QuickSpecs. HP Z420 Workstation. HP Z420 Workstation. Overview

Transcription

1 Overview 1. Handle in Top Optical Bay (optional) 2. 3 External 5.25 Bays in-1 Media Card Reader (optional) 4. Power Button 5. HDD Activity LED 6. Front I/O: 1 USB 2.0, 2 USB 3.0, 1 Headphone, 1 Microphone, a 7. Easy-open Side Panel c DA Worldwide Version 41 April 1, 2015 Page 1

2 Overview 8. 3 External 5.25 Bays 13. Intel Xeon Processors: E family (4C), E5-1600v Internal 3.5 Bays family (4C/6C/8C), E5-2600v2 (8C) DIMM Slots for DDR3 ECC Memory PCIe x16 Gen3 Slots W, 90% Efficient Power Supply or 400W, 90% Efficient Power Supply 12. Rear I/O: Rear Power Button & LED, PS/2 Ports, a, 4 USB 2.0, 2 USB 3.0, 1 RJ-45 to Integrated GbE, 1 Audio Line In, 1 Audio Line Out, 1 Microphone PCIe x8 Gen3, 1 PCIe x8(x4) Gen2, 1 PCIe x4(x1) Gen2, 1 PCI Slot Internal USB 2.0 Ports SATA Ports Form Factor Operating Systems Convertible Minitower Preinstalled: Windows 7 Professional 32/64 Windows 8.1 Pro 64-bit Windows 8.1 Simplified Chinese Edition 64-bit Windows 8.1 Pro Downgrade to Windows 7 Professional 32/64 SUSE Linux Enterprise Desktop 11 (90 day support) HP Installer Kit for Linux (includes drivers for 64-bit OS versions of RHEL 6 & 7 and SUSE Linux Enterprise Desktop 11) c DA Worldwide Version 41 April 1, 2015 Page 2

3 Overview Red Hat Enterprise Linux Desktop (Paper license with 1 year support; no preinstalled OS) Supported: Windows 8/8.1 Enterprise 64-bit Windows 7 Enterprise 32/64-bit Windows XP Professional 32/64 (on select configurations)* Red Hat Enterprise Linux Desktop/Workstation 5, 6, 7 Notes: *See the "Windows XP Support Matrix for Z Workstations" at: Available Processors Available Processor Disclaimers Notes: For detailed OS/hardware support information for Linux, see: Name Intel Xeon E v2 processor Intel Xeon E v2 processor Intel Xeon E v2 processor Intel Xeon E v2 processor Intel Xeon E v2 processor Intel Xeon E v2 processor Intel Xeon E processor Intel Xeon E processor Clock Cores Speed (GHz) Cache (MB) Memory Speed (MHz) QPI Speed (GT/s) Hyper- Threading Featuring Intel vpro Technology Intel Turbo TDP Boost Technology 1 (W) Y Y 4, Y Y 4, Y Y 2, Y Y 1, Y Y 0, N Y N/A Y Y 2, N Y N/A The specifications shown in this column represent the following: (all core maximum turbo steps, one core maximum turbo steps). Turbo boost stepping occurs in 100MHz increments. Processors that do not have turbo functionality are denoted as N/A. NOTE: Although the Intel Xeon E processor family supports dual processors, the HP Z420 Workstation does not support dual processor configurations. Intel's numbering is not a measurement of higher performance. Processor numbers differentiate features within each processor family, not across different processor families. See: for details. 64-bit computing on Intel 64 architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel 64 architecture. Processor will not operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations. See: for more information. c DA Worldwide Version 41 April 1, 2015 Page 3

4 Overview Color Convertibility Expansion Slots (see system board section for more details) Quad-Core, Six-Core, and Eight-Core technologies are designed to improve performance of multithreaded software products and hardware-aware multitasking operating systems and may require appropriate operating system software for full benefits. Check with software provider to determine suitability. Not all customers or software applications will necessarily benefit from use of these technologies. Jack Black Yes. 5.25" drives rotate for Minitower or Desktop orientation. Slot 1 (top): PCI Express Gen2 x4(1)* Full-height, Full-length Slot 2: PCI Express Gen3 x 16 Full-height, Full-length (with extender) Slot 3: PCI Express Gen2 x 8(4)* with open-ended connector** Full-height, Full-length (with extender) Slot 4: PCI Express Gen3 x8 with open-ended connector** Full-height, Full-length (with extender) Slot 5: PCI Express Gen3 x16 Full-height, Full-length (with extender) Slot 6: PCI 32bit/33MHz Full-height, Full-length (with extender) * x<number> = number of lanes or size of the physical/mechanical connector. (number) = number of lanes supported electrically. Typically communicated as x# mechanical, x(#)electrical. Expansion Bays (see storage section for more details) ** open-ended connector allows a greater bandwidth (e.g. x16) card to be installed physically into a lower bandwidth connector/slot. 3 internal 3.5" bays (with acoustic dampening rail assemblies pre-installed) 3 external 5.25" bays (4th HDD occupies one external bay) Top and Middle 5.25" bay device depth limit: 206mm (8.11 inches) Bottom 5.25" bay device depth limit: 173mm (6.81 inches) Front I/O 2 USB 3.0, 1 USB 2.0, 1 IEEE 1394a standard, 1 Headphone,1 Microphone Internal I/O USB 2.0 ports available by three separate 2x5 headers. Each 2x5 header supports either one HP Internal USB Port Kit (EM165AA) or one 14-in-1 Media Card Reader. Rear I/O 2 USB 3.0, 4 USB 2.0,1 IEEE 1394a port, 2 PS/2, RJ-45 (NIC), 1 Audio Line-In, 1 Audio Line-Out, 1 Microphone. Serial supported with optional connector on PCI bracket cabled to system board connector Interfaces Supported 14-in-1 Media Card Reader (optional) 6-channel SATA interface 6.0 Gb/s, 3.0 Gb/s). 6 channels are esata configurable for use with esata CTO/AMO Kit (No hot plug / hot swap supported). c DA Worldwide Version 41 April 1, 2015 Page 4

5 Overview USB 2.0, USB 3.0, IEEE 1394a interface Chassis Dimensions (HxWxD) Standard minitower orientation: x x cm (17.6 x 7.0 x 17.5 in) Converted desktop orientation: 17.9 x x cm (7.0 x 17.6 x 17.5 in) Weight Exact weights depend upon configuration. Minimum: 12.5kg (27.5 lbs) Standard: 13.2kg (29.2 lbs) Maximum: 17.7kg (39 lbs) Temperature Operating: 5 to 35 C (40 to 95 F) Non-operating -40 to 60 C (-40 to 140 F) Humidity Operating: 8% to 85% relative humidity, non-condensing Non-operating 8% to 90% relative humidity, non-condensing Maximum Altitude (nonpressurized) Operating: 3,048m (10,000ft) Non-operating 9,144m (30,000ft) Power Supply 600 watts wide-ranging, active Power Factor Correction, 90% Efficient The Z W power supply efficiency report can be found at this link: PACKARD_ _ECOS _600W_Report.pdf Workstation ISV Certifications (optional) 400 watts wide-ranging, active Power Factor Correction, 90% Efficient The Z W power supply efficiency report can be found at this link: 3%20A_ECOS%202277_400W_Report.pdf See the latest list of certifications at c DA Worldwide Version 41 April 1, 2015 Page 5

6 Supported Components Processors Intel Xeon E Series Factory Configured Option Kit Intel Xeon Processor E C 3.60GHz Y N Intel Xeon Processor E C 2.80GHz Y N Intel Xeon E v2 Series - CTO Intel Xeon Processor E v2 8C 2.60GHz Y N Intel Xeon E v2 Series Intel Xeon Processor E v2 8C 3.00GHz Y N Intel Xeon Processor E v2 6C 3.70GHz Y N Intel Xeon Processor E v2 6C 3.50GHz Y N Intel Xeon Processor E v2 4C 3.70GHz Y N Intel Xeon Processor E v2 4C 3.00GHz Y N Option Kit Part Number Support Notes HP Liquid Cooling option available for all the above processors. Liquid cooling supported on 600W PSU chassis only. Monitors / Displays Factory Configured Option Kit Option Kit Part Number Support Notes HP DreamColor LP2480zx Professional Display HP Z Display Z30i 30-inch IPS LED Backlit Monitor HP Z Display Z27i 27-inch IPS LED Backlit Monitor HP Z Display Z24i 24-inch IPS LED Backlit Monitor HP Z Display Z23i 23-inch IPS LED Backlit Monitor HP Z Display Z22i 21.5-inch IPS LED Backlit Monitor Supported by all operating systems available from HP Screen size measured diagonally Hard Drives Sub-Section Description/Notes Up to (4) 3.5-inch 15K rpm SAS drives: 300, 450, 600 GB; 2.4 TB max Up to (4) 2.5-inch 10K rpm SAS drives: 300, 600, 900 GB, 1.2 TB; 4.8 TB max NOTE: SAS controller add-in card required NOTE: 4th SFF HDDs will be automatically installed into the Z2/Z4 Handle and Dual SFF Drive Adapter in Top ODD Bay part SAS Hard Drives Removable Boot Drive option HP SAS (Serial Attached SCSI) Hard Drives for HP Workstations Factory Configured Option Kit Option Kit Part Number 600GB SAS 15K rpm 6Gb/s 3.5" HDD Y Y VM647AA 450GB SAS 15K rpm 6Gb/s 3.5" HDD Y Y LU968AA Support Notes c DA Worldwide Version 41 April 1, 2015 Page 6

7 Supported Components 300GB SAS 15K rpm 6Gb/s 3.5" HDD Y Y LU967AA HP 1.2TB SAS 10K SFF HDD Y Y E2P04AA HP 900GB SAS 10K SFF HDD Y Y E2P03AA HP 600GB SAS 10K SFF HDD Y Y A2Z21AA HP 300GB SAS 10K SFF HDD Y Y A2Z20AA Sub-Section Description/Notes Up to (4) 3.5-inch 7200 rpm SATA drives: 250, 500 GB, 1.0, 2.0, 3.0 TB; 12.0 TB max Up to (1) 2.5-inch SATA Self-Encrypting Drive (SED): 500 GB SATA Hard Drives Removable Boot Drive option SATA (Serial ATA) Hard Drives for HP Workstations 500GB SATA 7200 rpm 6Gb/s 3.5" HDD Y Y LQ036AA 1TB SATA 7200 rpm 6Gb/s 3.5" HDD Y Y LQ037AA 2.0TB SATA 7200 rpm 6Gb/s 3.5" HDD Y Y QB576AA 3.0TB SATA 7200 rpm 6Gb/s 3.5" HDD Y Y QF298AA 500GB SATA 7.2K SED SFF HDD Y N Sub-Section Description/Notes Up to (4) 2.5-inch Micron 6Gb/s SATA Solid State Drives: 128, 256, 512 GB; 3.0 TB max Up to (1) 2.5-inch SATA Self-Encrypting Solid State Drive (SED SSD): Micron 6Gb/s 256 GB Up to (4) 2.5-inch Seagate 600 Pro 6Gb/s SATA Solid State Drives: 120, 240, 480 GB; 1.9 TB max Up to (1) 2.5-inch Intel Pro Gb/s SATA Solid State Drive: 180 GB SATA Solid State Drives PCIe SSDs NOTE: 4th SSDs will be automatically installed into the Z2/Z4 Handle and Dual SFF Drive Adapter in Top ODD Bay part HP Solid State Drives (SSDs) for Workstations HP 128GB SATA 6Gb/s SSD Y Y A3D25AA HP 256GB SATA 6Gb/s SSD Y Y A3D26AA HP 512GB SATA 6Gb/s SSD Y Y D8F30AA HP 256GB SATA 6Gb/s SED SSD Y N Seagate 600 Pro 120GB SATA SSD Y Y E9Q50AA Seagate 600 Pro 240GB SATA SSD Y Y E9Q51AA Seagate 600 Pro 480GB SATA SSD Y Y E9Q52AA Intel Pro GB SATA SSD Y Y F5Z70AA PCIe SSDs for HP Workstations Fusion iofx 410GB PCIe Accelerator Y Y E4W49AA HP Z Turbo Drive 512GB SSD* Y Y G3G89AA HP Z Turbo Drive 256GB SSD* Y Y G3G88AA *Each drive requires a PCIe x4 (minimum) slot to be available. Full performance is obtained only when using PCIe slots connected to the CPU. Non-CPU PCIe slots may see a decrease of up to 10%. Please see slot configuration recommendations at Note that graphics cards, Thunderbolt, and other devices will require PCIe slots. For hard drives, 1 GB = 1 billion bytes; TB = 1 trillion bytes. Actual formatted capacity is less. c DA Worldwide Version 41 April 1, 2015 Page 7

8 Supported Components Hard Drive Controllers Integrated SATA 6.0 Gb/s Controller Factory Configured Option Kit Option Kit Part Number Support Notes Integrated SATA 6.0 Gb/s Controller Y N Two ports Integrated SATA 3.0 Gb/s Controller Integrated SATA 3.0 Gb/s Controller Y N Four ports Factory integrated RAID on motherboard for SATA drives RAID 0 Configuration - Striped Array Y N Note 1 RAID 0 Data Configuration -- Boot/OS Drive + 2 Drive Striped Array Y N Note 1 RAID 1 Configuration - Mirrored Array Y N Note 1 RAID 10 Configuration - Striped/Mirrored Array Y N Note 1 RAID 5 Configuration - Parity Array Y N Note 1 LSI i4e 8-port SAS 6Gb/s RAID Card LSI i4e 8-port SAS 6Gb/s RAID Card Y Y E0X20AA Note 2 LSI i SAS 6Gb/s ROC RAID Card and ibbu9 Battery Backup Unit LSI i SAS 6Gb/s ROC RAID Card Y Y E0X21AA Note 2 LSI ibbu09 Battery Backup Unit N Y E0X19AA SATA hardware RAID is supported on Linux systems that have support for the Intel RSTe technology. The Linux kernel, with built-in software RAID, provides excellent functionality and performance. It is a good alternative to hardware-based RAID. Please visit for RAID capabilities with Linux. All drives must be identical in type and capacity. RAID arrays greater than 2 TB are fully supported. NOTE 1: Requires hard drives with identical speed, capacity, and interface. Specific user-configured hardware SAS RAID configurations are supported on this Linux system. For details, please visit NOTE 2: Specific user-configured hardware SAS RAID configurations are supported on this Linux system. IS: Striping of 2 or more HDDs into a single logical volume IM: Mirroring of 2 HDDs into a single logical volume IME: Mirroring of 3 or more HDDs into a single logical volume. For details, please visit Graphics Professional 2D Factory Configured Option Kit Option Kit Part Number Support Notes Supported # of cards Mixed? NVIDIA NVS MB Graphics Y Y A7U59AA Note 1 3 YES NVIDIA NVS 315 1GB Graphics Y Y E1U66AA Note 1 3 NO NVIDIA NVS 510 2GB Graphics Y Y C2J98AA Note 2 2 YES Entry 3D NVIDIA Quadro MB Graphics Y Y A7U60AA 2 NO NVIDIA Quadro K600 1GB Graphics Y Y C2J92AA 2 NO AMD FirePro V3900 1GB Graphics Y Y A6R69AA Note 5 2 NO Mid-range 3D NVIDIA Quadro K2000 2GB Graphics Y Y C2J93AA Note 5 2 NO c DA Worldwide Version 41 April 1, 2015 Page 8

9 Supported Components High End 3D AMD FirePro W7000 4GB Graphics Y Y C2K00AA Notes 3, 4 1 NO NVIDIA Quadro K4000 3GB Graphics Y Y C2J94AA Notes 3, 4 1 NO NVIDIA Quadro K5000 4GB Graphics Y Y C2J95AA Notes 3, 4 1 NO NVIDIA Quadro K GB Graphics N Y WS097AA Notes 3, 4 1 NO NOTE 1: When configuring with a 3rd NVS 300, 310, or 315--the configuration requires the Z4 Fan and Front Card Guide Kit, which is available both CTO (QE150AV) and AMO (A2Z46AA). NOTE 2: If 1st graphics card is NVS 510 then 2nd graphics card must be NVS 510 or NVS 310. NOTE 3: Configuration requires the Z4 Fan and Front Card Guide Kit, which is available both CTO (QE150AV) and AMO (A2Z46AA). NOTE 4: Supported on 600W PSU chassis only. NOTE 5: Dual graphics configuration supported on 600W PSU chassis only. High Performance GPU Computing Factory Configured Option Kit Option Kit Part Number Support Notes NVIDIA Tesla K20c Compute Processor Y Y C2J97AA Notes 1, 2, 3 NVIDIA Tesla K40 Compute Processor Y Y F4A88AA Notes 1, 2, 3 NOTE 1: This device does not have an operational graphics output. Tesla K20c/K40 configurations require the addition of either NVIDIA Quadro K600 1st graphics or NVIDIA Quadro K2000 1st graphics. NOTE 2: All Tesla configurations require the Z4 Fan and Front Card Guide Kit, which is available both CTO (QE150AV) and AMO (A2Z46AA). NOTE 3: Supported on 600W PSU chassis only. Memory CTO Option Kit Part Number DDR ECC Unbuffered DIMMs - CTO Support Notes 8GB DDR ECC Unbuffered RAM Note 2 4GB DDR ECC Unbuffered RAM 2GB DDR ECC Unbuffered RAM DDR ECC Unbuffered DIMMs - CTO 8GB DDR ECC Unbuffered RAM Note 2 4GB DDR ECC Unbuffered RAM 2GB DDR ECC Unbuffered RAM AMO DDR ECC Unbuffered DIMMs - AMO HP 8GB (1x8GB) DDR ECC RAM A2Z50AA Note 2 HP 4GB (1x4GB) DDR ECC RAM A2Z48AA HP 2GB (1x2GB) DDR ECC RAM A2Z47AA DDR ECC Unbuffered DIMMs - AMO HP 8GB (1x8GB) DDR ECC RAM E2Q93AA Note 2 HP 4GB (1x4GB) DDR ECC RAM E2Q91AA HP 2GB (1x2GB) DDR ECC RAM E2Q90AA For details on the supported memory configurations on the, please refer to the c DA Worldwide Version 41 April 1, 2015 Page 9

10 Supported Components System Technical Specifications - System Board section of this document. Each processor supports up to 4 channels of DDR3 memory. To realize full performance at least 1 DIMM must be inserted into each channel. The CPUs determine the speed at which the memory is clocked. If a 1066MT/s capable CPU is used in the system, the maximum speed the memory will run at is 1066MT/s regardless of the specified speed of the memory. NOTE 1: Only unbuffered DDR3 DIMMs are supported. NOTE 2: 8GB DIMMs are only supported when configured in a Z420 system that includes both the 600W power supply option and HP Z420 Front Memory Duct. Multimedia and Audio Devices Factory Configured Option Kit Integrated Intel/Realtek HD ALC262 Audio Y N Option Kit Part Number HP Thin USB Powered Speakers Y Y KK912AA Support Notes Optical and Removable Storage Factory Configured Option Kit Option Kit Part Number Support Notes HP 16X DVD-ROM SATA Drive (non Lightscribe) Y Y AR629AA Note 1 HP 16X DVD+/-RW SuperMulti SATA Drive (non- Lightscribe) Y Y QS208AA HP Blu-ray Writer Y Y AR482AA Note 2 HP 14-in-1 Media Card Reader Y Y E5G19AA HP CMT Handle in Top Optical Bay Y Y A9A48AA Note 3 HP 15-in-1 Media Card Reader Y Y G1S79AA Actual speeds may vary. Does not permit copying of commercially available DVD movies or other copyright protected materials. Intended for creation and storage of your original material and other lawful uses. Double Layer discs can store more data than single layer discs. However, double-layer discs burned with this drive may not be compatible with many existing single-layer DVD drives and players. As Blu-ray is a new format containing new technologies, certain disc, digital connection, compatibility and/or performance issues may arise, and do not constitute defects in the product. Flawless playback on all systems is not guaranteed. In order for some Blu-ray titles to play, they may require a DVI or HDMI digital connection and your display may require HDCP support. HD-DVD movies cannot be played on this workstation. NOTE 1: Not supported as a 2nd drive option. NOTE 2: Cannot be ordered in combination with another Blu-ray Writer. NOTE 3: The Z2/Z4 Handle and Dual SFF Drive Adapter in Top ODD Bay kit, which contains two SFF internal drive bays, is installed automatically when customers order a 4th SFF hard drive. Controller Cards Factory Configured Option Kit Option Kit Part Number HP IEEE 1394b FireWire PCIe Card Y Y NK653AA Support Notes HP Thunderbolt-2 PCIe 1-port I/O Card Y Y F3F43AA Note 1 c DA Worldwide Version 41 April 1, 2015 Page 10

11 Supported Components NOTE 1: Compatible with NVIDIA Quadro K2000, K4000, and K5000 only. Networking and Communications Factory Configured Option Kit Integrated Intel 82579LM PCIe GbE Controller Y N Option Kit Part Number Support Notes Intel Gigabit CT Desktop NIC Y Y FH969AA Note 1 Intel Ethernet I210-T1 PCIe NIC Y Y E0X95AA Broadcom NetXtreme Gigabit Ethernet Plus NIC (PCIe) Y Y FS215AA Notes 1 & 2 HP 361T PCIe Dual Port Gigabit NIC N Y C3N37AA Note 1 HP Wireless NIC b/g/n PCIe Card N Y FH971AA HP X520 10GbE Dual Port Adapter Y Y C3N52AA HP 10GbE SFP+ SR Transceiver Y Y C3N53AA NOTE 1:Gigabit" Ethernet indicates compliance with IEEE standard 802.3ab for Gigabit Ethernet and does not connote actual operating speed of 1 Gb/sec. For high speed transmission, connection to a Gigabit Ethernet server and network infrastructure is required. NOTE 2: This is a PCI Express card based on the Broadcom 5761 chip. This card does not support DASH 1.1 manageability on this platform. Racking and Physical Security Factory Configured Option Kit Option Kit Part Number HP Solenoid Hood Lock & Hood Sensor Y Y DE618A HP Business PC Security Lock Kit N Y PV606AA HP xw4/z2/z4 Depth Adjustable Fixed Rail Rack Kit N Y WH340AA Support Notes Input Devices Other Hardware Factory Configured Option Kit Option Kit Part Number HP PS/2 Keyboard Y Y QY774AA HP PS/2 Mouse Y Y QY775AA HP USB Keyboard Y Y QY776AA HP USB Smart Card Keyboard Y Y E6D77AA HP USB Optical Mouse Y Y QY777AA HP USB 1000dpi Laser Mouse Y Y QY778AA HP USB Optical 3-Button 2.9M OEM Mouse N Y ET424AA HP Wireless Keyboard and Mouse N Y QY449AA HP SpaceMouse Pro USB 3D Input Device N Y B4A20AA HP SpacePilot Pro 3D USB Intelligent Controller N Y WH343AA Product numbers QY774AA-QY778AA represent the new 2012 products with the updated product design. The previous models will be phased out over time Factory Configured Option Kit Option Kit Part Number Support Notes Support Notes HP Z420 Front Memory Duct Y Y C4J29AA Note 1 HP Z4 Fan and Front Card Guide Kit Y Y A2Z46AA c DA Worldwide Version 41 April 1, 2015 Page 11

12 Supported Components HP Serial Port Adapter Y Y PA716A HP Internal USB Port Kit N Y EM165AA Note 2 HP esata PCI Cable Kit Y Y GM110AA Note 3 HP Optical Bay HDD Mounting Bracket N Y NQ099AA HP Power Cord Kit N Y DM293A Configure minitower in desktop orientation Y N HP Workstation Mouse Pad Y N Japan only HP Energy Star Enabled Configuration Y N Note 1: The HP Z420 Front Memory Duct is available to add to any configuration for improved system cooling, but is required for memory configurations using 8GB DIMMs and for configurations including the HP Liquid Cooling Solution thermal kit. Note 2: The HP Internal USB Port kit has a single USB 2.0 type A connector. Note 3: No hot plug / hot swap supported Software Operating Systems Factory Configured Option Kit Option Kit Part Number Support Notes HP Performance Advisor Y Y Note 1 HP Remote Graphics Software (RGS) 6.0 Y N Note 2 HP ProtectTools Security Y N Note 3 MS Office Home & Business 2013 Y N Note 4 HP Power Assistant Y N PDF Complete - Corporate Edition Y N Cyberlink Media Suite & PowerDVD Y N Media playback/ authoring software NOTE 1: Available as a free download here: NOTE 2: Supports both 32 and 64 bit versions of Windows 7 Professional and Enterprise, Windows XP Professional and Enterprise, and RHEL V6 NOTE 3: Must select as a Configure to Order option. Delivered as a "Drop in the Box" CD NOTE 4: Must select as a Configure to Order option Windows 8.1 Pro 64-bit Windows 8.1 Simplified Chinese Edition 64-bit Windows 8.1 Pro Downgrade to Windows 7 Professional 64-bit Windows 8.1 Pro Downgrade to Windows 7 Professional 32-bit Windows 8.1 Pro Downgrade to Windows 7 Professional 64-bit (National Academic) Windows 8.1 Pro Downgrade to Windows 7 Professional 32-bit (National Academic) Windows 8 Pro 64-bit Windows 8 Simplified Chinese Edition 64-bit Windows 8 Pro Downgrade to Windows 7 Professional 32-bit Windows 8 Pro Downgrade to Windows 7 Professional 64-bit Support Notes Genuine Windows 7 Ultimate 64-bit Note 1 c DA Worldwide Version 41 April 1, 2015 Page 12

13 Supported Components Genuine Windows 7 Professional 32-bit Note 1 Genuine Windows 7 Professional 64-bit Note 1 SUSE Linux Enterprise Desktop 11 HP Linux Installer Kit Red Hat Enterprise Linux (RHEL) Workstation - Paper License (1yr) Note 2 NOTE 1: See for support details. NOTE 2: This second OS must be ordered with the HP Linux Installer Kit as the first OS. c DA Worldwide Version 41 April 1, 2015 Page 13

14 System Technical Specifications System Board System Board Form Factor Processor Socket CPU Bus Speed Chipset Super I/O Controller ATX x mm (9.6 x 12 inches) Single LGA2011 QPI: Up to 8.0GT/sec Intel C602 Chipset Nuvoton NPCD379H (SIO-12) Memory Expansion Slots 8 DDR3 memory slots Memory Type Supported DDR3, UDIMM (Unbuffered), ECC Memory Modes Memory Speed Supported Memory Protection Memory Memory Configuration Table Channel Interleaved 1066MT/s, 1333MT/s, 1600MT/s, and 1866MT/s ECC available on data, parity on address and command Please refer to the table below for details on how supported memory configurations are installed in your system. Front Slots Rear Slots Capacity (GB) Type DIMM 1 DIMM 2 DIMM 3 DIMM 4 DIMM 5 DIMM 6 DIMM 7 DIMM 8 2 UDIMM 2GB 4 UDIMM 2GB 2GB 6 UDIMM 2GB 2GB 2GB 8 UDIMM 2GB 2GB 2GB 2GB 16 UDIMM 2GB 2GB 2GB 2GB 2GB 2GB 2GB 2GB 4 UDIMM 4GB 8 UDIMM 4GB 4GB 12 UDIMM 4GB 4GB 4GB 16 UDIMM 4GB 4GB 4GB 4GB 32 UDIMM 4GB 4GB 4GB 4GB 4GB 4GB 4GB 4GB 8 UDIMM 8GB 16 UDIMM 8GB 8GB 24 UDIMM 8GB 8GB 8GB 32 UDIMM 8GB 8GB 8GB 8GB 64 UDIMM 8GB 8GB 8GB 8GB 8GB 8GB 8GB 8GB Slot Load Order For a detailed diagram, please refer to the label located on the inside of the system side panel. Maximum Memory Memory Configuration (Supported) Note on Maximum Supports up to 64GB (600W PSU) and 32GB (400W PSU) Only ECC DIMMs are supported. *Maximum memory capacities assume 64-bit operating systems such as Genuine Windows 7 Ultimate c DA Worldwide Version 41 April 1, 2015 Page 14

15 System Technical Specifications Memory PCI Express Connectors PCI Connectors (5.0V) Supported Drive Interfaces Integrated Graphics Network Controller 64-bit or Genuine Windows 7 Professional 64-bit. Genuine Windows 7 Professional 32-bit supports up to 4GB. Linux 32-bit supports up to 8GB. 2 x16 PCIe Gen3 1 x8 PCIe Gen3 1 x8 PCIe (x4) Gen2 1 x4 PCIe (x1) Gen2 1 PCI SATA Integrated 6-channel SATA interface (2@6Gb/s, 4@3Gb/s). Supports RAID 0, 1, 5, 10 and NCQ. Factory integrated RAID is Microsoft Windows only. Integrated RAID NOTE: Requires identical hard drives (speeds, capacity, interface) No Integrated Intel Gbit LAN Supports the following management functionalities: Intel AMT7.0, TXT, DASH 1.1, WOL, and PXE 2.1 External SATA (esata) 6 ports are esata configurable with optional esata After-Market Option cable kit (No hot plug / hot swap supported). IDE connector No Floppy connector No Serial 1 internal header 2nd Serial No Parallel No AUX IN (audio) No IEEE 1394 Connector(s) Front 1 IEEE 1394a standard Rear Internal USB Connector(s) Front 2 USB USB 2.0 Rear 2 USB USB 2.0 HD Integrated Audio Flash ROM CPU Fan Header Chasiss Fan Header Front PCI Fan Header Front Control Panel/Speaker Header CMOS Battery Holder - Lithium Integrated Trusted Platform Module Power Supply Headers Power Switch, Power LED & Hard Drive LED Header Internal Realtek ALC262 Yes Yes 1 IEEE 1394a standard; 2 IEEE 1394b (requires optional PCIe card) No 1 Rear System Chassis Fan Header Yes Yes Yes Integrated TPM 1.2 Yes Yes 6 USB 2.0 ports available by three separate 2x5 headers: each header supports either one HP Internal USB Port Kit or one USB Media Card Reader. Each Internal Port Kit has one USB 2.0 connector. c DA Worldwide Version 41 April 1, 2015 Page 15

16 System Technical Specifications Clear Password Jumper Serial Port Parallel Port Keyboard/Mouse Power Supply Yes 1 internal header No USB or PS/2 Power Supply 600W 90% Efficient, Custom PSU (Wide-Ranging, Active PFC) 400W 90% Efficient, Custom PSU (Wide-Ranging, Active PFC) Operating Voltage Range VAC VAC Rated Voltage Range VAC 118 VAC VAC Rated Line Frequency Hz 400 Hz Hz Operating Line Frequency Range Hz Hz Hz Rated Input Current A A 5.5A Heat Dissipation Typical: 1365btu/hr (344 kg-cal/hr) Maximum: 2354btu/hr (593 kg-cal/hr) Typical = 910 btu/hr (229 kg-cal/hr) Max = 1569 btu/hr (395 kg-cal/hr) Power Supply Fan 92x25 mm variable speed 92x25 mm variable speed ENERGY STAR Qualified (Configuration dependent) 80 PLUS Compliant Yes, 90% Efficient FEMP Standby Power (Wake-on LAN disabled) (<2W in S5 - Power Off) EuP 230V (<1 W in S5 - Power Off) CECP 220V (<4W in S3 - Suspend to RAM) Power Consumption in sleep mode (as defined by ENERGY STAR) - Suspend to RAM (S3) (Instantly Available PC) measured at 115V. Yes The Z W power supply efficiency report can be found at this link: psu_reports/ HEWLETT PACKARD_ _ ECOS _600W_Report.pdf Yes Yes Yes; Configuration dependent Yes Yes, 90% Efficient The Z W power supply efficiency report can be found at this link: psu_reports/ HEWLETT-PACKARD_ _ECOS%202277%201_400W _Report.pdf Yes Yes Yes; Configuration dependent <10W <10W Built-in Self Test LED Yes Yes Surge Tolerant Full Ranging Power Supply (withstands power surges up to 2000V) Yes Yes Hood Lock Header Hood Sensor Header Memory Fan Yes Yes 1 Memory Fan Header c DA Worldwide Version 41 April 1, 2015 Page 16

17 System Technical Specifications System Configurations Example Configuration Processor Info #1 Memory Info (ENERGY STAR QUALIFIED) Graphics Info Disks/Optical/Floppy PSU Other 1x Intel Xeon E (Quad-Core) 1x 2GB DDR (UDIMM) 1x NVIDIA NVS 300 1x 250GB SATA 7200/1x 16X DVD-ROM SATA 600W 90% Custom PSU - Energy Consumption 115 VAC 230 VAC 100 VAC LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled Windows Idle (S0) 50.0 W 48.9 W 49.5 W Windows Busy Typ (S0) 118 W 115 W 118 W Windows Busy Max (S0) 130 W 127 W 129 W Sleep (S3) 3.56 W 3.42 W W 3.66 W 3.53 W 3.41 W Off (S5) 1.34 W 1.20 W 1.58 W 1.45 W 1.31 W 1.18 W Zero Power Mode (ErP) 0.20 W 0.43 W 0.17 W Heat Dissipation** 115 VAC 230 VAC 100 VAC LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled Windows Idle (S0) 171 btu/hr 167 btu/hr 169 btu/hr Windows Busy Typ (S0) 403 btu/hr 392 btu/hr 403 btu/hr Windows Busy Max (S0) 444 btu/hr 433 btu/hr 440 btu/hr Sleep (S3) 12.2 btu/hr 11.7 btu/hr 12.9 btu/hr 12.5 btu/hr 12.0 btu/hr 11.6 btu/hr Off (S5) 4.57 btu/hr 4.09 btu/hr 5.39 btu/hr 4.95 btu/hr 4.47 btu/hr 4.03 btu/hr Zero Power Mode (ErP) 0.68 btu/hr 1.47 btu/hr 0.58 btu/hr Example Configuration Processor Info #2 Memory Info (ENERGY STAR QUALIFIED) Graphics Info Disks/Optical/Floppy Power Supply Other 1x Intel Xeon E (Six-Core) 2x 4GB DDR (UDIMM) 1x NVIDIA Quadro x 500GB SATA 7200/1x 16X DVD+-RW SuperMulti SATA 600W 90% Custom PSU - Energy Consumption 115 VAC 230 VAC 100 VAC LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled Windows Idle (S0) 73.9 W 72.9 W 73.8 W Windows Busy Typ (S0) 272 W 270 W 277 W Windows Busy Max (S0) 298 W 294 W 300 W Sleep (S3) 4.31 W 4.18 W 4.53 W 4.41 W 4.27 W 4.17 W Off (S5) 1.35 W 1.20 W 1.59 W 1.44 W 1.32 W 1.17 W Zero Power Mode (ErP) 0.21 W 0.43 W 0.17 W Heat Dissipation** 115 VAC 230 VAC 100 VAC LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled Windows Idle (S0) 252 btu/hr 249 btu/hr 252 btu/hr Windows Busy Typ (S0) 928 btu/hr 921 btu/hr 945 btu/hr Windows Busy Max (S0) 1017 btu/hr 1003 btu/hr 1024 btu/hr Sleep (S3) 14.7 btu/hr 14.3 btu/hr 15.5 btu/hr 15.1 btu/hr 14.6 btu/hr 14.2 btu/hr Off (S5) 4.61 btu/hr 4.09 btu/hr 5.43 btu/hr 4.91 btu/hr 4.50 btu/hr 3.99 btu/hr Zero Power Mode (ErP) 0.72 btu/hr 1.47 btu/hr 0.58 btu/hr Example Configuration #3 Processor Info Memory Info Graphics Info 1x Intel Xeon E (Eight-Core) 8x 4GB DDR (UDIMM) 1x NVIDIA Quadro 5000 c DA Worldwide Version 41 April 1, 2015 Page 17

18 System Technical Specifications Disks/Optical/Floppy Power Supply Other 4x 600GB SAS 15K/1x 16X DVD+-RW SuperMulti SATA 600W 90% Custom PSU LSI 9212 SAS Card Energy Consumption 115 VAC 230 VAC 100 VAC LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled Windows Idle (S0) 152 W 151 W 154 W Windows Busy Typ (S0) 347 W 346 W 354 W Windows Busy Max (S0) 421 W 430 W 432 W Sleep (S3) 6.77 W 6.68 W 6.96 W 6.82 W 6.79 W 6.63 W Off (S5) 1.33 W 1.20 W 1.55 W 1.42 W 1.30 W 1.18 W Zero Power Mode (ErP) 0.19 W 0.41 W 0.16 W Heat Dissipation** 115 VAC 230 VAC 100 VAC LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled Windows Idle (S0) 519 btu/hr 515 btu/hr 525 btu/hr Windows Busy Typ (S0) 1184 btu/hr 1181 btu/hr 1208 btu/hr Windows Busy Max (S0) 1437 btu/hr 1467 btu/hr 1474 btu/hr Sleep (S3) 23.1 btu/hr 23.8 btu/hr 23.8 btu/hr 23.3 btu/hr 23.2 btu/hr 22.6 btu/hr Off (S5) 4.54 btu/hr 4.09 btu/hr 5.29 btu/hr 4.85 btu/hr 4.44 btu/hr 4.03 btu/hr Zero Power Mode (ErP) 0.65 btu/hr 1.40 btu/hr 0.55 btu/hr Z W Configuration #1 Processor Info Memory Info Graphics Info Disks/Optical/Floppy Power Supply Other 1x Intel Xeon E GHz 4C CPU HP 4GB (1x4GB) DDR ECC RAM 1x NVIDIA NVS 315 Graphics 1x Seagate 600 Pro 240GB SATA SSD / 1xDVD-ROM SATA 400W 90% Custom PSU - Energy Consumption 115 VAC 230 VAC 100 VAC LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled Windows Idle (S0) 47 W 47 W 47 W Windows Busy Typ (S0) 105 W 104 W 106 W Windows Busy Max (S0) 112 W 112 W 110 W Sleep (S3) 4.03 W 3.88 W 4.23 W 4.08 W 4.04 W 3.88 W Off (S5) 1.26 W 1.14 W 1.44 W 1.32 W 1.25 W 1.13 W Zero Power Mode (ErP) 0.17 W 0.35 W 0.16 W Heat Dissipation** 115 VAC 230 VAC 100 VAC LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled Windows Idle (S0) 160 Btu/hr 160 Btu/hr 160 Btu/hr Windows Busy Typ (S0) 358 Btu/hr 355 Btu/hr 362 Btu/hr Windows Busy Max (S0) 382 Btu/hr 382 Btu/hr 375 Btu/hr Sleep (S3) 13.8 Btu/hr 13.2 Btu/hr 14.4 Btu/hr 13.9 Btu/hr 13.8 Btu/hr 13.2 Btu/hr Off (S5) 4.30 Btu/hr 3.89 Btu/hr 4.91 Btu/hr 4.50 Btu/hr 4.27 Btu/hr 3.86 Btu/hr Zero Power Mode (ErP) 0.58 btu/hr 1.19 btu/hr 0.55 btu/hr Z W Configuration Processor Info 1x Intel Xeon E5-1680v2 3.7GHz 4C CPU #2 Memory Info Graphics Info Disks/Optical/Floppy Power Supply Other HP 32GB (8x4GB) DDR ECC RAM 1x AMD FirePro V3900 Graphics 3x 500GB SATA 7200 HDD / 1xDVD+-RW SATA 400W 90% Custom PSU - Energy Consumption 115 VAC 230 VAC 100 VAC c DA Worldwide Version 41 April 1, 2015 Page 18

19 System Technical Specifications LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled Windows Idle (S0) 66 W 66 W 66 W Windows Busy Typ (S0) 187 W 185 W 188 W Windows Busy Max (S0) 229 W 224 W 231 W Sleep (S3) 6.26 W 6.10 W 6.46 W 6.33 W 6.24 W 6.09 W Off (S5) 1.28 W 1.16 W 1.47 W 1.33 W 1.26 W 1.14 W Zero Power Mode (ErP) 0.17 W 0.34 W 0.16 W Heat Dissipation** 115 VAC 230 VAC 100 VAC LAN Enabled LAN Disabled LAN Enabled LAN Disabled LAN Enabled LAN Disabled Windows Idle (S0) 225 Btu/hr 225 Btu/hr 225 Btu/hr Windows Busy Typ (S0) 638 Btu/hr 631 Btu/hr 641 Btu/hr Windows Busy Max (S0) 781 Btu/hr 764 Btu/hr 788 Btu/hr Sleep (S3) 21.4 Btu/hr 20.8 Btu/hr 22.0 Btu/hr 21.6 Btu/hr 21.3 Btu/hr 20.8 Btu/hr Off (S5) 4.37 Btu/hr 3.96 Btu/hr 5.02 Btu/hr 4.54 Btu/hr 4.30 Btu/hr 3.89 Btu/hr Zero Power Mode (ErP) 0.58 btu/hr 1.16 btu/hr 0.55 btu/hr Declared Noise Emissions (Entry-level and High-end configurations) System Configuration (Entry level) Processor Info Memory Info Graphics Info Disks/Optical/Floppy Intel Xeon E GHz 4 - DDR3 2 GB 1600 MT/s UDIMM NVIDIA Q400 Single 500 GB 7200 RPM SATA DVD-RW Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296) Sound Power (LWAd, bels) Deskside Sound Pressure (LpAm, decibels Idle SATA Hard drive Operating (random reads) DVD-ROM Operating (sequential reads) System Configuration (High-end) Processor Info Memory Info Graphics Info Intel Xeon E GHz 8-4 GB DDR MT/s UDIMM NVIDIA Q4000 Disks/Optical/Floppy GB 15K RPM SAS 3.5" DVD-RW Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296) Sound Power (LWAd, bels) Deskside Sound Pressure (LpAm, decibels Idle SATA Hard drive Operating (random reads) DVD-ROM Operating (sequential reads) c DA Worldwide Version 41 April 1, 2015 Page 19

20 System Technical Specifications Environmental Requirements Temperature Operating: 5 to 35 C (40 to 95 F) Non-operating: -40 to 60 C (-40 to 140 F) Humidity Maximum Altitude Dynamic (new) Operating: 8% to 85% RH, non-condensing Non-operating: 8% to 90% RH, non-condensing Operating: 3,000 m (10,000 feet) Non-operating: 9,100 m (30,000 feet) Shock Operating: ½-sine: 40g, 2-3ms (~62 cm/sec) Non-operating: ½-sine: 160 cm/s, 2-3ms (~105g) square: 422 cm/s, 20g NOTE: Values represent individual shock events and do not indicate repetitive shock events. Cooling Vibration Operating random: 0.5g (rms), Hz, up to g²/Hz Non-operating random: 2.0g (rms), Hz, up to g²/hz NOTE: Values do not indicate continuous vibration. Above 1524 m (5,000 ft) altitude, maximum operating temperature is derated by 1 C (1.8 F) per 305 m (1,000 ft) elevation increase Physical Security and Serviceability Access Panel Optical Drive Hard Drives Expansion Cards Processor Socket Green User Touch Points Color-coordinated Cables and Connectors Tool-less Includes system board and memory information. Tool-less Tool-less Tool-less Tool-less Yes, on primary serviceable components. Yes Memory Tool-less System Board Screw-In Dual Color Power and HD Yes LED on Front of Computer Configuration Record SW Yes Over-Temp Warning on Yes, at POST screen on reboot Screen Restore CD/DVD Set Dual Function Front Power Switch Padlock Support Cable Lock Support Universal Chassis Clamp Lock Support Solenoid Lock and Hood Restores the computer to its original factory shipping image; can be obtained via HP Support. Yes, causes a fail-safe power off when held for 4 seconds Yes (optional): Locks side cover and secures chassis from theft 5.56 mm ( in) diameter padlock loop at rear of system Yes, Kensington Cable Lock (optional): Locks side cover and secures chassis from theft 3 mm x 7 mm slot at rear of system Yes (optional): Locks side cover and locks cables to chassis. Secures chassis from theft and allows multiple units to be chained together when used with optional cable Threaded feature at rear of system Yes (optional) c DA Worldwide Version 41 April 1, 2015 Page 20

21 System Technical Specifications Sensor Rear Port Control Cover Serial, Parallel, USB, Audio, Network, Enable/Disable Port Control Removable Media Write/Boot Control Power-On Password Setup Password 3.3V Aux Power LED on System PCA NIC LEDs (integrated) (Green & Amber) CPUs and Heatsinks Power Supply Diagnostic LED Front Power Button Rear Power Button Front Power LED Front Hard Drive Activity LED Front ODD Activity LED Internal Speaker System/Emergency ROM Flash Recovery Cooling Solutions Power Supply Fans CPU Heatsink Fan Chassis Fan Memory Heatsink Fan HP Advanced System Diagnostics Offline Edition The Solenoid Hood Lock eliminates the need for a physical key by making the chassis lockable through software and a password. You can also lock and unlock the chassis remotely over the network. The Sensor Kit detects when the access panel has been removed Yes (optional);locks rear IO cables to prevent cable theft Yes, enables or disables serial, USB, audio, and network ports Yes, prevents ability to boot from removable media on supported devices (and can disable writes to media) Yes, prevents an unauthorized person from booting up the workstation Yes, prevents an unauthorized person from changing the workstation configuration Yes Yes A T-15 Torx or flat blade screwdriver is needed to remove the CPU heatsink before the CPU can be removed. CPU removal is tool-less Yes Yes, ACPI multi-function Yes Yes, blue (normal), red (fault) Yes, green Yes Yes Recovers corrupted system BIOS. Air cooled forced convection, liquid cooling (optional) 92 mm x 92 mm x 25 mm 4-wire (non-serviceable) 92 x 25 mm 5-wire PWM 92 mm x 92mm x 25 mm 4-wire PWM Yes, rear memory HP Vision Diagnostics Offline Edition The diagnostics utility enables you to perform testing and to view critical computer hardware and software configuration information from various sources. This utility enables you to: Run diagnostics View the hardware configuration of the system Key features and benefits HP Vision Diagnostics simplifies the process of effectively identifying, diagnosing, and isolating the hardware issues. In addition to robust management tools, service tools can be invaluable in quickly resolving system problems. To streamline the service process and resolve problems quickly, it is necessary to have the right information available at the time that a service call is placed. The primary information requirement, which is also the one that provides the greatest Vision into potential system issues, is the configuration of the system. Vision Diagnostics helps provide higher system availability. c DA Worldwide Version 41 April 1, 2015 Page 21

22 System Technical Specifications Typical uses of the Vision Diagnostics are: Testing and diagnosing apparent hardware failures Documenting system configurations for upgrade planning, standardization, inventory tracking, disaster recovery, and maintenance Sending configuration information to another location for more in-depth analysis Access Panel Key Lock ACPI-Ready Hardware No Advanced Configuration and Power Management Interface (ACPI). Allows the system to wake from a low power mode. Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system Trusted Platform Module Chip with optional ProtectTools Software Integrated Chassis Handles Power Supply PCI Card Retention Flash ROM Diagnostic Power Switch LED on board Clear Password Jumper Clear CMOS Button CMOS Battery Holder DIMM Connectors HP ProtectTools Security Manager Yes, Infineon SLB9635TT1.2 No Optional Handle in Top Optical Bay kit Requires T15 Torx or flat blade screwdriver Yes, rear (all), middle (optional), front (full-length cards with extender, used in with the front card guide and fan holder) Yes Yes Yes Yes Yes Yes Yes - Not supported on Linux BIOS BIOS 32-bit Services Standard BIOS 32-bit Service Directory Proposal v0.4 PCI 3.0 Support Full BIOS support for PCI Express through industry standard interfaces. ATAPI ATAPI Removable Media Device BIOS Specification Version 1.0. BBS WMI Support BIOS Boot Spec BIOS Power On ROM Based Computer Setup Utility (F10) System/Emergency ROM BIOS Boot Specification v1.01. WMI is Microsoft's implementation of Web-Based Enterprise Management (WBEM) for Windows. WMI is fully compliant with the Distributed Management Task Force (DMTF) Common Information Model (CIM) and WBEM specifications Provides more control over how and from what devices the workstation will boot. Users can define a specific date and time for the system to power on. Review and customize system configuration settings controlled by the BIOS. Recovers system BIOS in corrupted Flash ROM c DA Worldwide Version 41 April 1, 2015 Page 22

23 System Technical Specifications Flash Recovery with Video Replicated Setup SMBIOS Boot Control Memory Change Alert Thermal Alert Saves BIOS settings to diskette or USB flash device in human readable file. Repset.exe utility can then replicate these settings on machines being deployed without entering Computer Configuration Utility (F10 Setup). System Management BIOS 2.7, for system management information. Disables the ability to boot from removable media on supported devices. Alerts management console if memory is removed or changed. Monitors the temperature state within the chassis. Three modes: NORMAL - normal temperature ranges. ALERTED - excessive temperatures are detected. Raises a flag so action can be taken to avoid shutdown or provide for a smoother system shutdown. SHUTDOWN - excessive temperatures are encountered. Automatically shuts down the computer without warning before hardware component damage occurs. Remote ROM Flash ACPI (Advanced Configuration and Power Management Interface) Ownership Tag Remote Wakeup/ Remote Shutdown Instantly Available PC (Suspend to RAM - ACPI sleep state S3) Remote System Installation via F12 (PXE 2.1) (Remote Boot from Server) ROM revision levels System board revision level Start-up Diagnostics (Power-on Self-Test) Auto Setup when new hardware installed Provides secure, fail-safe ROM image management from a central network console. Allows the system to enter and resume from low power modes (sleep states). Enables an operating system to control system power consumption based on the dynamic workload. Makes it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system. Supports ACPI 2.0 for full compatibility with 64-bit operating systems. A user-defined string stored in non-volatile memory that is displayed in the BIOS splash screen. System administrators can power on, restart, and power off a client computer from a remote location. Allows for very low power consumption with quick resume time. Allows a new or existing system to boot over the network and download software, including the operating system. Reports the system BIOS revision level in Computer Configuration Utility (F10 Setup). Version is available through an industry standard interface (SMBIOS) so that management SW applications can use and report this information. Allows management SW to read revision level of the system board. Revision level is digitally encoded into the HW and cannot be modified. Assesses system health at boot time with selectable levels of testing System automatically detects addition of new hardware. Keyboard-less Operation The system can be booted without a keyboard. Localized ROM Setup Asset Tag Per-slot Control Adaptive Cooling Pre-boot Diagnostics Common BIOS image supports System Configuration Utility (F10 Setup) menus in 12 languages with local keyboard mappings. The user or MIS to set a unique tag string in non-volatile memory. Allows I/O slot parameters (option ROM enable/disable, bus latency) to be configured individually. Control parameters are set according to detected hardware configuration for optimal acoustics. (Pre-video) critical errors are reported via beeps and blinks on the power LED c DA Worldwide Version 41 April 1, 2015 Page 23

24 System Technical Specifications Industry Standard Specification Support UEFI Specification Revision Industry Standard Revision Supported by the BIOS ACPI Advanced Configuration and Power Management Interface, Version 2.0c ATA (IDE) AT Attachment 6 with Packet Interface (ATA/ATAPI-6), Revision 3b CD Boot "El Torito" Bootable CD-ROM Format Specification Version 1.0 EDD Enhanced Disk Drive Specification Version 1.1 BIOS Enhanced Disk Drive Specification Version 3.0 EHCI Enhanced Host Controller Interface for Universal Serial Bus, Revision 1.0 PCI PCI Local Bus Specification, Revision 2.3 PCI Power Management Specification, Revision 1.1 PCI Firmware Specification, Revision 3.0, Draft.7 PCI Express PCI Express Base Specification, Revision 2.0 PCI Express Base Specification, Revision 3.0 PMM POST Memory Manager Specification, Version 1.01 SATA Serial ATA Specification, Revision 1.0a Serial ATA 3 Gb/s: Serial ATA Specification, Revision 2.5 Serial ATA 6 Gb/s: Serial ATA Specification, Revision 3.0 SPD PC SDRAM Serial Presence Detect (SPD) Specification, Revision 1.2B TPM Trusted Computing Group TPM Specification Version 1.2 UHCI Universal Host Controller Interface Design Guide, Revision 1.1 USB Universal Serial Bus Revision 1.1 Specification Universal Serial Bus Revision 2.0 Specification Universal Serial Bus Revision 3.0 Specification SMBIOS System Management BIOS Reference Specification, Version 2.7 Social and Environmental Responsibility Eco-Label Certifications & Declarations This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks: ENERGY STAR (energy-saving features available on selected configurations-windows only) US Federal Energy Management Program (FEMP) China Energy Conservation Program IT ECO declaration Batteries The battery in this product complies with EU Directive 2006/66/EC Battery size: CR2032 (coin cell) Battery type: Lithium Metal The battery in this product does not contain: Mercury greater than 5ppm by weight Cadmium greater than 10ppm by weight c DA Worldwide Version 41 April 1, 2015 Page 24

25 System Technical Specifications Lead greater than 40ppm by weight Restricted Material Usage This product meets the material restrictions specified in HP's General Specification for the Environment. Hewlett-Packard is committed to compliance with all applicable environmental laws and regulations, including the European Union Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to exceed compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis. Low Halogen Statement This product is low halogen except for power cords, cables and peripherals, as well as the following customer-configurable internal components: 3 ½" SAS HDDs, Liquid Cooling Solution, and Broadcom 5761 Gigabit PCIe NIC are not Low Halogen. Service parts obtained after purchase may not be Low Halogen. End-of-Life Management and Recycling Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner. This product is greater than 90% recyclable by weight when properly disposed of at end of life. Hewlett-Packard For more information about HP's commitment to the environment: Corporate Environmental Global Citizenship Report Information Additional Information This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE) Directive /96/EC. Plastic parts weighing over 25 grams used in the product are marked per ISO and ISO1043. This product is >90% recycle-able when properly disposed of at end of life. Packaging EPEAT Gold registered in the U.S. EPEAT registration varies by country. See for registration status by country HP Workstation product packaging meets the HP General Specification for the Environment at Does not contain restricted substances listed in HP Standard General Specification for the Environment Does not contain ozone-depleting substances (ODS) Does not contain heavy metals (lead, mercury, cadmium or hexavalent chromium) in excess of 100 ppm sum total for all heavy metals listed Maximizes the use of post-consumer recycled content materials in packaging materials All packaging material is recyclable All packaging material is designed for ease of disassembly Reduced size and weight of packages to improve transportation fuel efficiency Plastic packaging materials are marked according to ISO and DIN 6120 standards formatting Packaging Materials Internal External Cushions and plastic bags made of low density polyethylene (LDPE). Outer carton, accessories carton, and insert made of corrugated paper board. Manageability Industry Standard Specifications This product meets the following industry standard specifications for manageability functionality: c DA Worldwide Version 41 April 1, 2015 Page 25