IMPORTANT NOTICE: This part is no longer recommended for new designs; please use IR2175, IR2177, IR21771, IR2277 or IR V OFFSET I QBS.

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1 Features Floating channel up to +00V Monolithic integration Overcurrent sensing through shunt resistor Low IQBS allows the boot strap power supply Independent fast 1µsec overcurrent trip signal High common mode noise immunity Input overvoltage protection for IGBT short circuit condition Open Drain outputs Available in Lead-Free Description IR2170(S) is the monolithic over current sensing IC designed for motor drive applications. It senses the motor phase current through an external shunt resistor, detects overcurrent condition, and transfers the signal to the low side. IR s proprietary high voltage isolation technology is implemented to enable the high bandwidth signal processing. The dedicated overcurrent trip () signal facilitates IGBT short circuit protection. The output pulse width can be programmed by the external resistor and capacitor. The open-drain outputs make easy for any interface from 3.3V to 1V. Typical Application Vdd +1V Data Sheet No. PD018 reve IMPORTANT NOTICE: This part is no longer recommended for new designs; please use IR217, IR2177, IR21771, IR2277 or IR Ω OVER CURRENT SENSING IC Product Summary V OFFSET I QBS Overcurrent trip signal delay Overcurrent trip level Packages 8-Lead SOIC IR2170(S) & (PbF) DC Bus (up to 00V) 00Vmax 1mA 1.usec (typ) +/-20mV (typ.) 8-Lead PDIP 1 k (typ) V CC + V B V IN+ 10 uf 0.47 uf 10 nf (DGND) (AGND) V IN- V S R SENSE To Motor Phase IR2170 (Circuit Common = DC Bus Negative) (Refer to Lead Assignments for correct pin configuration). This/These diagram(s) show electrical connections only. Please refer to our Application Notes and DesignTips for proper circuit board layout.

2 Absolute Maximum Ratings Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are absolute voltages referenced to, all currents are defined positive into any lead. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions. Symbol Definition Min. Max. Units V S High side offset voltage V BS High side floating supply voltage V CC Low side and logic fixed supply voltage V IN Maximum input voltage between V IN+ and V IN- - V Overcurrent output voltage -0.3 VCC +0.3 V IN- V IN- input voltage (note 1) V S - V B+ 0.3 dv/dt Allowable offset voltage slew rate 0 V/ns P D Package power T A +2 C 8 lead SOIC.2 8 lead PDIP 1.0 W Rth JA Thermal resistance, junction to ambient 8 lead SOIC lead PDIP 12 C/W T J Junction temperature 10 T S Storage temperature - 10 C T L Lead temperature (soldering, 10 seconds) 300 Note 1: Capacitors are required between VB and Vin-, and between VB and Vs pins when bootstrap power is used. The external power supply, when used, is required between Vs and Vin-, and between VB and Vs pins. V Recommended Operating Conditions The output logic timing diagram is shown in figure 1. For proper operation the device should be used within the recommended conditions. Symbol Definition Min. Max. Units V B High side floating supply voltage V S V S +20 V S High side floating supply offset voltage note 2 00 V Overcurrent output voltage VCC V V CC Low side and logic fixed supply voltage V IN Input voltage between V IN+ and V IN mv T A Ambient temperature C Note 2: Logic operation for Vs of - to +00V. Logic state held for Vs of -V to -VBS. (Please refer to the Design Tip DT97-3 for more details). 2

3 DC Electrical Characteristics V CC = V BS = 1V, and T A = 2 o C unless otherwise specified. Symbol Definition Min. Typ. Max. Units Test Conditions V + Overcurrent trip positive input voltage 20 V - Overcurrent trip negative input voltage -20 I LK Offset supply leakage current 0 µa V B = V S = 00V I QBS Quiescent V BS supply current 1 2 V S = 0V I QCC Quiescent V CC supply current 0. I C output sink current 10 1 mv ma V O = 1V V O = 0.1V AC Electrical Characteristics V CC = V BS = 1V, and T A = 2 o C unless otherwise specified. Symbol Definition Min. Typ. Max. Units Test Conditions Proagation delay characteristics tdoc Propagation delay time of 1 1. µsec twoc Low true pulse width of 1 +20mV Vin -20mV t woc t doc Figure 1. Waveform 3

4 Lead Definitions Symbol Description V CC V IN+ V IN- V B V S N.C. Low side and logic supply voltage Low side logic ground Positive sense input Negative sense input High side supply High side return Overcurrent output (negative logic) No connection Lead Assignments 1 VCC VIN+ 8 1 VCC VIN+ 8 2 NC 8 lead SOIC 7 2 NC 8 lead PDIP VIN- VIN- 7 3 IR2170S VB 3 IR2170 VB 4 VS 4 VS 4

5 Case outlines 8-Lead PDIP (MS-001AB) A E X D e B H 0.2 [.010] A.4 [.2] 3X 1.27 [.00] FOOTPRINT 8X 0.72 [.028] 8X 1.78 [.070] DIM IN C HES MILLIMETERS MIN MAX MIN MAX A A b c D E e.00 BASIC 1.27 BASIC e1.02 BASIC 0.3 BASIC H K L y e1 A C y K x 4 8X b A1 0.2 [.010] C A B 0.10 [.004] 8X L 7 8X c NOTES: 1. DIMENSIONING & TOLERANCING PER ASME Y14.M CONTROLLING DIMENSION: MILLIMETER 3. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES]. 4. OUTLINE CONFORMS TO JEDEC OUTLINE MS-012AA. 8-Lead SOIC DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.1 [.00]. DIMENSION DOES NOT INCLUDE MOLD PROTRUSIONS. MOLD PROTRUSIONS NOT TO EXCEED 0.2 [.010]. 7 DIMENSION IS THE LENGTH OF LEAD FOR SOLDERING TO A SUBSTRATE (MS-012AA)

6 ORDER INFORMATION Basic Part (Non-Lead Free) Lead-Free Part 8-Lead PDIP IR2170 order IR Lead PDIP IR2170 order IR2170PbF 8-Lead SOIC IR2170S order IR2170S 8-Lead SOIC IR2170S order IR2170SPbF This product has been designed and qualified for the Industrial market. Qualification Standards can be found on IR s Web Site. Data and specifications subject to change without notice. IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 9024, USA Tel: (310) TAC Fax: (310) Visit us at for sales contact information. 3/1/200