Computer Systems. General Overview HPERC. MilSystem. RuffSystem. ReadySystem. Computer Systems

Transcription

1 General Overview ADLINK provides system products that deliver quality, reliability, durability, compatibility, high performance and long product lifecycle. The heart of every one of our systems is a reliable, field-proven single board computer (SBC). HPERC Sealed Extreme Rugged COTS computing platform in a tiny VITA-75 footprint, ideal for ground, air, and sea deployments. Based on 3 rd generation Intel Core i7 CPU and optional GPGPU parallel processing engine. Easily configured application-ready platform for fast integration of custom rugged embedded applications. A wide array of fast IO provided on uniquely-keyed MIL-DTL connectors. MilSystem Designed for tight integration into military vehicle and other platforms. MIL-STD-D38999 connectors, rugged-by-design internal components, and completely passive cooling maximize reliability for operations in harsh conditions. MilSystems provide shock and vibration immunity exceeding MIL-STD-810G standards, and operate at full CPU speed over a wide temperature range of -40 to +75 C. RuffSystem Designed to tolerate the harshest environments, ADLINK s RuffSystem products are truly rugged by design. These Extreme Rugged systems provide passive convection cooling, use ADLINK Extreme Rugged system boards, and meet MIL-STD-810G requirements for shock and vibration over wide temperature and humidity ranges. ReadySystem ReadySystem embedded computers accelerate time-to-market by providing a complete, application-ready solution. The ReadySystem features an EPIC form factor ReadyBoard with all electronics in a compact housing for limited space applications. Each system can be configured with various memory, hard disk and/or CompactFlash options. 37

2 Selection Guide HPERC MilSystem RuffSystem ReadySystem HPERC -IBR MilSystem 840 MilSystem 735 RuffSystem 840 RuffSystem 735 ReadySystem 850 Internal Board EPIC Express with AHD COM 840 with rugged EBX Carrier LittleBoard 735 COM 840 with rugged EBX Carrier LittleBoard 735 ReadyBoard 850 Form Factor EPIC Express EBX with COM Express EBX EBX with COM Express EBX EPIC CPU Gen3 Intel Core i7 + GPGPU Up to 1.66GHz Intel Core 2 Duo 1.6GHz Intel Atom N270 Up to 1.66GHz Intel Core 2 Duo 1.6GHz Intel Atom N GHz Intel Core 2 Duo (Socket P) Maximum 16GB DDR3L GB DDR GB DDR GB DDR GB DDR GB DDR3 Expansion PCI/104 Express, PCIe MiniCard, MXM3.1 Mini PCI, PC/104-Plus, Mini PCI, PC/104-Plus, No Maximum Storage 1TB SSD 128GB SSD 128GB SSD 128GB SSD 128GB SSD HDD dependent Optional Drive SDHC CompactFlash CompactFlash CompactFlash CompactFlash CompactFlash Internal Drive Bay 2x 2.5 Removable Single 2.5 Single 2.5 2x 2.5 Single 2.5 Single 2.5 Ethernet TBC 2x GbE 2x GbE 1x GbE 2x GbE 2x GbE I/O 3x DP/DVI/HDMI, 4x RS-232/422, 4x USB2, 2x USB3.0, In/Out 2xRS-232/422/485, 1x PS/2 KB, 1x PS/2 KB 2xRS-232/422/485, 1x PS/2 KB/MS, 1x PS/2 KB/MS 4x USB,, 1x PS/2 KB/MS Standard OS Windows 7, Linux Windows XP Embedded (Linux, Windows CE 6.0, VxWorks 6.6, QNX 6.4 Supply MIL-STD-1275 Wide-range 14 to 32 Wide-range 14 to 32 Wide-range 14 to 32 Wide-range 14 to VDC Cooling Conduction, Free Air Convection Convection Cooled Convection Cooled Convection Cooled Convection Cooled Fan Cooled Environment Sealed, Extreme Rugged Extreme Rugged Extreme Rugged Extreme Rugged Extreme Rugged Rugged Standard Operating Temp. -20 C to +65 C -20 C to +65 C -20 C to +65 C -20 C to +65 C -20 C to +65 C 0 C to +55 C Extended Operating Temp. -40 C to +75 C -40 C to +75 C -40 C to +75 C -40 C to +75 C -40 C to +75 C -- Size (WxDxH) Coldplate x 150 x mm Heatsink x 150 x 203.4mm 8.2 x 10 x x 10 x x 10 x x 10 x x 8 x 1.75 Page Number

3 HPERC-IBR High Performance Extreme Rugged Computer System with 3 rd Generation Intel Core i7 CPU 3 rd Generation Intel Core i7 Processor Soldered DDR3L GB Up to 16GB RAM Quad Gigabit Ethernet Ultra-Fast 12GB/s Solid-State-RAID with Secure Erase 16-lane 3 rd Generation PCI Express to optional GPGPU Small SWaP-efficient Sealed Enclosure Three Digital DisplayPort/HDMI/DVI Simple Expansion and Configuration Sealed rugged COTS computing platform Inside the tiny footprint of HPERC lives the power of 3 rd generation Intel Core i7 processor and optional GPGPU parallel processing engine. Dual removable secure erase RAID-0 SSDs provide 12Gb/s throughput and security for deployment in hostile environments. Easy configuration and expansion allows for fast integration of custom rugged embedded applications. HPERC reserves connector pins for expansion interfaces. The GPGPU sits on a 16-lane 3 rd generation PCI Express interface. Uniquely-keyed MIL-DTL connectors provide a wide array of fast IO. Built with proven Ampro reliability, the rugged capabilities of HPERC are ideal for ground, air and sea deployments. HPERC systems survive shock, resist corrosion and galvanic oxidation, and perform in the humid jungle, the heat of the desert, and the bitter cold of frozen mountain passes. Processors GPGPU BIOS Expansion Busses 3 rd Generation Intel Core i7 Intel Core i7-3517ue 1.7GHz, Dual Core Intel Core i7-3555le 2.5GHz, Dual Core Intel Core i7-3612qe 2.1GHz, Quad Core Intel QM77 Express Nvidia or AMD via MXM 16GB DDR3L-1333 ECC 8GB soldered down, 8GB SODIMM AMI EFI MXM (3 rd Generation PCIe) PCI/104 Express (Gen2 PCIe) PCI Express Mini Card (Gen2 PCIe) Standard I/O Video 3x HDMI/DP/DVI 1x VGA/NTSC 1x Amplified Stereo output 1x Mono Mic input LAN 4x Intel I210 Ethernet controller LAN Speed 10/100/1000 Mbps esata 2x SATA 3Gb/s (non-powered) USB 4x 3.0 6x 2.0 4x RS-232/422 GPIO 8x digital IO Internal Storage Removable SATA RAID Removable Security TPM Secure Erase Input Performance Thermal Internal Transfer Storage Temperature HPERC-IBR-MC HPERC-IBR-M SLC SSD on SATA 3 Gb/s (Up to 1 TB) 0/1 supports up to 12Gb/s SD 1 - SLC SDHC (Up to 64 GB) Atmel AT97SC3204-U1A190 Hardware input triggered Software triggered 9-36VDC P-States 0-16 (Speedstep & Turbo) S-States S3, S4, And IFFS Passive conduction to body -55 C to +85 C Operating temperature: -40 C to +85 C Coldplate conduction VITA mount Operating temperature: -40 C to +75 C Heatsink (free air convection) VITA or 21 mount 39

4 Environmental Immersion Humidity Shock Vibration EMI/EMC Temperature Functional Diagram IEC IP-67 MIL-STD-810G Procedure I 95% at 60 C non-condensing MIL-STD-810G Procedures I and V MIL-STD-810G Procedure I Categories 4, 7-9, MIL-STD-461F FCC EN55022 ClassB MIL-STD-810G Procedure II, Method 1 and 3 MIL-STD-810G , Procedure 1 and 2 Mechanical Form Factor HPERC-IBR-MC HPERC-IBR-M IO Connectors VITA-75.20/21/22 SFF mount Coldplate x 5.9 x 8 inches 4.6 Lbs (63.5mm x 150mm x 203.4mm 2.0 Kg) Heatsink x 5.9 x 8 inches 6.7 Lbs (100mm x 150mm x 203.4mm 3.0 Kg) MIL-DTL (uniquely-keyed) 8/16GB ECC DDR3 RAM Removable Media SSD SSD SDHC Intel 3 rd Generation I7 CPU GPGPU (Nvidia or AMD) Intel PCH QM77 PC-104 Express Mini PCI Express User Expansion slots HPERC-IBR-M HPERC-IBR-M-R17 HPERC-IBR-M-L17 HPERC Accessories HPERC-X-01 DDR3L CC-DDR3 CC-HPERC-IBR 1553-HPERC 429-HPERC E6760-HPERC i7-3517ue, 2C, 17W, 8GB solder down DDR3L-1333 RAM, D38999 Quick-start kit including: HPERC -IBR-MR17, HPERC-X-01, and USB stick with BSP/drivers and manuals HPERC breakout cable kit including all IO and AC Adapter HPERC 16GB RAM option Comformal Coating option for HPERC 16GB RAM option Conformal Coating option for HPERCIBR PC-104 Express MIL-STD-1553 option PC-104 Express ARINC-429 option AMD E MHz GPGPU with 800MHz 128-bit 1GB GDDR5 HPERC-IBR-MC HPERC-IBR-MC-R17 HPERC-IBR-MC-R25 HPERC-IBR-MC-R35 HPERC-IBR-MC-L17 HPERC-IBR-MC-L25 HPERC-IBR-MC-L35 i7-3517ue 1.7GHz, 2C, 17W, 8GB solder down DDR3L-1333 RAM, D38999 i7-3555le 2.5GHz, 2C, 25W, 8GB solder down DDR3L-1333 RAM, D38999 i7-3612qe 2.1GHz, 4C, 35W, 8GB solder down DDR3L-1333 RAM, D38999 Quick-start kit including: HPERC-IBRMC- R17, HPERC-X-01, and USB stick with BSP/drivers and manuals Quick-start kit including: HPERC-IBRMC- R25, HPERC-X-01, and USB stick with BSP/drivers and manuals Quick-start kit including: HPERC-IBRMC- R35, HPERC-X-01, and USB stick with BSP/drivers and manuals (All options ship installed, not all options are available in all systems, not all options/systems can be combined) 40

5 MilSystem 840 Extreme Rugged Intel Core 2 Duo COTS Military Computer Passive convection-cooled chassis Intel Core 2 Duo processor Uniquely-keyed D38999 connectors Tested to MIL-STD-810G standards Internal expansion for Mini PCI and Wide range input: 12 to 32 VDC Windows XP Professional or Preinstalled Windows CE, QNX, and VxWorks supported CPU Graphics Multi I/O and Storage Expansion Slots CompactFlash Storage VGA LVDS Ethernet USB Parallel Floppy PS/2 Intel Core 2 Duo L7500, 1.60 GHz, 4M L2 Cache, 800MHz FSB, 17 W TDP Intel Core 2 Duo U7500, 1.06 GHz, 2M L2 cache, 533MHz FSB, 10 W TDP Intel GME965 GMCH and ICH8-M GME965 integrated Mobile Intel GMA X3100 Dual Channel DDR2-667 SODIMM, up to 4GB 1x Mini PCI, 1x PCI Express Mini Card 1x CF socket accessible via rear panel 1x 2.5 SATA SSD (32, 64, 128GB), 1x External supports up to 2048 x 1536 resolution 2x GbE (Intel 82566, 82572EI controllers) 4x USB 2.0 ports (4 root hubs), 1x EPP/ECP bidirectional port Supported by USB (bootable) Keyboard Mic-in, Line-in, Line-out MIL840W MilSystem 840, 1.6GHz Core 2 Duo L7500, 32GB SSD, 2GB RAM, WinXP Professional, 14-32VDC, RoHS MIL840W A101 MilSystem 840, 1.6GHz Core 2 Duo L7500, 32GB SSD, 2GB RAM, Ubuntu 8.04 LTS, 14-32VDC, RoHS MIL840W MilSystem 840, 1.6GHz Core 2 Duo L7500, 128GB SSD, 4GB RAM, WinXP Professional, 14-32VDC, RoHS MIL840W A101 MilSystem 840, 1.6GHz Core 2 Duo L7500, 128GB SSD, 4GB RAM, Ubuntu 8.04 LTS, 14-32VDC, RoHS MIL-ACC-US MilSystem Starter Kit: MC1, MC2, MC3 breakout cables, AC adapter, software, and documentation MIL-ACA-US MilSystem AC adapter (19VDC output), power cord Other configurations available. Please contact your salesperson. Units: mm DC Input Mechanical Weight 14~32 VDC (standard) 12~25 VDC (optional) 208 x 254 x 93.4mm (8.2 x 10 x 3.68 ) W x D x H 4.8 kg (10.6 lbs) Environmental Operating Temperature Standard: -20 C to +65 C Extended: -40 C to +75 C Storage Temperature -40 C to +85 C Certifications CE, FCC Class A, IP50 rated Complies with MIL-STD-810G military standards for shock and vibration Operating Systems Standard Support Windows XP Professional or Ubuntu Linux pre-installed Extended Support (BSP) Windows CE, QNX or VxWorks 41

6 RuffSystem 840 Extreme Rugged Intel Core 2 Duo Computer System Passive convection-cooled chassis Intel Core 2 Duo processor Internal expansion for Mini PCI and PCIe Mini Card Tested to MIL-STD-810G standards Wide range input: 12 to 32 VDC Windows XP Professional or pre-installed Windows CE, QNX, and VxWorks supported CPU Graphics Multi I/O and Storage Expansion Slots CompactFlash Storage VGA Ethernet USB Parallel PS/2 DC Input Intel Core 2 Duo L7500, 1.60 GHz, 4M L2 Cache, 800MHz FSB, 17 W TDP Intel Core 2 Duo U7500, 1.06 GHz, 2M L2 cache, 533MHz FSB, 10 W TDP Intel GME965 GMCH and ICH8-M GME965 integrated Mobile Intel GMA X3100 Dual Channel DDR2-667 SODIMM, up to 4GB 1x Mini PCI, 1x PCI Express Mini Card 1x CF socket accessible via rear panel 2x 2.5 SATA SSD (32, 64, 128GB) 1x DB15 connector, supports up to 2048 x 1536 resolution 2x GbE (Intel 82566, 82572EI controllers) 4x USB 2.0 ports (4 root hubs), 1x EPP/ECP bidirectional port 1x Keyboard/Mouse 3x 3.5mm jacks for Mic-in, Line-in, Line-out 14~32 VDC (standard) 12~25 VDC (optional) RUF840W RuffSystem 840, 1.6GHz Core 2 Duo L7500, 32GB SSD, 2GB RAM, WinXP Professional, 14-32VDC, RoHS RUF840W A101 RuffSystem 840, 1.6GHz Core 2 Duo L7500, 32GB SSD, 2GB RAM, Ubuntu 8.04 LTS, 14-32VDC, RoHS RUF840W RuffSystem 840, 1.6GHz Core 2 Duo L7500, 128GB SSD, 4GB RAM, WinXP Professional, 14-32VDC, RoHS RUF840W A101 RuffSystem 840, 1.6GHz Core 2 Duo L7500, 128GB SSD, 4GB RAM, Ubuntu 8.04 LTS, 14-32VDC, RoHS RUF-ACC-US RuffSystem Starter Kit: AC adapter, software, and documentation RUF-ACA-US AC adapter (19VDC output), power cord Other configurations available. Please contact your salesperson. Units: mm Mechanical Weight 208 x 254 x 93.4mm (8.2 x 10 x 3.68 ) W x D x H 4.9 kg (10.8 lbs) Environmental Operating Temperature Standard: -20 C to +65 C Extended: -40 C to +75 C Storage Temperature -40 C to +85 C Certifications CE, FCC Class A, IP50 rated Complies with MIL-STD-810G military standards for shock and vibration Operating Systems Standard Support Windows XP Professional or Ubuntu Linux pre-installed Extended Support (BSP) Windows CE, QNX or VxWorks 42

7 ReadySystem 850 1U Computer System with Core 2 Duo EPIC ReadyBoard 850 SBC Intel Core 2 Duo Processor Intel GM45 Express Dual Channel DDR3 SODIMM up to 4GB Dual Gigabit Ethernet CPU Graphics Multi I/O and Storage CompactFlash USB Ethernet VGA PS/2 ATA Input Mode Intel Core 2 Duo Processor P8400 (2.26GHz, 3MB L2 cache, 1066MHz FSB, 25W TDP) Intel Celeron Processor T3100 (dual-core, 1.9GHz, 1MB L2 cache, FSB 800MHz, 35W TDP) Intel GM45 Express (GM45 GMCH, ICH9-M) Integrated Intel GMA 4500MHD Dual Channel DDR3 800/1066 SODIMM up to 4GB 1x CompactFlash type II socket 4x USB 2.0 ports 2x Intel 82574L GbE controllers 1x DB15 connector 1x PS/2 for Keyboard/Mouse 3x 3.5mm jacks for Mic, Line In, Line Out 1x internal HDD or SSD 12V DC from AC/DC adapter AT power Mechanical and Environmental 220 x 203 x 44mm (8.66 x 8.00 x 1.75 ) W x D x H Operating Temperature 0 C to +55 C (AC/DC adapter 40 C only) Storage Temperature -20 C to +75 C Certifications CE, FCC Class A Relative Humidity 10% to 90%, non-condensing Weight 1.7 kg net (3.7 lbs) Operating Systems Windows 7 installed (optional) Other OS Support: Linux, Windows CE 6.0, VxWorks 6.6, QNX 6.4 RB1-S85A-R-T31M1G RB1-S85A-R-T31M4G RB1-S85A-R-T31M4G RB1-S85A-R-P84M4G Back View Left View Top View Right View Bottom View Front View ReadySystem 1U, ReadyBoard 850, T GHz CPU, 1GB RAM, 160GB HDD, 75W AC/DC adapter ReadySystem 1U, ReadyBoard 850, T GHz CPU, 4GB RAM, 160GB HDD, 75W AC/DC adapter ReadySystem 1U, ReadyBoard 850, T GHz CPU, 4GB RAM, 160GB HDD, 75W AC/DC adapter, Window 7 ReadySystem 1U, ReadyBoard 850, P GHz CPU, 4GB RAM, 160GB HDD, 75W AC/DC adapter Units: mm 43