CYStech Electronics Corp.

Transcription

1 Page No. : 1/7 1A Snubber Damping Rectifier Features High current capability Smoothly soft reverse recovery time (trr) Low profile surface mounted package in order to minimize board space Pb-free lead plating and halogen-free package Mechanical data Case : Molded plastic, TO-92-2L. Epoxy : UL94-V0 rated flame retardant Terminals : Plated terminals, solderable per MIL-STD-202 method 208 Polarity : Indicated by cathode band Mounting position : Any Weight : approx. 0.2 gram Ordering Information Device Package Shipping TO-92-2L 1000 pcs / bag, 10 bags/box, -XX-BK-G (Pb-free lead plating and halogen-free package) 10 boxes/carton TO-92-2L -XX-TB-G 2000 pcs / Tape & Box (Pb-free lead plating and halogen-free package) Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, TB :2000 pcs/tape & box; BK: 1000 pcs / bag, 10 bags/box, 10 boxes/carton Product rank, zero for no rank products Product name

2 Page No. : 2/7 Symbol Outline TO-92-2L A K Absolute Maximum Ratings (TA=25, unless otherwise noted) Parameters Conditions Symbol Value Units Repetitive peak reverse voltage VRRM V RMS voltage VRMS V Continuous reverse voltage VR V Forward rectified current Single phase half wave, C IF(AV) 1 A Forward surge current 8.3ms single half sine-wave superimposed on rated load IFSM 10 A (JEDEC method) Maximum reverse recovery time IF=0.5A, IR=1.0A, IRR=0.25A trr 3 μs Storage temperature range Tstg -55~+150 C Operating junction temperature range Tj -55~+150 C Thermal Data Parameter Symbol Value Unit Thermal Resistance, Junction-to-case, max Rth,j-c 55 Thermal Resistance, Junction-to-ambient, max Rth,j-a 200 C/W

3 Page No. : 3/7 Characteristics (TA=25 C, unless otherwise noted) Characteristic Symbol Condition Min. Typ Max. Unit Breakdown Voltage VR IR=100μA V VF 1 IF=100mA Forward Voltage V VF 2 IF=500mA IR VR=620V na Reverse Leakage Current IR VR=620V, TA=125 C μa Junction Capacitance CJ VR=1V, f=1mhz pf Classification of VR Rank Range >650V >700V

4 Page No. : 4/7 Typical Characteristics 0.7 Power Derating Curve 1000 Forward Current vs Forward Voltage Power Dissipation(W) Instantaneous Forward Current---IF(mA) C 25 C Pulse width=300μs, 1% Duty cycle Ambient Temperature---TA( ) Forward Voltage---VF(V) 1000 Reverse Leakage Current vs Reverse Voltage 10 Junction Capacitance vs Reverse Voltage Reverse Leakage Current---IR(nA) Tj=125 Tj=75 Tj=25 Junction Capacitance---CJ(pF) Tj=25, f=1.0mhz Reverse Voltage---VR(V) Reverse Voltage---VR(V)

5 Page No. : 5/7 TO-92-2L Taping Outline DIM Item Millimeters Min. Max. A Component body height D Tape Feed Diameter D1 Lead Diameter D2 Component Body Diameter F1 Component Lead Pitch (5.08±0.2 mm) H Height Of Seating Plane H1 Feed Hole Location H2 Front To Rear Deflection - 1 H2A Deflection Left Or Right - 1 H3 Component Height - 27 H4 Feed Hole To Bottom Of Component - 21 L Lead Length After Component Removal - 11 L1 Lead Wire Enclosure P Feed Hole Pitch P1 Center Of Seating Plane Location P2 4 Feed Hole Pitch T Over All Tape Thickness T1 Total Taped Package Thickness T2 Carrier Tape Thickness W Tape Width W1 Adhesive Tape Width pcs Pitch

6 Page No. : 6/7 Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices /-5 C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3 C/second max. 3 C/second max. Preheat Temperature Min(TS min) Temperature Max(TS max) Time(ts min to ts max) 100 C 150 C seconds 150 C 200 C seconds Time maintained above: Temperature (TL) Time (tl) 183 C seconds 217 C seconds Peak Temperature(TP) /-5 C /-5 C Time within 5 C of actual peak temperature(tp) seconds seconds Ramp down rate 6 C/second max. 6 C/second max. Time 25 C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

7 Page No. : 7/7 TO-92-2L Dimension Marking: Style: Pin 1.Anode 2.Not Connected 3.Cathode 2-Lead TO-92-2L Plastic Surface Mounted Package CYStek Package Code: A2 DIM Millimeters Inches Millimeters Inches DIM Min. Max. Min. Max. Min. Max. Min. Max. A e TYP TYP A e b L c L D Φ D h E Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: Lead: Pure tin plated. Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. CYStek reserves the right to make changes to its products without notice. CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.