STH265N6F6-2AG, STH265N6F6-6AG

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1 STH265N6F6-2AG, STH265N6F6-6AG Automotive N-channel 60 V, 1.6 mω typ., 180 A STripFET F6 Power MOSFET in H²PAK-2 and H²PAK-6 packages Datasheet - production data Features TAB TAB Order code VDS RDS(on) max ID STH265N6F6-2AG 60 V 2.1 mω 180 A 2 1 H2PAK H2PAK-6 7 STH265N6F6-6AG 60 V 2.1 mω 180 A Designed for automotive applications Very low on-resistance Very low gate charge High avalanche ruggedness Low gate drive power loss Figure 1: Internal schematic diagram Applications Switching applications G(1) D(TAB) G(1) D(TAB) Description This device is an N-channel Power MOSFET developed using the STripFET F6 technology with a new trench gate structure. The resulting Power MOSFET exhibits very low RDS(on) in all packages. S(2, 3) S(2, 3, 4, 5, 6, 7) H2PAK-2 H2PAK-6 SC06140_H2PAK-2-6 Table 1: Device summary Order code Marking Package Packaging STH265N6F6-2AG 265N6F6 H 2 PAK-2 Tape and reel STH265N6F6-6AG 265N6F6 H 2 PAK-6 Tape and reel December 2014 DocID Rev 2 1/18 This is information on a product in full production.

2 Contents STH265N6F6-2AG, STH265N6F6-6AG Contents 1 Electrical ratings Electrical characteristics Electrical characteristics (curves) Package mechanical data H2PAK-2 mechanical data H²PAK-6 package information Packaging information Revision history /18 DocID Rev 2

3 STH265N6F6-2AG, STH265N6F6-6AG Electrical ratings 1 Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage 60 V VGS Gate-source voltage ± 20 V ID (1) Drain current (continuous) at TC = 25 C 180 A ID (1) Drain current (continuous) at TC = 100 C 180 A IDM (2) Drain current (pulsed) 720 A PTOT Total dissipation at TC = 25 C 300 W EAS Single pulse avalanche energy (Starting TJ = 25 C, ID = 80 A) 720 mj Derating factor 2 W/ C Tstg Tj Storage temperature - 55 to 175 C Operating junction temperature Notes: (1) Current limited by package. (2) Pulse width limited by safe operating area. Table 3: Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case max 0.5 C/W Rthj-pcb (1) Thermal resistance junction-pcb max 35 C/W Notes: (1) When mounted on FR-4 board of 1 inch², 2 oz Cu. DocID Rev 2 3/18

4 Electrical characteristics STH265N6F6-2AG, STH265N6F6-6AG 2 Electrical characteristics (TCASE = 25 C unless otherwise specified) Symbo l V(BR)DSS IDSS Table 4: On/off states Parameter Test conditions Min. Typ. Max. Unit Drain-source breakdown voltage (VGS = 0) Zero gate voltage drain current (VGS = 0) ID = 250 µa 60 V VDS = 60 V 1 µa VDS = 60 V, TC=125 C IGSS Gate-body leakage current (VDS = 0) VGS = ± 20 V VGS(th) RDS(on) Gate threshold voltage Static drain-source on-resistance VDS = VGS, ID = 250 µa VGS = 10 V, ID = 60 A 100 µa ± 100 na 2 4 V mω Table 5: Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit Ciss Input capacitance pf VDS = 25 V, f = 1 MHz, Coss Output capacitance pf VGS = 0 Crss Reverse transfer capacitance pf Qg Total gate charge nc VDD = 30 V, ID = 120 A, Qgs Gate-source charge nc VGS = 10 V Qgd Gate-drain charge nc Table 6: Switching times Symbol Parameter Test conditions Min. Typ. Max. Unit td(on) Turn-on delay time ns tr Rise time VDD = 30 V, ID = 60 A RG = 4.7 Ω, ns td(off) Turn-off-delay time VGS = 10 V ns tf Fall time ns 4/18 DocID Rev 2

5 STH265N6F6-2AG, STH265N6F6-6AG Electrical characteristics Table 7: Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit ISD Source-drain current 180 A ISDM (1) Source-drain current (pulsed) 720 A VSD (2) Forward on voltage ISD = 180 A, VGS = V trr Reverse recovery time ISD = 120 A, VDD = 48 V ns Qrr Reverse recovery charge di/dt = 100 A/µs, nc IRRM Reverse recovery current Tj = 150 C A Notes: (1) Pulse width limited by safe operating area. (2) Pulsed: pulse duration = 300 µs, duty cycle 1.5% DocID Rev 2 5/18

6 Electrical characteristics 2.2 Electrical characteristics (curves) Figure 2: Safe operating area STH265N6F6-2AG, STH265N6F6-6AG Figure 3: Thermal impedance 280tok K ᵟ= Zth=k Rthj-c ᵟ=tp/t 10-2 Single pulse tp t tp(s) Figure 4: Output characteristics Figure 5: Transfer characteristics Figure 6: Normalized V(BR)DSS vs. temperature V(BR)DSS AM09071v1 (norm) ID=1mA 1.1 Figure 7: Static drain-source on resistance RDS(on) (mω) VGS=10V TJ( C) ID(A) 6/18 DocID Rev 2

7 STH265N6F6-2AG, STH265N6F6-6AG Figure 8: Gate charge vs. gate-source voltage Electrical characteristics Figure 9: Capacitance variations Figure 10: Normalized gate threshold voltage vs. temperature Figure 11: Normalized on resistance vs. temperature Figure 12: Source-drain diode forward characteristics DocID Rev 2 7/18

8 Package mechanical data STH265N6F6-2AG, STH265N6F6-6AG 3 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. 8/18 DocID Rev 2

9 STH265N6F6-2AG, STH265N6F6-6AG 3.1 H2PAK-2 mechanical data Figure 13: H²PAK-2 outline Package mechanical data _D DocID Rev 2 9/18

10 Package mechanical data STH265N6F6-2AG, STH265N6F6-6AG Table 8: H²PAK-2 mechanical data mm Dim. Min. Typ. Max. A A C e E F H H L L L L L M R V /18 DocID Rev 2

11 STH265N6F6-2AG, STH265N6F6-6AG Figure 14: H²PAK-2 recommended footprint Package mechanical data _D DocID Rev 2 11/18

12 Package mechanical data STH265N6F6-2AG, STH265N6F6-6AG 3.2 H²PAK-6 package information Figure 15: H²PAK-6 outline _Rev_F 12/18 DocID Rev 2

13 STH265N6F6-2AG, STH265N6F6-6AG Package mechanical data Table 9: H²PAK-6 mechanical data mm Dim. Min. Typ. Max. A A C e e e E F H H L L L L L M R V 0 8 DocID Rev 2 13/18

14 Package mechanical data Figure 16: H²PAK-6 recommended footprint STH265N6F6-2AG, STH265N6F6-6AG footprint_rev_f Dimensions are in mm. 14/18 DocID Rev 2

15 STH265N6F6-2AG, STH265N6F6-6AG Packaging information 4 Packaging information Figure 17: Tape outline DocID Rev 2 15/18

16 Packaging information REE L DIMENS IONS Figure 18: Reel outline STH265N6F6-2AG, STH265N6F6-6AG T 40 mm min. Access hole At slot location B D C A N Full radius Tape slot In core for Tape start G measured At hub Table 10: Tape and reel mechanical data Tape Reel Dim. mm mm Dim. Min. Max. Min. Max. A A 330 B B 1.5 D C D D 20.2 E G F N 100 K T 30.4 P P Base quantity 1000 P Bulk quantity 1000 R 50 T W /18 DocID Rev 2

17 STH265N6F6-2AG, STH265N6F6-6AG Revision history 5 Revision history Table 11: Document revision history Date Revision Changes 13-Oct First release. 18-Dec Document status promoted from preliminary to production data. DocID Rev 2 17/18

18 STH265N6F6-2AG, STH265N6F6-6AG IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document STMicroelectronics All rights reserved 18/18 DocID Rev 2

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