Performance Evalua/on and So2ware Development of FPCCD Vertex Detector for ILC

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1 Performance Evalua/on and So2ware Development of FPCCD Vertex Detector for ILC MORI Tatsuya, KAMAI Daisuke, MIYAMOTO Akiya A SUGIMOTO Yasuhiro A, ISHIKAWA Akimasa, SUEHARA Taikan, KATO Eriko, YAMAMOTO Hitoshi Tohoku University, KEK A 1

2 Contents of This Presenta/on 1. Introduc;on of FPCCD 2. Occupancy 3. Performance with Larger Pixel Size 4. Tracking Performance 5. Summary Framework:ILCSo2 v01-16 (h&p://ilcso/.desy.de/portal) 2

3 Road of Vertex Detector one of the ILC physics goal: precise measurement of Higgs coupling constant to c and b (hard at LHC) precise iden;fica;on of Hà bb, cc, gg is required W b c s (B 0 : cτ = 455 µm) (D 0 : cτ = 123 µm) W Higgs coupling constant mass[gev] We need Vertex detector (VXD) with high performance 3

4 Fine Pixel CCD Vertex Detector (FPCCD) FPCCD s feature: /ny pixel CCD! pixel size : 5 5 µm 2 sensi;ve thickness : 15 µm total thickness : 50 µm 10 billion pixels readout : per 1 train 1 train (1ms) rest (199ms) High IP Resolu/on! Low Pixel Occupancy! But Tracking with many bkg. hits is challenging FPCCD s readout 4

5 Occupancy 5

6 Setup for Pixel Occupancy we must also take into account background (bkg.) in VXD dominant bkg. in VXD is derived from the beam cross- sec/onal view e + e - Pair bkg. generated from beamstrahlung at beam collision point direct hit backscaxering from BeamCal (BCAL) direct 25 nsec. backsca&ering nsec. fieldx03 Calcula/on of occupancy 1: Pair bkg. hits from 10 BX are simulated (BX : bunch crossing) 2: Create pixel hits by digi;zer which takes into account Landau distribu;on, threshold, path length, noise 3: Occupancy is scaled to 1 train 6

7 Evalua/on of Pixel Occupancy Requirement : below 2 3 % Occupancy(%) at 500 GeV Layer No. all direct backscatter 1(inner) (outer) Occupancy(%) at 1 TeV Layer No. all direct backscatter 1(inner) (outer) GeV is OK!! Layer No. However 1 TeV is challenging Solu;ons: Larger radius Make pixels smaller Op;mize geometry of forward detector Reduce bkg. hits using cluster shape 7

8 Performance with Larger Pixel Size 8

9 Performance with Larger Pixel Size FPCCD VXD has lots of pixels large power consump;on Lower power consump/on could be achieved by larger pixel size Pixel size (1st,2nd layer) Pixel size (outer 4 layers) Power consump/on small 5 µm 5 µm 70% 111 W large 5 µm 10 µm reduc/on! 34 W Pixel Size 5 µm 1.44 µm 10 µm 2.88 µm Spa;al Resolu;on Occupancy and IP resolu;on with large configura;on were evaluated Occupancy(%) at 1 TeV 10 x 10 µm 2 layer No. all direct backscatter Low Occupancy! r (mm) IPReso distribution. ~ FPCCD 5um10um VS FPCCD all5um ~ small VS large 1 10 FPCCD all5um 20deg FPCCD all5um 30deg FPCCD all5um 85deg FPCCD 5um10um 20deg FPCCD 5um10um 30deg FPCCD 5um10um 85deg Two conf. almost overlap!! 2 10 Momentum(GeV/c) Large configura/on which can reduce power consump/on by 70% sa/sfies requirement of occupancy and IP resolu/on 9

10 Tracking Performance 10

11 Tracking in ILD frequently referred from here 1st phase: Stand- alone silicon (VXD + SIT) tracking Stand- alone TPC tracking 2nd phase: Silicon track + TPC track track merging & refilng Merged track 11

12 Silicon Tracking Process load VXD hits SIT layers VXD layers 12

13 Silicon Tracking Process load VXD hits SIT layers triplet search triplet is track seed VXD layers First, we divide the area into 80 θ x 80 φ regions Second, we search the triplet in each area 13

14 Silicon Tracking Process load VXD hits triplet search triplet is track seed red : seed layers SIT Third, triplet will be found on seed layers VXD Fourth, triplet will be fi&ed At last, if the result of the fit sa;sfies Chi2/ndf and track parameter requirements, then the triplet becomes the seed of track candidate 14

15 Silicon Tracking Process load VXD hits triplet search add remaining hits to the triplet SIT VXD 15

16 Silicon Tracking Process load VXD hits triplet search add remaining hits to the triplet connect connect tracks and tracks with a few VXD hits 16

17 Silicon Tracking Process load VXD hits triplet search add remaining hits to the triplet connect tracks and tracks with a few VXD hits output tracks add remaining hits to the tracks final refilng with Kalman Filter 17

18 Challenge of Tracking with Pair bkg. There are many bkg. hits in two most inner layers of FPCCD VXD If they are included in the triplet search, there will be many fake triplets and we consume a lot of CPU ;me for many combina;ons We studied tracking performance excluding two most inner layers from triplet search FPCCD VXD layers : 6th 5th 4th 3rd 2nd 1st not used for triplet search in this study Setup for evalua/on of tracking in FPCCD: Pair bkg. in 1TeV beam run is overlaid on single µ + event Pair bkg. from 1, 100, 200, 500, 1000, 2650 BX ( = 1train) are studied 18

19 Evalua/on of IP Resolu/on of Good Tracks with bkg. Good Track track with VXD hits >= 5 d0 /mm θ = 85 (fixed) 100GeV 30GeV 10GeV 3GeV 1GeV number # of of BX BX IP resolu/on of good tracks is EXCELLENT & Deteriora/on of resolu/on is small 19

20 Evalua/on of Frac/on of Good Track Frac/on of Good Track : η # of tracks with VXD hits >= 5 # of µ + with 6 VXD hits in simula/on Frac/on Tracking of Good Efficiency( ) Track (η) θ = 85 (fixed) 100GeV 30GeV 10GeV 3GeV 1GeV number # of BX A problem in tracking of 1 GeV par/cle 20

21 Threshold of track deteriora/on in FPCCD without pair bkg. Triplet Search : first two VXD layers inac/vated Tracking Efficiency( ) Frac;on of Good Track(η) Threshold : P T 1.6GeV/c th85 th80 th75 th70 th65 th60 th55 th50 th45 th40 th35 th Transverse Momentum(MeV/c) 21

22 Threshold of track deteriora/on in FPCCD without pair bkg. Tracking Efficiency( ) Frac;on of Good Track(η) Triplet Search : using all layers dip at 1GeV (also appears in the case of CMOS) th85 th80 th75 th70 th65 th60 th55 th50 th45 Using all layers recovers th40 frac;on th35 Frac/on depends th30 on triplet search process Threshold : 1.4GeV Transverse Momentum(MeV/c) 22

23 φ Division in Silicon Tracking Most preferred triplet search combina;on : SIT s two and VXD s outermost layers for avoiding picking up beam background hits In standard configura;on, search area is divided into 80 x 80 (θ and φ) too strict to find triplets in preferred layers If # of φ divisions is reduced, efficiency of silicon track increases. φ division frac;on of good track in stand- alone silicon tracking 80 (default) 5% 40 22% (evaluated with single µ + event, P = 1GeV/c, θ = 85 ) By 40 φ division, efficiency of merged track is expected to increase 23

24 Efficiency of Merged Track (φ division of 40) However, in spite of improved efficiency of silicon track, frac/on of good track becomes a lixle worse Triplet Search : first two VXD layers inac/vated Tracking Efficiency( ) Frac;on of Good Track(η) th85 th80 th75 th70 Merging silicon & TPC track doesn t succeed th65 th60 frequently under 1.6GeV/c th55 th50 th45 We must develop th40 an algorithm that achieves enough th35 efficiency without th30 first two VXD layers Threshold : P T 1.6GeV/c Transverse Momentum(MeV/c) 24

25 Summary Occupancy: Pixel occupancy : Good!! (under E CM = 500 GeV) Performance with Larger Pixel Size: Configura;on of pixel size 10µm in outer 4 layers leads to 70% reduc;on of power consump;on while keeping pixel occupancy and IP resolu/on requirement sa/sfied Tracking Performance: Frac;on of Good Track : Good!! (except low P T ) IP resolu;on under pair bkg. : Good!! Need improvements of low P T tracking efficiency 25

26 BACK UP 26

27 Requirement : Impact Parameter Resolu/on The higher impact parameter resolu/on (IP resolu/on) VXD has, the more precise the separa/on between b, c, and g is Defini/on of IP resolu/on: vertex point d 0 Impact Parameter B = 3.5T (along beam axis) track hit IP resolu/on requirement p:absolute momentum[gev/c], θ:angle from beam axis 27

28 Parameteriza/on of Digi/zing for Evalua/ng Occupancy 1. From path Length, energy deposit is calculated 2. The energy deposit is smeared by Landau distribu;on with σ = x path Length 3. We assume 276 electrons per 1KeV in a pixel 4. The threshold of energy deposit : > 0.72KeV (corresponding to 200 electrons) 5. The energy deposit is also deposit by Gaus distribu;on with σ = 0.18KeV (corresponding to 50 electrons) 28

29 Triplet Search Process SIT layers First, we divide the area into 80 θ x 80 φ regions VXD layers Second, we search the triplet in each area red : seed layers SIT Third, triplet will be found on seed layers VXD Fourth, triplet will be fi&ed At last, if the result of the fit sa;sfies Chi2/ndf and track parameter requirements, then the triplet becomes the seed of track candidate 29

30 Setup for Threshold of Track Deteriora/on Setup : Threshold of track deteriora;on was inves;gated with following setup Digi;zer : VXDPlanarDigiProcessor spa;al resolu;on : 1.44 µm in all layers resolu;on of FPCCD only one µ + in one event µ + polar angle with respect to beam axis : θ = e Absolute Momentum : + θ e MeV Triplet Search : VXD inner two layers inac;ve for beam bkg. 30

31 One Reason for Track Deteriora/on Ques;on : When are VXD hits assigned to a track lost? silicon tracking phase? merging Silicon & TPC track phase? One Answer : silicon tracking phase Setup for checking tracking efficiency in silicon tracking single µ + event, P = 1GeV/c, θ = events Ac;ve tracker : silicon tracking (only) Triplet Search : not using VXD inner two layers for beam bkg. a_ntracks % of all µ + are tracked à Very Bad htemp Entries 1000 Mean RMS a_ntotalhits # of VXD + SIT hits htemp Entries 359 Mean RMS 1.6 a_nvxdhits # of VXD hits htemp Entries 359 Mean RMS Tracks with VXD hits >= 5 are not many enough a_nsithits # of SIT hits htemp Entries 359 Mean RMS There is no problem about SIT hits a_ntracks a_ntotalhits a_nvxdhits a_nsithits 31

32 strict division(80 x 80, default) a_ntracks htemp a_ntotalhits Entries Mean RMS htemp Entries 359 Mean RMS 1.6 a_nvxdhits 250 htemp Entries 359 Mean RMS a_nsithits htemp Entries 359 Mean RMS a_ntracks a_ntotalhits a_nvxdhits a_nsithits a_ntracks 1000 htemp Entries 1000 Mean RMS a_ntotalhits 700 htemp Entries 987 Mean RMS 1.68 a_nvxdhits 700 htemp Entries 987 Mean RMS a_nsithits 1000 htemp Entries 987 Mean RMS % 99% of all µ + are tracked # of VXD + SIT hits # of VXD hits 600 # of SIT hits a_ntracks loose division(80 x 40) a_ntotalhits a_nvxdhits Tracking efficiency increases much a_nsithits 32

33 φ- division 40 Frac/on of good track using all layers also becomes a lixle worse Triplet Search : using all layers Tracking Efficiency( ) Frac;on of Good Track(η) Threshold : 1.4GeV th85 th80 th75 th70 th65 th60 th55 th50 th45 th40 th35 th Transverse Momentum(MeV/c) 33

34 Other Possible Improvements red : seed layers Add triplet search combina/on of con/nuous VXD layers VXD layers Add new way of addi/on of remaining hits to triplets Op/mize fit requirement for Chi2/ndf and track parameters 34

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