MC74VHC86. MARKING DIAGRAMS. Features FUNCTION TABLE
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1 MC74C86 Quad 2-Input XOR Gate The MC74C86 is an advanced high speed CMOS 2 input Exclusive OR gate fabricated with silicon gate CMOS technology. It achieves high speed operation similar to equivalent Bipolar Schottky TT while maintaining CMOS low power dissipation. The internal circuit is composed of three stages, including a buffer output which provides high noise immunity and stable output. The inputs tolerate voltages up to 7, allowing the interface of 5 systems to 3 systems. Features igh Speed: t PD = 4.8 ns (Typ) at CC = 5 ow Power Dissipation: I CC = 2 A (Max) at T A = 25 C igh Noise Immunity: NI = NI = 28% CC Power Down Protection Provided on Inputs Balanced Propagation Delays Designed for 2 to 5.5 Operating Range ow Noise: OP = 0.8 (Max) Pin and Function Compatible with Other Standard ogic Families atchup Performance Exceeds 300 ma ESD Performance: uman Body Model (BM) > 2000 ; Machine Model > 200 Chip Complexity: 56 FETs or 4 Equivalent Gates N Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Q00 Qualified and PPAP Capable These Devices are Pb Free and are RoS Compliant A B A2 B2 A3 B3 A4 B Figure. ogic Diagram 3 Y 6 Y2 8 Y = A B Y3 Y4 CC B4 A4 Y4 B3 A3 Y SOIC 4 D SUFFIX CASE 75A TSSOP 4 DT SUFFIX CASE 948G MARKING DIAGRAMS A = Assembly ocation W, = Wafer ot Y, YY = Year WW, W = Work Week G or = Pb Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. 4 4 FUNCTION TABE Inputs C86G AWYWW C 86 AYW Output A B Y A B Y A2 B2 Y2 GND Figure 2. Pinout: 4 ead Packages (Top iew) Semiconductor Components Industries, C, 204 September, 204 Rev. 7 Publication Order Number: MC74C86/D
2 MC74C86 MAXIMUM RATINGS SymbolÎÎ Parameter Î alue Unit CC ÎÎ DC Supply oltage Î 0.5 to +7.0 in ÎÎ DC Input oltage Î 0.5 to +7.0 out ÎÎ DC Output oltage Î 0.5 to CC +0.5 I IK ÎÎ Input Diode Current Î 20 ma I OK ÎÎ Output Diode Current Î 20 ma I out ÎÎ DC Output Current, per Pin Î 25 ma I CC ÎÎ DC Supply Current, CC and GND Pins Î 50 ma P D ÎÎ Power Dissipation in Still Air, SOIC Package Î Î 500 TSSOP Package Î 450 mw T stg ÎÎ Storage Temperature Î 65 to +50 C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Derating SOIC Package: 7 mw/ C from 65 to 25 C TSSOP Package: 6. mw/ C from 65 to 25 C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. owever, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high impedance circuit. For proper operation, in and out should be constrained to the range GND ( in or out ) CC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or CC ). Unused outputs must be left open. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Î Min Î Max Unit CC DC Supply oltage Î 2.0 Î 5.5 in DC Input oltage Î 0 Î 5.5 out DC Output oltage Î 0 Î CC T A Operating Temperature, All Package Types Î 55 Î +25 C t r, t f Input Rise and Fall Time CC = 3.3 ±0.3 Î 0 Î 00 ns/ CC = 5.0 ±0.5 Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability
3 MC74C86 ÎÎ DC EECTRICA CARACTERISTICS ÎÎ T A = 25 C T A = 55 C to ÎÎ CC +25 C Symbol Parameter Test Conditions Min Typ Max Min Max Unit I igh evel Input ÎÎ oltage Î Î.50 ÎÎ 3.0 to CC x 0.7Î CC x 0.7ÎÎ 5.5 I ow evel Input oltage to 0.50 CC x CC x ÎÎ O igh evel Output oltage in = I or I I O = 50 A ÎÎ ÎÎ in = I or I I O = 4 I O = 8 ma ÎÎ O ow evel Output in = I or I oltage I O = 50 A ÎÎ in = I or I Î I O = 4 ma 3.0 Î I O = 8 ma ÎÎ I in Input eakage Current in = 5.5 or GND 0 to 5.5 ±0. ±.0 A ÎÎ I CC Quiescent Supply in = CC or GND Î A Current Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. Î AC EECTRICA CARACTERISTICS (Input t r = t f = 3.0ns) Î T T A = 25 C ÎÎ A = 55 C to +25 C ÎÎ Symbol Î Parameter Test Conditions Min Typ Max Min Max ÎÎ Unit t P, Î Propagation Delay, A or B to Y CC = 3.3 ± 0.3 C = 5 pf ÎÎ t P C = 50 pf ÎÎ ÎÎ ÎÎ ns Î CC = 5.0 ± 0.5 C = 5 ÎÎ pf ÎÎ C = 50 pf Î C in Input Capacitance pf C PD Power Dissipation Capacitance (Note.) 25 C, CC = 5.0. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I CC(OPR) = C PD CC f in + I CC / 4 (per gate). C PD is used to determine the no load dynamic power consumption; P D = C PD CC 2 f in + I CC CC. 8 pf NOISE CARACTERISTICS (Input t r = t f = 3.0ns, C = 50 pf, CC = 5.0, Measured in SOIC Package) T A = 25 C Symbol Characteristic Typ Max Unit OP Quiet Output Maximum Dynamic O O Quiet Output Minimum Dynamic O ID Minimum igh evel Dynamic Input oltage 3.5 ID Maximum ow evel Dynamic Input oltage.5 3
4 MC74C86 ORDERING INFORMATION MC74C86DR2G Device Package Shipping SOIC / Tape & Reel MC74C86DTG MC74C86DTR2G TSSOP 4 TSSOP 4 96 Units / Rail 2500 / Tape & Reel NC86ADTR2G* TSSOP / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D. *N Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Q00 Qualified and PPAP Capable. TEST POINT A or B 50% t P t P CC GND DEICE UNDER TEST OUTPUT C * Y 50% CC *Includes all probe and jig capacitance Figure 3. Switching Waveforms Figure 4. Test Circuit INPUT Figure 5. Input Equivalent Circuit 4
5 MC74C86 PACKAGE DIMENSIONS SOIC 4 CASE 75A 03 ISSUE K M B M e D 7 3X b A B E 0.25 M C A S B S A A C SEATING PANE DETAI A h X 45 M A3 DETAI A NOTES:. DIMENSIONING AND TOERANCING PER ASME Y4.5M, CONTROING DIMENSION: MIIMETERS. 3. DIMENSION b DOES NOT INCUDE DAMBAR PROTRUSION. AOWABE PROTRUSION SA BE 0.3 TOTA IN EXCESS OF AT MAXIMUM MATERIA CONDITION. 4. DIMENSIONS D AND E DO NOT INCUDE MOD PROTRUSIONS. 5. MAXIMUM MOD PROTRUSION 0.5 PER SIDE. MIIMETERS INCES DIM MIN MAX MIN MAX A A A b D E e.27 BSC BSC h M SODERING FOOTPRINT* X.8.27 PITC 4X 0.58 DIMENSIONS: MIIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. 5
6 MC74C86 PACKAGE DIMENSIONS 0.5 (0.006) T 0.5 (0.006) T 0.0 (0.004) T SEATING PANE U U S 2X /2 PIN IDENT. S D C 4 G 4X K REF A 0.0 (0.004) M T U S S 8 7 B U N J J TSSOP 4 DT SUFFIX CASE 948G ISSUE B N F DETAI E DETAI E 0.25 (0.00) K K M ÇÇÇ ÉÉÉ SECTION N N SODERING FOOTPRINT* W NOTES:. DIMENSIONING AND TOERANCING PER ANSI Y4.5M, CONTROING DIMENSION: MIIMETER. 3. DIMENSION A DOES NOT INCUDE MOD FAS, PROTRUSIONS OR GATE BURRS. MOD FAS OR GATE BURRS SA NOT EXCEED 0.5 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCUDE INTEREAD FAS OR PROTRUSION. INTEREAD FAS OR PROTRUSION SA NOT EXCEED 0.25 (0.00) PER SIDE. 5. DIMENSION K DOES NOT INCUDE DAMBAR PROTRUSION. AOWABE DAMBAR PROTRUSION SA BE 0.08 (0.003) TOTA IN EXCESS OF TE K DIMENSION AT MAXIMUM MATERIA CONDITION. 6. TERMINA NUMBERS ARE SOWN FOR REFERENCE ONY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PANE W. MIIMETERS INCES DIM MIN MAX MIN MAX A B C D F G 0.65 BSC BSC J J K K BSC BSC M PITC 4X X.26 DIMENSIONS: MIIMETERS ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, C (SCIC) or its subsidiaries in the United States and/or other countries. SCIC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCIC s product/patent coverage may be accessed at Marking.pdf. SCIC reserves the right to make changes without further notice to any products herein. SCIC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCIC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCIC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCIC does not convey any license under its patent rights nor the rights of others. SCIC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCIC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCIC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCIC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCIC was negligent regarding the design or manufacture of the part. SCIC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBICATION ORDERING INFORMATION ITERATURE FUFIMENT: iterature Distribution Center for ON Semiconductor P.O. Box 563, Denver, Colorado 8027 USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderlit@onsemi.com N. American Technical Support: Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order iterature: For additional information, please contact your local Sales Representative MC74C86/D
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