TVN S AB0 Engineering Specification

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1 TVN S3 A Scope TVN S3 A s are TVS diodes designed to protect one power/control line or one low speed signal line from overvoltage hazard of Electrostatic Discharge (ESD), Electrical Fast Transients (EFT) and Lightning. These interfaces can be used in computer interfaces protection, microprocessors protection, serial and parallel ports protection, control signal lines protection, power lines on PC protection, latchup protection, etc. The ESD protection of TVS arrays meets the immunity standard of IEC 6-4-, level 4 (±kv air, ±8kV contact discharge). Explanation of Part Number TV N S3 A () () (3) (4) () () Product Type:TV=TVS Diode () Capacitance Code:N=Normal Capacitance (3) Package Size Code (4) Channel Code:= Channels () Specialized Specification Code 3. Circuit Diagram /Pin Configuration SOD-3 (Top View) TITLE : TVN S3 A SPEC REV.: A Page of

2 4. Specifications 4. ASOLUTE MAXIMUM RATINGS PARAMETER PARAMETER RATING UNITS Peak Pulse Current (tp =8/μs) I PP 8. A Operating Supply (pin-,- to pin-3) V DC 6 V ESD per IEC 6-4- (Air) ESD per IEC 6-4- (Contact) V ESD- ± ± Lead Soldering Temperature T SOL 6 ( sec.) Operating Temperature T OP - to + Storage Temperature T STO - to + kv 4. ELECTRICAL CHARACTERISTICS PARAMETER SYMOL CONDITIONS MINI TYP MAX UNITS Reverse Stand-Off V RWM T=. V Reverse Leakage Current Reverse reakdown I Leak V RWM = V, T=.. μa V V I V = ma, T= V Clamping V CL I PP =A, tp=8/μs, T=. 7 8 V Clamping V CL I PP =7A, tp=8/μs, T=. 8 9 V ESD Holding V hold IEC kV, T=, Contact mode. Channel Input Capacitance. V C IN V R = V, f = MHz, T=.. 3. pf TITLE : TVN S3 A SPEC REV.: A Page of

3 4.3 TYPICAL CHARACTERISTICS Clamping (V) Clamping vs. Peak Pulse Current Peak pulse Current (A) Waveform Parameters: tr=8μs td=μs Capacitance (pf) Typical Variation C IN vs V IN 4 f= MHz ias (V) Transmission Line Pulsing (TLP) Measurement V_pulse Pulse from a transmission line TLP_I ns + TLP_V DUT Transmission Line Pulsing (TLP) (V). LAND LAYOUT.8mm.6mm.9mm.6mm Notes: This LAND LAYOUT is for reference purposes only. Please consult your manufacturing partners to ensure your company s PC design guidelines are met. TITLE : TVN S3 A SPEC REV.: A Page 3 of 3

4 6. Application information In order to obtain enough suppression of ESD induced transient, good circuit board is critical. Thus, the following guidelines are recommended: Minimize the path length between the protected lines and this device. Place this device near the input terminals or connectors to restrict transient coupling. The ESD current return path to ground should be kept as short as possible. Use ground planes whenever possible. NEVER route critical signals near board edges and near the lines which the ESD transient easily injects to. V R Normal Operation -V R Input Output V R V CL Transient -V R -V CL Protected Devices 7. MARKING CODE: Marking Code:aX ax a = Device Code X = Date Code TITLE : TVN S3 A SPEC REV.: A Page 4 of 4

5 8. Mechanical Details SOD-3 PACKAGE DIAGRAMS 8. Taping Quantity: 3,pcs/ Reel ( for 7 Reel) TITLE : TVN S3 A SPEC REV.: A Page of

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