Base Order Number 6AG ES7647-6C... Availability 01/2014 Available now

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1 Product Attributes of SIMATIC IPC627D in Detail The following lists the new product attributes, which for clarification are compared with the attributes of the existing SIMATIC IPC627C. The differences are highlighted in gray. Product Name Platform SIMATIC IPC627D (New) Intel Xeon Processor 4th Generation Intel Core i Processor SIMATIC IPC627C (Presently) 1st Generation Intel Core i Processor Base Order Number 6AG ES7647-6C... Availability 01/2014 Available now Form Factor Compact Box PC Compact Box PC Processor Xeon Processor E3-1268L v3 4 Cores, 8 Threads, 2.3 (3.3) GHz, TB, HT, VT-x, VT-d, AMT, 8 MB Cache Core i7-620e 2 Cores, 4 Threads, 2.53 (3.2) GHz, TB, HT, VT-x, VT-d, AMT, 4 MB Cache Core i3-4330te 2 Cores, 4 Threads, 2.4 GHz, HT, VT-x, 4 MB Cache Core i3-330e 2 Cores, 4 Threads, 2.13 GHz, HT, VT-x, 3 MB Cache Celeron G1820TE 2 Cores, 2 Threads, 2.2 GHz, 2 MB Cache Celeron P Cores, 2 Threads, 1.86 GHz, 2 MB Cache Chipset Intel DH82C226 PCH Intel BD82QM57 PCH Main Memory From 2 GB From 1 GB DDR PC DDR Expandable up to 16 GB Expandable up to 8 GB 2 DIMM slots 2 DIMM slots ECC optional ECC optional Expansion Slots 2 x PCI (185 / 185 mm) 2 x PCI (290 / 185 mm)

2 or 1 x PCI / 1 x PCIe x16 (185 / 185 mm) or 1 x PCI / 1 x PCIe x16 (290 / 185 mm) PCI Rev. 2.3 PCIe Rev. 2.1 and Rev. 3.0 PCI Rev. 2.3 PCIe Rev. 2.1 Graphics Graphics Controller Intel HD 4x00 Graphics with Intel HD Graphics with Dynamic Dynamic Frequency, integrated Frequency, integrated into the into the Chipset Chipset Video Memory Up to 512 MB Up to 256 MB (Shared Memory) (Shared Memory) Resolution 1920 x 1200 Pixels 1280 x 1024 Pixels Frequency 100 Hz 100 Hz Color Depth 32-Bit 32-Bit Operating System Without Windows XP No Prof. MUI (preinstalled & activated) Windows 7 Ultimate 32-Bit MUI (preinstalled & activated) (preinstalled & activated) Windows 7 Ultimate 64-Bit MUI (preinstalled & activated) (preinstalled & activated) Windows 8-2nd Delivery Stage: Mid-./. Prof. 64-Bit 2014 Windows Embedded No Standard Bit On 8 GB Siemens (XPe) CompactFlash (preinstalled & activated) Windows Embedded - 2nd Delivery Stage: Mid-./. Standard 7 (WES7) Bit On 8 GB CFast Memory Card (preinstalled & activated) Power Supply 120/230 V AC Wide-Range 24 V DC Mains Switch / / / On/Off Switch./.

3 Drives Hard Disk Drive (HDD) Solid-State Drive (SSD) Flash Drive (externally accessible) RAID1 Controller Serial-ATA Serial-ATA 250 GB, 3.5" or 250 GB, 3.5" or 500 GB, 3.5" or 500 GB, 3.5" or No 2 x 250 GB, 2.5" or RAID1, 2 x 250 GB, 2.5" RAID1, 2 x 250 GB, 2.5" or 2nd Delivery Stage: Mid RAID1 on 2 x Removable HDD SSD 240GB, 2.5" SATA MLC SSD 50GB, 2.5" SATA SLC 2 x CFast (optional, 2nd Delivery 1 x CompactFlash Stage) 1 x CompactFlash (optional, internal) Intel Rapid Storage Technology Intel Rapid Storage Technology integrated into the Chipset integrated into the Chipset Optical Drive (ODD) ±R/RW/-DL/-RAM ±R/RW/-DL/-RAM Interfaces PROFINET PROFINET, 3 x RJ45, CP1616- compatible (onboard, optional) PROFINET, 3 x RJ45, CP1616- compatible (onboard, optional) PROFIBUS/MPI 12 Mbit/s, CP5622-compatible (onboard, optional) 12 Mbit/s, CP5611-compatible (onboard, optional) Ethernet 2 x Gigabit Ethernet (IE/PN), RJ45, teaming-enabled 2 x Gigabit Ethernet (IE/PN), RJ45, teaming-enabled USB 4x USB 3.0 SuperSpeed, 500 MB/s 4 x USB 2.0 HighSpeed, 60 MB/s DisplayPort (DP)./. VGA/DVI 1 x DVI-I (analog & digital) VGA via Adapter Cable (Accessory) 1 x DVI-I (analog & digital) VGA via Adapter Cable (Accessory) Dual-Monitoring DP and DVI 1 x VGA, 1 x DVI-D via DVI-I to VGA/DVI-D Y-Adapter (Accessory) Serial 1 x RS232 (COM1) 1 x RS232 (COM1) Monitoring Functions Temperature - Temperatures inside PC - Temperatures inside PC

4 - External Temperature - External Temperature Fan rpm BIOS Battery Watchdog Monitoring Software SIMATIC PC DiagBase SIMATIC PC DiagBase (included in the Delivery Scope) (included in the Delivery Scope) SIMATIC PC DiagMonitor SIMATIC PC DiagMonitor Environmental Conditions Vibration during Operation according to DIN IEC to 58 Hz: mm, 58 to 500 Hz: 9.8 m/s 2 approx. 1 g 10 to 58 Hz: mm, 58 to 500 Hz: 9.8 m/s 2 approx. 1 g Shock during Operation according to IEC , IEC Temperature during Operation according to IEC , IEC , IEC m/s 2, 30 ms approx. 5 g and removable HDD +5 to +45 C +5 to +50 C Slots: 20 W) 50 m/s 2, 30 ms approx. 5 g +5 to +45 C +5 to +50 C Slots: 20 W) +5 to +55 C Slots: 10 W) +5 to +55 C Slots: 10 W) Relative Humidity - during Operation 5 to 80% at 25 C 5 to 80% at 25 C

5 - during Storage/Transport 5 to 95% at 25 C 5 to 95% at 25 C according to IEC , IEC Other Enclosure Chromated, new Lid Concept for Galvanized simplified access to PC Cards and PC Components Battery-backed SRAM Memory 2 MB onboard (Fieldbus Models: max. 128 KB usable by WinAC RTX) 2 MB onboard (Fieldbus Models: max. 128 KB usable by WinAC RTX) NAU Signal for the, with AC and DC Models, with AC and DC Models Detection of Power Loss (WinAC RTX) CMOS Battery Service-friendly, easy to replace from the Outside Service-friendly, easy to replace from the Outside Wake-On-LAN Interface Modules 1 x COM2/LPT - in Faceplate PCI Interface Card for COM2, LPT (PC Accessory) 2 x USB- in Faceplate Requires one PC Slot each Portrait Mounting Interfaces exit at the Top or Bottom (PC Accessory) Not released for Operation Interfaces exit at the Top or Bottom (PC Accessory) Not released for Operation Portrait Mounting - Front Interfaces exit to the Front (PC Accessory) Interfaces exit to the Front (PC Accessory) Component Sticker Sticker listing PC Components (Processor, HDD,...) affixed to Enclosure Sticker listing PC Components (Processor, HDD,...) affixed to Enclosure Fans For active Heat Dissipation 1 x Enclosure 1 x Power Supply For active Heat Dissipation 1 x Enclosure 1 x Power Supply Mounting Positions 5 Mounting Possibilities 5 Mounting Possibilities Cable Strain Relief 1 x for 24 V or 230 V Cable 1 x for 24 V or 230 V Cable

6 1 x for each USB and Ethernet Interface (included in the Delivery Scope) 1 x for each USB and Ethernet Interface (included in the Delivery Scope) Dimensions and Weight Mounting Dimensions (W x H x D, mm) 312 x 301 x x 301 x 80 (without ) 312 x 301 x x 301 x 80 (without ) (incl. Mounting Rail) Weight approx. 6 kg approx. 6 kg New Technology and Explanations Feature Description Xeon Core i3 Celeron Turbo Boost (TB) Intel HD Graphics with Dynamic Frequency Core (C) Thread (T) Hyper-Threading (HT) The Intel Turbo Boost (TB) technology enables an overclocking of the clock rate of the cores - subject to the processor overall load and ambient temperature. This increases the processor performance. - Xeon: 2.53 GHz to max. 3.3 GHz Similar to Turbo Boost, this graphics technology can significantly increase the graphics performance under certain conditions. Graphics Base Frequency / Graphics max. Dynamic Frequency: Xeon: 350 MHz / 1000 MHz Core i3: 200 MHz / 1100 MHz These are the individual hardware processor cores. - Xeon: 4 Cores - Core i3, Celeron: 2 Cores (2C) each Threads are program parts that can be processed in parallel. The Intel Hyper-Threading technology enables the parallel processing of two programs (threads) on one core. X - - X X - X X - Xeon: 4 Cores/8 Threads (2C/4T), i.e., when using four

7 cores, up to eight programs can be simultaneously executed. Intel Virtualization Technology for Directed I/O (VT-d) Intel Virtualization Technology (VT-x) Error Correction Code (ECC) Platform Controller Hub (PCH) Active Management Technology (AMT) Trusted Platform Module (TPM) Celeron: 2C/2T: Two programs can be simultaneously executed on two cores - no Hyper-Threading. Expanded virtualization technology with access to hardware components by means of directed I/O. (Innovation of VT-x). Standard virtualization technology (makes available special commands) Enables the detection of main memory errors and the correction of 1-bit errors. Feature of the PCH and the memory hardware. Succeeds the well-known Intel chipsets (northbridge/southbridge). The memory controller is integrated into the PCH, which no longer has a northbridge. This architecture increases the performance. Intel technology for the remote access/service access to another computer. The TPM is a special chip on the motherboard that substantially expands the security functions of a computer: Protection against manipulations on the software side and unauthorized third parties. X - - X X - X - -

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