C3D06065A Silicon Carbide Schottky Diode Z-Rec Rectifier

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1 C3D665 Silicon Carbide Schottky Diode Z-Rec Rectifier RM = 65 V ( =135 C) = 9 Q c = 15 nc Features 65-Volt Schottky Rectifier Zero Reverse Recovery Current Zero Forward Recovery Voltage High-Frequency Operation Temperature-Independent Switching Behavior Extremely Fast Switching Positive Temperature Coefficient on V F Benefits Replace Bipolar with Unipolar Rectifiers Essentially No Switching Losses Higher Efficiency Reduction of Heat Sink Requirements Parallel Devices Without Thermal Runaway Package TO-22-2 PIN 1 PIN 2 CSE pplications Switch Mode Power Supplies Power Factor Correction Motor Drives Part Number Package Marking C3D665 TO-22-2 C3D665 Maximum Ratings ( = 25 C unless otherwise specified) Symbol Parameter Value Unit Test Conditions Note RM Repetitive Peak Reverse Voltage 65 V SM Surge Peak Reverse Voltage 65 V V DC DC Blocking Voltage 65 V Continuous Forward Current =25 C =135 C =154 C Fig. 3 RM Repetitive Peak Forward Surge Current 3 2 =25 C, t P = 1 ms, Half Sine Wave =11 C, t P = 1 ms, Half Sine Wave SM Non-Repetitive Peak Forward Surge Current =25 C, t p = 1 ms, Half Sine Wave =11 C, t p = 1 ms, Half Sine Wave Fig. 8,Max Non-Repetitive Peak Forward Surge Current =25 C, t P = 1 µs, Pulse =11 C, t P = 1 µs, Pulse Fig. 8 P tot Power Dissipation W =25 C =11 C Fig. 4 T J, T stg Operating Junction and Storage Temperature -55 to +175 C TO-22 Mounting Torque Nm lbf-in M3 Screw 6-32 Screw 1 C3D665 Rev. B

2 Electrical Characteristics Symbol Parameter Typ. Max. Unit Test Conditions Note V F I R Forward Voltage Reverse Current Q C Total Capacitive Charge 15 nc C Total Capacitance V μ pf = 6 T J =25 C = 6 T J =175 C = 65 V T J =25 C = 65 V T J =175 C = 4 V, = 6 di/dt = 5 /μs T J = 25 C = V, T J = 25 C, f = 1 MHz = 2 V, T J = 25 C, f = 1 MHz = 4 V, T J = 25 C, f = 1 MHz Fig. 1 Fig. 2 Fig. 5 Fig. 6 E C Capacitance Stored Energy 2.3 μj = 4 V Fig. 7 Note: This is a majority carrier diode, so there is no reverse recovery charge. Thermal Characteristics Symbol Parameter Typ. Unit Note R θjc Thermal Resistance from Junction to Case 1.7 C/W Fig. 9 Typical Performance Fowa ard I Current, () F () T J = -55 C 1 T J = 75 C 8 T J = 125 C 6 T J = 175 C Foward VVoltage, F (V) V F (V) Reverse Leaka age Current, I RR (m) I R (m) T J = 175 C T J = 125 C T J = 75 C T J = -55 C Reverse VVoltage, R (V) (V) Figure 1. Forward Characteristics Figure 2. Reverse Characteristics 2 C3D665 Rev. B

3 Typical Performance (peak) () () % Duty 2% Duty 3% Duty 5% Duty 7% Duty DC P P TOT Tot (W) ( C) C ( C) C Figure 3. Current Derating Figure 4. Power Derating Capacit tive Q Charge, C (nc) Q C (nc) Conditions: Ca apacitance C (pf) (pf) Conditions: F test = 1 MHz V test = 25 mv Reverse VVoltage, R (V) (V) Reverse VVoltage, R (V) (V) Figure 5. Total Capacitance Charge vs. Reverse Voltage Figure 6. Capacitance vs. Reverse Voltage 3 C3D665 Rev. B

4 Typical Performance 6 1, 5 Capacitance Sto ored E Energy, E C (µj) C (mj) Reverse VVoltage, (V) R (V) SM FSM () 1 T J = 11 C 1 1E-6 1E-6 1E-3 1E-3 Time, t p (s) t p (s) Figure 7. Capacitance Stored Energy Figure 8. Non-repetitive peak forward surge current versus pulse duration (sinusoidal waveform) Thermal Resistance Thermal Resistance ( C/W) ( o C/W) 1 1E-3 1E SinglePulse 1E-3 1E-6 1E-6 1E-6 1E-3 1E-3 1E-3 1 Time, T (Sec) t p (s) Figure 9. Transient Thermal Impedance 4 C3D665 Rev. B

5 Package Dimensions Package TO-22-2 POS Inches Millimeters Min Max Min Max B Z C D 1 2 J B E H G F S T P Q U Y X C D E F G H J R.197 R.197 L M N L M N V W P Q S T U PIN 1 PIN 2 CSE V W X Y z NOTE: 1. Dimension L, M, W apply for Solder Dip Finish Recommended Solder Pad Layout TO-22-2 Part Number Package Marking C3D665 TO-22-2 C3D665 Note: Recommended soldering profiles can be found in the applications note here: 5 C3D665 Rev. B

6 Diode Model Vf T = V T + If * R T V T =.96 + (T J * -1.1*1-3 ) R T =.7 + (T J * 7.4*1-4 ) Note: T V T R j = Diode Junction Temperature In Degrees Celsius, T valid from 25 C to 175 C Notes RoHS Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 211/65/ EC (RoHS2), as implemented January 2, 213. RoHS Declarations for this product can be obtained from your Cree representative or from the Product Documentation sections of RECh Compliance RECh substances of high concern (SVHCs) information is available for this product. Since the European Chemical gency (ECH) has published notice of their intent to frequently revise the SVHC listing for the foreseeable future,please contact a Cree representative to insure you get the most up-to-date RECh SVHC Declaration. RECh banned substance information (RECh rticle 67) is also available upon request. This product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human body nor in applications in which failure of the product could lead to death, personal injury or property damage, including but not limited to equipment used in the operation of nuclear facilities, life-support machines, cardiac defibrillators or similar emergency medical equipment, aircraft navigation or communication or control systems, or air traffic control systems. Related Links Cree SiC Schottky diode portfolio: Schottky diode Spice models: SiC MOSFET and diode reference designs: Copyright 215 Cree, Inc. ll rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo, and Zero Recovery are registered trademarks of Cree, Inc. Cree, Inc. 46 Silicon Drive Durham, NC 2773 US Tel: Fax: C3D665 Rev. B

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