MC74HC1G02. Single 2-Input NOR Gate

Transcription

1 MC74CG2 Single 2-Input NOR Gate The MC74CG2 is a high speed CMOS 2 input NOR gate fabricated with silicon gate CMOS technology. The internal circuit is composed of multiple stages, including a buffer output which provides high noise immunity and stable output. The MC74CG2 output drive current is /2 compared to the MC74C series. igh Speed: t PD = 7 ns (Typ) at CC = ow Power Dissipation: I CC = A (Max) at T A = 2 C igh Noise Immunity Balanced Propagation Delays (t P = t P ) Symmetrical Output Impedance (I O = I O = 2 ma) Chip Complexity: FET = 4 These Devices are Pb Free and are RoS Compliant SC7 /SC 88A/SOT 33 DF SUFFIX CASE 49A MARKING DIAGRAMS 3 M IN B IN A 2 CC GND 3 4 OUT Y Figure. Pinout (Top iew) SOT23 /TSOP /SC9 DT SUFFIX CASE M 3 = Specific Device Code M = Date Code = Pb Free Package (Note: Microdot may be in either location) IN A IN B Figure 2. ogic Symbol OUT Y PIN ASSIGNMENT IN B 2 IN A 3 GND 4 OUT Y CC FUNCTION TABE Inputs Output A B Y ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Semiconductor Components Industries, C, 2 February, 2 Rev. 9 Publication Order Number: MC74CG2/D

2 MC74CG2 MAXIMUM RATINGS Symbol Parameter alue Unit CC DC Supply oltage. to 7. IN DC Input oltage. to CC. OUT DC Output oltage. to CC. I IK DC Input Diode Current 2 ma I OK DC Output Diode Current 2 ma I OUT DC Output Sink Current 2. ma I CC DC Supply Current per Supply Pin 2 ma T STG Storage Temperature Range 6 to C T ead Temperature, mm from Case for Seconds 26 C T J Junction Temperature Under Bias C JA Thermal Resistance SC7 /SC 88A (Note ) TSOP P D Power Dissipation in Still Air at 8 C SC7 /SC 88A TSOP C/W mw MS Moisture Sensitivity evel F R Flammability Rating Oxygen Index: 28 to 34 U 2 in ESD ESD Withstand oltage uman Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) 2 2 N/A I ATCUP atchup Performance Above CC and Below GND at 2 C (Note ) ma Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. Measured with minimum pad spacing on an FR4 board, using mm by inch, 2 ounce copper trace with no air flow. 2. Tested to EIA/JESD22 A4 A. 3. Tested to EIA/JESD22 A A. 4. Tested to JESD22 C A.. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit CC DC Supply oltage IN DC Input oltage. CC OUT DC Output oltage. CC T A Operating Temperature Range 2 C t r, t f Input Rise and Fall Time CC = CC = CC = CC = 6 4 ns DEICE JUNCTION TEMPERATURE ERSUS TIME TO % BOND FAIURES Junction Temperature C Time, ours Time, Years 8,32, , , , , ,8 4 8,9. NORMAIZED FAIURE RATE FAIURE RATE OF PASTIC = CERAMIC UNTI INTERMETAICS OCCUR T J = 3 C T J = 2 C T J = C T J = C TIME, YEARS Figure 3. Failure Rate vs. Time Junction Temperature T J = 9 C T J = 8 C 2

3 MC74CG2 DC EECTRICA CARACTERISTICS CC T A = 2 C T A 8 C C T A 2 C Symbol Parameter Test Conditions () Min Typ Max Min Max Min Max Unit I Minimum igh evel Input oltage I Maximum ow evel Input oltage O Minimum igh evel Output oltage IN = I or I IN = I or I I O = 2 A IN = I or I I O = 2 ma I O = 2.6 ma O Maximum ow evel Output oltage IN = I or I IN = I or I I O = 2 A.... IN = I or I I O = 2 ma I O = 2.6 ma I IN I CC Maximum Input eakage Current Maximum Quiescent Supply Current IN = or GND.. A IN = CC or GND. 4 A AC EECTRICA CARACTERISTICS (Input t r = t f = ns) T A = 2 C T A 8 C C T A 2 C Symbol Parameter Test Conditions Min Typ Max Min Max Min Max Unit t P, ÎÎ Maximum CC =. C = 3. ÎÎÎ Î 2 ÎÎÎ 2 ÎÎ ns t P Propagation Delay, Î Input A or B to Y CC = C = pfî 9 ÎÎÎ ÎÎÎ ÎÎÎ 2 ÎÎ Î CC = CC ÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎ ÎÎ = Î CC = ÎÎÎ ÎÎÎ 6. ÎÎÎ 7 ÎÎÎ ÎÎÎ 2 26 ÎÎ t T, ÎÎ Output Transition CC =. C = 3 ÎÎÎ Î ÎÎÎ 2 ÎÎ ns t T Time Î CC = C = pfî 2 ÎÎÎ 2 ÎÎÎ ÎÎÎ 2 ÎÎ Î CC = CC = ÎÎÎ ÎÎÎ ÎÎÎ 2 ÎÎÎ ÎÎÎ 3 38 ÎÎ CC = Î C IN Maximum Input Î ÎÎÎ ÎÎÎ ÎÎ pf Capacitance 2 C, CC =. C PD Power Dissipation Capacitance (Note 6) pf 6. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I CC(OPR) = C PD CC f in + I CC. C PD is used to determine the no load dynamic power consumption; P D = C PD CC 2 f in + I CC CC. 3

4 MC74CG2 INPUT A or B 9% % % t f t r CC GND INPUT C * OUTPUT t P t P OUTPUT Y 9% % % t T t T *Includes all probe and jig capacitance. A Mz square input wave is recommended for propagation delay tests. Figure 4. Switching Waveforms Figure. Test Circuit DEICE ORDERING INFORMATION Device Order Number ogic Circuit Indicator Temp Range Identifier Device Nomenclature Technology Device Function Package Suffix Tape and Reel Suffix Package Type MC74CG2DFTG MC 74 CG 2 DF T SC7 /SC 88A/ SOT 33 (Pb Free) MC74CG2DFT2G MC 74 CG 2 DF T2 SC7 /SC 88A/ SOT 33 (Pb Free) MC74CG2DTTG MC 74 CG 2 DT T SOT23 /TSOP / SC9 (Pb Free) Tape and Reel Size 78 mm (7 in) 3 Unit 78 mm (7 in) 3 Unit 78 mm (7 in) 3 Unit For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8/D. 4

5 MC74CG2 PACKAGE DIMENSIONS SC 88A (SC 7 /SOT 33) CASE 49A 2 ISSUE K S A G 4 B 2 3 D P.2 (.8) M B M N NOTES:. DIMENSIONING AND TOERANCING PER ANSI YM, CONTROING DIMENSION: INC A OBSOETE. NEW STANDARD 49A DIMENSIONS A AND B DO NOT INCUDE MOD FAS, PROTRUSIONS, OR GATE BURRS. INCES MIIMETERS DIM MIN MAX MIN MAX A B C D G.26 BSC.6 BSC J.4..2 K N.8 REF.2 REF S C J K

6 MC74CG2 PACKAGE DIMENSIONS SOT23 /TSOP /SC9 DT SUFFIX CASE ISSUE 2X 2X NOTE T.2 T G A B C D X.2 C A B T S SEATING PANE J K DETAI Z M DETAI Z SODERING FOOTPRINT* NOTES:. DIMENSIONING AND TOERANCING PER ASME YM, CONTROING DIMENSION: MIIMETERS. 3. MAXIMUM EAD TICKNESS INCUDES EAD FINIS TICKNESS. MINIMUM EAD TICKNESS IS TE MINIMUM TICKNESS OF BASE MATERIA. 4. DIMENSIONS A AND B DO NOT INCUDE MOD FAS, PROTRUSIONS, OR GATE BURRS.. OPTIONA CONSTRUCTION: AN ADDITIONA TRIMMED EAD IS AOWED IN TIS OCATION. TRIMMED EAD NOT TO EXTEND MORE TAN.2 FROM BODY. MIIMETERS DIM MIN MAX A BSC B. BSC C.9. D.2. G.9 BSC. J.26 K M S SCAE : mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, C (SCIC). SCIC reserves the right to make changes without further notice to any products herein. SCIC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCIC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCIC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCIC does not convey any license under its patent rights nor the rights of others. SCIC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCIC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCIC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCIC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCIC was negligent regarding the design or manufacture of the part. SCIC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBICATION ORDERING INFORMATION ITERATURE FUFIMENT: iterature Distribution Center for ON Semiconductor P.O. Box 63, Denver, Colorado 827 USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderlit@onsemi.com N. American Technical Support: Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order iterature: For additional information, please contact your local Sales Representative MC74CG2/D