MBRS130LT3G SBRS8130LT3G. Schottky Power Rectifier. Surface Mount Power Package SCHOTTKY BARRIER RECTIFIER 1.0 AMPERE 30 VOLTS

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1 MBRS3LT3G, SBRS83LT3G Schottky Power Rectifier Surface Mount Power Package This device employs the Schottky Barrier principle in a large area metal to silicon power diode. State of the art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes, in surface mount applications where compact size and weight are critical to the system. Features Very Low Forward Voltage Drop (.395 Volts T J = ) Small Compact Surface Mountable Package with J Bend Leads Highly Stable Oxide Passivated Junction Guard Ring for Stress Protection ESD Ratings: Human Body Model = 3B (> 6 V) Machine Model = C (> 4 V) EC Q Qualified and PPP Capable SBRS8 Prefix for utomotive and Other pplications Requiring Unique Site and Control Change Requirements ll Packages are Pb Free* Mechanical Characteristics Case: Epoxy, Molded Weight: mg (approximately) Finish: ll External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 26 C Max. for Seconds Cathode Polarity Band SCHOTTKY BRRIER RECTIFIER. MPERE 3 VOLTS BL3 Y WW CSE 43 MRKING DIGRM YWW BL3 = Specific Device Code = ssembly Location = Year = Work Week = Pb Free Package (Note: Microdot may be in either location) ORDERING INFORMTION Device Package Shipping MBRS3LT3G SBRS83LT3G (Pb Free) (Pb Free) 2,5 / Tape & Reel 2,5 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8/D. *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 22 January, 22 Rev. 9 Publication Order Number: MBRS3LT3/D

2 MBRS3LT3G, SBRS83LT3G MXIMUM RTINGS Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage verage Rectified Forward Current T L = 2 C T L = C Rating Symbol Value Unit V RRM V RWM V R I F(V) V Non Repetitive Peak Surge Current (Surge pplied at Rated Load Conditions Halfwave, Single Phase, 6 Hz) I FSM 4 Operating Junction Temperature T J 65 to +25 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERML CHRCTERISTICS Thermal Resistance, Junction to Lead Characteristic Symbol Value Unit JL 2 C/W Thermal Resistance, Junction to mbient (T =, Min Pad, oz copper) Junction to mbient (T =, Pad, oz copper) R J C/W ELECTRICL CHRCTERISTICS Maximum Instantaneous Forward Voltage (Note ) (i F =., T J = ) (i F = 2., T J = ) Maximum Instantaneous Reverse Current (Note ) (Rated dc Voltage, T J = ) (Rated dc Voltage, T J = C). Pulse Test: Pulse Width = 3 s, Duty Cycle 2%. Characteristic Symbol Value Unit V F I R. V m I F, INSTNTNEOUS FORWRD CURRENT () T J = C V F, INSTNTNEOUS VOLTGE (V) I F, MXIMUM INSTNTNEOUS FORWRD CURRENT () T J = C V F, MXIMUM INSTNTNEOUS VOLTGE (V) Figure. Typical Forward Voltage Figure 2. Maximum Forward Voltage 2

3 MBRS3LT3G, SBRS83LT3G I R, IREVERSE CURRENT (m).. T J = C I R, IREVERSE CURRENT (m).. T J = C V R, REVERSE VOLTGE (V) Figure 3. Typical Reverse Leakage Current V R, REVERSE VOLTGE (V) Figure 4. Typical Maximum Reverse Leakage Curent I F(V), VERGE FORWRD CURRENT () DC.4.2 SQURE WVE T C, CSE TEMPERTURE ( C) Figure 5. Current Derating (Case) P F(V), VERGE POWER DISSIPTION (W) SQURE DC I F(V), VERGE FORWRD CURRENT () Figure 6. Typical Power Dissipation C, CPCITNCE (pf) NOTE: TYPICL CPCITNCE T V = 29 pf V R, REVERSE VOLTGE (VOLTS) Figure 7. Typical Capacitance 3

4 MBRS3LT3G, SBRS83LT3G EFFECTIVE TRNSIENT THERML RESISTNCE D = SINGLE PULSE... t, TIME (s) Figure 8. Thermal Response, Min Pad EFFECTIVE TRNSIENT THERML RESISTNCE D = SINGLE PULSE..... t, TIME (s) Figure 9. Thermal Response, Inch Pad J ( C/W) oz oz COPPER RE (mm 2 ) Figure. Thermal Resistance vs. Copper rea POWER DISSIPTION (W) 2..8 Power based on T = 2. oz.6. oz COPPER RE (mm 2 ) Figure. Power Dissipation vs. Copper rea 4

5 MBRS3LT3G, SBRS83LT3G PCKGE DIMENSIONS CSE 43 3 ISSUE H H E E b POLRITY INDICTOR OPTIONL S NEEDED D NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y4.5M, CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHLL BE MESURED WITHIN DIMENSION P. MILLIMETERS INCHES DIM MIN NOM MX MIN NOM MX b c D E H E L L.5 REF.2 REF L L c SOLDERING FOOTPRINT* SCLE 8: mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICTION ORDERING INFORMTION LITERTURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 563, Denver, Colorado 827 US Phone: or Toll Free US/Canada Fax: or Toll Free US/Canada orderlit@onsemi.com N. merican Technical Support: Toll Free US/Canada Europe, Middle East and frica Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative MBRS3LT3/D