Mini Computing : Optimizing Design to Accelerate New Usage Models

Transcription

1 Mini Computing : Optimizing Design to Accelerate New Usage Models TP Chuah Platform Architect, Intel Corporation Johnny Cheng Senior System Engineer, Intel Corporation Acknowledgement to Bhupesh Agrawal for his contribution to this presentation Mini PC Segment Marketing Manager, Intel Corporation 1 CBCS001 Make the Future with China!

2 Agenda Overview : Ultra small form factor trends and new form factors Key design challenges for the Mini PC Innovation and enhanced usage models on Mini PC What s next for the Mini computing segment 2

3 Overview: Ultra small form factor trends and new form factors Key design challenges for the Mini PC Innovation and enhanced usage models on Mini PC What s next for the Mini computing segment 3

4 Mini PC All the Power without the Tower SMALL Less than 3 liters in volume POWERFUL Performance scalable up to Intel Core i7 vpro processor LOCAL Compute and store What Makes a Mini PC a Mini PC? 4

5 Mini PC Market Growth Mini PC TAM Volume (Mu) 20% TAM CAGR ( ) 1 One of the fastest Growing Segment in Desktops Business 60% Consumer 40% 5 1. Source: Intel Forecast Q4 14

6 Value Proposition Size Small footprint or zero footprint Performance Tower like performance Security and Manageability Built-in confidence Connectivity Easy connection with peripherals Configurability Easy versatility Reusability Combine with new or existing peripherals Energy Efficiency Lower wattage than tower PCs 6

7 Mini PC Form Factor Innovation Mini ITX MB: 170x170mm Sub-1L 35W Mini PC MB: 147x140mm Intel NUC MB: 101.6x101.6mm Mini Lake Reference Design MB: 101.6x63.5mm Compute Stick 30x90mm 7

9 Design Considerations: Key Vectors Usage model Productivity, Consumption Entertainment, Leisure Form Factor ID consideration Power envelope Thermal Mechanical Feature Support Architecture partitioning Platform I/O selection Technologies Cost CPU/Platform scaling System BOM target SPP target 9

10 BOM Cost Considerations Small Form Factors (SFF) System BOM Cost Trend Intel NUC Mini Lake Reference Design Future SFF Intel NUC Mini Lake Future SFF System BOM SPP Target $ $ $ $ $ $ $ $ $50.00 $0.00 PCB SPI Crystal Crystal Audio Codec System VR LAN Storage DDR3L Micro USB LAN+USB HDMI Audio connector NGFF MicroSD Connector VGA Misc logic Wifi/BT card Antenna Heat Sink Adaptor Chassis Labor + Packaging System BOM cost is modulated by Intel Architecture partitioning and BOM component selection 10

11 Board Features Design Considerations Mini ITX MB: 170x170mm Sub-1L 35W Mini PC MB: 147x140mm Intel NUC MB: 101.6x101.6mm Mini Lake Reference Design MB: 101.6x63.5mm Compute Stick 30x90mm Lesser scalability or flexibility 28,900mm 2 20,580mm 2 MB size : 29% vs mini ITX LGA 35W SoDIMM DC-power No PCIe x16 10,323mm 2 50% vs 35W Mini PC BGA only SoDIMM DC-power No PCIe x16 6,452mm 2 38% vs Intel NUC Memory down Storage down 2,700mm 2 58% vs Mini Lake Intel Atom Memory down Storage down PMIC 11 Optimum features Connector & BOM selection New I/O options

12 I/O Design Considerations Mini ITX MB: 170x170mm Sub-1L 35W Mini PC MB: 147x140mm Intel NUC MB: 101.6x101.6mm Mini Lake Reference Design MB: 101.6x63.5mm Compute Stick 30x90mm 28,900mm 2 20,580mm 2 MB size : 29% vs mini ITX Essential I/Os Headers 10,323mm 2 50% vs 35W Mini PC Essential I/Os Headers 6,452mm 2 38% vs Intel NUC Reduced I/O count Reduced Headers 2,700mm 2 58% vs Mini Lake Limited I/O & Headers 12 Optimum features Connector & BOM selection New I/O options

13 Thermal Design Considerations Mini ITX MB: 170x170mm Sub-1L 35W Mini PC MB: 147x140mm Intel NUC MB: 101.6x101.6mm Mini Lake Reference Design MB: 101.6x63.5mm Compute Stick 30x90mm Standard Intel boxed cooler Up to 65W max Customized Active cooling module Up to 35W max Customized Active cooling module Up to 15W max Customized Passive cooling Up to 4.3W max Customized Up to 2.2W max Optimize heat sink size Air flow design Heat source placement/distribution 13

14 Sub-1L Socketed Mini PC A new proof-of-concept by Intel PCB Size 147x140mm 8L Type3 Board 1150 LGA Socket for scalability Stack connector - 2X DIMM slot - 2X Mini PCI Express * (SSD and Wi-Fi * module) Vertical port - 4X USB3-2X HDMI * Optimum features BOM selection Compact placement Room planning

15 System/Platform Power Envelope Impact Volume vs. System Power Tiny FF = smaller power envelope 19V to 5V adaptor Powered by USB Look ahead proliferation to future USB power Mini Lake Reference Design and Compute Stick are designed to be powered by 5V supply from power bank or USB port on TV/Monitors Enable fan less passive cooling and simple 5V USB power supply 15

16 Platform Power Delivery (PD) Considerations Platform Power Delivery (PD) Area Discrete VR occupy larger area as a result of using bulky capacitor and inductor PMIC Platform PD Area Trend PMIC consume less area but limit performance Discrete VR Solution PMIC PMIC with Trade-off VR Area Size (mm2) Platform PD Cost 10 Platform PD Cost Platform PD cost can be scaled down depending on silicon SKU and feature set Additional PD cost removal can be done such as 5V switcher and 1.5V rail removal Discrete Discrete with tradeoff PMIC PMIC with trade-off Simplifications of system PD design drives the PCB area and cost reduction 16 Source: Intel

17 Small Board Design (X-Y impact) Intel Atom processor (Quad-core) PCB Size 30x90mm 6L Type3 Board Power Delivery - PMIC Architecture supporting Desktop PC. (X-Power AXP288D) - Cost reduction Solution - Low component count (62 count) Memory Design - 4 devices with 2up2bottom Placement - Compact memory routing USB Type A board cut out for Z-height reduction DDR3L BYT-T CR microusb $Cove PMIC SD Card Slot Top HDMI * emmc SPI 2M microusb Type A USB Bottom DDR3L Wi-Fi * / Bluetooth Entry features BOM selection Compact placement Room planning 17

18 Thermal Mechanical Design (Z impact) Center-Fed Folded Dipole: High-efficiency Antenna for Very Small Form-Factor Thin, low profile and shape conformal - Capable of being placed on the wall of the plastic casing Ground/Chassis Independent - Not easily detuned by the size of the PCB ground plane Bending of the Folded Dipole - Accommodates the width limit of the PCB and casing Good enough features BOM selection Compact placement Room planning 18 Antenna placed inside a plastic casing and near to the PCB ground plane.

20 Other Technological Innovations for Mini PC Intel Ready Mode Technology Takes advantage of new power-saving states in Intel processors combined with software and board level optimizations which enable computers that are instantly ready and always connected while consuming minimal power Revolutionary I/O technology that supports high-resolution displays and highperformance data devices through a single, compact port. Skip typing and remembering all those passwords. The True Key App does it for you. Log in using things unique to you like your face, fingerprint, and devices making it easier for you to stay in control of your online security, without compromising convenience, whether you are on your PC, tablet, or phone. Intel WiDi Intel Pro WiDi Software Suite for PC-inevery-conference room concept Wireless Charging 20

21 Intel Ready Mode Technology The PC as an essential, integrated part your life Intel Ready Mode Technology is a capability that takes advantage of new power-saving states in Intel s processor combined with software and board level optimizations which enable computers that are instantly ready and always connected while consuming minimal power C7 states enabling lower idle power Design guides to optimize idle power consumption Mini PCs Keep your ENERGY STAR * qualified Desktop PC ON and updated with less than 10W of energy consumption at idle while retaining the fast responsiveness of a desktop system 1 Always connected Optimize for lower idle power 21 1 Requires the purchase of Intel Ready Mode Technology-enabled desktop PC or motherboard, a genuine Intel processor, internet connection, Windows* 7 or Windows* 8 OS, and 3rd party software. Results dependent upon hardware, applications installed, internet connectivity, setup and configuration. Performance may vary based upon hardware, applications installed, internet connectivity, setup and configuration. Enables an OEM to meet energy regulations per published testing guidelines from global energy regulatory bodies.

22 Thunderbolt Technology 20Gbps link w/channel aggregation, bidirectional - Compatible with 10Gbps dual-channel - Existing cables support both 10Gbps and 20Gbps (see cable diagram below) PCI Express * and DisplayPort * protocols through a single compact port Compatible with standard DisplayPort displays Simple daisy-chaining of up to six devices allows one cable from the PC Active cables (circuitry in cable ends) enable up to 3M electrical and 60M optical cable length How it works Thunderbolt Cables 22

23 Wireless Charging Solution Source Control WCT Transmitter WCT Receiver TX Analog Circuits (Power Amp, Impedance Matching, Sensors) Tx Coil Rx Coil Rectifier I 2 C VR µctrl,a/d Feedback Blue tooth Low Energy (BLE) Radio BLE Radio VR uctrl I 2 C Device 23

24 Software Suite for PC-in-every-conference Room Concept Rendezvous Service Start Software Suite & Check-in With Rendezvous Service Ranger Assigns a PIN Enter PIN of remote display 2 4 WLAN 4 5 Ranger Performs a PIN Lookup and returns results P2P Connection to Display

26 What s Next : Let s develop a No Wire Mini PC The first step to an all-wireless Mini PC Wireless LAN Integrated Audio Integrated Battery Integrated Voice and Speech Intel Ready Mode Technology 26 26

27 Summary Mini PC TAM will continue to growth! Ultra compact mini PC is scalable from Intel Atom processors to Intel Core processors but posses several key design considerations Key design knobs to meet Mini PC UX include: - Usage Model - Form Factors target - Features support - Cost target Right trade off between performance and cost is key!!! Intel continues to capitalize Intel Architecture advantage to innovate on Mini PC category 27

28 Call to Action Quick adoption by customer based on Intel Collaterals/Database. Simplify the design effort/resource to customer. The system design covers the market from low end cost to high end cost (including CTE market) 28

29 Additional Sources of Information A PDF of this presentation is available from our Technical Session Catalog: This URL is also printed on the top of Session Agenda Pages in the Pocket Guide. Audio recordings of sessions will be added to this catalog by April 13 More web based info on Mini PCs: Please come and see the Mini PC demo in the Showcase located in the Client Computing Pavilion at booth #717 29

30 Legal Notices and Disclaimers Intel technologies features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Tests document performance of components on a particular test, in specific systems. Differences in hardware, software, or configuration will affect actual performance. Consult other sources of information to evaluate performance as you consider your purchase. For more complete information about performance and benchmark results, visit Cost reduction scenarios described are intended as examples of how a given Intel-based product, in the specified circumstances and configurations, may affect future costs and provide cost savings. Circumstances will vary. Intel does not guarantee any costs or cost reduction. This document contains information on products, services and/or processes in development. All information provided here is subject to change without notice. Contact your Intel representative to obtain the latest forecast, schedule, specifications and roadmaps. Statements in this document that refer to Intel s plans and expectations for the quarter, the year, and the future, are forward-looking statements that involve a number of risks and uncertainties. A detailed discussion of the factors that could affect Intel s results and plans is included in Intel s SEC filings, including the annual report on Form 10-K. The products described may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. Intel does not control or audit third-party benchmark data or the web sites referenced in this document. You should visit the referenced web site and confirm whether referenced data are accurate. Intel, Core, Atom, vpro, True Key, Thunderbolt, Pentium, Celeron and the Intel logo are trademarks of Intel Corporation in the United States and other countries. The Bluetooth word mark and logos are registered trademarks owned by Bluetooth SIG, Inc. and any use of such marks by Intel is under license. *Other names and brands may be claimed as the property of others Intel Corporation. 30

31 Risk Factors The above statements and any others in this document that refer to plans and expectations for the first quarter, the year and the future are forwardlooking statements that involve a number of risks and uncertainties. Words such as "anticipates," "expects," "intends," "plans," "believes," "seeks," "estimates," "may," "will," "should" and their variations identify forward-looking statements. Statements that refer to or are based on projections, uncertain events or assumptions also identify forward-looking statements. Many factors could affect Intel's actual results, and variances from Intel's current expectations regarding such factors could cause actual results to differ materially from those expressed in these forward-looking statements. Intel presently considers the following to be important factors that could cause actual results to differ materially from the company's expectations. Demand for Intel s products is highly variable and could differ from expectations due to factors including changes in the business and economic conditions; consumer confidence or income levels; customer acceptance of Intel s and competitors products; competitive and pricing pressures, including actions taken by competitors; supply constraints and other disruptions affecting customers; changes in customer order patterns including order cancellations; and changes in the level of inventory at customers. Intel s gross margin percentage could vary significantly from expectations based on capacity utilization; variations in inventory valuation, including variations related to the timing of qualifying products for sale; changes in revenue levels; segment product mix; the timing and execution of the manufacturing ramp and associated costs; excess or obsolete inventory; changes in unit costs; defects or disruptions in the supply of materials or resources; and product manufacturing quality/yields. Variations in gross margin may also be caused by the timing of Intel product introductions and related expenses, including marketing expenses, and Intel s ability to respond quickly to technological developments and to introduce new features into existing products, which may result in restructuring and asset impairment charges. Intel's results could be affected by adverse economic, social, political and physical/infrastructure conditions in countries where Intel, its customers or its suppliers operate, including military conflict and other security risks, natural disasters, infrastructure disruptions, health concerns and fluctuations in currency exchange rates. Results may also be affected by the formal or informal imposition by countries of new or revised export and/or import and doing-business regulations, which could be changed without prior notice. Intel operates in highly competitive industries and its operations have high costs that are either fixed or difficult to reduce in the short term. The amount, timing and execution of Intel s stock repurchase program and dividend program could be affected by changes in Intel s priorities for the use of cash, such as operational spending, capital spending, acquisitions, and as a result of changes to Intel s cash flows and changes in tax laws. Product defects or errata (deviations from published specifications) may adversely impact our expenses, revenues and reputation. Intel s results could be affected by litigation or regulatory matters involving intellectual property, stockholder, consumer, antitrust, disclosure and other issues. An unfavorable ruling could include monetary damages or an injunction prohibiting Intel from manufacturing or selling one or more products, precluding particular business practices, impacting Intel s ability to design its products, or requiring other remedies such as compulsory licensing of intellectual property. Intel s results may be affected by the timing of closing of acquisitions, divestitures and other significant transactions. A detailed discussion of these and other factors that could affect Intel s results is included in Intel s SEC filings, including the company s most recent reports on Form 10-Q, Form 10-K and earnings release. 31 Rev. 1/15/15