STTH5R06. Turbo 2 ultrafast high voltage rectifier

Transcription

1 STTH5R06 Turbo 2 ultrafast high voltage rectifier Datasheet - production data K TO-220AC A K A K K A K TO-220FPAC Description The device is developed using ST's Turbo V technology. It is well-suited as a boost diode, especially for use in continuous mode power factor corrections and hard switching conditions. This device is also intended for use as a free wheeling diode in power supplies and other power switching applications. Symbol Table 1: Device summary Value IF(AV) 5 A D²PAK NC A VRRM 600 V Tj (max.) 175 C VF (typ.) 1.40 V K K trr (max.) 25 ns NC A DPAK A NC Features Ultrafast switching Low reverse recovery current Reduces switching losses Low thermal resistance Insulated package: TO-220FPAC Insulation voltage: 2000 VRMS sine ECOPACK 2 compliant component for DPAK on demand October 2016 DocID7976 Rev 12 1/17 This is information on a product in full production.

2 Characteristics STTH5R06 1 Characteristics Table 2: Absolute ratings (limiting values at 25 C, unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 600 V IF(RMS) IF(AV) IFSM Forward rms current Average forward current δ = 0.5, square wave Surge non repetitive forward current TC = 135 C TC = 105 C TO-220AC TO-220FPAC D²PAK 20 DPAK 10 TO-220AC DPAK D²PAK 5 A TO-220FPAC tp = 10 ms sinusoidal 50 A Tstg Storage temperature range -65 to +175 C Tj Maximum operating junction temperature 175 C A Table 3: Thermal parameter Symbol Parameter Max. value Unit Rth(j-c) TO-220AC / DPAK / D²PAK 3.0 Junction to case C/W TO-220FPAC 5.5 Table 4: Static electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit IR (1) VF (2) Reverse leakage current Forward voltage drop Notes: (1) Pulse test: tp = 5 ms, δ < 2% (2) Pulse test: tp = 380 µs, δ < 2% Tj = 25 C - 20 VR = VRRM Tj = 125 C Tj = 25 C IF = 5 A Tj = 125 C µa V To evaluate the conduction losses, use the following equation: P = x IF(AV) x IF 2 (RMS) 2/17 DocID7976 Rev 12

3 STTH5R06 Table 5: Dynamic electrical characteristics Characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit trr Reverse recovery time Tj = 25 C IF = 0.5 A Irr = 0.25 A IR = 1 A IF = 1 A - 25 ns VR = 30 V dif/dt = -50 A/µs - 40 IRM Reverse recovery current IF = 5 A Sfactor Softness factor Tj = 125 C VR = 400 V Qrr Reverse recovery charges dif/dt = -200 A/µs A nc tfr VFP Forward recovery time Forward recovery voltage Tj = 25 C IF = 5 A VFR = 1.1 x VF(max.) dif/dt = 40 A/µs ns V DocID7976 Rev 12 3/17

4 Characteristics 1.1 Characteristics (curves) Figure 1: Conduction losses versus average current P(W) 13 δ = 0.05 δ = 0.1 δ = 0.2 δ = δ = T 2 I 1 F(AV) δ =tp/t tp (A) STTH5R06 Figure 2: Forward voltage drop versus forward current Figure 3: Relative variation of thermal impedance junction to case versus pulse duration (TO-220AC, DPAK, D²PAK) Z th(j-c) /Rth(j-c) δ = 0.5 δ = 0.2 δ = 0.1 Single pulse 0.1 t p(s) δ=tp/t tp E-03 1.E-02 1.E-01 1.E+00 T Figure 4: Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAC) Z th (j-c)/r th(j-c ) δ = 0.5 δ = 0.2 δ = 0.1 S ingle pulse t (s ) p T δ= t p/t tp E-03 1.E-02 1.E-01 1.E+00 1.E+01 Figure 5: Peak reverse recovery current versus dif/dt (typical values) I (A) 22 R M V R =400V T j =125 C I F=0.25 x I F(AV ) I F=0.5 x I F(AV ) I F=I F(AV ) I F=2 x I F(AV ) 2 di F/d t(a /µs) Figure 6: Reverse recovery time versus dif/dt (typical values) t rr(ns) I F = 2 x I F (AV) I F = I F (AV) I F = 0.5 x I F (AV) V R = 400V T j = 125 C 10 di F/d t(a /µs) /17 DocID7976 Rev 12

5 STTH5R06 Figure 7: Reverse recovery charges versus dif/dt (typical values) Q rr (nc) V R = 400V T j= 125 C I F = 2 x I F (AV) I F = I F (AV) I F = 0.5 x I F (AV) 50 di F/ dt (A/µs) S factor Characteristics Figure 8: Softness factor versus dif/dt (typical values) I F = I F (AV) V = 400 V R T = 125 C j di F/dt(A/µs) Figure 9: Relative variations of dynamic parameters versus junction temperature Figure 10: Transient peak forward voltage versus dif/dt (typical values) V FP(V ) I = I (AV) F F T j = 125 C di /d t(a /µs) F Figure 11: Forward recovery time versus dif/dt (typical values) t fr (ns) I = I (AV) F F V = 1.1 x V max FR F T j = 125 C Figure 12: Junction capacitance versus reverse voltage applied (typical values) C (pf) 100 F = 1 MHz V osc = 30 V FMS T j = 25 C di /d t(a /µs) F V (V) R DocID7976 Rev 12 5/17

6 Characteristics Figure 13: Thermal resistance junction to ambient versus copper surface under tab (DPAK) STTH5R06 Figure 14: Thermal resistance junction to ambient versus copper surface under tab (D²PAK) 6/17 DocID7976 Rev 12

7 STTH5R06 Package information 2 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: ECOPACK is an ST trademark. Cooling method: by conduction (C) Epoxy meets UL 94,V0 Recommended torque value: 0.55 N m (for TO-220FPAC / TO-220AC) Maximum torque value: 0.7 N m (for TO-220FPAC / TO-220AC) 2.1 TO-220AC package information Figure 15: TO-220AC package outline DocID7976 Rev 12 7/17

8 Package information STTH5R06 Table 6: TO-220AC package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A C D E F F G H L typ typ. L L L L L M 2.6 typ typ. Diam /17 DocID7976 Rev 12

9 STTH5R TO-220FPAC package information Figure 16: TO-220FPAC package outline Package information H B A Dia L6 L2 L7 L3 L5 F1 D L4 G1 F E G DocID7976 Rev 12 9/17

10 Package information STTH5R06 Table 7: TO-220FPAC package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A B D E F F G G H L typ typ. L L L L L Dia /17 DocID7976 Rev 12

11 STTH5R DPAK package information Figure 17: DPAK package outline Package information This package drawing may slightly differ from the physical package. However, all the specified dimensions are guaranteed. DocID7976 Rev 12 11/17

12 Package information STTH5R06 Table 8: DPAK package mechanical data Dimensions Ref. Millimeters Inches Min. Max. Min. Max. A A A b b c c D D E E e typ typ. e H L L L V Figure 18: DPAK recommended footprint (dimensions in mm) 12/17 DocID7976 Rev 12

13 STTH5R D²PAK package information Figure 19: D²PAK package outline Package information DocID7976 Rev 12 13/17

14 Package information STTH5R06 Table 9: D²PAK package mechanical data Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A A b b c c D D D E E E e e H J L L L R V /17 DocID7976 Rev 12

15 STTH5R06 Figure 20: D²PAK recommended footprint (dimensions are in mm) Package information DocID7976 Rev 12 15/17

16 Ordering information STTH5R06 3 Ordering information Table 10: Ordering information Order code Marking Package Weight Base qty. Delivery mode STTH5R06D STTH5R06D TO-220AC 1.90 g 50 Tube STTH5R06G-TR STTH5R06G D²PAK 1.48 g 1000 Tape and reel STTH5R06FP STTH5R06FP TO-220FPAC 1.90 g 50 Tube STTH5R06B STTH5 R06B DPAK 0.30 g 75 Tube STTH5R06B-TR STTH5 R06B DPAK 0.30 g 2500 Tape and reel 4 Revision history Table 11: Document revision history Date Revision Changes 17-Feb Last issue. 01-Aug Added insulated package text in Features. Corrected typographical errors in Table 10. Updated TO-220FPAC, D2PAK and DPAK package information and reformatted to current standard. 18-Sep Updated Figure 18, Figure 19 and Table Oct Updated DPAK package information and reformatted to current standard. 16/17 DocID7976 Rev 12

17 STTH5R06 IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document STMicroelectronics All rights reserved DocID7976 Rev 12 17/17

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