Automated Packaging of Photonic Communication Transceivers
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1 Automated Packaging of Photonic Communication Transceivers Name Abteilung Gunnar Böttger (Work Group OIT - Optical Interconnection Technology - Henning Schröder) XI. Workshop Photonic Micro-Packaging, Dresden,
2 Outline Definitions and motivations: Defining a new automated assembly machine class Comparison of active alignment and passive alignment strategies Examples of realized microoptical assemblies Summary and directions for the future 2
3 Defining a new automated assembly machine class Conventional pick-and-place automated assembly: high-speed assembly of electronical components on 2D-planar systems placing accuracies typically within 50 µm (enhanced precision < 10 µm) alignment of components towards each other typically not required joining processes (e.g. reflow soldering) may move placed components Optical pick-and-place automated assembly: components with optical surfaces can be difficult to pick (but only 3..20) placing and fixing accuracies of sub-µm accuracy may be required (in 3D!) fibers, light sources, lenses,... are coupled in one or more optical paths assembled systems can be very sensitive in joining (solder vapours, heat) 3
4 Typical configurations of microoptical systems to be assembled Fiber to chip (LD, AWG, PIC) and more generally also: Active alignment, measurement of positions, coupled optical powers,.. required! actively driven optical components non-active components are dark aligning + power measurement inside spatially tight packages active positioning feedback loops courtesy of 4
5 electrical interface Microoptical assemblies contain high-f electronics + heat sources thermal interface laser driver laser chip + external cavity controller electronics IZM microoptical integration bank coherent receiver QPSK-modulator modulator driver optical interface 100 Gbps Transceiver to be integrated in CFP4-pluggable form factor: Target 7 W internal loss Design-flow also needs optimization loops with extensive physical modeling 5
6 Outline Definitions and motivations: Defining a new automated assembly machine class Comparison of active alignment and passive alignment strategies Examples of realized microoptical assemblies Summary and directions for the future 6
7 Production strategies for microoptical systems: active vs. passive alignment active alignment Operated devices and use of the light signal for alignment Pick, measure and place passive alignment Dark devices Pre-process measurement Use of vision systems and precise mounting systems Fit into place Max. light intensity measurement (detector sensitivity, algorithms, step width of motion system) Beam quality characterisation (detector sensitivity, algorithms, far and near field, step width of motion system) Initial: recognition vision system and equipment precision (resolution, step width, repeatability...) Initial: component tolerances (sawing, etching,cleaving) Initial: mechanical stops+grooves (sawing, etching, cleaving) + Structuring tolerances of edges and shapes (sawing, etching,cleaving, sintering) + Tolerances of fiducial marks (pattering) + Joining reproducibility (soldering, gluing, welding) Assembled + aligned to specifications Post-process measurement 7
8 Cost and flexibility aspects of active vs. passive alignment strategies active alignment aligning passive alignment production component accuracy pick, measure and place in-process control+ measurement process complexity machine cost component cost large volume fit into place pre-process control+ measurement cycle time inexpensive components expensive assembly flexible assembly layouts programmable assembly x expensive components inexpensive assembly Inflexible + incomplex assemblies fixed assembly routines (pass/fail) 8
9 Progress on both strategies is made active alignment first generation of industrial grade programmable automated optical assembly machines is available user interfaces are getting usable series of optical assemblies can be produced economically passive alignment improvements in joining technologies make position-accurate soldering for optical components available improvements in laser processing for selective writing in glass/wafers courtesy of 9
10 Outline Definitions and motivations: Defining a new automated assembly machine class Comparison of active alignment and passive alignment strategies Examples of realized microoptical assemblies Summary and directions for the future 10
11 Active alignment for collimating high optical power laser bars Limo driving currents up to 100 A pulsed operation, water cooled vacuum gripper for FAC-lenses active alignment of lens array on laser bar similar operating conditions as in later use optimized joining with UV-curing epoxy intermediate image of 19 laser emitters collimated beam from laser bar 11
12 Passive alignment: Waferlevel features with µm-accuracy compact fiber coupled TX and RX for telecom focussing balls falls into KOH-eched pit V-grooves and deflective mirrors demonstrated Passive alignment: Micro-milling with µm-accuracy optical fiber ferrule aligned by insertion focussing optics positioned by grooves/marks 13
13 Waferlevel features for passive alignment by surface tension steps and ridges formed by RIE optics-compatible solder materials soldering induces shift into defined positions µm accuracies can be reached microsection Enhanced soldering processes for optical components bump soldering (also flip chip) transient liquid phase soldering pressure-free silver sintering AuSn bumps after reflow Flip-chipped InP laser 14
14 Passive alignment enhanced by intermediate tools placing accuracies improvable by tools avoid electrical short-circuits in array optimize thermal management 1200 W array with 400 LEDs Going back to conventional machine concepts: Optical bond wires using 150 µm diameter POF only little bonder retooling flexible optical wiring Wedge/ball bond with POF SMD-LED coupling 15
15 Outline Definitions and motivations: Defining a new automated assembly machine class Comparison of active alignment and passive alignment strategies Examples of realized microoptical assemblies Summary and directions for the future 16
16 Summary pick and place optical assembly machines are moving from labs into industry sub-µm accuracies for optimal optical coupling can be reached by either active alignment of activated components with in-process measurement passive alignment of dark components via precise component features optical packages are getting ever more complex (also thermally, electrically) hardware-wise a high standard is reached software still needs improvements 17
17 To be included in next generation: Laser bonding + laser forming patented optical fiber to bulk glass laser bonding also usable for tight fiber arrays + capillaries CO 2 laser + scanning optics Under investigation: Selective curing schemes IR-curing: apply heat only where needed (using MIR fibers and lasers) Induction- curing: develop new antenna geometries and filled epoxies 18
18 To be closed: Chain from design to machine programming optical simulation of coupling efficiencies identifies critical tolerances full integration with standard 3D-CAD mechanical drawing software, file formats still missing: interfaces enabling direct interchange with assembly machines 19
19 Thank you for your attention! Fraunhofer Institute for Reliability and Microintegration IZM Gustav-Meyer-Allee Berlin Germany Phone URL Please contact: Phone
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