Application Note. AC - Direct LED. Contents. (Instruction Manual) Innovative AC driving engine for PKG Type light

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1 Application Note (Instruction Manual) AC - Direct LED Innovative AC driving engine for PKG Type light Contents 1. Product naming method Product description Optical properties Thermal Management Handling Guide Mechanical Assembly Guide ESD Control Caution

2 1. Product Naming Method (ex. Linearon / Flush Mount / TileBlock ) Product Family PCB Size/shape Power CRI+CCT IV Module type Option1 Option2 Option3 LNM 280X30 4R5W 8 30 XXXV A 0 0 V1_0 Mod name PCB size' Power '7'= '27'= Input type circuit etc MP Model Linearon 280X30mm 4R5 Watt 70Ra+ 2700K 9 Watt '8'= '30'= Voltage 'A'=A Option Item Option Item V1_0 560X30mm 9 Watt 80Ra+ 3000K 00 = 18 Watt '9'= '35'= Standard 0 = DP Model V0_1 90Ra+ 3500K 230V 'B'=B 01 = PCB Flush Mount 116mm Ø 15 Watt '40'= Flicker 192mm Ø 22 Watt 4000K 02 = 1 = 268mm Ø 33 Watt '50'= Or 'C'=C Zero-Ten Terminal 5000K 03 = Tile Block 75X59mm 35 Watt '57'= Turn Off 120V 50 Watt 5700K 04 = 122X85mm 65 Watt Color change 80 Watt 05 ~ 15 : Option Item R.f 2

3 1) Option system standard (ex. Linearon ) Product Family Product Section Product Description PCB > shape > Watt > CRI+CCT > IV > Type > Option > Version model name numbering AC Module Linearon LNM LNM_280X30_4R5W_830_XXXV_C001_V2_0 Option NO. 항목 NO. 항목 NO. 항목 00 Standard 05 Flicker + Zero-Ten 10 Turn off + Color change 01 Flicker 06 Flicker + Turn off 11 Flicker + Zero-Ten + Turn off 02 Zero-Ten 07 Flicker + Color change 12 Flicker + Zero-Ten + Color change 03 Turn Off 08 Zero-Ten + Turn off 13 Flicker + Turn off + Color change 04 Color change 09 Zero-Ten + Color change 14 Zero-Ten + Turn off + Color change Hz 15 Flicker + Zero-Ten + Turn off + Color change 3

4 2. Product Description AC-ALLTM, Lumens AC Driverless Modules/Engines, provides excellent solutions for lighting designers and manufacturers. It is designed to be run on AC direct current so as to bring you the most design flexibility. With its patented Dimming and Flicker solutions, AC-ALLTM enables you to enhance the value of your lighting products the most. AC-Direct LED Module can provide you a comprehensive solution to achieve an industry-leading combination of light quality and efficacy. Unlike the conventional DC type LED module, AC-Direct Module is an AC type DOB (Driver on Board) LED module. The PKG and circuit components on the PCB allow the LED Module to operate on AC. Thus, the driverless (no power supply) Module provides sufficient space and design freedom for the user. The advanced and progressive concept of the AC-Direct Module helps the user to easily handle and install the product. The AC-Direct Module is available from 4.5W to 80W you want. The Module is built with a 150 C thermal protection and surge & over current protection circuit. These functions enable the Module to be safely operated in different types of environment. As shown below, the AC-Direct Module is available in various different options. The options definitely offer a wide variety of selection for the user. Type 1 Type 2 Connector Option 1 : Mannual Pad Option 2 : Connector Pad 4

5 Application Product Brief Note AC-ALL Direct series_ LED Module Eggdrop ) Mechanical Dimension Outer Size 280X30mm : LNM/280X30/4.5W, 9W 560X30mm : LNM/5600X30/9W, 18W Outer Size 116C : FNM/116C/15W 192C : FNM/192C/22W 268C : FNM/268C/33W Outer Size 116C : FNM/116C/15W 192C : FNM/192C/22W 268C : FNM/268C/33W Outer Size 77X59 : TBL/75X59/35W, 50W 122X85: TBL/12285/65W, 80W Copyright Lumens Co., Ltd All right reserved 5

6 y Application Note AC Direct LED Module _ Optical Properties 1) Chromaticity Bins Lumens complies with the ANSI C78.377A standard for its chromaticity bin structure. For each ANSI quadrangle for the CCT range of 2700K to 5000K, Lumens provides 5 bins Black Body Locus MacAdam 3 Step ANSI C78.377A x CCT(K) x y CCT(K) x y CCT(K) x y K 4000K CCT(K) K 2700K K Center Ellipse Parameter x y Axis a Axis b Angle( ) 5000K K K K K

7 2) Spectral Power Distribution 7

8 4. Thermal Management 1) Significance of heat dissipation When designing a product using Modules, it is important to account for the heat generated by the Modules. The ambient temperature that the Module can be used in is determined by the junction temperature(tj). The LEDs may become dim, or net even illuminate if the Tj goes above the absolute maximum ratings specified in the specification sheet. It is important to have a good thermal design as keeping the Tj as low as possible will lengthen the life of the Module. Tj = (Rj-s Pd) + Ts = ((Rj-s + Rs-a) Pd) + Ta Tj : Junction temperature [ ] Ts : Case temperature, bottom of package [ ] Ta : Ambient temperature [ ] Pd : Input power of LED package [W] R j-s : Thermal resistance from junction to case [K/W or /W] R s-a : Thermal resistance from case to ambient [K/W or /W] 2) Thermal Simulation (Fig. 1. Cross-section of LED Module) In package component level, good thermal conduction in the structure is most important. When heat generated from chip diode, it transfer through the component into assembly module outside the package and dissipated to the ambient environment. When performing the thermal simulations as assumptions must be determined and the operating boundary conditions must be checked. Computational fluid dynamics (CFD) analysis is one of simulation tools for solving thermal conduction, convection, and radiation to evaluate the thermal design. This method proposes for quick and inexpensive for design adjustments. Simulations usually show the answers and depending to the approach taken, just like due to the boundary condition setting of interface between materials and heat spreading path assuming, it may not always be equal to actual situation. After simulating or optimizing the design, building a prototype to double confirmed the performance is always recommended. 8

9 5. Handling Guide 1) General Handling Guides Use Teflon-type tweezers to grab the base of LED and do not touch the optical surface. Avoid putting mechanical stress on the optical surface. Never touch the optical surface with fingers or sharp object. The LED surface could be soiled or damaged, which affect the optical performance of the Module. Please avoid touching electrodes while handling Module. If debris contacts the resin, gently remove it using the tip of a cotton swab soaked in isopropyl alcohol. Incorrect Do not use tweezers Do not touch with naked hands Do not stack the products Incorrect Do not touch LES with hands, tweezers, or other metal. Please avoid use of anything sharp to press, put stress on, rub, attach or make contact with the Module. They might negatively affect the function, performance and reliability of the product. 9

10 2) Wire Connection (Terminal Type) Insert the wire to the connector. Wire spec. : 0.5~0.75mm 2 (AWG 20~18) Push down the hole with a sharp object to pull the wire from the connector when disconnects. 10

11 Incorrect Application Note AC Direct LED Module _ ) Wire Connection (Solder Type) 1. Products shall be heated to a temperature of 150 before soldering. Ensure not to be over 150 to avoid any potential of problem. Lumens strongly recommends Soldering iron and hot plate together for soldering wire connection. Set a hot plate on 150. Set a soldering iron on 400. Soldering iron tip is recommendable. 2. Strip 2.7mm (±0.1mm) of wire for soldering wire connection and ensure not to be stripped off jacket of the wire by a soldering iron to avoid shock or any serious problem. Wire open Length 2.7mm 3. Pre-solder on solder pad and cable with a soldering iron. 11

12 4. Solder with a soldering iron after 5-6 sec since you put LED Moudle on hot plate (150 ). During soldering, always wear anti-static wrist band, shoes and clothes for the safety. 5. Ensure wires soldered to a product to avoid solder-pad lifting or any damage to the product. 6. Remove solder flux after soldering. 12

13 6. Mechanical Assembly Guide 1) General Assembly Guide 1 Basically, one full set is composed of holder, EDC, thermal pad & heat sink. Ex ) Linear Module 13

14 2) General Assembly Guide 2 In case of assembly without pad. 3) General Assembly Guide 3 In case of assembly without holder, Plastic bushing is recommended for electrical isolation 14

15 4) General Assembly Guide 4 In case of assembly without holder, Plastic bushing is recommended for electrical isolation 1. The contact surface of Product and Heat sink or luminaire shall be always cleaned without any foreign materials and kept flat. 2. Use caution when assembling a product to the heat sink or luminaire not to cause any damage on the PCB surface by uneven, convex contact surface or improper stress forces. It can cause safety issues such as withstand voltage. Lumens strongly recommends using thermal pad on the surface instead of thermal grease. Heat Sink Heat Sink Correct Incorrect PCB damaged by improperly assembled screws PCB damaged by burrs 15

16 7. ESD Control 1. Ground the worker. Wear an antistatic wrist strap. 2. Ground the surface of the work bench and ground the tools and other apparatus. Lay the ESD protective mat on the work bench to ground it. 3. Remove from the area all materials (static producing materials) which tend to cause static electricity problems. Use the ESD protective tools. 4. Use ionization or other charge mitigating techniques to neutralize the charge if removing the static charge by grounding is not possible. Use the static eliminator (ionizer). 5. Place sensitive items in appropriate protective packaging when transporting or moving to storage from areas in which the above three points are being enforced. Store in antistatic bag. 16

17 Cautions 1. Do use proper wire in terms of thickness. 2. Always make sure to discharge prior to wire soldering. 3. Do not use wires that are ripped or damaged. 4. Do not add or change wires while product is active. 5. Wires shall not protrude beyond solder pads and excessive solder flux shall be cleaned in order to minimize the potential for contamination. 6. Do use heat sink which fits capacity of each AC module. 7. It is strongly recommended to insert thermal pad for better thermal performance. Please refer to the drawing of the PCB for accurate dimension of thermal pad. Thickness of Recommended Thermal pad : Minimum 0.5mm 8. Please use carefully when using thermal grease instead of thermal pad, to avoid catastrophic mechanical damage to the LED. 9. Do not make any modification or change on product. 10. It is recommended to store product under the condition of 5~30 and humidity less than 40% RH. When storing products for a long period of time before usage, please put silica gel with product into dry bag or anti-static bag. 17

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