TARIF IFTEC DES NORMES IPC (TOUS LES PRIX SONT SUSCEPTIBLES D'ÉVOLUER EN FONCTION DE LA PARITÉ EURO/DOLLAR)
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- Barbara Dorsey
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1 TARIF IFTEC DES NORMES IPC (TOUS LES SONT SUSCEPTIBLES D'ÉVOLUER EN FONCTION DE LA PARITÉ EURO/DOLLAR) 02/11/15 Validité : 01/12/15 IFTEC : 33 rue Ravon BOURG-LA-REINE - France Tel : Fax : Mail : iftec@iftec.fr Site : SAS CAPITAL RCS Nanterre Id. TVA FR
2 TARIF IFTEC NORMES IPC AU 2 NOVEMBRE 2015 Coût transport emballage Colissimo Expert France : Colissimo Expert étranger : poids < 2 kg poids < 3 kg poids > 2kg < 4 kg poids > 3kg < 6 kg poids > 4kg < 6 kg poids > 6kg < 10 kg poids > 6kg < 8 kg poids > 10kg < 15 kg poids > 8kg < 10 kg poids > 15kg < 20 kg LIV = Livre version papier CD = CD licence individuelle KIT = Livre version papier + CD licence individuelle LIV IPC CD IPC-1601(E) Printed Board Handling and Storage Guidelines KIT IPC-1601-K LIV IPC Conflict Minerals Data Exchange Standard 2141A B 2221B-FR 2222A 2222A-FR 2223C LIV IPC-2141A CD IPC-2141A (E) KIT IPC-2141A-K LIV IPC CD IPC-2152(E) KIT IPC-2152-K LIV IPC-2220 (SERIE 2221B A C ) IPC 2220 Family of Design Documents CD IPC-2220-S(E) KIT IPC-2220-K LIV IPC-2221B CD IPC-2221B(E) Generic Standard on Printed Board Design KIT IPC-2221B-K LIV IPC-2221B-FR CD IPC-2221B-FR(E) KIT IPC-2221B-FR-K LIV IPC-2222A CD IPC-2222A(E) KIT IPC-2222A-K LIV IPC-2222A-FR CD IPC-2222A-FR(E) KIT IPC-2222A-FR-K LIV IPC-2223C CD IPC-2223C(E) KIT IPC-2223C-K LIV IPC Sectional Standard of Design of PWBs for PC Cards CD IPC-2224(E) LIV IPC CD IPC-2225(E) LIV IPC CD IPC-2226(E) LIV IPC CD IPC-2251(E) Design Guide for High-Speed Controlled Impedance Circuit Boards Standard for Determining Current Carrying Capacity in Printed Board Design Norme Générique de Conception du Circuit Imprimé (French Language) Sectional Design Standard for Rigid Organic Printed Boards Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides (French Language) Sectional Design Standard for Flexible Printed Boards Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies Sectional Design Standard for High Density Interconnect (HDI) Boards Design Guide for the Packaging of High Speed Electronic Circuits
3 D-WAM1 4103A-WAM A 4203A 4204A-WAM1 4412B 4552-WAM A A 5704 LIV IPC CD IPC-2291(E) Design Guideline for Printed Electronics KIT IPC-2291-K LIV IPC CD IPC-2611(E) KIT IPC-2611-K LIV IPC CD IPC-2614(E) KIT IPC-2614-K LIV IPC Printed Board Dimensions and Tolerences CD IPC-2615(E) LIV IPC-4101D-WAM CD IPC-4101D-WAM1(E) KIT IPC-4101D-WAM1-K LIV IPC-4103A-WAM CD IPC-4103A-WAM1(E) KIT IPC-4103A-WAM1-K LIV IPC CD IPC-4104(E) LIV IPC-4202A CD IPC-4202A(E) KIT IPC-4202A-K LIV IPC-4203A CD IPC-4203A(E) KIT IPC-4203A-K LIV IPC-4204A-WAM CD IPC-4204A-WAM1(E) KIT IPC-4204A-WAM1-K LIV IPC-4412B CD IPC-4412B(E) KIT IPC-4412B-K LIV IPC-4552-WAM CD IPC-4552-WAM1-2(E) KIT IPC-4552-WAM1-2-K LIV IPC-4553A CD IPC-4553A(E) KIT IPC-4553A-K LIV IPC CD IPC-4554(E) KIT IPC-4554-K LIV IPC CD IPC-4556(E) KIT IPC-4556-K LIV IPC-4562A CD IPC-4562A(E) Metal Foil for Printed Board Applications KIT IPC-4562A-K LIV IPC CD IPC-5704(E) KIT IPC-5704-K Generic Requirements for Electronic Product Documentation Sectional Requirements for Board Fabrication Documentation Specification for Base Materials for Rigid and Multilayer Printed Boards Specification for Base Materials for High Speed / High Frequency Applications Specification for High Density Interconnect (HDI) and Microvia Materials Flexible Base Dielectrics for Use in Flexible Printed Circuitry Cover and Bonding Material for Flexible Printed Circuitry Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry - With Amendment 1 Specification for Finished Fabric Woven from "E" Glass for Printed Boards Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards Specification for Immersion Silver Plating for Printed Boards Specification for Immersion Tin Plating for Printed Circuit Boards - includes Amendment 1 Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards Cleanlisness Requirements for Unpopulated Printed Board
4 D 6012C-FR 6013C B C 7351B 7525B 7527 LIV IPC-6010 (SERIE D C B) IPC-6010 Family of Board Performance Documents CD IPC-6010-S(E) KIT IPC-6010SERIES-K LIV IPC CD IPC-6011(E) LIV IPC-6012D CD IPC-6012D(E) KIT IPC-6012D-K LIV IPC-6012C-FR CD IPC-6012C-FR(E) KIT IPC-6012C-FR-K LIV IPC-6013C CD IPC-6013C(E) KIT IPC-6013C-K LIV IPC CD IPC-6015(E) LIV IPC CD IPC-6016(E) LIV IPC CD IPC-6017(E) KIT IPC-6017-K LIV IPC-6018B CD IPC-6018B(E) KIT IPC-6018B-K LIV IPC CD IPC-7092(E) KIT IPC-7092-K LIV IPC CD IPC-7093(E) KIT IPC-7093-K LIV IPC CD IPC-7094(E) KIT IPC-7094-K LIV IPC-7095C CD IPC-7095C(E) KIT IPC-7095C-K LIV IPC-7351B CD IPC-7351B(E) KIT IPC-7351B-K LIV IPC-7525B CD IPC-7525B(E) Stencil Design Guidelines KIT IPC-7525B-K LIV IPC CD IPC-7527(E) Requirements for Solder Paste Printing KIT IPC-7527-K Generic Performance Specification for Printed Boards Rigid Printed Boards Définitions et Spécification des propriétés des circuits imprimés rigides (French Language) Flexible Printed Boards Qualification & Performance Specification for Organic Multichip Module (MCM-L) Mounting & Interconnecting Structures Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards Printed Boards Containing Embedded Passive Devices High Frequency (Microwave) Printed Boards Embedded Components Bottom Termination Components Flip Chip and Die Size Components BGAs Generic Requirements for Surface Mount Design and Land Pattern Standard
5 /21B 7711/21B-FR 9201A A A 9701A 9709 A-600H A-600H-FR A-610F A-610F-FR A-620B LIV IPC CD IPC-7530(E) KIT IPC-7530-K LIV IPC-7711/21B CD IPC-7711/21B(E) KIT IPC-7711/21B-K LIV IPC-7711/21B-FR CD IPC-7711/21B-FR(E) KIT IPC-7711/21B-FR-K LIV IPC-9201A CD IPC-9201A(E) Surface Insulation Resistance Handbook KIT IPC-9201A-K LIV IPC CD IPC-9202(E) KIT IPC-9202-K LIV IPC-9252A CD IPC-9252A(E) KIT IPC-9252A-K LIV IPC CD IPC-9641(E) High Temperature Printed Board Flatness Guideline KIT IPC-9641-K LIV IPC-9691A CD IPC-9691A(E) KIT IPC-9691A-K LIV IPC-9701A CD IPC-9701A(E) KIT IPC-9701A-K LIV IPC CD IPC-9709(E) KIT IPC-9709-K LIV IPC-A-600H CD IPC-A-600H(E) Acceptability of Printed Boards KIT IPC-A-600H-K LIV IPC-A-600H-FR CD IPC-A-600H-FR(E) Acceptabilité des Circuits Imprimés (French language) KIT IPC-A-600H-FR-K LIV IPC-A-610F CD IPC-A-610F(E) Acceptability of Electronic Assemblies KIT IPC-A-610F-K LIV IPC-A-610F-FR CD IPC-A-610F-FR(E) KIT IPC-A-610F-FR-K LIV IPC-A-620B CD IPC-A-620B(E) KIT IPC-A-620B-K Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes Rework, Modification and Repair of Electronic Assemblies Reprise, modification et réparation des assemblages électroniques Material and Process Characterization / Qualification Test Protocol for Assessing Electrochemical Performance Requirements for Electrical Testing of Unpopulated Printed Boards User Guide for the IPC-TM-650, Method , Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Miation Testing) Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments Test Guidelines for Acoustic Emission Measurements during Mechanical Testing Acceptabilité des assemblages électroniques (French Language) IPC/WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies
6 A-620B-FR A-630 AJ-820A CC-830B CH-65B LIV IPC-A-620B-FR CD IPC-A-620B-FR(E) KIT IPC-A-620B-FR-K LIV IPC-A CD IPC-A-630(E) KIT IPC-A-630-K LIV IPC-AJ-820A CD IPC-AJ-820A(E) Assembly & Joining Handbook KIT IPC-AJ-820A-K LIV IPC-CC-830B CD IPC-CC-830B(E) KIT IPC-CC-830B-K LIV IPC-CH-65B CD IPC-CH-65B(E) KIT IPC-CH-65B-K DRM-18H LIV IPC-DRM-18H DRM-PTH-F LIV IPC-DRM-PTH-F DRM-SMT-F LIV IPC-DRM-SMT-F Exigences et Critères d'acceptabilité pour l'interconnexion des Faisceaux de Fils et de Câbles (French Language) Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies - Includes Amendment 1 Guidelines for Cleaning of Printed Boards and Assemblies Component Identification Training and Reference Guide Through-Hole SolderJoint Evaluation Training & Reference Guide Surface Mount Solder Joint Evaluation Training & Reference Guide DRM-WHA-B LIV IPC-DRM-WHA-B Wire Harness Assembly Training & Reference Guide HDBK-001E HDBK-005 HDBK-630 HDBK-830A HDBK-850 J-STD-001F J-STD-001F- FR J-STD-002D LIV IPC-HDBK-001E CD IPC-HDBK-001E(E) Handbook and guide to supplement IPC-J-STD-001 KIT IPC-HDBK-001E-K LIV IPC-HDBK CD IPC-HDBK-005(E) Guide to Solder Paste Assessment KIT IPC-HDBK-005-K LIV IPC-HDBK CD IPC-HDBK-630(E) KIT IPC-HDBK-630-K LIV IPC-HDBK-830A CD IPC-HDBK-830A(E) KIT IPC-HDBK-830A-K LIV IPC-HDBK CD IPC-HDBK-850(E) KIT IPC-HDBK-850-K LIV IPC-J-STD-001F CD IPC-J-STD-001F(E) KIT IPC-J-STD-001F-K LIV IPC-J-STD-001F-FR CD IPC-J-STD-001F-FR(E) KIT IPC-J-STD-001F-FR-K LIV IPC-J-STD-002D CD IPC-J-STD-002D(E) KIT IPC-J-STD-002D-K Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures Guidelines for Design, Selection and Application of Conformal Coatings Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly Requirements for Soldered Electrical and Electronic Assemblies Exigences des Assemblages Electriques et Electroniques Brasés (French Language) EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
7 J-STD-003C- WAM1 J-STD-004B J-STD-005A J-STD-006C J-STD-020E J-STD-030A J-STD-033C-1 J-STD-075 J-STD-609A LIV IPC-J-STD-003C-WAM CD IPC-J-STD-003C-WAM1(E) Solderability Tests for Printed Boards KIT IPC-J-STD-003C-WAM1-K LIV IPC-J-STD-004B CD IPC-J-STD-004B(E) KIT IPC-J-STD-004B-K LIV IPC-J-STD-005A CD IPC-J-STD-005A(E) Requirements for Soldering Pastes KIT IPC-J-STD-005A-K LIV IPC-J-STD-006C CD IPC-J-STD-006C(E) KIT IPC-J-STD-006C-K LIV IPC-J-STD-020E CD IPC-J-STD-020E(E) KIT IPC-J-STD-020E-K LIV IPC-J-STD-030A CD IPC-J-STD-030A(E) KIT IPC-J-STD-030A-K LIV IPC-J-STD-033C CD IPC-J-STD-033C-1(E) KIT IPC-J-STD-033C-1-K LIV IPC-J-STD CD IPC-J-STD-075(E) KIT IPC-J-STD-075-K LIV IPC-J-STD-609A CD IPC-J-STD-609A(E) KIT IPC-J-STD-609A-K ROADMAP-13 CD IPC-ROADMAP SM-817A SM-840E T-50M TM-650 LIV IPC-SM-817A CD IPC-SM-817A(E) KIT IPC-SM-817A-K LIV IPC-SM-840E CD IPC-SM-840E(E) KIT IPC-SM-840E-K LIV IPC-T-50M CD IPC-T-50M(E) KIT IPC-T-50M-K LIV IPC-TM Test Methods Manual CD IPC-TM-650(E) Requirements for Soldering Fluxes - includes Amendment 1 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices Selection and Application of Board Level Underfill Materials Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices Classification of Non-IC Electronic Components for Assembly Processes Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes IPC 2013 International Technology Roadmap for Electronic Interconnections General Requirements for Dielectric Surface Mount Adhesives Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials Terms and Definitions for Interconnecting and Packaging Electronic Circuits
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