SL05 through SL24. Low Capacitance TVS Diode For High Speed Data Interfaces. PROTECTION PRODUCTS Description. Features. Mechanical Characteristics

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1 Description The SL series of TS arrays are designed to protect sensitive electronics from damage or latchup due to ESD, lightning, and other voltageinduced transient events. They are available with operating voltages of 5, 12, 15 and 24. TS diodes are solidstate devices designed specifically for transient suppression. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The SL series devices feature a low capacitance, fast switching compensation diode in series with a standard TS diode. This effectively reduces the overall capacitance of the device to less than 5pF making it an integrated, low capacitance solution for use on highspeed interfaces. The SL series devices may be used to meet the immunity requirements of IEC 60042, level 4. SL05 through SL24 Low TS Diode For High Speed Data Interfaces Features Transienrotection for highspeed data lines to IEC (ESD) ±15k (air), ±8k (contact) IEC (EFT) 40 (5/50ns) IEC (Lightning) 12 (8/20µs) Small package for use in portable electronics Two devices will protect one line Low capacitance for highspeed data lines Working voltages: 5, 12, 15 and 24 Solidstate silicon avalanche technology Mechanical Characteristics JEDEC SOT23 package Molding compound flammability rating: UL 940 Marking : Marking Code ackaging : Tape and Reel per EI 481 pplications HighSpeed data lines Cellular handsets ND accessories Universal Serial us (US) porrotection ortable instrumentation LN/WN equipment eripherals Circuit Diagram Schematic & IN Configuration 1 3 (N.C.) 2 SOT23 Top iew Revision 09/23/04 1

2 bsolute Rating Rating alue ulse ower (t = 8/20µs) p k p 00 3 Watts ESD oltage (HM per IEC 60042) ESD 25 > k Lead Soldering Temperature T L 260 ( sec. ) C Operating Temperature T J 55 to +125 C Storage Temperature T STG 55 to +150 C Electrical Characteristics SL05 arameter StandOff oltage RWM 5 reakdown oltage R = 1m 6 RWM = 5, T=25 C 20 µ oltage C = 1, 9.8 oltage C = 5, 11 ulse Current in 1 to 2 = 0, f = 1MHz 17 I R SL12 arameter StandOff oltage WM reakdown oltage R 2 R 1 = 1m RWM = 12, T=25 C 1 µ oltage C = 1, 19 oltage C = 5, 24 ulse Current in 1 to 2 = 0, f = 1MHz 12 I R 2004 Semtech Corp. 2

3 Electrical Characteristics (Continued) SL15 arameter StandOff oltage WM reakdown oltage R 5 R 1 = 1m RWM = 15, T=25 C 1 µ oltage C = 1, 24 oltage C = 5, 30 ulse Current in 1 to 2 = 0, f = 1MHz I R SL24 arameter StandOff oltage WM reakdown oltage R 4 R 2 = 1m RWM = 24, T=25 C 1 µ oltage C = 1, 43 oltage C = 5, 55 ulse Current in 1 to 2 = 0, f = 1MHz 5 I R 2004 Semtech Corp. 3

4 Characteristics ulse ower pk (kw) NonRepetitive ulse ower vs. ulse Time ulse Duration (µs) % of Rated ower or I ower Derating Curve mbient Temperature T ( o C) ulse Waveform ercent of I e t td = I/2 Waveform arameters: tr = 8µs td = 20µs Time (µs) ESD ulse Waveform (er IEC 60042) IEC Discharge arameters Level First Current () Current at 30 ns () Current at 60 ns () Test oltage (Contact Discharge) (k) Test oltage (ir Discharge) (k) Semtech Corp. 4

5 pplications Information Device Connection for rotection of One HighSpeed Data Line The SL series devices are designed to protect highspeed data lines. The SLxx utilizes a low capacitance compensation diode in series with, but in opposite polarity to a TS diode in each line to achieve an effective capacitance of less than 5pF per device. During a transient event, the internal rectifier must be forward biased (TS is reversed biased). Therefore, each device will only suppress transient events in one polarity. To achieve protection in both positive and negative polarity, a second device is connected in antiparallel to the first. On unidirectional lines, a fast switching steering diode may be used as an alternative to using two SL devices. The options for connecting the devices are as follows: Low capacitance protection of one highspeed line: rotection of one unidirectional or bidirectional highspeed line is achieved by connecting two devices in antiparallel. in 1 of the first device is connected to the line and pin 2 is connected to ground (or to a second line for differential protection). in 2 of the second device is connected to line 1 and pin 1 is connected to ground (or line 2) as shown. in 3 is not connected. During positive duration transients, the first device will conduct from pin 1 to 2. The steering diode conducts in the forward direction while the TS will avalanche and conduct in the reverse direction. During negative transients, the second device will conduct in the same manner. For optimum protection, the ground connections should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. The path length between the TS and the protected line should also be minimized. Connection Option for Unidirectional Lines Only: n optional method for protecting unidirectional (normal signal polarities above ground) lines is to add a fast switching steering diode in parallel to the SL TS. Input/outputs are connected to pin 1 of the SL device and the cathode of the rectifier. The anode of the diode and pin 2 of the SL TS are connected to ground. SL Connection Options Two Devices : idirectional or Unidirectional Line One Devices with Steering Diode : Unidirectional Line I/O Line rotection Matte Tin Lead Finish Matte tin has become the industry standard leadfree replacement for Snb lead finishes. matte tin finish is composed of 0% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the C, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both leadfree and Snb assembly techniques. In addition, unlike other leadfree compositions, matte tin does not have any added alloys that can cause degradation of the solder joint Semtech Corp. 5

6 Outline Drawing SOT23 3L D e e E1 bxn bbb E C SETING LNE C GUGE LNE 0.25 H DETIL L L1 0 c DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MX MIN NOM MX b c D E E e SC e SC L L1.022 (0.55) N aaa bbb X aaa C SETING LNE SIDE IEW SEE DETIL 1 C NOTES: 1. CONTROLLING DIMENSIONS RE IN MILLIMETERS (NGLES IN DEGREES). 2. DTUMS ND TO E DETERMINED T DTUM LNE H 3. DIMENSIONS "E1" ND "D" DO NOT INCLUDE MOLD FLSH, ROTRUSIONS OR GTE URRS. Land attern SOT23 3L X Z Y Y G C DIMENSIONS DIM INCHES MILLIMETERS C (.087) (2.20) E E G X Y Z NOTES: E1 1. THIS LND TTERN IS FOR REFERENCE UROSES ONLY CONSULT YOUR MNUFCTURING GROU TO ENSURE YOUR COMNY'S MNUFCTURING GUIDELINES RE MET. 2. REFERENCE ICSM782. E 2004 Semtech Corp. 6

7 Marking Codes art Number Marking Code SL05 L05 SL12 L12 SL15 L15 SL24 L24 Ordering Information art Number Lead Finish Qty per Reel Reel Size SL05.TC SL12.TC SL15.TC SL24.TC SL05.TCT SL12.TCT SL15.TCT SL24.TCT Snb Snb Snb Snb b b b b Contact Information Semtech Corporation rotection roducts Division 200 Flynn Road, Camarillo, C hone: (805) FX (805) Semtech Corp. 7