Sony IMX Mp, 4.8 µm Pixel Size APS-C (DX Format) CMOS Image Sensor from Nikon D7000
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1 Sony IMX Mp, 4.8 µm Pixel Size APS-C (DX Format) CMOS Image Sensor from Nikon D7000 Module 1: Overview, Teardown, Die Photograph, Die Features
2 2 Some of the information is this report may be covered by patents, mask and/or copyright protection. This report should not be taken as an inducement to infringe on these rights Chipworks Inc. This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization s corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information. IPR JMRFER Revision 1.0 Published: December 23, 2010
3 3 Table of Contents (all Modules) Module 1: Overview Introduction, Device Summary, Product Teardown, Die Photograph, Die Features Module 2: Die Utilization, Basic Functionality Analysis Annotated Metal 1 Die Photograph, Die Utilization Analysis, Standard Logic Cell Size, SRAM Cell Size Module 3: Planar Pixel Analysis Pixel Design Summary, Pixel Schematic, Pixel Bevel SEM Analysis, Related Horizontal Pixel Dimensions Module 4: Pixel Cross-Sectional Analysis Pixel Process Summary, Pixel Horizontal and Vertical Cross-Sectional SEM Analyses, TEM Analysis of a Pixel Transistor and Gate Oxide, Related Pixel Dimensions Module 5: Substrate Dopant Analysis Pixel Bevel SCM Analysis, Pixel Cross-Sectional SCM Analysis, SRP of Pixel Substrate, SRP and SCM Analyses of Peripheral Substrate Module 6: Peripheral Cross-Sectional and Process Analysis SEM and TEM Analyses of General Structure, Dielectrics, Metals, Vias and Contacts, Column Capacitors, MOS Transistors, Isolation, Results of SEM and TEM EDS Analyses (BSI Process Features if Present)
4 4 Module 1 Contents Introduction Teardown Images (1 of 15) Teardown Images (2 of 15) Teardown Images (3 of 15) Teardown Images (4 of 15) Teardown Images (5 of 15) Teardown Images (6 of 15) Teardown Images (7 of 15) Teardown Images (8 of 15) Teardown Images (9 of 15) Teardown Images (10 of 15) Teardown Images (11 of 15) Teardown Images (12 of 15) Teardown Images (13 of 15) Teardown Images (14 of 15) Teardown Images (15 of 15) Package Photographs Package X-Rays IMX071 Die Photograph Die Markings Die Corners Overview Die Corners Detail Minimum Pitch Bond Pads Pixel Array Corners Overview Pixel Array Corners Detail Device Identification IMX071 Die Summary Statement of Measurement Uncertainty and Scope Variation About Chipworks
5 33 About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at Chipworks 3685 Richmond Road, Suite 500 Ottawa, Ontario K2H 5B7 Canada T F Web site: info@chipworks.com Please send any feedback to feedback@chipworks.com
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