19 th INTERNATIONAL CONGRESS ON ACOUSTICS MADRID, 2-7 SEPTEMBER 2007
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1 19 th INTERNATIONAL CONGRESS ON ACOUSTICS MADRID, 2-7 SEPTEMBER 2007 MICROMACHINED MICROPHONES WITH DIFFRACTION-BASED OPTICAL INTERFEROMETRIC READOUT AND ELECTROSTATIC ACTUATION PACS: Ar F. Levent Degertekin 1, Neal A. Hall 1, Baris Bicen 1, Caesar Garcia 1, Kamran Jeelani 1, Shakeel Qureshi 1, and Murat Okandan 2 1 G.W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA 30332, United States; levent@gatech.edu 2 Sandia National Laboratories, Albuquerque, NM 87185, United States; mokanda@sandia.gov ABSTRACT Micromachined microphones that use a diffraction-based optical method for integrated interferometric detection of diaphragm displacement are described. With optoelectronics integration, this approach yields highly sensitive microphones in mm-cube volumes. Furthermore, the electrical port of the device, which is freed by optical detection, is used for electrostatic actuation of the microphone diaphragm to adjust microphone characteristics via force feedback and to generate self characterization signals. This approach also changes the paradigm for the backplate and gap structure design enabling use of millimeter size diaphragms to achieve wide frequency response and low thermal mechanical noise levels characteristic of precision measurement microphones. Prototype optical microphone structures with polysilicon diaphragms have been fabricated using Sandia National Laboratories' silicon based SwIFT- Lite(TM) process. Measurements on these diaphragms show an A-weighted diaphragm displacement noise of 2.4-pm and flat electrostatic response up to 20-kHz. Straightforward design improvements lead to measurement microphones with 1.5-mm diameter diaphragms, 15-dBA internal noise, and 20-kHz bandwidth. Application of the detection method in a bioinspired directional microphone for hearing aids, and packaging development for half-inch calibration microphones are also discussed. INTRODUCTION Micromachined microphones with diffraction-based optical displacement detection have been recently introduced as an alternative to existing detection methods [1]. The approach has the advantage of providing optical interferometric displacement detection resolution for integrated microphone diaphragm structures, while also significantly decoupling the dependency of the displacement detection sensitivity on mechanical and acoustical design constraints. This decoupling allows for the use of microphone backplate designs with low squeeze-film resistance - the dominant damping mechanism and thermal-mechanical noise source in condenser microphones [2]. As shown in Fig.1, the basic structure of the microphone consists of a rigid diffraction grating under the microphone diaphragm. When illuminated by a laser, this structure generates reflected diffraction orders, whose intensity varies with diaphragm displacement. In addition, the microphone has an electrostatic actuation port (Fig. 1) that enables application of static and dynamic forces to the diaphragm for selfcharacterization and force feedback signals. The combination of these features may enable microphones with overall size characteristic of 1 mm 3 package size and but with detection performance characteristic of the highest precision measurement microphones. Microphones with this property would be suitable for noninvasive Diffraction Grating Photodetectors and Amplifiers Microphone Diaphragm I -1 I in I 0 VCSEL I 1 Silicon GaAs V DC +V AC Fig 1. Schematic of a micromachined diffraction-based optical microphone with integrated readout
2 instrumentation applications and audio applications where small size is desired, microfabricated arrays may be ideally suited for broadband sound intensity measurements and advanced speech recognition applications utilizing ambient noise suppression algorithms designed for miniature acoustic apertures [3]. The fact that relatively large distance between the grating and the optoelectronics can be used without sensitivity loss enables integration of the detection method with innovative biomimetic mechanical structures for micromachined directional microphones [4]. In the following, a specific implementation of the diffraction-based optical microphone structure is described and results of thermal-noise and self-characterization experiments are presented. Development of a measurement microphone package for the optical microphone is summarized and initial results obtained on biomimetic directional microphone are shown. MICROPHONE STRUCTURE AND FABRICATION Prototype optical microphone structures have been fabricated previously using Sandia National Laboratories dedicated silicon-based process technology and the details have been described elsewhere [4]. The processing sequence used to fabricate the devices described here is similar, but with significant structural improvements to achieve lower thermal noise floor and broad bandwidth. The microphone diaphragms, schematically shown in Fig. 1, are circular and made of 2.25 µm thick near-zero stress surface micromachined polysilicon layer on a silicon substrate. Several diaphragms with 1.5 mm and 0.9 mm diameters are fabricated on a single chip. The micrograph in Fig. 2 shows the top view of a completed 3 mm square chip with 4 microphone diaphragms. The diaphragms are suspended over a bulk silicon backplate. Different separation distances (2.5, 4.5 and 6 µm) are implemented by adjusting the sacrificial oxide thickness to determine and verify the effect of the squeezed film effects on thermal noise and frequency response. To remove topography resulting from the underlying grating structure, chemical mechanical polishing (CMP) is used to planarize the sacrificial oxide layer. This ensures a that the diaphragm acts as a flat reflector for optical detection purposes. The details of the backplate are visible from backside view of the structure which is shown in Fig. 3 along with a cross section identifying separate sections. In contrast with micromachined capacitive microphones, the backplate only consists of three bulk-silicon armlike structures which hold a surface micromachined grating rigidly in place beneath the compliant diaphragm. The grating is etched into a 0.8 µm-thick silicon nitride layer with a 4 µm period. This nitride layer exists above the silicon substrate across its entire surface and provides electrical isolation between the microphone diaphragm and bulk silicon substrate. Although not visible here, an electrically conductive 0.3 µm thick polysilicon layer is patterned above the nitride to form a ground plane electrode with a footprint similar to the three-arm structure itself. This electrode makes electrical contact with the bulk silicon substrate. A similar electrical contact is made outside of and away from the circumference of the diaphragm to create a wirebond pad for the ground Backside view electrode as can be seen in Fig. 3. The isolated electrodes enable application electrostatic forces to the diaphragm for self-tuning and characterization as demonstrated in the following 2 Backplate (Support arms) 3 mm Fig 2. The top view of a silicon chip with optical microphone diaphragms. Diaphragm Grating Bulk silicon Figure 3. The cross section of the fabricated device and the backside view showing the backplate and the grating structure
3 sections. In a final process step, 100 nm of gold is sputtered on the backside of the structure to enhance the optical reflectivity of the grating and diaphragm. For this microphone structure, the squeezed film damping in the thin gap between the diaphragm and backplate is the dominant damping mechanism and thermal-mechanical noise source. The backplate shown in Fig. 3 has been specifically designed for broadband frequency response and low thermal-mechanical noise using an advanced thin-film damping model able to study complex backplate geometries that are a substantial departure from traditional perforated backplate designs. The backplate structure presented in Fig. 3, for example, consists of mostly open area with the main purpose of supporting the grating. Therefore, this structure is a stark demonstration of a critical advantage of the optical detection approach the ability to design acoustic sensing structures without regard to device capacitance. Neighbouring microphone elements on the same chip can also be partially observed in Fig. 2 and Fig. 3 as these silicon components have been designed for miniature array applications. DEVICE CHARACTERIZATION To characterize the optical microphone structures, an experimental setup with the elements of the schematic in Fig. 1 is implemented. Vertical cavity surface emitting laser (VCSEL) and 630 nm laser diodes are used as the light source, and an external transimopedance amplifier is used to convert the photodiode current to a voltage signal. For noise cancellation, the difference of the 0 th and 1 st diffraction order signal is used, or part of the laser output beam is diverted to a second photodiode and subtracted from the 1 st order output. The electrostatic actuation port is used to optimize the bias point on the interference curve and calibrate the displacement sensitivity based on the wavelength of the light source. To obtain the dynamic response of the diaphragm, a signal analyzer is used to sweep the frequency of the ac signal input at the optimal DC bias voltage. Figure 4 a) shows experimentally measured frequency response for three diaphragms with 6 µm gap thickness along with the simulation result. The advanced squeezed film model which takes into account the losses due to multiple vibration modes of the diaphragm on the comples backplate structure accurately predicts the dynamic response. Note that the particular diaphragm has a bandwidth beyond 20 khz as desired in a measurement microphone. The damping of the diaphragms can be easily adjusted by controlling the gap thickness. Figure 4 b) shows measurements on several 1.5 mm diameter microphones with 2.5, 4.5 and 6 µm gap thickness, showing that the bandshape can be determined by the device geometry. Also should be noted is the uniformity of the device characteristics over different silicon chips. Dynamic Response db: arb ref simulation 10 4 Frequency (Hz) The thermal noise of the microphone diaphragms and the detection noise levels are also investigated in detail and compared with the damping model which is verified by the dynamic measurements. The displacement noise levels of the diaphragms shown in Fig. 4 a) are limited by the thermal mechanical noise of the diaphragm to about 2.4pm (A-weighted). This corresponds to 2.7 µpa/ Hz level equivalent pressure noise (24 db (A-weighted) given the 3 Dynamic Respons (db) Frequency (Hz) 2.5µm Fig 4 a) Simulated and measured dynamic response of 1.5 mm optical microphone diaphragm with 6 µm gap thickness. b) Measured dynamic response variation for diaphragms with different gap thickness 6µm
4 pressure sensitivity of the diaphragm. For the same case, the noise level of the optical detection system is limited by shot noise to about 0.9 µpa/ Hz. Therefore, the diaphragm design can be further improved to take advantage of the extremely low noise of the optical detection scheme. A simple change of design increasing the gap from 6 µm to 12 µm reduces the thermal noise level to about 0.9 µpa/ Hz and enables a microphone with noise level of 15 db(a). As seen in Fig. 4 a) this diaphragm would have a higher resonance peak, and damping that peak by reduction of gap as Fig. 4-b) is not an option since thermal noise will increase. The optical microphone structure of Fig. 1 offers a solution to this problem with the use of the electrostatic actuation capability for force feedback. As applied in several other areas of scientific instrumentation, such as atomic force microscopy, force feedback can be used to reduce the quality factor of a mechanical resonator without introducing significant extra noise to the system [6]. The integrated electrostatic actuator shown in Fig. 1, is ideal for this type of force feedback application to adjust system dynamics. This approach can yield very low noise measurement microphones with unprecedented bandwidth and small size, and is currently under investigation and the details will be reported elsewhere. MICROPHONE PACKAGING DEVELOPMENT The results presented in the previous sections were obtained using the built-in electrostatic actuator show the potential of the diffraction based optical microphone structures for implementation of miniature measurement microphones. To verify these results through acoustic testing, a package with the same form factor of a 0.5 inch diameter measurement microphone has been developed. The overall package, shown in Fig. 5, is made up of an aluminium tube which carries the electronics for photocurrent to voltage conversion for several channels and application of electrostatic forces for in-situ characterization and optimization purposes. The electrical connections are provided with a LEMO cable and the device interfaces with external electronics through standard BNC cables. The device has a permanent header with VCSEL and specially designed photodetectors placed on a PCB. This header is shown in detail in Fig. 6 along with the silicon microphone diaphragm holder. Various types of optical microphones, single diaphragm, omni-directional devices as in Fig. 2, or biomimetic directional microphone devices can be placed on the permanent header for acoustics characterization. Fig. 6 shows the header with a silicon chip including several directional microphone diaphragms [4]. The silicon chip is placed on a carrier made by 3-D laser stereolithography (SLA) that roughly aligns the grating on the microphone diaphragm to the VCSEL beam. Finer alignment is performed under an optical microscope before the silicon chip is fixed in place on the carrier. As seen in Fig. 6, leads through the carrier are provided to provide electrostatic actuation signals to the silicon chip for self testing and force-feedback operation [7]. LEMO cable Silicon microphone diaphragm chip Aluminum body Mounted silicon microphone chip Actuation pins PCB with laser and PD Permanent header Fig 5 The 0.5 inch diameter measurement microphone package for acoustic testing of various microphone structures using diffraction-based optical detection Permanent header base Fig 6 Detailed view of the optical microphone head including the permanent PCB carrying the VCSEL and photodetector (PD ) array and the silicon chip with biomimetic directional microphone diaphragms 4
5 The package is tested with various microphones and initial sound recording are made for characterization purposes. Figure 7 shows the result of a typical electrostatic characterization measurement on a biomimetic directional microphone. This particular device has a resonance frequency of about 1.8 khz and a quality factor of about 12. We have measured the noise level of similar structures to be around 36 db(a) with nearly ideal figure-8 response, which is better than existing directional hearing aid microphones. Our initial results on the force-feedback application using the electrostatic actuation shows that to the resonance of the device can be damped significantly to have a flat frequency response without degrading the noise performance significantly. CONCLUSIONS Micromachined optical microphones with diffractionbased interferometric detection have several key features such as an extremely high detection sensitivity decoupled from mechanical design. This provides wider mechanical design space for the microphone structure, especially the backplate to implement microphones with low thermal noise floor. This capability has been demonstrated and verified by detailed models. The flexibility offered by the detection scheme has led to implementation of low noise Fig 7 Frequency response of a biomimetic directional microphone membrane measured using the package shown in Figures 5 and 6. Integrated electrostatic actuation is used to obtain the dynamic response shown. directional micromachined microphones with novel biomimetic structures. These devices should find use in advanced hearing aids. The unique force feedback capability offered by the integrated electrostatic actuator of the optical microphone should be useful in adjusting the apparent dynamic properties of the microphone diaphragm leading microphones with desired noise levels and frequency response characteristics. ACKNOWLEDGMENTS This work partially supported by NIH Grant 5R01DC , CA postdoctoral fellowship, the Catalyst Foundation, and Sandia National Laboratory. Prof. Ron Miles has provided the biomimetic silicon micromachined directional microphones. References: [1] N. A. Hall, B. Bicen, M. K. Jeelani, W. Lee, S. Qureshi, M. Okandan, and F. L. Degertekin: Micromachined microphones with diffraction based optical displacement detection. Journal of the Acoustical Society of America, 118 (2005) [2] T. B. Gabrielson: Mechanical-thermal noise in micromachined acoustic and vibration sensors. IEEE Transactions on Electron Devices, 40 (1993) [3] M. Stanacevic and G. Cauwenberghs: Micropower gradient flow acoustic localizer. IEEE Transactions on Circuits and Systems I-Regular Papers, 52 (2005) [4] W. Cui, B. Bicen, N. Hall, S. A. Jones, F.L. Degertekin, R. N. Miles: Optical Sensing In A Directional MEMS Microphone Inspired By The Ears Of The Parasitoid Fly, Ormia Ochracea. Proceedings of MEMS 06 (2006) [5] N. A. Hall, M. Okandan, and F. L. Degertekin: Surface and bulk micromachined optical displacement sensor fabricated with Swift-Lite TM. Journal of Microelectromechanical Systems, 15 (2006) [6] J. Mertz, 0. Marti, and J. Mlynek: Regulation of a microcantilever response by force feedback. Applied Physics Letters. 19 (1993) [7] F.L. Degertekin, N.A. Hall and W. Lee, Highly-sensitive displacement-measuring optical device, U.S. Patent 7,116,430, 10/3/2006 5
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