RF Power LDMOS Transistors High Ruggedness N--Channel Enhancement--Mode Lateral MOSFETs

Transcription

1 Freescale Semiconductor Technical Data RF Power LDMOS Transistors High Ruggedness N--Channel Enhancement--Mode Lateral MOSFETs RF power transistors designed for both narrowband and broadband ISM, broadcast and aerospace applications operating at frequencies from 1.8 to 2000 MHz. These devices are fabricated using Freescale s enhanced ruggedness platform and are suitable for use in applications where high VSWRs are encountered. Typical Performance: V DD =50Volts Frequency (MHz) 1.8to (2,6) Signal Type Two--Tone ( khz spacing) (3,6) Two--Tone (200 khz spacing) 512 (4) Pulse (0 sec, 20% Duty Cycle) P out (W) G ps (db) D (%) IMD (1) (dbc) 25 PEP PEP Peak (4) CW (5) CW Load Mismatch/Ruggedness Frequency (MHz) Signal Type VSWR (2) CW >65:1 at all Phase Angles P in (W) 0.23 (3 db Overdrive) 512 (3) CW 1.6 (3 db Overdrive) 512 (4) Pulse (0 sec, 20% Duty Cycle) 0.14 Peak (3 db Overdrive) 512 (4) CW 0.14 (3 db Overdrive (5) CW 0.34 (3 db Overdrive Test Voltage Result 50 No Device Degradation 1. Distortion products are referenced to one of two tones. See p. 13, Measured in MHz broadband reference circuit. 3. Measured in MHz broadband reference circuit. 4. Measured in 512 MHz narrowband test circuit. 5. Measured in MHz narrowband test circuit. 6. The values shown are the minimum measured performance numbers across the indicated frequency range. Features Wide Operating Frequency Range Extreme Ruggedness Unmatched, Capable of Very Broadband Operation Integrated Stability Enhancements Low Thermal Resistance Extended ESD Protection Circuit In Tape and Reel. R1 Suffix = 500 Units, 24 mm Tape Width, 13--inch Reel. Document Number: MRFE6VS25N Rev. 1, 12/2012 MRFE6VS25NR1 MRFE6VS25GNR MHz, 25 W, 50 V WIDEBAND RF POWER LDMOS TRANSISTORS Gate TO PLASTIC MRFE6VS25NR1 TO GULL PLASTIC MRFE6VS25GNR1 1 2 (Top View) Drain Note: The backside of the package is the source terminal for the transistor. Figure 1. Pin Connections, All rights reserved. 1

2 Table 1. Maximum Ratings Rating Symbol Value Unit Drain--Source Voltage V DSS --0.5, +133 Vdc Gate--Source Voltage V GS --6.0, + Vdc Storage Temperature Range T stg --65 to +150 C Case Operating Temperature T C --40 to +150 C Operating Junction Temperature (1,2) T J --40 to +225 C Table 2. Thermal Characteristics Characteristic Symbol Value (2,3) Unit Thermal Resistance, Junction to Case CW: Case Temperature 80 C, 25 W CW, 50 Vdc, I DQ = ma, 512 MHz Thermal Impedance, Junction to Case Pulse: Case Temperature 77 C, 25 W Peak, 0 sec Pulse Width, 20% Duty Cycle, 50 Vdc, I DQ = ma, 512 MHz R JC 1.2 C/W Z JC 0.29 C/W Table 3. ESD Protection Characteristics Test Methodology Human Body Model (per JESD22--A114) Machine Model (per EIA/JESD22--A115) Charge Device Model (per JESD22--C1) Class 2, passes 2500 V B, passes 250 V IV, passes 2000 V Table 4. Moisture Sensitivity Level Test Methodology Rating Package Peak Temperature Unit Per JESD22--A113, IPC/JEDEC J--STD C Table 5. Electrical Characteristics (T A =25 C unless otherwise noted) Characteristic Symbol Min Typ Max Unit Off Characteristics Gate--Source Leakage Current (V GS =5Vdc,V DS =0Vdc) Drain--Source Breakdown Voltage (V GS =0Vdc,I D =50mA) Zero Gate Voltage Drain Leakage Current (V DS =50Vdc,V GS =0Vdc) Zero Gate Voltage Drain Leakage Current (V DS = 0 Vdc, V GS =0Vdc) I GSS 400 nadc V (BR)DSS Vdc I DSS 2 Adc I DSS 7 Adc On Characteristics Gate Threshold Voltage (V DS =Vdc,I D =85 Adc) Gate Quiescent Voltage (V DD =50Vdc,I D = madc, Measured in Functional Test) Drain--Source On--Voltage (V GS =Vdc,I D = 2 madc) V GS(th) Vdc V GS(Q) Vdc V DS(on) 0.28 Vdc Dynamic Characteristics Reverse Transfer Capacitance (V DS =50Vdc 1 MHz, V GS =0Vdc) Output Capacitance (V DS =50Vdc 1 MHz, V GS =0Vdc) Input Capacitance (V DS =50Vdc,V GS =0Vdc 1 MHz) C rss 0.26 pf C oss 14.2 pf C iss 39.2 pf 1. Continuous use at maximum temperature will affect MTTF. 2. MTTF calculator available at Select Software & Tools/Development Tools/Calculators to access MTTF calculators by product. 3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to Select Documentation/Application Notes -- AN1955. (continued) 2

3 Table 5. Electrical Characteristics (T A =25 C unless otherwise noted) (continued) Characteristic Symbol Min Typ Max Unit Functional Tests (1) (In Freescale Test Fixture, 50 ohm system) V DD =50Vdc,I DQ =ma,p out = 25 W Peak (5 W Avg.), f = 512 MHz, 0 sec Pulse Width, 20% Duty Cycle Power Gain G ps db Drain Efficiency D % Input Return Loss IRL db Load Mismatch/Ruggedness (In Freescale Test Fixture, 50 ohm system) I DQ =ma Frequency (MHz) Signal Type VSWR P in (W) Test Voltage, V DD Result 512 Pulse (0 sec, 20% Duty Cycle) >65:1 at all Phase Angles 0.14 Peak (3 db Overdrive) 50 No Device Degradation CW 0.14 (3 db Overdrive) 1. Measurements made with device in straight lead configuration before any lead forming operation is applied. Lead forming is used for gull wing (GN) parts. 3

4 TYPICAL CHARACTERISTICS C, CAPACITANCE (pf) 0 C iss C oss NORMALIZED V GS(Q) I DQ =ma ma C rss 150 ma Measured with 1 MHz V GS =0Vdc ma V DS, DRAIN--SOURCE VOLTAGE (VOLTS) T C, CASE TEMPERATURE ( C) Figure 2. Capacitance versus Drain -Source Voltage Figure 3. Normalized V GS and Quiescent Current versus Case Temperature V DD =50Vdc I DQ (ma) Slope (mv/ C) I D =0.6Amps V DD =50Vdc 7 MTTF (HOURS) Amps 0.9 Amps T J, JUNCTION TEMPERATURE ( C) 250 Note: MTTF value represents the total cumulative operating time under indicated test conditions. Figure 4. MTTF versus Junction Temperature - CW 4

5 512 MHz NARROWBAND PRODUCTION TEST FIXTURE C1 B1 C13 C14 B2 C5* C2 C3 C4 L1 L2 L3 C12 C15 C6 C7 C8 CUT OUT AREA C9* C* C11 MRFE6VS25N Rev. 1 *C5, C9 and C are mounted vertically. Figure 5. MRFE6VS25NR1 Narrowband Test Circuit Component Layout 512 MHz Table 6. MRFE6VS25NR1 Narrowband Test Circuit Component Designations and Values 512 MHz Part Description Part Number Manufacturer B1, B2 Long Ferrite Beads Fair-Rite C1 22 F, 35 V Tantalum Capacitor T491X226K035AT Kemet C2, C F Chip Capacitors CDR33BX4AKWY AVX C3, C F Chip Capacitors C0805C3K5RAC Kemet C4,C11,C pf Chip Capacitors ATC0B181JT0XT ATC C5 18 pf Chip Capacitor ATC0B180JT500XT ATC C6 2.7 pf Chip Capacitor ATC0B2R7BT500XT ATC C7 15 pf Chip Capacitor ATC0B150JT500XT ATC C8 36 pf Chip Capacitor ATC0B360JT500XT ATC C9 4.3 pf Chip Capacitor ATC0B4R3CT500XT ATC C 13 pf Chip Capacitor ATC0B1JT500XT ATC C F, 63 V Electrolytic Capacitor MCGPR63V477M13X26-RH Multicomp L1 33 nh Inductor 1812SMS-33NJLC Coilcraft L nh Inductor A04TJLC Coilcraft L3 82 nh Inductor 1812SMS-82NJLC Coilcraft PCB 0.0, r =2.55 AD255A Arlon 5

6 L3 B2 V BIAS + B1 C12 C13 C14 + C15 V SUPPLY C1 C2 C3 C4 L2 RF INPUT Z1 C5 Z2 Z3 Z4 Z5 Z6 Z7 Z8 C6 C7 C8 L1 Z9 Z DUT Z11 Z12 Z13 C9 Z14 Z15 Z16 Z17 C Z18 C11 Z19 RF OUTPUT Figure 6. MRFE6VS25NR1 Narrowband Test Circuit Schematic 512 MHz Table 7. MRFE6VS25NR1 Narrowband Test Circuit Microstrips 512 MHz Microstrip Description Microstrip Description Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z4* Microstrip Z14* Microstrip Z Microstrip Z Microstrip Z6* Microstrip Z16* Microstrip Z Microstrip Z17* Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip * Line length includes microstrip bends 6

7 TYPICAL CHARACTERISTICS 512 MHz P out, OUTPUT POWER (WATTS) V DD =50Vdc P in =0.07W f = 512 MHz P out, OUTPUT POWER (dbm) V DD =50Vdc I DQ =ma f = 512 MHz V GS, GATE--SOURCE VOLTAGE (VOLTS) Figure 7. CW Output Power versus Gate -Source Voltage at a Constant Input Power P in, INPUT POWER (dbm) f (MHz) P1dB (W) P3dB (W) Figure 8. CW Output Power versus Input Power G ps, POWER GAIN (db) _C V DD =50Vdc I DQ =ma f = 512 MHz T C =--_C 85_C G ps D 85_C 90 --_C _C D, DRAIN EFFICIENCY (%) P out, OUTPUT POWER (WATTS) 50 Figure 9. Power Gain and Drain Efficiency versus CW Output Power 7

8 512 MHz NARROWBAND PRODUCTION TEST FIXTURE f MHz V DD =50Vdc,I DQ =ma,p out = 25 W Peak Z source Z load j j18.3 Z source = Test circuit impedance as measured from gate to ground. Z load = Test circuit impedance as measured from drain to ground. 50 Input Matching Network Device Under Test Output Matching Network 50 Z source Z load Figure. Narrowband Series Equivalent Source and Load Impedance 512 MHz 8

9 1.8 - MHz BROADBAND REFERENCE CIRCUIT Table MHz Broadband Performance (In Freescale Reference Circuit, 50 ohm system) V DD =50Volts,I DQ = 0 ma Signal Type P out (W) f (MHz) G ps (db) D (%) IMD (dbc) Two-Tone ( khz spacing) 25 PEP Table 9. Load Mismatch/Ruggedness (In Freescale Reference Circuit) Frequency (MHz) Signal Type VSWR CW >65:1 at all Phase Angles P in (W) Test Voltage, V DD Result 0.23 (3 db Overdrive) 50 No Device Degradation 9

10 1.8 - MHz BROADBAND REFERENCE CIRCUIT C2 C3 C4 C5 C6 C7 C8 R1 + E1, L1 C9 C C1* Q1 E2, L2 C11* MRFE6VS25L/N Rev. 0 CUT OUT AREA *C1 and C11 are mounted vertically. Figure 11. MRFE6VS25NR1 Broadband Reference Circuit Component Layout MHz Table. MRFE6VS25NR1 Broadband Reference Circuit Component Designations and Values MHz Part Description Part Number Manufacturer C1, C5, C6, C9, C11 20K pf Chip Capacitors ATC200B203KT50XT ATC C2 F, 35 V Tantalum Capacitor T491D6K035AT Kemet C3 0.1 F Chip Capacitor CDR33BX4AKWY AVX C4 2.2 F Chip Capacitor C3225X7R1H225KT TDK C7 0.1 F Chip Capacitor GRM319R72A4KA01D Murata C8 2.2 F Chip Capacitor G2225X7R225KT3AB ATC C 220 F, 0 V Electolytic Capacitor MCGPR0V227M16X26-RH Multicomp E1 #43 Ferrite Toroid Fair--Rite E2 #61 Ferrite Toroid Fair--Rite L1 4 Turns, 22 AWG, Toroid Transformer with Ferrite E Copper Magnetic Wire Belden L2 26 Turns, 22 AWG, Toroid Transformer with Ferrite E Copper Magnetic Wire Belden Q1 RF Power LDMOS Transistor MRFE6VS25NR1 Freescale R1 1k, 3 W Axial Leaded Resistor CPF31K0000FKE14 Vishay PCB 0.0, r =4.8 S00 Shenzhen Multilayer PCB Technology

11 V BIAS + E1, L1 Z4 R1 C2 C3 C4 C5 Z3 Z8 C6 C7 C8 + C V SUPPLY RF INPUT Z1 Z2 Z5 C9 Z7 Z6 E2, L2 Z9 C11 Z RF OUTPUT C1 DUT Figure 12. MRFE6VS25NR1 Broadband Reference Circuit Schematic MHz Table 11. MRFE6VS25NR1 Broadband Reference Test Circuit Microstrips MHz Microstrip Description Microstrip Description Z1, Z Microstrip Z4, Z Microstrip Z2, Z Microstrip Z5, Z Microstrip Z Microstrip Z Microstrip 11

12 TYPICAL CHARACTERISTICS MHz BROADBAND REFERENCE CIRCUIT 35 G ps, POWER GAIN (db) G ps f, FREQUENCY (MHz) V DD =50Vdc,P in =0.1W I DQ =25mA Figure 13. Power Gain, CW Output Power and Drain Efficiency versus Frequency at a Constant Input Power P out 46 D D, DRAIN EFFICIENCY (%) P out,output POWER (WATTS) P out, OUTPUT POWER (WATTS) MHz f=mhz 1.8 MHz V DD =50Vdc P in =0.1W P out, OUTPUT POWER (dbm) MHz f=mhz 1.8 MHz V DD =50Vdc I DQ =25mA V GS, GATE--SOURCE VOLTAGE (VOLTS) P in, INPUT POWER (dbm) Figure 14. CW Output Power versus Gate -Source Voltage at a Constant Input Power f (MHz) P1dB (W) P3dB (W) Figure 15. CW Output Power versus Input Power G ps, POWER GAIN (db) MHz MHz MHz G ps D 1.8 MHz MHz MHz D, DRAIN EFFICIENCY (%) V DD =50Vdc I DQ =25mA P out, OUTPUT POWER (WATTS) Figure 16. Power Gain and Drain Efficiency versus CW Output Power 12

13 TYPICAL CHARACTERISTICS MHz BROADBAND REFERENCE CIRCUIT TWO -TONE (1) IMD, INTERMODULATION DISTORTION (dbc) V DD =50Vdc,I DQ = 0 ma f1 = MHz, f2 = MHz Two--Tone Measurements 7th Order 3rd Order 5th Order IMD, INTERMODULATION DISTORTION (dbc) V DD =50Vdc,I DQ = 0 ma f1 = MHz, f2 =.005 MHz Two--Tone Measurements 3rd Order 5th Order th Order P out, OUTPUT POWER (WATTS) PEP P out, OUTPUT POWER (WATTS) PEP Figure 17. Intermodulation Distortion Products versus Output Power 1.8 MHz Figure 18. Intermodulation Distortion Products versus Output Power MHz IMD, INTERMODULATION DISTORTION (dbc) th Order V DD =50Vdc,I DQ = 0 ma f1 = MHz, f2 =.005 MHz Two--Tone Measurements 3rd Order th Order Figure 19. Intermodulation Distortion Products versus Output Power MHz P out, OUTPUT POWER (WATTS) PEP 1. The distortion products are referenced to one of the two tones and the peak envelope power (PEP) is 6 db above the power in a single tone. 13

14 1.8 - MHz BROADBAND REFERENCE CIRCUIT Z o =50 f=1.8mhz Z source f=mhz f=mhz f=1.8mhz Z load f MHz V DD =50Vdc,I DQ =25mA,P out =25WCW Z source Z load j j j j j j j j j j j j j j5.70 Z source = Test circuit impedance as measured from gate to ground. Z load = Test circuit impedance as measured from drain to ground. 50 Input Matching Network Device Under Test Output Matching Network 50 Z source Z load Figure 20. Broadband Series Equivalent Source and Load Impedance MHz 14

15 -512 MHz BROADBAND REFERENCE CIRCUIT Table MHz Broadband Performance (In Freescale Reference Circuit, 50 ohm system) V DD =50Volts,I DQ = 0 ma Signal Type P out (W) f (MHz) G ps (db) D (%) IMD (dbc) Two-Tone (200 khz spacing) 25 PEP Table 13. Load Mismatch/Ruggedness (In Freescale Reference Circuit) Frequency (MHz) Signal Type VSWR 512 CW >65:1 at all Phase Angles P in (W) Test Voltage, V DD Result 1.6 (3 db Overdrive) 50 No Device Degradation 15

16 -512 MHz BROADBAND REFERENCE CIRCUIT D1 C5 C6 C R1 R3 C7 E2, L2 C9 C8 T2 C11 L1 E3 C2 R2 C1 C3 Q1 C4 E1 E4 T1 MRFE6VS25L/N Rev. 0 T3 Note: See Figure 21a for a more detailed view of the semi--flex cables with shields and #61 multi--aperture cores. Figure 21. MRFE6VS25NR1 Broadband Reference Circuit Component Layout -512 MHz Table 14. MRFE6VS25NR1 Broadband Reference Circuit Component Designations and Values -512 MHz Part Description Part Number Manufacturer C1, C3, C6, C7, C8 1,000 pf Chip Capacitors ATC0B2JT50XT ATC C2 2.7 pf Chip Capacitor ATC0B2R7BT500XT ATC C4 15 nf Chip Capacitor C3225CH2A153JT TDK C5, C9 nf Chip Capacitors GRM3195C1E3JA01 Murata C 1 F Chip Capacitor C3225JB2A5KT TDK C F, 0 V Electrolytic Capacitor MCGPR0V227M16X26-RH Multicomp D1 8.2 V, 1 W Zener Diode 1N4738A Fairchild Semiconductor E1, E3, E4 #61 Multi-aperture Cores Fair-Rite E2 Ferrite Core Bead J Ferronics L1 47 nh Inductor 1812SMS-47NJLC Coilcraft L2 4 Turns, 20 AWG, Toroid Transformer with 8076 Copper Magnetic Wire Belden Ferrite E2 Q1 RF Power LDMOS Transistor MRFE6VS25NR1 Freescale R1 5.6 k, 1/4 W Chip Resistor CRCW12065K60FKEA Vishay R2 15, 1/4 W Chip Resistor CRCW120615R0FKEA Vishay R3 5k Potentiometer CMS Cermet Multi--turn 3224W-1-502E Bourns T1 25 Semi-flex Cable, Shield Length D Microdot T2, T3 25 Semi-flex Cables, Shield Length D Microdot PCB 0.0, r =3.5 TC350 Arlon 16

17 Center conductor connection to PCB T2 E3 C2 C3 Shield connection to PCB C4 E1 T1 S T2 Z12 E3 S E4 NOT TO SCALE T1 S E1 S S T3 T3 E4 S T3 S = Shield Figure 21a. Detailed View of Semi -flex Cables with Shields and #61 Multi -aperture Cores R1 + V SUPPLY RF INPUT Z1 Z2 D1 Z3 C5 Z4 R3 C6 T1 C7 L1 Z6 Z8 R2 Z7 L2, E2 Z9 Z C4 C8 Z11 C9 C C11 T2 E3 Z12 Z14 T3 E4 Z15 Z16 RF OUTPUT C1 C2 Z5 E1 C3 DUT Z13 Figure 22. MRFE6VS25NR1 Broadband Reference Circuit Schematic -512 MHz Table 15. MRFE6VS25NR1 Broadband Reference Circuit Microstrips -512 MHz Microstrip Description Microstrip Description Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip 17

18 TYPICAL CHARACTERISTICS -512 MHz BROADBAND REFERENCE CIRCUIT G ps, POWER GAIN (db) V DD =50Vdc,P in =0.8W I DQ =25mA G ps D P out f, FREQUENCY (MHz) Figure 23. Power Gain, CW Output Power and Drain Efficiency versus Frequency at a Constant Input Power P out, OUTPUT POWER (WATTS) D, DRAIN EFFICIENCY (%) P out, OUTPUT POWER (WATTS) V DD =50Vdc P in =0.65W f = 0 MHz 512 MHz MHz V GS, GATE--SOURCE VOLTAGE (VOLTS) Figure 24. CW Output Power versus Gate -Source Voltage at a Constant Input Power 0.65 W P out, OUTPUT POWER (WATTS) V DD =50Vdc P in = W f = 512 MHz MHz 0 MHz V GS, GATE--SOURCE VOLTAGE (VOLTS) Figure 25. CW Output Power versus Gate -Source Voltage at a Constant Input Power W 18

19 P out, OUTPUT POWER (WATTS) TYPICAL CHARACTERISTICS -512 MHz BROADBAND REFERENCE CIRCUIT V DD =50Vdc I DQ =25mA f = 0 MHz MHz MHz P in, INPUT POWER (dbm) f (MHz) P1dB (W) P3dB (W) Figure 26. CW Output Power versus Input Power V DD =50Vdc I DQ =25mA G ps, POWER GAIN (db) f = 0 MHz MHz 512 MHz D G ps 512 MHz MHz 0 MHz P out, OUTPUT POWER (WATTS) Figure 27. Power Gain and Drain Efficiency versus CW Output Power D, DRAIN EFFICIENCY (%) 19

20 TYPICAL CHARACTERISTICS -512 MHz BROADBAND REFERENCE CIRCUIT TWO -TONE (1) IMD, INTERMODULATION DISTORTION (dbc) --20 V --25 DD =50Vdc,I DQ = 0 ma f1 = 29.9 MHz, f2 =.1 MHz, Two--Tone Measurements rd Order th Order th Order IMD, INTERMODULATION DISTORTION (dbc) --20 V --25 DD =50Vdc,I DQ = 0 ma f1 = 99.9 MHz, f2 = 0.1 MHz, Two--Tone Measurements rd Order th Order th Order P out, OUTPUT POWER (WATTS) PEP P out, OUTPUT POWER (WATTS) PEP Figure 28. Intermodulation Distortion Products versus Output Power MHz Figure 29. Intermodulation Distortion Products versus Output Power 0 MHz IMD, INTERMODULATION DISTORTION (dbc) --20 V --25 DD =50Vdc,I DQ = 0 ma f1 = MHz, f2 = MHz, Two--Tone Measurements rd Order th Order th Order P out, OUTPUT POWER (WATTS) PEP Figure. Intermodulation Distortion Products versus Output Power 512 MHz The distortion products are referenced to one of the two tones and the peak envelope power (PEP) is 6 db above the power in a single tone. 20

21 -512 MHz BROADBAND REFERENCE CIRCUIT Z o =50 f = 512 MHz f=mhz Z source Z load f = 512 MHz f=mhz V DD =50Vdc,I DQ =25mA,P out =25WCW f MHz Z source Z load j j j j j j j j j j j j j j j j j j j j j j j j5.90 Z source = Test circuit impedance as measured from gate to ground. Z load = Test circuit impedance as measured from drain to ground. 50 Input Matching Network Device Under Test Output Matching Network 50 Z source Z load Figure 31. Broadband Series Equivalent Source and Load Impedance -512 MHz 21

22 MHz NARROWBAND REFERENCE CIRCUIT Table 16. MHz Narrowband Performance (In Freescale Reference Circuit, 50 ohm system) V DD =50Volts,I DQ =25mA Signal Type P out (W) f (MHz) G ps (db) D (%) CW Table 17. Load Mismatch/Ruggedness (In Freescale Reference Circuit) Frequency (MHz) Signal Type VSWR CW >65:1 at all Phase Angles P in (W) Test Voltage, V DD Result 0.34 (3 db Overdrive) 50 No Device Degradation 22

23 MHz NARROWBAND REFERENCE TEST FIXTURE C4 C5 C7 C8 B1 C6 MRFE6VS25N Rev. 0 C9 C11 C C12 C13 C14 C1 C2 C3 Q1 L1 C15 C17 C18 C16 L2 C19 C20 CUT OUT AREA Figure 32. MRFE6VS25NR1 Narrowband Reference Circuit Component Layout MHz Table 18. MRFE6VS25NR1 Narrowband Reference Circuit Component Designations and Values MHz Part Description Part Number Manufacturer B1 Short Ferrite Bead Fair-Rite C1, C3 22 pf Chip Capacitors ATC0B220JT500XT ATC C2 6.2 pf Chip Capacitor ATC0B6R2BT500XT ATC C4 F Chip Capacitor GRM55DR61H6KA88L Murata C F Chip Capacitor GRM319R72A3KA01D Murata C6 43 pf Chip Capacitor ATC0B4JT500XT ATC C7 0.1 F Chip Capacitor GRM32MR71H4JA01L Murata C8 1.0 F Chip Capacitor GRM31MR71H5KA88L Murata C9 0.1 F Chip Capacitor C1206C4K1RAC-TU Kemet C 20K pf Chip Capacitor ATC200B203KT50XT ATC C pf Chip Capacitor ATC0B471JT200XT ATC C12, C13 22 F Chip Capacitors C5750KF1H226ZT TDK C pf, 63 V Electrolytic Capacitor MCGPR63V477M13X26-RH Multicomp C15, C pf Chip Capacitors ATC0B4R3CT500XT ATC C16, C pf Tuning Capacitors 27271SL Johanson Components C pf Chip Capacitor ATC0B2R2JT500XT ATC C20 20 pf Chip Capacitor ATC0B200JT500XT ATC L1 43 nh, Turn Inductor BTJLC Coilcraft L2 2.5 nh, 1 Turn Inductor A01TKLC Coilcraft Q1 RF Power LDMOS Transistor MRFE6VS25NR1 Freescale PCB 0.0, r =3.5 TL350 Arlon 23

24 B1 Z Z9 + V SUPPLY V BIAS C11 C C9 C12 C13 C14 C4 C5 C7 C8 C6 L1 RF INPUT Z1 Z2 Z3 Z4 Z5 Z8 Z6 Z7 Z11 Z12 Z13 C16 C17 C15 C18 L2 Z14 Z15 C19 C20 Z16 RF OUTPUT C1 C2 C3 DUT Figure 33. MRFE6VS25NR1 Narrowband Reference Circuit Schematic MHz Table 19. MRFE6VS25NR1 Narrowband Reverence Test Circuit Microstrips MHz Microstrip Description Microstrip Description Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z5, Z Taper Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z Microstrip Z8* Microstrip * Line length includes microstrip bends 24

25 TYPICAL CHARACTERISTICS MHz NARROWBAND REFERENCE CIRCUIT 46 P out, OUTPUT POWER (WATTS) V DD =50Vdc P in =0.14W f = MHz P out, OUTPUT POWER (dbm) V DD =50Vdc I DQ =25mA f = MHz V GS, GATE--SOURCE VOLTAGE (VOLTS) P in, INPUT POWER (dbm) Figure 34. CW Output Power versus Gate -Source Voltage at a Constant Input Power f P1dB P3dB (MHz) (W) (W) Figure 35. CW Output Power versus Input Power G ps, POWER GAIN (db) V DD =50Vdc I DQ =25mA f = MHz G ps D P out, OUTPUT POWER (WATTS) Figure 36. Power Gain and Drain Efficiency versus CW Output Power D, DRAIN EFFICIENCY (%) 25

26 MHz NARROWBAND REFERENCE CIRCUIT f MHz V DD =50Vdc,I DQ =25mA,P out =25WCW Z source Z load j j7.78 Z source = Test circuit impedance as measured from gate to ground. Z load = Test circuit impedance as measured from drain to ground. 50 Input Matching Network Device Under Test Output Matching Network 50 Z source Z load Figure 37. Narrowband Series Equivalent Source and Load Impedance MHz 26

27 PACKAGE DIMENSIONS 27

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33 PRODUCT DOCUMENTATION, SOFTWARE AND TOOLS Refer to the following documents, software and tools to aid your design process. Application Notes AN1907: Solder Reflow Attach Method for High Power RF Devices in Over--Molded Plastic Packages AN1955: Thermal Measurement Methodology of RF Power Amplifiers AN3263: Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over--Molded Plastic Packages AN3789: Clamping of High Power RF Transistors and RFICs in Over--Molded Plastic Packages Engineering Bulletins EB212: Using Data Sheet Impedances for RF LDMOS Devices EB38: Measuring the Intermodulation Distortion of Linear Amplifiers Software Electromigration MTTF Calculator RF High Power Model.s2p File Development Tools Printed Circuit Boards For Software and Tools, do a Part Number search at and select the Part Number link. Go to the Software & Tools tab on the part s Product Summary page to download the respective tool. The following table summarizes revisions to this document. REVISION HISTORY Revision Date Description 0 June 2012 Initial Release of Data Sheet 1 Dec Added part number MRFE6VS25GNR1, p. 1 Added 1265A--03 (TO Gull) package isometric, p. 1, and Mechanical Outline, p Load Mismatch/Ruggedness tables: changed output power to input power to clarify the conditions used during test, p. 1, 3, 9, 22 Figs. 17, 18 and 19, Intermodulation Distortion Products versus Output Power (1.8,, MHz): corrected x--axis data to show Watts (PEP) measurement, p. 13 Added MHz Broadband Reference Circuit as follows: -- Typical Performance table, p Table 12, Broadband Performance, p Table 13, Load Mismatch/Ruggedness, p Fig. 21, Broadband Reference Circuit Component Layout, p Table 14, Broadband Reference Circuit Component Designations and Values, p Fig. 21a, Detailed View of Semi--flex Cables with Shields and #61 Multi--aperture Cores, p Fig. 22, Broadband Reference Circuit Schematic, p Table 15, Broadband Reference Circuit Microstrips, p Fig. 23, Power Gain, CW Output Power and Drain Efficiency versus Frequency at a Constant Input Power, p Fig. 24, CW Output Power versus Gate--Source Voltage at a Constant Input Power, P in =0.65W,p Fig. 25, CW Output Power versus Gate--Source Voltage at a Constant Input Power, P in = W, p Fig. 26, CW Output Power versus Input Power, p Fig. 27, Power Gain and Drain Efficiency versus CW Output Power, p Fig. 28, Intermodulation Distortion Products versus Output Power -- MHz, p Fig. 29, Intermodulation Distortion Products versus Output Power -- 0 MHz, p Fig., Intermodulation Distortion Products versus Output Power MHz, p Fig. 31, Broadband Series Equivalent Source and Load Impedance, p

34 How to Reach Us: Home Page: freescale.com Web Support: freescale.com/support Information in this document is provided solely to enable system and software implementers to use Freescale products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits based on the information in this document. Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including typicals, must be validated for each customer application by customer s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. Freescale, the Freescale logo, AltiVec, C--5, CodeTest, CodeWarrior, ColdFire, C--Ware, Energy Efficient Solutions logo, Kinetis, mobilegt, PowerQUICC, Processor Expert, QorIQ, Qorivva, StarCore, Symphony, and VortiQa are trademarks of, Reg. U.S. Pat. & Tm. Off. Airfast, BeeKit, BeeStack, ColdFire+, CoreNet, Flexis, MagniV, MXC, Platform in a Package, QorIQ Qonverge, QUICC Engine, Ready Play, SafeAssure, SMARTMOS, TurboLink, Vybrid, and Xtrinsic are trademarks of All other product or service names are the property of their respective owners. E 2012 Document Number: MRFE6VS25N 34 Rev. 1, 12/2012