HANDBOOK OF THICK- AND THIN-FILM HYBRID MICROELECTRONICS

Size: px

Start display at page:

Download "HANDBOOK OF THICK- AND THIN-FILM HYBRID MICROELECTRONICS"

Adela Craig
7 years ago
Views:

1 HANDBOOK OF THICK- AND THIN-FILM HYBRID MICROELECTRONICS TAPAN K. GUPTA WILEY- INTERSCIENCE A JOHN WILEY & SONS, INC., PUBLICATION

2 CONTENTS Preface xiii 1 Introduction Hybrid Microcircuit Family, Printed Circuit Board, Thick Film, Thin Film, Integrated Circuit, Modules, 4 Need for Hybrid Microcircuits, Multilayer Circuits, Military Applications, Data Processing, Telecommunications, Automotive Industry, Medical Science, Aerospace Systems, High-Frequency Circuits, 10 Why Hybrid Microcircuits? 11 Applications of Hybrid Microcircuits, Automotive Industry, Commercial Products Medical Science Telecommunications Consumer Electronics. 19

3 viii CONTENTS Military Applications, Typical Microelectronic Products, Consumer Electronics, Industrial Applications, Military and Aerospace Applications, Automotive Industry, Microwave Engineering, Multichip Modules, Summary, 29 References, 29 Recommended Reading, 38 2 Mathematical Foundations, Circuit Design, and Layout Rules for Hybrid Microcircuits Mathematical Foundations, Factors Affecting the Value of a Resistor, Mathematical Model for Thick-Film Deposition, Theoretical Model for Screen-Printed Film Thickness, Thick-Film Resistor Design, Theoretical Model for Thin-Film Thickness, Dissipation Factor or Dielectric Loss within a Dielectric Material, Inductors, Theoretical Model for Transport Properties during Hermetic Sealing, Circuit Design and Layout Rules, Hybrid Circuit Design Elements, Thick-Film Hybrid Circuit Design, Basic Rules for Laying Out Hybrid Microcircuits, 74 References, 82 Recommended Reading, 88 3 Computer-Aided Design and Pattern Generation Techniques Computer-Aided Design Techniques, Size and Complexity of Hybrid Microcircuits, CALMA Online Design Process, Computer-Aided Engineering to Design Hybrid Microcircuits, Circuit Layout Design, Pattern Generation Techniques, Additive Processes, Subtractive Processes, Photolithography, 109

4 CONTENTS ix References, 119 Recommended Reading, Thick-Film Fundamentals Thick-Film Substrates, Substrate Materials, Physical Properties, Substrate Fabrication, Electrical Properties, Multilayer Technology Using LTCC, Thick-Film Conductors, Conduction in Metals, Conductor Materials, Conductor Pastes, Thick-Film Resistors, Physical Properties, Resistor Characteristics, Dielectric Inks and Pastes, Low-A: Dielectric Materials, High-A" Dielectric Materials Thick-Film Inductors, 152 References, 153 Recommended Reading, Thick-Film Deposition Techniques Thick-Film Processing, Screen Printing, Screen Printer, Drying and Firing, 170 References, 175 Recommended Reading, Thin-Film Fundamentals Thin-Film Substrates, Substrate Materials Physical Characteristics, Characteristics of Substrates Characteristics of Metals, Thin-Film Conductors Conductor Materials and Properties Thin-Film Resistors Resistor Properties, Resistor Materials Thin-Film Capacitors Capacitor Properties. 201

5 i CONTENTS Capacitor Materials, Thin-Film Inductors, Technologies of the Twenty-First Century, 207 References, 211 Recommended Reading, Thin-Film Deposition Techniques Physical Vapor Deposition, Turbo Pump, Cryogenic Pump, Flash Evaporation, Sputtering, Chemical Vapor Deposition, Ion-Beam Deposition, Ion-Beam Sputter Deposition, Ion-Beam-Assisted Deposition, Pulsed-Laser Deposition {Laser Ablation), High-Density Plasma-Assisted Deposition, Electroplating, Electrode Electroplating, Electroless Electroplating, Sol-Gel Coating, Atomic Layer Deposition, Summary, 237 References, 238 Recommended Reading, Component Assembly and Interconnections Component Assembly, Silicon-Gold Eutectic Bonding, Adhesive and Epoxy Bonding, Solder Joint Bonding, Solder Alloys, Solder Reflow System, Lead-Free Interconnects, Interconnections, Thermocompression Wire Bonding, Thermosonic Wire Bonding, Ultrasonic Wire Bonding, Automated Single-Point Tape Automated Bonding, Laser Wire Bonding, Flip-Chip Bonding, 269 References, 269 Recommended Reading, 275

6 CONTENTS xi 9 Adjustment of Passive Components Airbrasive Trimming, Laser Trimming, Carbon Dioxide Laser, Yttrium-Aluminum-Garnet Laser, Laser Trimming Systems, Trimming Procedure, Design Criteria for Resistor Trimming, Definitions, 295 References, 296 Recommended Reading, Packaging and Thermal Considerations Packaging Materials, Packaging Systems, TO Packages, Flat-Case Packages, Chip Carriers, Small-Outline Packages, Systems on a Chip, Chip-Scale Packages, Wafer-Level Packaging, Three-Dimensional Packaging, Package Sealing, Thermal Effects on Electronic Packaging, Power Dissipation, Thermal Design Calculations, Non-Steady-State Heat Transfer Model, Thermal Resistance inside the Substrate, Natural Convection, 320 J Thermal Radiation, Thermal Resistance of Nitrogen Gas Heat Conduction inside the Kovar Shell, Flip-Chip Technology, Packaging Material Reliability, 323 References, 324 Recommended Reading, Multichip Module and Microwave Hybrid Circuits Multichip Module Circuits Conductor Materials, Summary, Microwave Hybrid Circuits, Major Circuit Requirements, Waveguides, 355

7 xii CONTENTS Transmission Lines, Lumped Circuit Elements, Directional Couplers, Impedance Matching, Microwave Integrated Circuits, Dielectric Resonators, 375 References, 376 Glossary 385 Index 397

Good Boards = Results

Section 2: Printed Circuit Board Fabrication & Solderability Good Boards = Results Board fabrication is one aspect of the electronics production industry that SMT assembly engineers often know little about.