FYS4260/FYS9260: Microsystems and Electronics Packaging and Interconnect. Components
|
|
- Laura King
- 7 years ago
- Views:
Transcription
1 FYS4260/FYS9260: Microsystems and Electronics Packaging and Interconnect Components
2 Topics Introduce descriptions of geometrical, thermal and some electrical properties of main types of components. No description of electrical properties of integrated circuits.
3 Types of general purpose fixed resistors Examples of general purpose fixed resistors Type Carbon Metal film Wirewound Surface mount Tolerance 2-10% (5%) 0.1-5% (1%) 0.1-5% (1%) 0.1-5% (1%) Power rating W (¼W) 0.1-5W (¼W) 1-200W (10W) W (0.1W) Temp. coefficient ppm/k (450) ppm/k (50) ppm/k (50) ppm/k (100) Table 2: Examples of general purpose fixed resistors with typical ranges for tolerance, power rating and temperature coefficient of resitance. Typical value in bold. FYS4260/FYS9260 Frode Strisland 3
4 Hole Mounted Resistors Mature design, fig. 4.1: Carbon composite (a) Metal film (b) Wire wound (c)
5 Surface Mounted Resistors Fig.4.2.a: Thick film layers on ceramic substrate, rectangular shape Slide 5
6 Surface Mounted Resistors Fig. 4.2 b): Metal system for termination on SMD resistors. Slide 6
7 Surface Mounted Resistors Table 4.1. Properties of SMD resistors (Philips). Resistance range and tolerance ohm to 1 Mohm (E24* series) ± 2% Table 4.1: Properties of10 SMD 1 ohm to 10resistors Mohm (E24 series) ± 5% 1 ohm to 10 Mohm (E12 series) ±10% Dimensions 3,2 x 1,6 x 0,6 mm Operating temperature range -55 C to C Temperature coefficient (-40 C to 125 C) <+200 x 10-6/K Absolute max. dissipation at Tamb= 70 C 0,25 W Maximum permissible voltage 200 V (r.m.s.) Climatic category (IEC68) 55/155/56 Jumper resistance = 50 mohm Maximum current 2A *See Table 4.2 Slide 7
8 Surface Mounted Resistors Table. 4.2: The resistance series E24, E12 and E6. The numbers mean that for example in series E6 there are 6 resistance values for each decade: 10, Table 15, 4.2: 22, 33, The 47 and resistance 68 x10 n ohms. series E24, 12 and 6 E E E Slide 8
9 Surface Mounted Components Coding of component sizes Still very common to define sizes in fractions of inches, e.g. For example: 0603 = 0.06inch x 0.03 inch = 60mils x 30 mils = (1.6 mm 0.8 mm) mils 30 mils A word of warning: Some locations use a similar, metric system FYS4260/FYS9260 Frode Strisland 9
10 Dimensions of Surface Mount Passives. Power rating of resistors Code Length (l) Width (w) Height (h) Power Imperial Metric inch mm inch mm inch mm Watt /20 (0.05) /16 (0.062) /10 (0.10) /8 (0.125) /4 (0.25) /2 (0.50) /4 (0.75) FYS4260/FYS9260 Frode Strisland 10
11 Hole Mounted Resistors Coding: Color Value Multiplier Tolerance (%) Black Brown 1 1 ±1 Red 2 2 ±2 Orange 3 3 ±0.05 Yellow Green 5 5 ±0.5 Blue 6 6 ±0.25 Violet 7 7 ±0.1 Gray White Gold - -1 ±5 Silver - -2 ±10 None - - ±20 Slide 11
12 Tolerances Components of different tolerances are often picked according to value from the same production. +/- 1% What you might get if you use +/- 10% components R o FYS4260/FYS9260 Frode Strisland 12
13 Capacitors In addition the capacitance, the following properties are important: Maximum voltage rating Temperature dependence of the capacitance (temperature coefficient) Loss tangent (tan δ) Equivalent series resistance Long term stability and ageing phenomena High frequency properties Leakage current Ability to withstand various production processes (high temperature, etc.) Price, physical size, etc. Web: Slide 13
14 Capacitors, continued Main types: Ceramic multilayer Electrolytic dry, polarized Electrolytic, wet, polarized Metallized plastic film Mica Slide 14
15 Capacitors, continued Electrical model: C = (ε o ε r A) /d Z = [ R s 2 + (ωl - 1/ωC) 2 ] 1/2 C A = electrode area d= electrode distance R s = series resistance (R p neglected), L = inductance, fig. 4.5 Resonance frequency will be when: ωl = 1/ωC L R s C Rp Loss tangent: tan δ = R / Im Z = { R p + R s [1+ (ωcr p ) 2 ]} / [ ωcr p 2 - ω L (1+ (ωcr p ) 2 ] Slide 15
16 Fig. 4.3: Electrical equivalent model for capacitor. If R p can be neglected the impedance is given by: Capacitors, continued Rp L R s C Z = [R s 2 + (ωl - 1/ωC) 2 ] 1/2 Fig. 4.4: The frequency dependence of impedance for multilayer ceramic capacitors (lower curve) and tantalum electrolytic capacitors (upper curve), all having 100 nf capacitance value. Slide 16
17 Capacitors, continued Fig. 4.5: Frequency dependence of the loss tangent tan δ schematically. tan δ = R / Im Z = [R p + R s ( 1+ ( ωcr p ) 2 ) ] / ( ωcr p 2 - ω L (1+ ( ωcr p ) 2 ) ] Slide 17
18 Multilayer Ceramic Capacitors Capacitors, continued Fig. 4.7.a: SMD Multilayer Ceramic Capacitor Fig. 4.7.b: Metal system for the end termination of multilayer ceramic capacitors. Slide 18
19 Multilayer Ceramic Capacitor Buildup Detailed construction of a multilayer ceramic chip capacitor (MLCC). 1. Ceramic dielectric, 2. Ceramic or lacquered coating, 3. Metallized electrode, 4. Connecting terminals "MLCC-Structure-Details" by Elcap, Jens Both, SVG-Version: Hk kng - based on de:bild:mlcc- Aufbau-detailliert.png. Licensed under CC BY-SA 3.0 via Wikimedia Commons - Structure-Details.svg FYS4260/FYS9260 Frode Strisland 19
20 Multilayer Ceramic Capacitor, continued Class 1: Low capacitance, good electrical properties, types NP0, N220, N750, COG, etc. Class 2: High capacitance, poorer electrical behaviour, types X7R, Z5U Fig. 4.8: Relative dielectric constant for ferroelectric ceramic compositions (class 2), as a function of temperature, near the Curie point Slide 20
21 Multilayer Ceramic Capacitors, continued Fig. 4.9: Properties of dielectrics of the types NP0, X7R and Z5U in SMD ceramic multilayer capacitors. Top: The voltage dependence of capacitance. Middle: Loss tangent as function of temperature. Bottom: The temperature coefficient of the capacitance (Philips). Slide 21
22 Take home message: A capacitor is not always the capacitor you think it is: Check ratings and intended usage before selecting component. FYS4260/FYS9260 Frode Strisland 22
23 Multilayer Ceramic Capacitors, continued Fig. 4.10: Crack formation because of thermal stress in ceramic capacitors Slide 23
24 Electrolytic capacitors Electrolytic capacitors uses a metal oxide as dielectric Electrolytic capacitors are polarized they can only be biased one way The anode electrode (+) consist of a metal on which an insulating oxide layer acting as the dielectric. The has been fromed by anodization A non-solid or solid electrolyte which covers the surface of the oxide layer in principle serves as the second electrode (cathode) (-) of the capacitor. FYS4260/FYS9260 Frode Strisland 24
25 Tantalum dry electrolytic capacitor A tantalum electrolytic capacitor is an electrolytic capacitor, a passive component of electronic circuits. It consists of a pellet of tantalum metal as anode, covered by an insulating oxide layer that forms the dielectric, surrounded by liquid or solid electrolyte as a cathode. The tantalum capacitor distinguishes itself from other capacitors in having high capacitance per volume and weight. Tantalum capacitors have lower equivalent series resistance (ESR), lower leakage, and higher operating temperature than other electrolytic capacitors, although other types of capacitors are even better in these regards. Tantalum capacitors are more expensive than other commonly used type of capacitor, so they are used only in applications where the small size or better performance are important. "Tantalum-SMD-Chip-Molded" by Elcap - Own work. Licensed under CC0 via Wikimedia Commons - Molded.jpg#mediaviewer/File:Tantalum-SMD-Chip-Molded.jpg FYS4260/FYS9260 Frode Strisland 25
26 Capacitors, continued Electrolytic Capacitors why they are polarised: The capacitance is the oxidised surface of the anode Reversed polarity will remove the oxide by reduction reaction at the anode and loss of dielectric isolation leading to short-circuiting Fig a): Tantalum SMD electrolytic capacitor (Philips), and hole mounted tantalum capacitors (Siemens) Slide 26
27 Tantalum, Dry Electrolytic Capacitors, continued Dissipation factors vary with temperature: Maximum values which are not exceeded by any capacitor are as follows. Temperature -55 C 25 C 85 C 125 C Rated Voltage 4 to 10 V d.c. 10% 12% 12% 12% Rated Voltage 15 to 50 V d.c. 8% 6% 6% 6% The d.c. leakage current (at rated voltage) is within the limit set below 25 C < 0,01 µa/µf V or < 1 µa whichever is greater 85 C < 0,10 µa/µf V or < 10 µa whichever is greater 125 C < 0,125 µa/µf V or < 12,5 µa whichever is greater Fig b): Electrical properties of dry tantalum electrolytic capacitors. (Data from Philips) Slide 27
28 Aluminum wet electrolytic capacitor An aluminum electrolytic capacitor with a non-solid electrolyte always consists of two aluminum foils separated mechanically by a spacer, mostly paper, which is saturated with a liquid or gel-like electrolyte. One of the aluminum foils, the anode, is etched (roughened) to increase the surface and oxidized (formed). The second aluminum foil, called the "cathode foil", serves to make electrical contact with the electrolyte. A paper spacer mechanically separates the foils to avoid direct metallic contact. Both foils and the spacer are wound and the winding is impregnated with liquid electrolyte. Multiple electrolytes are used. Further reading: Wikipedia "Al-e-cap-construction" by Elcap - Own work. Licensed under CC0 via Wikimedia Commons - FYS4260/FYS9260 Frode Strisland 28
29 Diodes and Transistors Fig. 4.13: Axial, plastic encapsulated, hole mounted diodes to the left. Right: A plastic can with metal base for power diodes. It can be hole mounted or surface mounted, depending on how the leads are bent. The base is screwed to the substrate. Slide 29
30 Diodes and Transistors, continued Fig. 4.14: Various types of hole mounted transistor packages: a) Left: Plastic packages, b) Centre: Low power metal packages c) Right: Metal package for high power transistors. For the high power package, the collector is connected to the metal body. Slide 30
31 Diodes and Transistors, continued Fig. 4.16: SOT-packages for SMD diodes and transistors: The most common, SOT-23 top left, SOT-89 for power transistors in the middle, and SOT-143 with four terminals to the right. The dimensions for SOT-23 are shown bottom left, and a cut-through SOT-89 in the middle. Ceramic SMD transistor packages with terminal placement like for SOT-23 are shown bottom right. Slide 31
32 IC Packages Plastic or Ceramic IC Packages? Plastic: Not hermetic Low price in large quantities High initial cost Low thermal conductivity Limited time at high temperature Thermal mismatch to Si chip and metals Not suitable for high frequency circuits Ceramic: Hermetic, good reliability Costly, but OK for prototyping Good thermal conductivity Low thermal coefficient of expansion, matches well with Si, mismatch to organic substrates Gold metallization must be removed Well defined high frequency properties Slide 32
33 Packages for Hole Mounted ICs Fig. 4.17:a) DIP (Dual-in-line) IC package. b) Partly cross-sectioned DIP package which shows the silicon chip, bonding wires, lead frame and plastic body. c) The terminal organisation for 4 two-input NOR gates in a 14 pins package. Electronic Pack.. Chapter 4 Components for Electronic Systems Slide 33
34 Packages for Hole Mounted ICs, continued Fig. 4.18: Pin grid packages: To the left a cavity up ceramic package, and to the right a plastic moulded package. Slide 34
35 SMD IC Packages Small Outline (SO) Plastic Leaded Chip Carrier (PLCC) Leadless Chip Carrier (LLCC) Leaded Ceramic Chip Carrier (LDCC) Flatpack, mini-flatpack TapePak Chip Scale Packages Slide 35
36 Surface Mount Plastic Package types Malestrom: Printed Circuits Handbook 6ed FYS4260/FYS9260 Frode Strisland 36
37 SMD IC Packages, continued Fig. 4.19: Surface mounted SO (Small Outline) IC package. (From Philips) Slide 37
38 Outline Encapsulation Maximum width SMD IC Packages, continued SO Maximum width Maximum length Lead end to lead end [mm] [mm] [mm] SO-8 4,0 5,00 6,2 SO-8 7,6 7,6 12,4 SO-14 4,0 8,75 6,2 SO-16 4,0 10,00 6,2 SO-16L 7,6 10,5 10,65 SO-20 7,6 13,0 10,65 SO-24 7,6 15,6 10,65 SO-28 7,6 18,1 10,65 VLO-40 7,6 15,5 12,8 VSO-56 11,1 21,6 15,8 Table 4.3: Dimensions for SO- and VSO packages. Centre-to-centre lead distance is normally 50 mils, except for VSO-40 with 30 mils and VSO-56 with 0.75 mm. Slide 38
39 SMD IC Packages: Plastic Leaded Chip Carrier (PLCC) Fig. 4.20: Plastic leaded chip carrier with (PLCC). They are normally square with an equal number of terminals on all four sides (top). For large DRAMs, the package has terminals on only two sides, also being called SOJ. The bottom figure shows a 1 or 4 Mbit DRAM package. Slide 39
40 SMD IC Packages: Plastic Leaded Chip Carrier (PLCC) Leads Format Lead pitch Maximum body dimensions [AxB] [mm] Maximum Device Dimensions (LxW) [mm] Typical Height (C) [mm] [mm] 20 5x5 1,27 9,1x9,1 10,1x10,1 3,5-4,7 28 7x7 1,27 11,6x11,6 12,6x12,6 3,5-4, x11 1,27 16,8x16,8 17,8x17,8 3,5-4, x13 1,27 19,3x19,3 20,3x20,3 3,5-4, x17 1,27 24,4x24,4 25,4x25,4 3,5-4,7 18 5x4 1,27 10,9x7,5 11,9x8,5 3,5-4,7 28 9x5 1,27 14,1x9,0 15,1x10,0 3,5-4,7 32 9x7 1,27 14,1x11,6 15,1x12,6 3,5-4,7 Table 4.4: Dimensions for PLCC packages. Format means the number of terminals on two neighbouring sides. Slide 40
41 Leadless Chip Carrier (LLCC) Leaded Ceramic Chip Carrier (LDCC) Fig a): The various types of ceramic chip carriers [4.15]. Types A -D to the left are leadless (LLCC), whereas types A and B to the right are meant for mounting leads (LDCC). Slide 41
42 Image Description Image Description Image Description CBGA - Ceramic Ball Grid Array MQFP - Metric Quad Flat Package PQFP - Plastic Quad Flat Pack CCGA - Ceramic Column Grid Array CerDIP - Ceramic Dual-in-Line Package CerPack - Ceramic Package CLCC - Ceramic Leadless Chip Carrier MSOP - Micro Small Outline Package PBGA - Plastic Ball Grid Array PDIP - Plastic Dual-in-Line Package PLCC - Plastic Leaded Chip Carrier PSOP - Power Small Outline Package QFN - Quad Flat No Leads Package QSOP - Quarter Size Outline Package SBDIP - Sidebraze Dual-in-Line Package CPGA - Ceramic Pin Grid Array PPGA - Plastic Pin Grid Array SC-70 - Small Outline Transistor CQFP - Ceramic Quad Flat Pack D2PAK or DDPAK - Dou-ble Decawatt Package PQFN - Power Quad Flat No Leads Package TFBGA - Thin Fine-Pitch Ball Grid Array SIP - Single-In-Line Package SOIC - Small Outline IC Package FYS4260/FYS9260 Frode Strisland 42
43 DFN - Dual Flat No Leads Package DPAK - Decawatt Package FBGA - Fine- Pitch Ball Grid Array JLCC - J-Leaded Ceramic Chip Carrier LFBGA - Low Profile Fine-Pitch Ball Grid Array LGA - Land Grid Array LQFP - Low- Profile Quad Flat Package MLP - Micro Leadframe Package TQFP - Thin Quad Flat Pack TSOP - Thin Small Outline Package TSSOP - Thin Shrink Small Outline Package UTDFN - Ultra Thin Dual Flat No Leads Package UTQFN - Ultra Thin Quad Flat No Leads Package VFBGA - Very Thin Fine-Pitch Ball Grid Array PQFP - Plastic Quad Flat Pack PSOP - Power Small Outline Package SOT-23 - Small Outline Transistor SPDIP - Shrink Plastic Dual-in-Line Package SSOP - Shrink Small Outline Package TDFN - Thin Dual Flat No Leads Package TFBGA - Thin Fine- Pitch Ball Grid Array VSOP - Very Small Outline Package XDFN - Extreme Thin Dual Flat No Leads Package XQFN - Extreme Thin Quad Flat No Leads Package FYS4260/FYS9260 Frode Strisland 43
44 Leadless Chip Carrier (LLCC) Fig b): LLCC packages, additional details. The longest terminal is to designate electrical terminal number 1 in the circuit. Slide 44
45 Leadless Chip Carrier (LLCC), continued Leads Format Pad Pitch (p) [mm] Maximum Dimension (AxB) [mm] 20 5x5 1,27 9,1x9,1 28 7x7 1,27 11,6x11, x11 1,27 16,8x16, x13 1,27 19,3x19, x17 1,27 24,4x24, x21 1,27 29,6x29,6 18 5x4 1,27 10,9x7,5 28 9x5 1,27 14,1x9,0 32 9x7 1,27 14,1x11,6 Table 4.5. LLCCs, dimensions. Slide 45
46 Leaded Ceramic Chip Carrier (LDCC) Fig. 4.22: Leaded ceramic chip carriers. Slide 46
47 Leaded Ceramic Chip Carrier (LDCC), continued Fig. 4.23: Various shapes of the leads, and leadless termination for comparison. Slide 47
48 Flatpacks Fig. 4.24: Quad flatpack with leads on all four sides. Flatpacks are usually made of plastic or ceramic. They have leads on four or two sides. Slide 48
49 Mini-flatpacks Fig. 4.25: Mini-flatpacks is a name for higher density flatpacks: Typically terminals and a pitch of 25 mils. Slide 49
50 High Performance Packages Multilayer ceramic, Al 2 O 3 or AlN Ground planes Controlled characteristic impedance Thermal vias Slide 50
51 High Performance Packages Fig. 4.27: Thermal via-holes in the printed circuit board, for better heat conduction. Slide 51
52 High Performance Packages, continued Fig. 4.29: Multichip package for memory module in a Hitachi high-performance computer [4.18]. The module contains 6 ECL chips, mounted by flip chip. Slide 52
53 MEMS packaging differ from IC packaging: Includes an interface to the environment Contains delicate structures sensitive to mechanical stress Often combination of MEMS element and ASIC in single package Packaging often an integral part of the device operation, for example in a hearing aid or an implantable device Differential pressure sensor FYS4260/FYS9260 Frode Strisland 53
54 Electrostatic Discharges (ESD) Unprotected MOS: Max 5-80 V on input before destroyed Triboelectricity: >>1000 V discharge Billions of $ damage annually Protected circuits tolerate V Extensive precautions in industry, handling and packing Slide 54
55 Electrostatic Discharges Component Damages and Precautions Fig. 4.33: MOS transistor schematically. The gate oxide is very vulnerable for damage by electrostatic discharge. Gate oxides down below 200 Å (20 nm) are now used. Slide 55
56 Electrostatic Discharges - Component Damages and Precautions, continued Fig. 4.34: CMOS circuit exposed to electrostatic damage: Silicon has molten in a small area. Picture size 5µm x 5µm. Slide 56
57 Component Packaging Paper tape (hole mounted passives) Blister tape (SMD passives, discretes, small ICs) Sticks (DIPs, SMD ICs) Waffle trays (Flatpacks) Stack magazine Bulk: Not suited for automatic mounting Slide 57
58 Component Packaging for Automatic Placement Fig. 4.36: Blister tape for surface mounted components. Standard dimensions for 8 mm wide tape. Slide 58
59 Component Packaging for Automatic Placement Fig. 4.37: Plastic sticks as packaging for SMD integrated circuits. Slide 59
60 Component Packaging for Automatic Placement Fig. 4.38: Waffle trays packaging for flatpacks to the left, frame for stacking of single component to the right. Slide 60
INTERNATIONAL ATOMIC ENERGY AGENCY INSTRUMENTATION UNIT SMD (SURFACE MOUNTED DEVICES) REPAIR S. WIERZBINSKI FEBRUARY 1999
(SURFACE MOUNTED DEVICES) REPAIR S. WIERZBINSKI FEBRUARY 1999 (SURFACE MOUNTED DEVICES) REPAIR 1 TABLE OF CONTENTS PAGE 1. INTRODUCTION 3 2. ADVANTAGES 4 3. LIMITATIONS 4 4. DIALECT 5 5. SIZES AND DIMENSIONS
More information1.Introduction. Introduction. Most of slides come from Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda.
.Introduction If the automobile had followed the same development cycle as the computer, a Rolls- Royce would today cost $00, get one million miles to the gallon and explode once a year Most of slides
More informationPreface xiii Introduction xv 1 Planning for surface mount design General electronic products 3 Dedicated service electronic products 3 High-reliability electronic products 4 Defining the environmental
More informationSURFACE MOUNT NOMENCLATURE AND PACKAGING
SURFACE MOUNT NOMENCLATURE AND PACKAGING Tel 800-776-9888 Email info@topline.tv w w w. t o p l i n e. t v Contents Overview... 3 Flat Chip... 4 MELF Components...10 Tantalum Capacitors.... 12 Transistors
More informationPart Marking Instructions Chip Resistors
Chip Resistors Part Marking Instructions Part Marking Instructions Chip Resistors 1% Marking The nominal resistance is marked on the surface of the overcoating with the use of 4 digit markings. 0201 and
More informationhandbook, 2 columns handbook, halfpage 085 CS
FEATURES Polarized aluminium electrolytic capacitors, non-solid, self healing Extended voltage and capacitance range SMD-version, fully moulded, insulated Flexible terminals, reflow and wave solderable
More informationDISCRETE SEMICONDUCTORS DATA SHEET. BLF244 VHF power MOS transistor
DISCRETE SEMICONDUCTORS DATA SHEET September 1992 FEATURES High power gain Low noise figure Easy power control Good thermal stability Withstands full load mismatch Gold metallization ensures excellent
More information0.08 to 0.31 mils. IC Metal Interconnect. 6 mils. Bond Wire. Metal Package Lead Frame. 40 mils. PC Board. Metal Trace on PC Board 18507
3 PACKAGING Packaging the IC chip is a necessary step in the manufacturing process because the IC chips are small, fragile, susceptible to environmental damage, and too difficult to handle by the IC users.
More informationAxial and Radial Leaded Multilayer Ceramic Capacitors for Automotive Applications Class 1 and Class 2, 50 V DC, 100 V DC and 200 V DC
Axial and Radial Leaded Multilayer Ceramic Capacitors for Automotive Applications Class 1 and Class 2, 5 V DC, 1 V DC and 2 V DC DESIGNING For more than 2 years Vitramon has supported the automotive industry
More informationSuggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages
APPLICATION NOTE Suggested PCB Land Pattern Designs for Leaded and Leadless Packages, and Surface Mount Guidelines for Leadless Packages Introduction This Application Note provides sample PCB land pattern
More informationDATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS General Purpose & High Capacitance Class 2, X7R
DATA SHEET SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS General Purpose & High Capacitance Class 2, 6.3 V TO 50 V 100 pf to 22 µf RoHS compliant & Halogen Free Product Specification October 13, 11 V.8 Product
More informationCIRCUITS AND SYSTEMS- Assembly and Printed Circuit Board (PCB) Package Mohammad S. Sharawi ASSEMBLY AND PRINTED CIRCUIT BOARD (PCB) PACKAGE
ASSEMBLY AND PRINTED CIRCUIT BOARD (PCB) PACKAGE Mohammad S. Sharawi Electrical Engineering Department, King Fahd University of Petroleum and Minerals Dhahran, 31261 Saudi Arabia Keywords: Printed Circuit
More informationCHAPTER 6 THERMAL DESIGN CONSIDERATIONS. page. Introduction 6-2. Thermal resistance 6-2. Junction temperature 6-2. Factors affecting R th(j-a) 6-2
CHAPTER 6 THERMAL DESIGN CONSIDERATIONS page Introduction 6-2 Thermal resistance 6-2 Junction temperature 6-2 Factors affecting 6-2 Thermal resistance test methods 6-3 Test procedure 6-3 Forced air factors
More informationSurface Mount Multilayer Ceramic Chip Capacitors for Automotive Applications
Surface Mount Multilayer Ceramic Chip Capacitors for Automotive Applications FEATURES AEC-Q200 qualified with PPAP available Available in 0402 to 1812 body size Three dielectric materials AgPd termination
More informationSurface Mount Multilayer Ceramic Chip Capacitor Solutions for High Voltage Applications
Surface Mount Multilayer Ceramic Chip Capacitor Solutions for High Voltage Applications ELECTRICAL SPECIFICATIONS X7R GENERAL SPECIFICATION Note Electrical characteristics at +25 C unless otherwise specified
More informationElectronics and Soldering Notes
Electronics and Soldering Notes The Tools You ll Need While there are literally one hundred tools for soldering, testing, and fixing electronic circuits, you only need a few to make robot. These tools
More informationWW12X, WW08X, WW06X, WW04X ±1%, ±5% Thick Film Low ohm chip resistors
WW12X, WW08X, WW06X, WW04X ±1%, ±5% Thick Film Low ohm chip resistors Size 1206, 0805, 0603, 0402 *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_WWxxX_V12 Nov.- 2011
More informationTC50 High Precision Power Thin Film chip resistors (RoHS compliant Halogen Free) Size 1206, 0805, 0603
WF2Q, WF08Q, WF06Q ±%, ±0.5%, ±0.25%, ±0.%, ±0.05% TC50 High Precision Power Thin Film chip resistors (RoHS compliant Halogen Free) Size 206, 0805, 0603 *Contents in this sheet are subject to change without
More informationHigh-ohmic/high-voltage resistors
FEATURES High pulse loading capability Small size. APPLICATIONS Where high resistance, high stability and high reliability at high voltage are required High humidity environment White goods Power supplies.
More informationWinbond W2E512/W27E257 EEPROM
Construction Analysis Winbond W2E512/W27E257 EEPROM Report Number: SCA 9703-533 Global Semiconductor Industry the Serving Since 1964 15022 N. 75th Street Scottsdale, AZ 85260-2476 Phone: 602-998-9780 Fax:
More informationCapacitors in Circuits
apacitors in ircuits apacitors store energy in the electric field E field created by the stored charge In circuit apacitor may be absorbing energy Thus causes circuit current to be reduced Effectively
More informationAdvanced VLSI Design CMOS Processing Technology
Isolation of transistors, i.e., their source and drains, from other transistors is needed to reduce electrical interactions between them. For technologies
More informationType RP73 Series. SMD High Power Precision Resistors. Key Features. Applications. Characteristics - Electrical - RP73 Series - Standard
Key Features n High precision - tolerances down to 0.05% n Low TCR - down to 5ppm/ C n Stable high frequency performance n Operating temperature -55 C to +155 C n Increased power rating - up to 1.0W n
More informationHigh-ohmic/high-voltage resistors
FEATURES These resistors meet the safety requirements of: UL1676 (range 510 kω to 11 MΩ) EN60065 BS60065 (U.K.) NFC 92-130 (France) VDE 0860 (Germany) High pulse loading capability Small size. APPLICATIONS
More informationBall Grid Array (BGA) Technology
Chapter E: BGA Ball Grid Array (BGA) Technology The information presented in this chapter has been collected from a number of sources describing BGA activities, both nationally at IVF and reported elsewhere
More informationGaN IC Die Handling, Assembly and Testing Techniques
GaN IC Die Handling, Assembly and Testing Techniques Page 1 of 9 1. Scope This document describes the storage and handling requirements for GaN IC chips. It also describes recommended assembly and testing
More informationPulse Withstanding Thick Film Chip Resistor-SMDP Series. official distributor of
Product: Pulse Withstanding Thick Film Chip Resistor-SMDP Series Size: /// official distributor of Pulse Withstanding Thick Film Chip Resistor-SMDP Series 1. Scope -This specification applies to ~ sizes
More informationMADP-000504-10720T. Non Magnetic MELF PIN Diode
MADP-54-172T Features High Power Handling Low Loss / Low Distortion Leadless Low Inductance MELF Package Non-Magnetic Surface Mountable RoHS Compliant MSL 1 Package Style 172 Dot Denotes Cathode Description
More informationSIL Resistor Network. Resistors. Electrical. Environmental. L Series. Thick Film Low Profile SIP Conformal Coated Resistor Networks RoHS Compliant
Resistors SIL Resistor Network Thick Film Low Profile SIP Conformal Coated Resistor Networks RoHS Compliant All parts are Pb-free and comply with EU Directive 2011/65/EU (RoHS2) Electrical Standard Resistance
More informationApplication Note: PCB Design By: Wei-Lung Ho
Application Note: PCB Design By: Wei-Lung Ho Introduction: A printed circuit board (PCB) electrically connects circuit components by routing conductive traces to conductive pads designed for specific components
More information2.996/6.971 Biomedical Devices Design Laboratory Lecture 2: Fundamentals and PCB Layout
2.996/6.971 Biomedical Devices Design Laboratory Lecture 2: Fundamentals and PCB Layout Instructor: Hong Ma Sept. 12, 2007 Fundamental Elements Resistor (R) Capacitor (C) Inductor (L) Voltage Source Current
More informationDATA SHEET THICK FILM CHIP RESISTORS Introduction
DATA SHEET THICK FILM CHIP RESISTORS Introduction Product Specification Product specification 2 Chip Resistor Surface Mount Data in data sheets is presented - whenever possible -according to a 'format',
More informationAS2815. 1.5A Low Dropout Voltage Regulator Adjustable & Fixed Output, Fast Response
1.5A Low Dropout oltage Regulator Adjustable & Fixed Output, Fast Response FEATURES Adjustable Output Down To 1.2 Fixed Output oltages 1.5, 2.5, 3.3, 5.0 Output Current of 1.5A Low Dropout oltage 1.1 Typ.
More informationSELECTION GUIDE. Nominal Input
www.murata-ps.com NKE Series FEATURES RoHS Compliant Sub-Miniature SIP & DIP Styles 3kVDC Isolation UL Recognised Wide Temperature performance at full 1 Watt load, 40 C to 85 C Increased Power Density
More informationStandard Thick Film Chip Resistors
Standard Thick Film Chip Resistors FEATURES Stability R/R = 1 % for 00 h at 70 C 2 mm pitch packaging option for size Pure tin solder contacts on Ni barrier layer provides compatibility with lead (Pb)-free
More informationGuide for Molded Tantalum Capacitors
Guide for Molded Tantalum Capacitors INTRODUCTION Tantalum electrolytic capacitors are the preferred choice in applications where volumetric efficiency, stable electrical parameters, high reliability,
More informationDEMO ONLY Version. This is a promotional sample of the IPC Training and Reference Guide DRM-18H.
DEMO ONLY Version This is a promotional sample of the IPC Training and Reference Guide DRM-18H. Please do not use this SAMPLE for training or reference purposes. IPC is a not-for-profit association for
More informationInductors. AC Theory. Module 3
Module 3 AC Theory What you ll learn in Module 3. Section 3.1 Electromagnetic Induction. Magnetic Fields around Conductors. The Solenoid. Section 3.2 Inductance & Back e.m.f. The Unit of Inductance. Factors
More informationNBB-402. RoHS Compliant & Pb-Free Product. Typical Applications
Typical Applications Narrow and Broadband Commercial and Military Radio Designs Linear and Saturated Amplifiers 0 RoHS Compliant & Pb-Free Product NBB-402 CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO
More informationKit 106. 50 Watt Audio Amplifier
Kit 106 50 Watt Audio Amplifier T his kit is based on an amazing IC amplifier module from ST Electronics, the TDA7294 It is intended for use as a high quality audio class AB amplifier in hi-fi applications
More informationMetal-Oxide Varistors (MOVs) Surface Mount Multilayer Varistors (MLVs) > MLN Series. MLN SurgeArray TM Suppressor. Description
MLN SurgeArray TM Suppressor RoHS Description The MLN SurgeArray Suppressor is designed to help protect components from transient voltages that exist at the circuit board level. This device provides four
More informationSLLP-5630-150-G PRODUCT DATASHEET. RoHS Compliant
PRODUCT DATASHEET SLLP-5630-150-G Table of Contents Features... 1 Applications 1 Characteristics.. 1 Typical Electro optical Characteristics Curves... 3 Mechanical Dimensions... 4 Carrier Tape Dimensions.....
More informationDATA SHEET CHIP RESISTORS RT Series 1%; 0.5%; 0.25%; 0.1%
DATA SHEET CHIP RESISTORS Series 1%; 0.5%; 0.25%; 0.1% Product specification Supersedes Date of Sep. 30, 2003 ynsc004 ynsc015 ynsc002 ynsc007 2 SCOPE This specification describes series chip resistors
More informationTypes MC and MCN Multilayer RF Capacitors
High-Frequency, High-Power, High-Voltage Chips with Nonmagnetic Option Rugged flexibility and compatibility with FR4 boards make Type MC and MCN capacitors ideal for use where other multilayer caps aren
More informationAdvanced Monolithic Systems
Advanced Monolithic Systems FEATURES Three Terminal Adjustable or Fixed oltages* 1.5, 1.8, 2.5, 2.85, 3.3 and 5. Output Current of 1A Operates Down to 1 Dropout Line Regulation:.2% Max. Load Regulation:.4%
More informationKit 27. 1W TDA7052 POWER AMPLIFIER
Kit 27. 1W TDA7052 POWER AMPLIFIER This is a 1 watt mono amplifier Kit module using the TDA7052 from Philips. (Note, no suffix.) It is designed to be used as a building block in other projects where a
More informationAdvantages of Precision Resistance Networks for use in Sensitive Applications
Advantages of Precision Resistance Networks for use in Sensitive Applications March 2012 Advantages of Network vs. Discrete Resistors Space Saving Features Lot Uniformity Tracking Features Existing Reliable
More informationAssembly and User Guide
1 Amp Adjustable Electronic Load 30V Max, 1 Amp, 20 Watts Powered by: 9V Battery Assembly and User Guide Pico Load is a convenient constant current load for testing batteries and power supplies. The digital
More informationPCB Board Design. PCB boards. What is a PCB board
PCB Board Design Babak Kia Adjunct Professor Boston University College of Engineering Email: bkia -at- bu.edu ENG SC757 - Advanced Microprocessor Design PCB boards What is a PCB board Printed Circuit Boards
More informationAdapters - Overview. Quick-Turn Solutions for IC Supply Issues
Adapters - Overview BGA to BGA Adapter BGA to PGA BGA to QFP BGA to BGA QFP to BGA SMT to DIP SMT to SMT PGA to PGA BGA to QFP Adapter with VR using FlexFrame Interconnect TSOP Adapter Packaged Die to
More informationPolymer Termination. Mechanical Cracking 2. The reason for polymer termination. What is Polymer Termination? 3
Polymer Termination An alternative termination material specifically designed to absorb greater levels of mechanical stress thereby reducing capacitor failures associated with mechanical cracking Mechanical
More informationBourns Resistive Products
Bourns Resistive Products Diverse Requirements Drive Innovations to Pulse Resistors Introduction Countless circuits depend on the protection provided by one of the most fundamental types of passive components:
More informationGLOLAB Universal Telephone Hold
GLOLAB Universal Telephone Hold 1 UNIVERSAL HOLD CIRCUIT If you have touch tone telephone service, you can now put a call on hold from any phone in the house, even from cordless phones and phones without
More informationTEST SOLUTIONS CONTACTING - SEMICONDUCTOR
ENGINEERED TO CONNECT CONTACTING - SEMICONDUCTOR TEST SOLUTIONS SPECIFICATIONS AND DRAWINGS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE - DIMENSIONS IN MILLIMETER CONTACTING - SEMICONDUCTOR 3 SEries
More informationCapacitor Self-Resonance
Capacitor Self-Resonance By: Dr. Mike Blewett University of Surrey United Kingdom Objective This Experiment will demonstrate some of the limitations of capacitors when used in Radio Frequency circuits.
More informationDISCRETE SEMICONDUCTORS DATA SHEET. BFQ34 NPN 4 GHz wideband transistor. Product specification File under Discrete Semiconductors, SC14
DISCRETE SEMICONDUCTORS DATA SHEET File under Discrete Semiconductors, SC4 September 995 DESCRIPTION PINNING NPN transistor encapsulated in a 4 lead SOTA envelope with a ceramic cap. All leads are isolated
More information1W High Power Purple LED Technical Data Sheet. Part No.: LL-HP60MUVA
1W High Power Purple LED Technical Data Sheet Part No.: LL-HP60MUVA Spec No.: HP60M Rev No.: V.2 Date: Aug./18/2009 Page: 1 OF 8 Features: Luckylight High power LED type. Lead frame type package (Heat
More informationDESIGN GUIDELINES FOR LTCC
DESIGN GUIDELINES FOR LTCC HERALOCK HL2000 MATERIALS SYSTEM Preliminary Guideline Release 1.0 CONTENTS 1. INTRODUCTION 1.1. GLOSSARY OF TERMS 1.2. LTCC PROCESS FLOW DIAGRAM 1.3. UNITS OF MEASURE 2. PROCESSING
More informationMADR-009269-0001TR. Single Driver for GaAs FET or PIN Diode Switches and Attenuators Rev. V1. Functional Schematic. Features.
Features High Voltage CMOS Technology Complementary Outputs Positive Voltage Control CMOS device using TTL input levels Low Power Dissipation Low Cost Plastic SOIC-8 Package 100% Matte Tin Plating over
More informationMicrostockage d énergie Les dernières avancées. S. Martin (CEA-LITEN / LCMS Grenoble)
Microstockage d énergie Les dernières avancées S. Martin (CEA-LITEN / LCMS Grenoble) 1 Outline What is a microbattery? Microbatteries developped at CEA Description Performances Integration and Demonstrations
More informationINTEGRATED CIRCUITS. For a complete data sheet, please also download:
INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications The IC06 74HC/HCT/HCU/HCMOS Logic Package Information The IC06 74HC/HCT/HCU/HCMOS
More informationCapacitive Touch Sensor Project:
NOTE: This project does not include a complete parts list. In particular, the IC described here does not come in a dual-inline-package (DIP), and so a gull-wing package has to be soldered to an adaptor
More informationApplication Note AN-0994 Maximizing the Effectiveness of your SMD Assemblies
Application Note AN-0994 Maximizing the Effectiveness of your SMD Assemblies Table of Contents Page Method...2 Thermal characteristics of SMDs...2 Adhesives...4 Solder pastes...4 Reflow profiles...4 Rework...6
More informationIntegrated Circuit Packaging and Thermal Design
Lezioni di Tecnologie e Materiali per l Elettronica Integrated Circuit Packaging and Thermal Design Danilo Manstretta microlab.unipv.it danilo.manstretta@unipv.it Introduction to IC Technologies Packaging
More informationLUXEON LEDs. Circuit Design and Layout Practices to Minimize Electrical Stress. Introduction. Scope LED PORTFOLIO
LED PORTFOLIO LUXEON LEDs Circuit Design and Layout Practices to Minimize Electrical Stress Introduction LED circuits operating in the real world can be subjected to various abnormal electrical overstress
More informationCustomer Service Note Lead Frame Package User Guidelines
Customer Service Note Lead Frame Package User Guidelines CSN30: Lead Frame Package User Guidelines Introduction Introduction When size constraints allow, the larger-pitched lead-frame-based package design
More informationDISCRETE SEMICONDUCTORS DATA SHEET M3D060. BLF177 HF/VHF power MOS transistor. Product specification Supersedes data of 1998 Jul 02.
DISCRETE SEMICONDUCTORS DATA SHEET M3D6 Supersedes data of 1998 Jul 2 23 Jul 21 FEATURES High power gain Low intermodulation distortion Easy power control Good thermal stability Withstands full load mismatch.
More informationIntroduction to VLSI Fabrication Technologies. Emanuele Baravelli
Introduction to VLSI Fabrication Technologies Emanuele Baravelli 27/09/2005 Organization Materials Used in VLSI Fabrication VLSI Fabrication Technologies Overview of Fabrication Methods Device simulation
More informationModifying the Yaesu FT-847 External 22.625 MHz Reference Input
Modifying the Yaesu FT-847 External 22.625 MHz Reference Input David Smith VK3HZ Introduction This document describes the modification of an FT-847 to allow an external 22.625 MHz Reference oscillator
More informationLM138 LM338 5-Amp Adjustable Regulators
LM138 LM338 5-Amp Adjustable Regulators General Description The LM138 series of adjustable 3-terminal positive voltage regulators is capable of supplying in excess of 5A over a 1 2V to 32V output range
More informationCLA4607-085LF: Surface Mount Limiter Diode
DATA SHEET CLA4607-085LF: Surface Mount Limiter Diode Applications Low-loss, high-power limiters Receiver protectors Anode (Pin 1) Anode (Pin 3) Features Low thermal resistance: 55 C/W Typical threshold
More informationPowering Integrated Circuits (ICs), and managing ripple voltage as it relates
Ripple Voltage & ESR Powering Integrated Circuits (ICs), and managing ripple voltage as it relates to ESR of capacitors Low voltage ICs require supply voltage (Vcc) to have reduced levels of ripple voltage
More informationPower chip resistor size 2512 PRC221 5%; 2% FEATURES Reduced size of final equipment Low assembly costs Higher component and equipment reliability.
FEATURES Reduced size of final equipment Low assembly costs Higher component and equipment reliability. APPLICATIONS Power supplies Printers Computers Battery chargers Automotive Converters CD-ROM. QUICK
More informationSupercapacitors. Advantages Power density Recycle ability Environmentally friendly Safe Light weight
Supercapacitors Supercapacitors also called ultracapacitors and electric double layer capacitors (EDLC) are capacitors with capacitance values greater than any other capacitor type available today. Capacitance
More informationLooking at Capacitors
Module 2 AC Theory Looking at What you'll learn in Module 2: In section 2.1 Common capacitor types and their uses. Basic Circuit Symbols for. In section 2.2 Charge & Discharge How capacitors work. What
More informationAluminum Electrolytic Capacitors Axial Miniature, Long-Life
Aluminum Electrolytic Capacitors Axial Miniature, Long-Life 38 AML 0 ASM smaller dimensions Fig. QUICK REFERENCE DATA DESCRIPTION Nominal case sizes (Ø D x L in mm) 6.3 x.7 to 0 x 5 VALUE 0 x 30 to x 38
More information200W DISCRETE POWER AMPLIFIER K8060
H8060IP-1 200W DISCRETE POWER AMPLIFIER K8060 Ideal for active speaker system or subwoofer, guitar amp, home theatre systems, instrument amp, etc. Features & Specifications Specifications: Excellent value
More informationSECTION 13. Multipliers. Outline of Multiplier Design Process:
SECTION 13 Multipliers VMI manufactures many high voltage multipliers, most of which are custom designed for specific requirements. The following information provides general information and basic guidance
More informationLecture 030 DSM CMOS Technology (3/24/10) Page 030-1
Lecture 030 DSM CMOS Technology (3/24/10) Page 030-1 LECTURE 030 - DEEP SUBMICRON (DSM) CMOS TECHNOLOGY LECTURE ORGANIZATION Outline Characteristics of a deep submicron CMOS technology Typical deep submicron
More informationCLA Series: Silicon Limiter Diode Bondable Chips
DATA SHEET CLA Series: Silicon Limiter Diode Bondable Chips Applications LNA receiver protection Commercial and defense radar Features Established Skyworks limiter diode process High-power, mid-range,
More informationMASW-007070-0001TB. GaAs SPST Switch, Absorptive, Single Supply, DC-4.0 GHz. Features. Pin Configuration 1,2,3,4. Description. Ordering Information
Features Operates DC - 4 GHz on Single Supply ASIC TTL / CMOS Driver Low DC Power Consumption 50 Ohm Nominal Impedance Test Boards are Available Tape and Reel are Available Lead-Free 4 x 6 mm PQFN Package
More informationINTEGRATED CIRCUITS DATA SHEET. SAA1064 4-digit LED-driver with I 2 C-Bus interface. Product specification File under Integrated Circuits, IC01
INTEGRATED CIRCUITS DATA SHEET 4-digit LED-driver with I 2 C-Bus interface File under Integrated Circuits, IC01 February 1991 GENERAL DESCRIPTION The LED-driver is a bipolar integrated circuit made in
More informationMicrosystem technology and printed circuit board technology. competition and chance for Europe
Microsystem technology and printed circuit board technology competition and chance for Europe Prof. Udo Bechtloff, KSG Leiterplatten GmbH 1 Content KSG a continuously growing company PCB based Microsystems
More informationWhat is surface mount?
A way of attaching electronic components to a printed circuit board The solder joint forms the mechanical and electrical connection What is surface mount? Bonding of the solder joint is to the surface
More informationSMD High Power Precision Resistors
Key Features High precision - TCR 5ppm/ C and 10ppm/ C Tolerance down to 0.01% Thin film (nichrome) Choice of packages Stable high frequency performance Temperature range -55 C to +155 C Applications Communications
More informationDATA SHEET HIGH POWER CHIP RESISTORS RC high power series 5%, 1% sizes 0603/0805/1206/2512. RoHS compliant & Halogen free
DATA SHEET HIGH POWER CHIP RESISTORS RC high power series 5%, 1% sizes 0603/005/1206/2512 RoHS compliant & Halogen free Product specification Supersedes Date of Mar. 06, 2003 Product specification 2 SCOPE
More informationElectronic Circuit Construction:
Electronic Circuit Construction: Various methods are used for building electronic circuits. The method that you choose depends on a number of factors, including the resources available to you and whether
More informationε0: Dielectric constant in vacuum ( =8.85x10 12 F/m ) ALUMINUM ELECTROLYTIC CAPACITORS TECHNICAL NOTE 1 General Description of Aluminum Electrolytic
CAPACITORS TECHNICAL General Description of Aluminum Electrolytic Capacitors - The Principle of Capacitor The principle of capacitor can be presented by the principle drawing as in Fig.-. When a voltage
More information1.50mm Height 2220 Package Top View Full Color Chip LEDs Technical Data Sheet. Part No.: LL-R5050RGBC-001
.5mm Height 222 Package Top View Full Color Chip LEDs Technical Data Sheet Part No.: LL-R55RGBC- Spec No.: R55 Rev No.: V.2 Date: Mar./6/26 Page: OF 2 Features: P-LCC-6 package. White package. Optical
More informationSilicon-On-Glass MEMS. Design. Handbook
Silicon-On-Glass MEMS Design Handbook A Process Module for a Multi-User Service Program A Michigan Nanofabrication Facility process at the University of Michigan March 2007 TABLE OF CONTENTS Chapter 1...
More informationChip-on-board Technology
Hybrid Technology The trend in electronics is to continue to integrate more and more functions and numbers of components into a single, smaller assembly. Hybrid circuit technology is a key method of increasing
More informationMounting Instructions for SP4 Power Modules
Mounting Instructions for SP4 Power Modules Pierre-Laurent Doumergue R&D Engineer Microsemi Power Module Products 26 rue de Campilleau 33 520 Bruges, France Introduction: This application note gives the
More informationPOWER FORUM, BOLOGNA 20-09-2012
POWER FORUM, BOLOGNA 20-09-2012 Convertitori DC/DC ad alta densità di potenza e bassa impedenza termica. Massimo GAVIOLI. Senior Field Application Engineer. Intersil SIMPLY SMARTER Challenges when Designing
More informationSC Series: MIS Chip Capacitors
DATA SHEET SC Series: MIS Chip Capacitors Applications Systems requiring DC blocking or RF bypassing Fixed capacitance tuning element in filters, oscillators, and matching networks Features Readily available
More informationDesigning with High-Density BGA Packages for Altera Devices
2014.12.15 Designing with High-Density BGA Packages for Altera Devices AN-114 Subscribe As programmable logic devices (PLDs) increase in density and I/O pins, the demand for small packages and diverse
More informationApplication Note, Rev.1.0, September 2008 TLE8366. Application Information. Automotive Power
Application Note, Rev.1.0, September 2008 TLE8366 Automotive Power Table of Contents 1 Abstract...3 2 Introduction...3 3 Dimensioning the Output and Input Filter...4 3.1 Theory...4 3.2 Output Filter Capacitor(s)
More informationAnalog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED
Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK Typical Applications The HMC547LP3
More informationAutomotive and Anti-Sulfuration Chip Resistor 0402
The resistors are constructed in a high grade ceramic body (aluminium oxide). Internal metal electrodes are added at each end and connected by a resistive paste that is applied to the top surface of the
More information0.45mm Height 0402 Package Pure Green Chip LED Technical Data Sheet. Part No.: LL-S160PGC-G5-1B
.45mm Height 42 Package Pure Green Chip LED Technical Data Sheet Part No.: LL-S16PGC-G5-1B Spec No.: S16 Rev No.: V.2 Date: Dec./6/25 Page: 1 OF 9 Features: Package in 8mm tape on 7" diameter reel. Compatible
More information4 SENSORS. Example. A force of 1 N is exerted on a PZT5A disc of diameter 10 mm and thickness 1 mm. The resulting mechanical stress is:
4 SENSORS The modern technical world demands the availability of sensors to measure and convert a variety of physical quantities into electrical signals. These signals can then be fed into data processing
More information