uclamp1201p μclamp TM 1-Line ESD protection PROTECTION PRODUCTS - MicroClamp TM Description Features Mechanical Characteristics Applications

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1 - MicroClamp TM Description The μclamp TM series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and PDAs. It features large cross-sectional area junctions for conducting high transient currents. It offers superior electrical characteristics such as lower clamping voltage and no device degradation when compared to MLVs. They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The μclamp TM 121P is in a 2-pin, RoHS/WEEE compliant, SLP16P2 package. It measures 1. x.6 x.5. The leads are spaced at a pitch of.65 and are finished with lead-free NiPdAu. Each device will protect one line operating at 12 volts. It gives the designer the flexibility to protect single lines in applications where arrays are not practical. They may be used to meet the ESD iunity requirements of IEC , Level 4 (±15kV air, ±8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and MP3 players. Dimensions uclamp121p μclamp TM 1-Line ESD protection Features Transient protection for data lines to IEC (ESD) ±15kV (air), ±8kV (contact) IEC (EFT) 4A (tp = 5/5ns) Cable Discharge Event (CDE) Ultra-small package (1. x.6 x.5) Protects one I/O or power line Low clamping voltage Working voltage: 12V Low leakage current Solid-state silicon-avalanche technology Mechanical Characteristics SLP16P2 package RoHS/WEEE Compliant Nominal Dimensions: 1. x.6 x.5 Lead Finish: NiPdAu Molding compound flaability rating: UL 94V- Marking: Marking code, cathode band Packaging: Tape and Reel Applications Cellular Handsets & Accessories Personal Digital Assistants (PDAs) Notebooks & Handhelds Portable Instrumentation Digital Cameras Peripherals MP3 Players Schematic & PIN Configuration Revision 1/7/29 Nominal Dimensions () SLP16P2 (Bottom View) 1

2 Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 8/2μs) M aximum Peak Pulse Current ( tp = 8/2μs) P pk 2 Watts I pp 8 Amps ESD per IEC ESD per IEC (Air) (Contact) V PP +/- 2 +/- 15 kv Operating Temperature T J -55 to +125 C Storage Temperature T STG 55 to C Electrical Characteristics (T=25 o C) Parameter Symbol Conditions Minimum Typical Maximum Units Reverse Stand-Off V WM R 2 1 V Reverse Breakdown V R B I t = 1mA V Reverse Leakage Current I R V RWM = 12V, T=25 C.1 1 μa Forward V F I F = 1mA. 8 V Clamping V C I PP = 1A, t = 8/2μs p 19 V Clamping V C I PP = 8A, t = 8/2μs p 25 V Junction Capacitance C j V R = V, f = 1MHz 6 pf 29 Semtech Corp. 2

3 Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve Peak Pulse Power - P PP (kw) Pulse Duration - tp (us) % of Rated Power or I PP Ambient Temperature - T A ( o C) Clamping vs. Peak Pulse Current Forward vs. Forward Current 25 3 Clamping - V C (V) Waveform Parameters: tr = 8μs td = 2μs Forward - V F (V) Waveform Parameters: tr = 8μs td = 2μs Peak Pulse Current - I PP (A) Forward Current - I F (A) Normalized Junction Capacitance vs. Reverse ESD Clamping (8kV Contact per IEC ) f = 1 MHz.9 CJ(VR) / CJ(VR=) Reverse - V R (V) Note: Data is taken with a 1x attenuator 29 Semtech Corp. 3

4 Applications Information Device Connection Options These TVS diodes are designed to protect one data, I/O, or power supply line. The device is unidirectional and may be used on lines where the signal polarity is above ground. The cathode band should be placed towards the line that is to be protected. Circuit Diagram Circuit Board Layout Recoendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recoended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. 29 Semtech Corp. 4

5 Applications Information - Spice Model uclamp121p Spice Model uclamp121p Spice Parameters Parameter IS BV VJ RS IBV CJO TT U nit D1 (TVS) Amp 1.48E-14 Volt Volt.723 Ohm.772 Amp 1.E-3 Farad 52E-12 sec 2.541E- 9 M N EG ev Semtech Corp. 5

6 Outline Drawing - SLP16P2 A D B aaa C A1 TOP VIEW E A C SEATING PLANE DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX A A b D E e.26 BSC.65 BSC L R N 2 2 aaa.3.8 bbb.4.1 PIN 1 ID bxn bbb C A B R e 2x L BOTTOM VIEW NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). Land Pattern - SLP16P2 (C) G Z X Y DIMENSIONS DIM INCHES MILLIMETERS C (.33) (.85) G X Y Z NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 29 Semtech Corp. 6

7 Marking Code Ordering Information Part Number Working Qty per Reel Reel Size 2P PIN 1 ID uclamp121p.tct 12V 3, 7 Inch Notes: 1) This is a lead-free, RoHS/WEEE compliant product MicroClamp, uclamp and μclamp are marks of Semtech Corporation Tape and Reel Specification Cathode Bar User Direction of feed Device Orientation in Tape A B K.69 +/ / /-.1 Tape Width B, (Max) D D1 E F P P P2 T W (.165) ( ).4 ±.25 (.31) 1.75±.1 (.69±.4) 3.5±.5 (.138±.2) 4.±.1 (.157±.- 4) 4.±.1 (.157±.- 4) 2.±.5 (.79±.2).254±.2 (.16) (.312±.12) Contact Information Semtech Corporation Protection Products Division 2 Flynn Rd., Camarillo, CA 9312 Phone: (85) FAX (85) Semtech Corp. 7

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