Product End-of-Life Disassembly Instructions

Transcription

1 Product End-of-Life Disassembly Instructions Product Category: Monitors and Displays Marketing Name / Model [List multiple models if applicable.] HP S2031 LCD Monitor Name / Model #3 Name / Model #4 Name / Model #5 Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE). 1.0 Items Requiring Selective Treatment 1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable. Quantity of items Item Description Notes included in product Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA) With a surface greater than 10 sq cm 1 Batteries Mercury-containing components Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm All types including standard alkaline and lithium coin or button style batteries For example, mercury in lamps, display backlights, scanner lamps, switches, batteries Includes background illuminated displays with gas discharge lamps 0 2 {Backlight Assembly (I type) 1 Cathode Ray Tubes (CRT) 0 Capacitors / condensers (Containing PCB/PCT) 23 Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height C804 External electrical cables and cords 2 Gas Discharge Lamps 2 Plastics containing Brominated Flame Retardants 0 Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. 0 Components and waste containing asbestos 0 EL-MF Page 1 Template Revision A

2 Components, parts and materials containing refractory ceramic fibers Components, parts and materials containing radioactive substances Tools Required List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed. Tool Description Tool Size (if applicable) Description #1: Bushing Screwdriver (HEX5.5MM) Description #2: Crossing Screwdriver 2# Description #3 Description #4 Description #5 3.0 Product Disassembly Process 3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment: 1. Lay the monitor on the desk, remove the base with hand. 2. remove the arm with hand. 3. Remove the front bezel with hand from product 4. Unlock the screw fixed the Hinge and Back Cover. 5. Release the Chassis from Back Cover,then get the Back Cover and Assembly Chassis, 6. Unlock the 2 screws which fix the Arm Up and Hinge and get the Arm Up. 7. To see the detail process are as attached files including assemble panel Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations). EL-MF Page 2 Template Revision A

3 Action Disassembly Flowchart for HP S2231 Model Tool Issue Date: Feb.2nd,2010 Initiator: Photo Remove the VGA Cable #2 Crossing Screw Driver Remove the base Remove the Arm Down Remove the Front Bezel with hand. Remove the LVDS Cable with Hand.

4 Remove the Lamp Line with Hand. Unlock the screw fixed the Hinge and Back Cover. #2 Crossing Screw Driver Take out the OSD PCB from the groove with hand.

5 Release the Chassis from Back Cover,then get the Back Cover and Assembly Chassis, Unlock the 2 screws which fix the Arm Up and Hinge and get the Arm Up. #2 Crossing Screw Driver Unlock the 5 fixed Back Cover and Hinge and Get the Hinge. #2 Crossing Screw Driver Unlock the 5 screw fixed the I/F Board and Chassis #2 Crossing Screw Driver and Hexagon recess screw driver (HEX5.5MM)

6 Unlock 4 screws fixed the Power Board and Chassis then get the Chassis. #2 Crossing Screw Driver Delivered all the parts with Hand Power board I/F Board

7 廠 商 名 稱 A. 6 E c o l o g y o f T C O 5. 1 頁 次 : 19/25 版 本 :V.1 MT200LW01 V.0 (P/N: AM ) Sequence of Module Disassembly for Lamp Separation 1. Original condition 2 Remove the Screw& theprotectcover(abovepcba) 19

8 廠 商 名 稱 A. 6 E c o l o g y o f T C O 5. 1 頁 次 : 20/25 版 本 :V.1 3.Remove Top Bezel 4.Remove LCD Cell&PCBA 5.Remove Mold Frame(Plastic Frame) 20

9 廠 商 名 稱 A. 6 E c o l o g y o f T C O 5. 1 頁 次 : 21/25 版 本 :V.1 6.Remove the Film 7.Remove the Bottom Bezel 21

10 廠 商 名 稱 A. 6 E c o l o g y o f T C O 5. 1 頁 次 : 22/25 版 本 :V.1 8.Remove the Lamp Reflector 9.Remove CCFL from Lamp Assembly 9-1. Lamp Assembly 22

11 廠 商 名 稱 A. 6 E c o l o g y o f T C O 5. 1 頁 次 : 23/25 版 本 :V Remove tape & Separate wires from Lamp Reflector Tape wire 9-3. Remove Lamp Reflector 23

12 廠 商 名 稱 A. 6 E c o l o g y o f T C O 5. 1 頁 次 : 24/25 版 本 :V Trim off the wire 9-5.Separate Rubber 24

13 廠 商 名 稱 A. 6 E c o l o g y o f T C O 5. 1 頁 次 : 25/25 版 本 :V CCFL 25