernet Links Fiber Channel Bridges/outers/intelligent hub and concentrators Performance Specifications Absolute Maximum atings Voltage VCC 0 7 V Storage Temperature TS 40 85 Operating Temperature TOP 0 70 Lead Soldering Limits TSOLD 260/10 /sec General Specifications s Data ate B 1.25 Gbps Supported Link Length on 9/125µm SMF L 40 Km
Optical and Electrical Characteristics Transmitter Electrical Characteristics Voltage VCC 3.15 5.25 V Current ICC 160 ma Data Differential Input Voltage V in, pp 300 1600 mv Disable Input Voltage VIL V CC 1.81 1.48 V Enable Input Voltage VIH V CC 1.16 0.88 V Transmitter Optical Characteristics Output Optical Power PO 5 0 dbm Center Wavelength λ C λ C 6.5 λ C λ C +6.5 nm Spectral Width (20db) λ 1 nm Optical ise Time (10%90%) t r 0.26 ns Optical Fall Time (10%90%) t f 0.26 ns Extinction atio E 10 db eceiver Electrical Characteristics Voltage VCC 3.15 5.25 V Current ICC 100 ma Data Differential Output Voltage V out, pp 300 1000 mv Data Output ise Time (10%90%) t r 0.35 ns Data Output Fall Time (10%90%) t f 0.35 ns eceiver Optical Characteristics Maximum eceiver Power Pin 3 dbm eceiver Sensitivity PS 24 dbm Optical Center Wavelength λ C 00 1600 nm Signal DetectAsserted PA 24 dbm Signal DetectDeasserted PD 36 dbm Signal DetectHysteresis PAP D 0.5 db
ecommended Circuit Schematic VccT VEET TxDisable 3 1,17,20 3.3V System TxFault 2 Laser Diode Laser Diode Driver 100Ω TD+ TD 18 19 VccT 16 1µΗ 3.3V 0.1µF 0.1µF 10µF SFP Transceiver Vcc 15 1µΗ SerDes IC D Pre Amplifier Photo Diode POST Amplifier D+ 10µF 12 13 0.1µF 100Ω Protocol IC Vcc LOS 8 3.3V MOD DEF2 4 EEPOM MOD DEF1 5 MOD DEF 0 6 PLD/ PAL VEE 9,10,,14 GBIC to host connector Pin Assignment As the GBIC CWDM 40km is inserted, first contact is made by the housing ground shield, Discharging any potentially componentdamaging static electricity. Ground pins engage next and are followed by Tx and x power supplies. Finally, signal lines are connected. Pin functions and sequencing are listed in next Table
Function Diagram OPTICAL INTEFACE INCOMING OPTICAL SIGNAL. 1 2 ECEIVE PHOTO DECTO AMPLIFCATION & QUANTIZATION ELECTICAL INTEFACE X+ (ECEIVE DATA) X (ECEIVE DATA) LOSS OF SIGNAL TANSMITTE TX_DISABLE OUTGOING OPTICAL SIGNAL LASE LASE DIVE & SAFETY CICUITY TX+ (TANSMIT DATA) TX (TANSMIT DATA) TX_FAULT MOD DEF2 EEPOM MOD DEF1 MOD DEF0
Package Outline Drawing Dimension (unit:mm) ohs eference Material Classify Heavy Metals Brominated Organic Compounds Substance eference Standard Analysis Equipment Lead (Pb)/ Lead Compounds 2002/95/EC < 1000 ppm US EPA 3050B ICPAES Cadmium (Cd)/ EN222001 2002/95/EC < 100 ppm Cadmium Compounds 91/338/EEC ICPAES Mercury ( Hg ) / Mercury Compounds 2002/95/EC < 1000 ppm US EPA 3052 ICPAES HexavalentChromium( US EPA 3060A 2002/95/EC < 1000 ppm Cr6+)Compounds & 7196A UVVIS PolyBrominated US EPA 3540 & 2002/95/EC < 1000 ppm Biphenyls (PBB) 3550 GC/MS PolyBromo Diphenyl US EPA 3540 & 2002/95/EC < 1000 ppm Ethers(PBDE) 3550 GC/MS
Qualification Information Heading Test Conditions Sample Size eference Mechanical Shock 5 times/axis 500G, 1.0ms Method 2002 Vibration 20G, 20Hz 2000HZ 4min/cycle,4cycles/axis Method 2007 Mechanical Thermal Shock Delta T=100 & Physical Method 2003 Solderability Method 2007 Fiber Pull 1Kg ; 3times ; 5sec Endurance Special Test Accelerated Aging 85, 5000hrs 25 High Temperature Storage 85, 2000hrs Low Temperature Storage 40, 2000hrs Temperature Cycling 500 cycles. Cyclic Moisture esistance 10 cycles 40, 95% Damp Heat H, 1344hrs Internal Moisture <5000ppm water vapor Flammability ESD Threshold 6 Section 5.18 Section 5.20 Section 5.23 MILSTD202 Method 103 Method 1018 T357 Sec.4.4.2.5 Section 5.22