Field evaporation and GCIB processing of electrodes

Size: px
Start display at page:

Download "Field evaporation and GCIB processing of electrodes"

Transcription

1 Field evaporation and GCIB processing of electrodes ß Field evaporation theory ß Multiscale Molecular Dynamics of Cu-tip Field Evaporation ß Surface processing with GCIB ß Experimental studies of GCIB ß Future applications Z. Insepov1), D. Swanson2), A. Kirkpatrick2), A. Hassanein1) 1) ANL, 2) EPION Corp. Argonne National Laboratory A Laboratory Operated by The University of Chicago

2 Field Evaporation Theory In a sufficiently high positive electric field, surface atoms can be desorbed from the surface at low temperature in the form of multiply charged positive ions. This effect have been used in field ion microscopy (FIM) for a long time. F ev n 1 Ê 3.6n = ÁL + Â Ii - nf - nr0 Ë i r0 Copper 2 ˆ V A L, ev f, ev r 0, _ I 1, ev I 2, ev I 3, ev E aff, ev F 1+, GV/m

3 Multiscale MD Simulation Method E tip =E m sin(p/2 t/t m ) t m =200 ps, E m =1,10,100 GV/m f=1.25 GHz, T= K + = The MD region : & r i ( t) = - 1 m Thermal balance: r dt(, t) r = DT dt The eq.of motion : 2 r d ui ó ik = 2 dt dx u + dx ( r, t) ˆ Â j i U r The Finite - Difference Region (Mesh) : Ê ó ik = -áktd ik + Ke lld ik + 2mÁe Ë Ê d ik ˆ + xe lld ik + 2h Á & e ik - & e ll Ë 3 e ik k 1 Ê ui Á 2 Ë dxk k i ij ij c - thermal diffusivity, K - bulk modulus, x - bulk viscosity, a - therm.expans.coeff, m -shear modulus, h - shear viscosity. ik -e ll d 3 ik ˆ

4 MD of Field Electric Field: 1GV/m 3% of the critical value for Cu 30 GV/m T=300K

5 MD of Field 1GV/m Electric Field: f=1.25ghz 1GV/m 3% of the critical field for Cu 30GV/m T=1100K

6 MD of Field Evaporation: 10GV/m Electric Field: f=1.25ghz 10GV/m 30% of the critical field for Cu 30 GV/m T=650K

7 MD of Field Evaporation: 10GV/m & variable update for surface charges Electric Field: f=1.25ghz 10GV/m, 30% of critical field for Cu 30 GV/m T=800K Automated update for the Charged surface atoms

8 MD of Field Evaporation: 100 GV/m Electric Field: f=1.25ghz 100GV/m, 3 times of the critical field for Cu 30 GV/m; T=800K Automated update for the charged surface atoms Ecr for cooperative evaporation could be estimated from the movie and it is 36 GV/m

9 Surface processing with Gas Cluster Ion Beams (GCIB) Conventional ions deep penetration thermal spike along stopping path normal sputtering distribution >1000 Å Gas cluster ions clusters have high total energy but low energy per atom extremely shallow penetration into target surface energy deposition into localized region lateral sputtering distribution inherent smoothing action < 100 Å

10 Cluster impact produces extreme transient conditions Cluster ion impact Ar + Shock wave generation Lateral sputtering Crater formation Lateral sputtering and crater formation target target target On metal surfaces, craters were hemispherical. The Lateral sputtering effect (LSE) was predicted by Molecular Dynamics simulation in 1992 and then was confirmed experimentally. It occurs due to interaction of rarefaction nano-scale shock-waves with an open target surface. The LSE effect dramatically enhances the surface atomic diffusivity which eventually would lead to the surface smoothing.

11 Surface smoothing by GCIB--example SiC Pre 54 A RMS Post 2.7 A RMS Pre 57.3 A RMS Post 5.7 A RMS

12 Atomic scale surface smoothing by GCIB AFM image of Ta film surface After GCIB Ra = 4Å Initial Ra =12Å, (Masked during processing)

13 GCIB surface enhancement Initial Ra = 3.8 Å Glass After GCIB Ra = 2.5 Å

14 GCIB Smoothing of Cu Pre-GCIB: Z = 210.6A Ra = 13.9A Rms = 17.9A Post-GCIB: Z = 67.0A Ra = 5.5A Rms = 6.9A

15 GCIB Smoothing of PVD Cu Ra (A) GCIB Process Time (arb. units)

16 GCIB smoothing of Cu with N 2 Pre-GCIB: Z = 72A Ra = 6.5A Post-GCIB: Z = 36A Ra = 3.4A

17 GCIB cleaning of ECD CuOx CuOx etching with N2 GCIB 1E15 / cm2 dose 20 native oxide thickness CuOx thickness (A) GCIB Energy (kv)

18 What can GCIB do? Smoothing to atomic levels Surface densification Reactive chemical modification of surfaces Assisted deposition of thin films High rate etching and cleaning without causing roughening Precise uniform reproducible etching and thinning Spatially variable etching and thinning Ultra-shallow implantation in semiconductors and metals

19 New Challenge for future generation of RF accelerators A Field Evaporation model has been proposed and simulated by Molecular Dynamics method Our modeling has revealed a new cooperative evaporation effect of a tip at a high electric field To reduce the surface roughness, we have proposed a new surface smoothening process by GCIB that can reduce the surface roughness up to atomic scale We plan to dramatically increase surface smoothness, make surfaces more dense, and to overall increase the critical field for the vacuum breakdown

Lecture 12. Physical Vapor Deposition: Evaporation and Sputtering Reading: Chapter 12. ECE 6450 - Dr. Alan Doolittle

Lecture 12. Physical Vapor Deposition: Evaporation and Sputtering Reading: Chapter 12. ECE 6450 - Dr. Alan Doolittle Lecture 12 Physical Vapor Deposition: Evaporation and Sputtering Reading: Chapter 12 Evaporation and Sputtering (Metalization) Evaporation For all devices, there is a need to go from semiconductor to metal.

More information

Coating Technology: Evaporation Vs Sputtering

Coating Technology: Evaporation Vs Sputtering Satisloh Italy S.r.l. Coating Technology: Evaporation Vs Sputtering Gianni Monaco, PhD R&D project manager, Satisloh Italy 04.04.2016 V1 The aim of this document is to provide basic technical information

More information

Vacuum Evaporation Recap

Vacuum Evaporation Recap Sputtering Vacuum Evaporation Recap Use high temperatures at high vacuum to evaporate (eject) atoms or molecules off a material surface. Use ballistic flow to transport them to a substrate and deposit.

More information

Ion Beam Sputtering: Practical Applications to Electron Microscopy

Ion Beam Sputtering: Practical Applications to Electron Microscopy Ion Beam Sputtering: Practical Applications to Electron Microscopy Applications Laboratory Report Introduction Electron microscope specimens, both scanning (SEM) and transmission (TEM), often require a

More information

Electron Beam and Sputter Deposition Choosing Process Parameters

Electron Beam and Sputter Deposition Choosing Process Parameters Electron Beam and Sputter Deposition Choosing Process Parameters General Introduction The choice of process parameters for any process is determined not only by the physics and/or chemistry of the process,

More information

For Touch Panel and LCD Sputtering/PECVD/ Wet Processing

For Touch Panel and LCD Sputtering/PECVD/ Wet Processing production Systems For Touch Panel and LCD Sputtering/PECVD/ Wet Processing Pilot and Production Systems Process Solutions with over 20 Years of Know-how Process Technology at a Glance for Touch Panel,

More information

Dry Etching and Reactive Ion Etching (RIE)

Dry Etching and Reactive Ion Etching (RIE) Dry Etching and Reactive Ion Etching (RIE) MEMS 5611 Feb 19 th 2013 Shengkui Gao Contents refer slides from UC Berkeley, Georgia Tech., KU, etc. (see reference) 1 Contents Etching and its terminologies

More information

Conductivity of silicon can be changed several orders of magnitude by introducing impurity atoms in silicon crystal lattice.

Conductivity of silicon can be changed several orders of magnitude by introducing impurity atoms in silicon crystal lattice. CMOS Processing Technology Silicon: a semiconductor with resistance between that of conductor and an insulator. Conductivity of silicon can be changed several orders of magnitude by introducing impurity

More information

III. Wet and Dry Etching

III. Wet and Dry Etching III. Wet and Dry Etching Method Environment and Equipment Advantage Disadvantage Directionality Wet Chemical Solutions Atmosphere, Bath 1) Low cost, easy to implement 2) High etching rate 3) Good selectivity

More information

Introduction to VLSI Fabrication Technologies. Emanuele Baravelli

Introduction to VLSI Fabrication Technologies. Emanuele Baravelli Introduction to VLSI Fabrication Technologies Emanuele Baravelli 27/09/2005 Organization Materials Used in VLSI Fabrication VLSI Fabrication Technologies Overview of Fabrication Methods Device simulation

More information

Chemical Sputtering. von Kohlenstoff durch Wasserstoff. W. Jacob

Chemical Sputtering. von Kohlenstoff durch Wasserstoff. W. Jacob Chemical Sputtering von Kohlenstoff durch Wasserstoff W. Jacob Centre for Interdisciplinary Plasma Science Max-Planck-Institut für Plasmaphysik, 85748 Garching Content: Definitions: Chemical erosion, physical

More information

Silicon-On-Glass MEMS. Design. Handbook

Silicon-On-Glass MEMS. Design. Handbook Silicon-On-Glass MEMS Design Handbook A Process Module for a Multi-User Service Program A Michigan Nanofabrication Facility process at the University of Michigan March 2007 TABLE OF CONTENTS Chapter 1...

More information

Sputtered AlN Thin Films on Si and Electrodes for MEMS Resonators: Relationship Between Surface Quality Microstructure and Film Properties

Sputtered AlN Thin Films on Si and Electrodes for MEMS Resonators: Relationship Between Surface Quality Microstructure and Film Properties Sputtered AlN Thin Films on and Electrodes for MEMS Resonators: Relationship Between Surface Quality Microstructure and Film Properties S. Mishin, D. R. Marx and B. Sylvia, Advanced Modular Sputtering,

More information

Pulsed laser deposition of organic materials

Pulsed laser deposition of organic materials Pulsed laser deposition of organic materials PhD theses Gabriella Kecskeméti Department of Optics and Quantum Electronics University of Szeged Supervisor: Dr. Béla Hopp senior research fellow Department

More information

Evaluating Surface Roughness of Si Following Selected Lapping and Polishing Processes

Evaluating Surface Roughness of Si Following Selected Lapping and Polishing Processes Applications Laboratory Report 86 Evaluating Surface Roughness of Si Following Selected Processes Purpose polishing of samples is a common application and required for a variety of manufacturing and research

More information

Neuere Entwicklungen zur Herstellung optischer Schichten durch reaktive. Wolfgang Hentsch, Dr. Reinhard Fendler. FHR Anlagenbau GmbH

Neuere Entwicklungen zur Herstellung optischer Schichten durch reaktive. Wolfgang Hentsch, Dr. Reinhard Fendler. FHR Anlagenbau GmbH Neuere Entwicklungen zur Herstellung optischer Schichten durch reaktive Sputtertechnologien Wolfgang Hentsch, Dr. Reinhard Fendler FHR Anlagenbau GmbH Germany Contents: 1. FHR Anlagenbau GmbH in Brief

More information

Solar Photovoltaic (PV) Cells

Solar Photovoltaic (PV) Cells Solar Photovoltaic (PV) Cells A supplement topic to: Mi ti l S Micro-optical Sensors - A MEMS for electric power generation Science of Silicon PV Cells Scientific base for solar PV electric power generation

More information

Optical Properties of Sputtered Tantalum Nitride Films Determined by Spectroscopic Ellipsometry

Optical Properties of Sputtered Tantalum Nitride Films Determined by Spectroscopic Ellipsometry Optical Properties of Sputtered Tantalum Nitride Films Determined by Spectroscopic Ellipsometry Thomas Waechtler a, Bernd Gruska b, Sven Zimmermann a, Stefan E. Schulz a, Thomas Gessner a a Chemnitz University

More information

Implementation Of High-k/Metal Gates In High-Volume Manufacturing

Implementation Of High-k/Metal Gates In High-Volume Manufacturing White Paper Implementation Of High-k/Metal Gates In High-Volume Manufacturing INTRODUCTION There have been significant breakthroughs in IC technology in the past decade. The upper interconnect layers of

More information

Vacuum Pumping of Large Vessels and Modelling of Extended UHV Systems

Vacuum Pumping of Large Vessels and Modelling of Extended UHV Systems Vacuum Pumping of Large Vessels and Modelling of Extended UHV Systems Georgy L. Saksaganski D.V. Efremov Institute, St Petersburg, Russia gruss@niiefa.spb.su An overview of the methods for reducing of

More information

Tableting Punch Performance Can Be Improved With Precision Coatings

Tableting Punch Performance Can Be Improved With Precision Coatings Tableting Punch Performance Can Be Improved With Precision Coatings by Arnold H. Deutchman, Ph. D. Director of Research and Development (614) 873-4529 X 114 adeutchman@beamalloy.net Mr. Dale C. Natoli

More information

Semiconductor doping. Si solar Cell

Semiconductor doping. Si solar Cell Semiconductor doping Si solar Cell Two Levels of Masks - photoresist, alignment Etch and oxidation to isolate thermal oxide, deposited oxide, wet etching, dry etching, isolation schemes Doping - diffusion/ion

More information

Transparent conducting sol gel ATO coatings for display applications by an improved dip coating technique

Transparent conducting sol gel ATO coatings for display applications by an improved dip coating technique Transparent conducting sol gel ATO coatings for display applications by an improved dip coating technique G. Guzman a, *, B. Dahmani b, J. Puetz c, M.A. Aegerter c a Corning S.A., Centre Européen de Recherche

More information

Graduate Student Presentations

Graduate Student Presentations Graduate Student Presentations Dang, Huong Chip packaging March 27 Call, Nathan Thin film transistors/ liquid crystal displays April 4 Feldman, Ari Optical computing April 11 Guerassio, Ian Self-assembly

More information

Development of New Inkjet Head Applying MEMS Technology and Thin Film Actuator

Development of New Inkjet Head Applying MEMS Technology and Thin Film Actuator Development of New Inkjet Head Applying MEMS Technology and Thin Film Actuator Kenji MAWATARI, Koich SAMESHIMA, Mitsuyoshi MIYAI, Shinya MATSUDA Abstract We developed a new inkjet head by applying MEMS

More information

1. Photon Beam Damage and Charging at Solid Surfaces John H. Thomas III

1. Photon Beam Damage and Charging at Solid Surfaces John H. Thomas III 1. Photon Beam Damage and Charging at Solid Surfaces John H. Thomas III 1. Introduction............................. 2. Electrostatic Charging of Samples in Photoemission Experiments............................

More information

Deposition of Thin Metal Films " (on Polymer Substrates)!

Deposition of Thin Metal Films  (on Polymer Substrates)! Deposition of Thin Metal Films " (on Polymer Substrates)! Shefford P. Baker! Cornell University! Department of Materials Science and Engineering! Ithaca, New York, 14853! MS&E 5420 Flexible Electronics,

More information

Substrate maturity and readiness in large volume to support mass adoption of ULP FDSOI platforms. SOI Consortium Conference Tokyo 2016

Substrate maturity and readiness in large volume to support mass adoption of ULP FDSOI platforms. SOI Consortium Conference Tokyo 2016 Substrate maturity and readiness in large volume to support mass adoption of ULP FDSOI platforms Christophe Maleville Substrate readiness 3 lenses view SOI Consortium C1 - Restricted Conference Tokyo 2016

More information

Module 7 Wet and Dry Etching. Class Notes

Module 7 Wet and Dry Etching. Class Notes Module 7 Wet and Dry Etching Class Notes 1. Introduction Etching techniques are commonly used in the fabrication processes of semiconductor devices to remove selected layers for the purposes of pattern

More information

IBS - Ion Beam Services

IBS - Ion Beam Services IBS - Ion Beam Services Profile Technologies Devices & sensor fabricat ion Participation to R&D programs Researched partnership Présentation activité composant 1 Profile : Products and services Product

More information

2. Deposition process

2. Deposition process Properties of optical thin films produced by reactive low voltage ion plating (RLVIP) Antje Hallbauer Thin Film Technology Institute of Ion Physics & Applied Physics University of Innsbruck Investigations

More information

Types of Epitaxy. Homoepitaxy. Heteroepitaxy

Types of Epitaxy. Homoepitaxy. Heteroepitaxy Epitaxy Epitaxial Growth Epitaxy means the growth of a single crystal film on top of a crystalline substrate. For most thin film applications (hard and soft coatings, optical coatings, protective coatings)

More information

Lezioni di Tecnologie e Materiali per l Elettronica

Lezioni di Tecnologie e Materiali per l Elettronica Lezioni di Tecnologie e Materiali per l Elettronica Danilo Manstretta danilo.manstretta@unipv.it microlab.unipv.it Outline Passive components Resistors Capacitors Inductors Printed circuits technologies

More information

PLASMA TECHNOLOGY OVERVIEW

PLASMA TECHNOLOGY OVERVIEW PLASMA TECHNOLOGY OVERVIEW Plasmas are not a lab curiosity. Plasma processing has been an essential production tool for more than 30 years in the fabrication of microelectronic devices for example. Over

More information

A Remote Plasma Sputter Process for High Rate Web Coating of Low Temperature Plastic Film with High Quality Thin Film Metals and Insulators

A Remote Plasma Sputter Process for High Rate Web Coating of Low Temperature Plastic Film with High Quality Thin Film Metals and Insulators A Remote Plasma Sputter Process for High Rate Web Coating of Low Temperature Plastic Film with High Quality Thin Film Metals and Insulators Dr Peter Hockley and Professor Mike Thwaites, Plasma Quest Limited

More information

Chapter 11 PVD and Metallization

Chapter 11 PVD and Metallization Chapter 11 PVD and Metallization 2006/5/23 1 Metallization Processes that deposit metal thin film on wafer surface. 2006/5/23 2 1 Metallization Definition Applications PVD vs. CVD Methods Vacuum Metals

More information

CIRICULUM VITAE 1. PERSONAL. Date of Birth-Place : March 2 nd 1984- Balikesir, Turkey

CIRICULUM VITAE 1. PERSONAL. Date of Birth-Place : March 2 nd 1984- Balikesir, Turkey CIRICULUM VITAE 1. PERSONAL Name, Title : Derya ATAÇ, M.Sc. Date of Birth-Place : March 2 nd 1984- Balikesir, Turkey Address Phone E-mail : NanoElectronics Group (NE), MESA+ Institute for Nanotechnology,

More information

Contamination. Cleanroom. Cleanroom for micro and nano fabrication. Particle Contamination and Yield in Semiconductors.

Contamination. Cleanroom. Cleanroom for micro and nano fabrication. Particle Contamination and Yield in Semiconductors. Fe Particles Metallic contaminants Organic contaminants Surface roughness Au Particles SiO 2 or other thin films Contamination Na Cu Photoresist Interconnect Metal N, P Damages: Oxide breakdown, metal

More information

2. Nanoparticles. Introduction to Nanoscience, 2005 1

2. Nanoparticles. Introduction to Nanoscience, 2005 1 2. Nanoparticles Nanoparticles are the simplest form of structures with sizes in the nm range. In principle any collection of atoms bonded together with a structural radius of < 100 nm can be considered

More information

Oberflächenbearbeitung durch reaktive Ionenstrahlen

Oberflächenbearbeitung durch reaktive Ionenstrahlen Oberflächenbearbeitung durch reaktive Ionenstrahlen André Mießler, Thomas Arnold Leibniz-Institut für Oberflächenmodifizierung e. V. Permoserstr. 15, D-04318 Leipzig andre.miessler@iom-leipzig.de www.iom-leipzig.de

More information

h e l p s y o u C O N T R O L

h e l p s y o u C O N T R O L contamination analysis for compound semiconductors ANALYTICAL SERVICES B u r i e d d e f e c t s, E v a n s A n a l y t i c a l g r o u p h e l p s y o u C O N T R O L C O N T A M I N A T I O N Contamination

More information

Nanometer-scale imaging and metrology, nano-fabrication with the Orion Helium Ion Microscope

Nanometer-scale imaging and metrology, nano-fabrication with the Orion Helium Ion Microscope andras@nist.gov Nanometer-scale imaging and metrology, nano-fabrication with the Orion Helium Ion Microscope Bin Ming, András E. Vladár and Michael T. Postek National Institute of Standards and Technology

More information

DEVELOPMENTS & TRENDS IN FEOL MATERIALS FOR ADVANCED SEMICONDUCTOR DEVICES Michael Corbett mcorbett@linx-consulting.com Semicon Taiwan2015

DEVELOPMENTS & TRENDS IN FEOL MATERIALS FOR ADVANCED SEMICONDUCTOR DEVICES Michael Corbett mcorbett@linx-consulting.com Semicon Taiwan2015 DEVELOPMENTS & TRENDS IN FEOL MATERIALS FOR ADVANCED SEMICONDUCTOR DEVICES Michael Corbett mcorbett@linx-consulting.com Semicon Taiwan2015 LINX BACKGROUND Linx Consulting 1. We help our clients to succeed

More information

DIEGO TONINI MORPHOLOGY OF NIOBIUM FILMS SPUTTERED AT DIFFERENT TARGET SUBSTRATE ANGLE

DIEGO TONINI MORPHOLOGY OF NIOBIUM FILMS SPUTTERED AT DIFFERENT TARGET SUBSTRATE ANGLE UNIVERSITÀ DEGLI STUDI DI PADOVA SCIENCE FACULTY MATERIAL SCIENCE DEGREE INFN LABORATORI NAZIONALI DI LEGNARO DIEGO TONINI MORPHOLOGY OF NIOBIUM FILMS SPUTTERED AT DIFFERENT TARGET SUBSTRATE ANGLE 2 QUESTIONS

More information

Sputtering by Particle Bombardment I

Sputtering by Particle Bombardment I Sputtering by Particle Bombardment I Physical Sputtering of Single-Element Solids Edited by R. Behrisch With Contributions by H. H. Andersen H. L. Bay R. Behrisch M. T. Robinson H. E. Roosendaal P. Sigmund

More information

Usage of Carbon Nanotubes in Scanning Probe Microscopes as Probe. Keywords: Carbon Nanotube, Scanning Probe Microscope

Usage of Carbon Nanotubes in Scanning Probe Microscopes as Probe. Keywords: Carbon Nanotube, Scanning Probe Microscope International Journal of Arts and Sciences 3(1): 18-26 (2009) CD-ROM. ISSN: 1944-6934 InternationalJournal.org Usage of Carbon Nanotubes in Scanning Probe Microscopes as Probe Bedri Onur Kucukyildirim,

More information

OPTIMIZING OF THERMAL EVAPORATION PROCESS COMPARED TO MAGNETRON SPUTTERING FOR FABRICATION OF TITANIA QUANTUM DOTS

OPTIMIZING OF THERMAL EVAPORATION PROCESS COMPARED TO MAGNETRON SPUTTERING FOR FABRICATION OF TITANIA QUANTUM DOTS OPTIMIZING OF THERMAL EVAPORATION PROCESS COMPARED TO MAGNETRON SPUTTERING FOR FABRICATION OF TITANIA QUANTUM DOTS Vojtěch SVATOŠ 1, Jana DRBOHLAVOVÁ 1, Marian MÁRIK 1, Jan PEKÁREK 1, Jana CHOMOCKÁ 1,

More information

Advanced VLSI Design CMOS Processing Technology

Advanced VLSI Design CMOS Processing Technology Isolation of transistors, i.e., their source and drains, from other transistors is needed to reduce electrical interactions between them. For technologies

More information

Formation of solids from solutions and melts

Formation of solids from solutions and melts Formation of solids from solutions and melts Solids from a liquid phase. 1. The liquid has the same composition as the solid. Formed from the melt without any chemical transformation. Crystallization and

More information

Electronic transport properties of nano-scale Si films: an ab initio study

Electronic transport properties of nano-scale Si films: an ab initio study Electronic transport properties of nano-scale Si films: an ab initio study Jesse Maassen, Youqi Ke, Ferdows Zahid and Hong Guo Department of Physics, McGill University, Montreal, Canada Motivation (of

More information

Improved Contact Formation for Large Area Solar Cells Using the Alternative Seed Layer (ASL) Process

Improved Contact Formation for Large Area Solar Cells Using the Alternative Seed Layer (ASL) Process Improved Contact Formation for Large Area Solar Cells Using the Alternative Seed Layer (ASL) Process Lynne Michaelson, Krystal Munoz, Jonathan C. Wang, Y.A. Xi*, Tom Tyson, Anthony Gallegos Technic Inc.,

More information

CVD SILICON CARBIDE. CVD SILICON CARBIDE s attributes include:

CVD SILICON CARBIDE. CVD SILICON CARBIDE s attributes include: CVD SILICON CARBIDE CVD SILICON CARBIDE is the ideal performance material for design engineers. It outperforms conventional forms of silicon carbide, as well as other ceramics, quartz, and metals in chemical

More information

THIN FILM MATERIALS TECHNOLOGY

THIN FILM MATERIALS TECHNOLOGY THIN FILM MATERIALS TECHNOLOGY Sputtering of Compound Materials by Kiyotaka Wasa Yokohama City University Yokohama, Japan Makoto Kitabatake Matsushita Electric Industrial Co., Ltd. Kyoto, Japan Hideaki

More information

Picosun World Forum, Espoo 9.6.2009. 35 years of ALD. Tuomo Suntola, Picosun Oy. Tuomo Suntola, Picosun Oy

Picosun World Forum, Espoo 9.6.2009. 35 years of ALD. Tuomo Suntola, Picosun Oy. Tuomo Suntola, Picosun Oy 35 years of ALD Conventional methods for compound film deposition Heat treatment Final crystallization Nucleation Vacuum evaporation Sputtering CVD Buildup of thin film in source controlled deposition

More information

Chapter 7-1. Definition of ALD

Chapter 7-1. Definition of ALD Chapter 7-1 Atomic Layer Deposition (ALD) Definition of ALD Brief history of ALD ALD process and equipments ALD applications 1 Definition of ALD ALD is a method of applying thin films to various substrates

More information

Plasma diagnostics focused on new magnetron sputtering devices for thin film deposition

Plasma diagnostics focused on new magnetron sputtering devices for thin film deposition Université Paris-Sud XI Laboratoire de Physique des Gaz et des Plasmas Orsay, France & Masaryk University in Brno Department of Physical Electronics Brno, Czech Republic Plasma diagnostics focused on new

More information

Development of certified reference material of thin film for thermal diffusivity

Development of certified reference material of thin film for thermal diffusivity Development of certified reference material of thin film for thermal diffusivity Takashi Yagi, Thermophysical properties section, NMIJ/AIST Joshua Martin MML, National Institute of Standards and Technology

More information

Modification of Pd-H 2 and Pd-D 2 thin films processed by He-Ne laser

Modification of Pd-H 2 and Pd-D 2 thin films processed by He-Ne laser Modification of Pd-H 2 and Pd-D 2 thin films processed by He-Ne laser V.Nassisi #, G.Caretto #, A. Lorusso #, D.Manno %, L.Famà %, G.Buccolieri %, A.Buccolieri %, U.Mastromatteo* # Laboratory of Applied

More information

STM, LEED and Mass spectrometry

STM, LEED and Mass spectrometry STM, LEED and Mass spectrometry R. Schloderer, S. Griessl, J. Freund, M. Edelwirth, W.M. Heckl Introduction TDS UHV technique Preparation STM LEED QMS Concept of new UHV chamber Conclusion P. Cole, M.

More information

PARTICLE SIMULATION ON MULTIPLE DUST LAYERS OF COULOMB CLOUD IN CATHODE SHEATH EDGE

PARTICLE SIMULATION ON MULTIPLE DUST LAYERS OF COULOMB CLOUD IN CATHODE SHEATH EDGE PARTICLE SIMULATION ON MULTIPLE DUST LAYERS OF COULOMB CLOUD IN CATHODE SHEATH EDGE K. ASANO, S. NUNOMURA, T. MISAWA, N. OHNO and S. TAKAMURA Department of Energy Engineering and Science, Graduate School

More information

Robert G. Hunsperger. Integrated Optics. Theory and Technology. Fourth Edition. With 195 Figures and 17 Tables. Springer

Robert G. Hunsperger. Integrated Optics. Theory and Technology. Fourth Edition. With 195 Figures and 17 Tables. Springer Robert G. Hunsperger Integrated Optics Theory and Technology Fourth Edition With 195 Figures and 17 Tables Springer Contents 1. Introduction 1 1.1 Advantages of Integrated Optics 2 1.1.1 Comparison of

More information

Status of High Current Ion Sources. Daniela Leitner Lawrence Berkeley National Laboratory

Status of High Current Ion Sources. Daniela Leitner Lawrence Berkeley National Laboratory http://ecrgroup.lbl.gov Status of High Current Ion Sources Daniela Leitner Lawrence Berkeley National Laboratory October, 27th, 2003 1 Content Overview of available high current sources Requirements for

More information

1. PECVD in ORGANOSILICON FED PLASMAS

1. PECVD in ORGANOSILICON FED PLASMAS F. FRACASSI Department of Chemistry, University of Bari (Italy) Plasma Solution srl SURFACE MODIFICATION OF POLYMERS AND METALS WITH LOW TEMPERATURE PLASMA OUTLINE METAL TREATMENTS 1 low pressure PECVD

More information

Simulation Techniques for Tablet and Mobile Phone Design Bill McGinn; Ansys Senior Application Engineer

Simulation Techniques for Tablet and Mobile Phone Design Bill McGinn; Ansys Senior Application Engineer Simulation Techniques for Tablet and Mobile Phone Design Bill McGinn; Ansys Senior Application Engineer 1 Tablets in our daily lives Tablets are very entertaining, stylish and powerful Shopping, reading,

More information

Defense Technical Information Center Compilation Part Notice

Defense Technical Information Center Compilation Part Notice UNCLASSIFIED Defense Technical Information Center Compilation Part Notice ADP012914 TITLE: Atomic Force Microscopy Characterization of Nanostructured Materials Using Selective Chemical Etching DISTRIBUTION:

More information

Results Overview Wafer Edge Film Removal using Laser

Results Overview Wafer Edge Film Removal using Laser Results Overview Wafer Edge Film Removal using Laser LEC- 300: Laser Edge Cleaning Process Apex Beam Top Beam Exhaust Flow Top Beam Scanning Top & Top Bevel Apex Beam Scanning Top Bevel, Apex, & Bo+om

More information

Focused Ion beam nanopatterning: potential application in photovoltaics

Focused Ion beam nanopatterning: potential application in photovoltaics Focused Ion beam nanopatterning: potential application in photovoltaics Research Infrastructure: Location: FIB-Focused Ion Beam ENEA Portici (Italy) Date March, 26 2013 Speakers: Vera La Ferrara, ENEA

More information

Secondary Ion Mass Spectrometry

Secondary Ion Mass Spectrometry Secondary Ion Mass Spectrometry A PRACTICAL HANDBOOK FOR DEPTH PROFILING AND BULK IMPURITY ANALYSIS R. G. Wilson Hughes Research Laboratories Malibu, California F. A. Stevie AT&T Bell Laboratories Allentown,

More information

Deposition of Silicon Oxide, Silicon Nitride and Silicon Carbide Thin Films by New Plasma Enhanced Chemical Vapor Deposition Source Technology

Deposition of Silicon Oxide, Silicon Nitride and Silicon Carbide Thin Films by New Plasma Enhanced Chemical Vapor Deposition Source Technology General Plasma, Inc. 546 East 25th Street Tucson, Arizona 85713 tel. 520-882-5100 fax. 520-882-5165 and Silicon Carbide Thin Films by New Plasma Enhanced Chemical Vapor Deposition Source Technology M.

More information

Plasma Electronic is Partner of. Tailor-Made Surfaces by Plasma Technology

Plasma Electronic is Partner of. Tailor-Made Surfaces by Plasma Technology Precision Fair 2013 Stand 171 Plasma Electronic is Partner of Tailor-Made Surfaces by Plasma Technology Dr. J. Geng, Plasma Electronic GmbH Modern Surface Technology in 1900 Overview A short introduction

More information

Novel inkjettable copper ink utilizing processing temperatures under 100 degrees C without the need of inert atmosphere

Novel inkjettable copper ink utilizing processing temperatures under 100 degrees C without the need of inert atmosphere Novel inkjettable copper ink utilizing processing temperatures under 100 degrees C without the need of inert atmosphere Printed Electronics Europe April 7-8, 2009 Dresden, Germany Dr. Zvi Yaniv Applied

More information

Demonstration of sub-4 nm nanoimprint lithography using a template fabricated by helium ion beam lithography

Demonstration of sub-4 nm nanoimprint lithography using a template fabricated by helium ion beam lithography Demonstration of sub-4 nm nanoimprint lithography using a template fabricated by helium ion beam lithography Wen-Di Li*, Wei Wu** and R. Stanley Williams Hewlett-Packard Labs *Current address: University

More information

T.M.M. TEKNIKER MICROMACHINING

T.M.M. TEKNIKER MICROMACHINING T.M.M. TEKNIKER MICROMACHINING Micro and Nanotechnology Dapartment FUNDACION TEKNIKER Avda. Otaola. 20 Tel. +34 943 206744 Fax. +34 943 202757 20600 Eibar http://www.tekniker.es TMM FACILITIES -Clean Room

More information

Calibration of AFM with virtual standards; robust, versatile and accurate. Richard Koops VSL Dutch Metrology Institute Delft

Calibration of AFM with virtual standards; robust, versatile and accurate. Richard Koops VSL Dutch Metrology Institute Delft Calibration of AFM with virtual standards; robust, versatile and accurate Richard Koops VSL Dutch Metrology Institute Delft 19-11-2015 VSL Dutch Metrology Institute VSL is the national metrology institute

More information

Formation of Oriented Fibers Using Injection of PEO Solutions inside Electric Fields Defined by Two Parallel Suspended Electrodes

Formation of Oriented Fibers Using Injection of PEO Solutions inside Electric Fields Defined by Two Parallel Suspended Electrodes 06 (43)-AF:Modelo-AF 8/20/11 6:41 AM Page 122 Formation of Oriented Fibers Using Injection of PEO Solutions inside Electric Fields Defined by Two Parallel Suspended R. Furlan 1, J. A. M. Rosado 2, A. N.

More information

Introduction to Thin Film Technology LOT. Chair of Surface and Materials Technology

Introduction to Thin Film Technology LOT. Chair of Surface and Materials Technology Introduction to Thin Film Introduction to Thin Film Verfahrenstechnik der Oberflächenmodifikationen Prof. Dr. Xin Jiang Lecture Institut für Werkstofftechnik der Uni-Siegen Sommersemester 2007 Introduction

More information

MICROPOSIT LOL 1000 AND 2000 LIFTOFF LAYERS For Microlithography Applications

MICROPOSIT LOL 1000 AND 2000 LIFTOFF LAYERS For Microlithography Applications Technical Data Sheet MICROPOSIT LOL 1000 AND 2000 LIFTOFF LAYERS For Microlithography Applications Regional Product Availability Description Advantages North America Europe, Middle East and Africa Latin

More information

FRAUNHOFER INSTITUTe For

FRAUNHOFER INSTITUTe For FRAUNHOFER INSTITUTe For surface engineering and thin films MOCCA + PROCESS AUTOMATION & OPTICAL MONITORING MOCCA + Automate your thin film coating process In many thin film coating processes various factors

More information

A Laboratory Approach to Semiconductor Process Technology

A Laboratory Approach to Semiconductor Process Technology A Laboratory Approach to Semiconductor Process Technology Mary Jane Willis Manufacturing Technology Program Albuquerque TVI, A Community College Albuquerque, New Mexico March, 1998 ABSTRACT The recent

More information

AC coupled pitch adapters for silicon strip detectors

AC coupled pitch adapters for silicon strip detectors AC coupled pitch adapters for silicon strip detectors J. Härkönen1), E. Tuovinen1), P. Luukka1), T. Mäenpää1), E. Tuovinen1), E. Tuominen1), Y. Gotra2), L. Spiegel2) Helsinki Institute of Physics, Finland

More information

Chapter 5: Diffusion. 5.1 Steady-State Diffusion

Chapter 5: Diffusion. 5.1 Steady-State Diffusion : Diffusion Diffusion: the movement of particles in a solid from an area of high concentration to an area of low concentration, resulting in the uniform distribution of the substance Diffusion is process

More information

Mylar polyester film. Electrical Properties. Product Information. Dielectric Strength. Electrode Size. Film Thickness

Mylar polyester film. Electrical Properties. Product Information. Dielectric Strength. Electrode Size. Film Thickness Product Information Mylar polyester film Electrical Properties Mylar offers unique design capabilities to the electrical industry due to the excellent balance of its electrical properties with its chemical,

More information

Sputtering Targets and Sputtered Films: Technology and Markets

Sputtering Targets and Sputtered Films: Technology and Markets A BCC Research Semiconductor Manufacturing Report and Sputtered Films: SMC037E Use this report to: Understand the most important advances in sputtering technology and target fabrication Identify the current

More information

AN900 APPLICATION NOTE

AN900 APPLICATION NOTE AN900 APPLICATION NOTE INTRODUCTION TO SEMICONDUCTOR TECHNOLOGY INTRODUCTION by Microcontroller Division Applications An integrated circuit is a small but sophisticated device implementing several electronic

More information

2015-2016 Facility Rates & Expense Caps

2015-2016 Facility Rates & Expense Caps NANOFAB FEES / SERVICES Entry Fee $20.00/Day $32.10/Day Nanofab Training Fee $25.00/Hour $40.13/Hour Nanofab Process Development/Labor $50.00/Hour $80.25/Hour Model Shop $25.00/Month $40.13/Month Wafer

More information

The New PVD HI3-Technology: Latest Developments and Potential for Coining Dies.

The New PVD HI3-Technology: Latest Developments and Potential for Coining Dies. The New PVD HI3-Technology: Latest Developments and Potential for Coining Dies. Technical Forum - World Money Fair 2015, Berlin 29 th January 2015, Oerlikon The New Segment Surface Solutions Segment Manmade

More information

Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO 2

Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO 2 PUBLICATION A Effects of Plasma Activation on Hydrophilic Bonding of Si and SiO 2 Journal of The Electrochemical Society, Vol. 149, No. 6, (2002), pp. G348 G351. Reprinted by permission of ECS The Electrochemical

More information

Heat Transfer and Energy

Heat Transfer and Energy What is Heat? Heat Transfer and Energy Heat is Energy in Transit. Recall the First law from Thermodynamics. U = Q - W What did we mean by all the terms? What is U? What is Q? What is W? What is Heat Transfer?

More information

Characterization of sputtered NiO thin films

Characterization of sputtered NiO thin films Surface & Coatings Technology 198 (2005) 138 142 www.elsevier.com/locate/surfcoat Characterization of sputtered NiO thin films Hao-Long Chen a, *, Yang-Ming Lu b, Weng-Sing Hwang a a Department of Materials

More information

. Tutorial #3 Building Complex Targets

. Tutorial #3 Building Complex Targets . Tutorial #3 Building Complex Targets. Mixed Gas/Solid Targets Gas Ionization Chamber Previous Tutorials have covered how to setup TRIM, determine which ion and energy to specify for a semiconductor n-well

More information

BEAMS OF ATOMIC CLUSTERS: EFFECTS ON IMPACT WITH SOLIDS

BEAMS OF ATOMIC CLUSTERS: EFFECTS ON IMPACT WITH SOLIDS Rev.Adv.Mater.Sci. Beams of atomic clusters: 11 (2006) effects 19-45on impact with solids 19 BEAMS OF ATOMIC CLUSTERS: EFFECTS ON IMPACT WITH SOLIDS V.N. Popok and E.E.B. Campbell Department of Physics,

More information

How To Implant Anneal Ion Beam

How To Implant Anneal Ion Beam ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING MEMS Ion Implant Dr. Lynn Fuller webpage: http://people.rit.edu/lffeee Electrical and Microelectronic Engineering Rochester Institute of Technology

More information

Education of Solar Cells at Budapest University of Technology and Economics

Education of Solar Cells at Budapest University of Technology and Economics Education of Solar Cells at Budapest University of Technology and Economics Veronika Timár-Horváth, Dr. János Mizsei, Balázs Plesz OUTLINE: Education of Solar Cells at TU Budapest Description of curricula

More information

Multi-scale modelling of plasma-material interactions

Multi-scale modelling of plasma-material interactions Multi-scale modelling of plasma-material interactions T. Ahlgren, C. Björkas, K. Heinola, K. O. E. Henriksson, N. Juslin, Ane Lasa, A. Meinander, K. E. Salonen, K. Vörtler of Physics and Helsinki Institute

More information

MOLECULAR DYNAMICS INVESTIGATION OF DEFORMATION RESPONSE OF THIN-FILM METALLIC NANOSTRUCTURES UNDER HEATING

MOLECULAR DYNAMICS INVESTIGATION OF DEFORMATION RESPONSE OF THIN-FILM METALLIC NANOSTRUCTURES UNDER HEATING NANOSYSTEMS: PHYSICS, CHEMISTRY, MATHEMATICS, 2011, 2 (2), P. 76 83 UDC 538.97 MOLECULAR DYNAMICS INVESTIGATION OF DEFORMATION RESPONSE OF THIN-FILM METALLIC NANOSTRUCTURES UNDER HEATING I. S. Konovalenko

More information

Effect of PWB Plating on the Microstructure and Reliability of SnAgCu Solder Joints

Effect of PWB Plating on the Microstructure and Reliability of SnAgCu Solder Joints Effect of PWB Plating on the Microstructure and Reliability of SnAgCu Solder Joints Y. Zheng, C. Hillman, P. McCluskey CALCE Electronic Products and Systems Center A. James Clark School of Engineering

More information

An example: helium isotopes. An example: helium isotopes. Limits to Detection/Measurement. Lecture 14 Measurements II: Mass spectrometry

An example: helium isotopes. An example: helium isotopes. Limits to Detection/Measurement. Lecture 14 Measurements II: Mass spectrometry Limits to Detection/Measurement Ionization is fundamentally a Probabilistic Process Just like radioactive decay So is transmission through the analyzer There is an intrinsic statistical uncertainty Proportional

More information

Microhardness study of Ti(C, N) films deposited on S-316 by the Hallow Cathode Discharge Gun

Microhardness study of Ti(C, N) films deposited on S-316 by the Hallow Cathode Discharge Gun of Achievements in Materials and Manufacturing Engineering VOLUME 14 ISSUE 1-2 January-February 2006 Microhardness study of Ti(C, N) films deposited on S-316 by the Hallow Cathode Discharge Gun A.J. Novinrooz*,

More information

Miniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M

Miniaturizing Flexible Circuits for use in Medical Electronics. Nate Kreutter 3M Miniaturizing Flexible Circuits for use in Medical Electronics Nate Kreutter 3M Drivers for Medical Miniaturization Market Drivers for Increased use of Medical Electronics Aging Population Early Detection

More information

Electron Beam Technology for Pressure Sensitive Adhesive Applications

Electron Beam Technology for Pressure Sensitive Adhesive Applications Electron Beam Technology for Pressure Sensitive Adhesive Applications Introduction Stephen C. Lapin, Ph.D. PCT Engineered Systems LLC Davenport, IA, USA Initial reports on the use of ultraviolet (UV) and

More information