Programme de Conversion au sans-plomb

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1 Programme de Conversion au sans-plomb September 9, 2005 Rev. 4.1T R ECO PACK 1

2 LEAD-FREE CONVERSION PROGRAM September 9, 2005 Rev. 4.1T R ECO PACK 1

3 Content Definitions & Regulations Lead-free solutions Solderability Whiskers Identification & Traceability Qualification Conversion roadmap Manufacturing Conclusion September 9, 2005 Rev. 4.1T

4 RoHS Compliant Packages Substances listed are not intentionally added, but might be present as impurity with defined upper limit. Limits refer to the individual material (such as mold compound, solder, plating, leadframe, substrate...) 1- Lead-free Definition substance Upper limit (weight) Materials e.g. Lead-free Pb < 1000 ppm lead finish solder balls 2- Other heavy metals banned by RoHS directive (Hg, Cd, Cr-VI ) and the 2 brominated compounds PBB and PBDE banned by RoHS are not present in STMicroelectronics products as referred in ST specification on environment related banned substances list # PBB : Poly Brominated Biphenyls such as DECABB, OCTABB & PENTABB - PBDE : Poly Brominated Diphenyl Ethers such as DECABDPE, OCTABDPE, PENTABPDE MONOBDPE Therefore, once converted to Lead-free (Pb-free), ST devices are RoHS compliant. For ST products : Lead-free => RoHS compliant Exception : RoHS directive do not ban the use of Lead (Pb) in Frit seal glass and in High Pbcontent alloys ( > 85%Pb) because no reliable alternative is ready. September 9, 2005 Rev. 4.1T

5 ECO R PACK Ecopack is the registered trade-mark of STMicroelectronics for its component development and programs implementation for solutions leading to environment friendly packaging and packing materials. Ecopack products are Lead-free and RoHS compliant. ECOPACK Working Group is active since 2000 Ecopack specification is referenced in ADCS under number September 9, 2005 Rev. 4.1T

6 E4 Initiative In July 2001, Philips, STMicroelectronics and Infineon Technologies (E3) teamed up to develop standards for Lead-free products. The definition includes factors such as solderability, reliability of alternative materials and characterization of the Moisture Sensitivity Level. A Lead-free product, as defined by the companies, contains less than 1000 parts per million lead by weight. On June 3, 2004 Freescale (Motorola) joined the E3 Initiative which is now renamed E4. New documents under the E4 logo under preparation. The 4 Companies have agreed on: common definition of Lead-free Components common definition of Green Components same Testing Methods A technical set of documents validated by the 4 companies is available on st.com: Lead-free packaging for semiconductor devices Whisker on Alloy42 (NiFe) leadframes based packages Whisker on Copper alloys leadframes based packages Solderability September 9, 2005 Rev. 4.1T

7 E4 Initiative Green Components The E4 classifies a product-package green when it is free from substances as defined in RoHS (Pb, Hg, Cd, Cr6+) and brominated flame retardant (PBB,PBDE) Exempted packages (e.g. high Lead solder for die attach), are also classified as green. Green is sometimes used to describe the trend to eliminate all Halogenated Flame Retardant in electronic components Halogen free (bromine free) materials are not a RoHS requirement but a trend in molding compounds to get better performance. ST is evaluating systematically such molding compounds to improve package robustness when necessary. September 9, 2005 Rev. 4.1T

8 Lead-free Solutions (1/2) Packages Pb-Based Lead-Free Main characteristics SnPb Dipping Tin (Sn) Dipping no Whisker growth Leadframe based SnPb Post plating Matte Tin (Sn) Post-plating NiPdAu Pre-plating Material availability is good Closest to PbSn in cost and process Good solderability with PbSn and Pb free solders Good solder-joint reliability Whisker free process available (1) (1) See whisker presentation Good solderability with PbSn and Pb free solders Good solder joint reliability Used in high volume Offered by major lead frame suppliers SnBi Only for subcontracted TSOP (Some memories only) Notice : The choice of finishing (Sn or NiPdAu) is determined by ST. Solutions are defined per package and per assembly line.

9 Lead-free Solutions (2/2) Packages Pb-Based Pb-Free Main characteristics Ball Grid Array SnPb SnAgCu (*) Good solderability with Pb free solders Offered by all major suppliers Limited backward compatibility with PbSn solders (board soldering process to be adapted) Bumps for FlipChip SnPb -SnAgCu (*) -SnAg -Gold bumps Depending on applications and bumping techniques Die bonding in power packages Glass sealing in frit seal packages Exempted (*) SnAgCu metallurgy or its derivatives

10 Lead-free Process for Semiconductor Packaging Ready Ready Ready Solder Dipping/Plating Solder Plating / NiPdAu coating Balls in BGA >exempted Ready >exempted Frit Seal Glass Bumps in Flip Chip Power Die Bonding

11 L/F packages Compatibility 215 C SnPb solder 240 C supplier Pb Pb customer component finish Pb solder ( C) Today Experience of some decades of board assembly BACKWARD COMPATIBILITY Processability: Solderability: Reliability: 235 C Pb-free solder 260 C Increase temp. by 20 C Pb solder ( C) Processability: Solderability: Reliability: Processability: Solderability: Reliability: FORWARD COMPATIBILITY MSL / PPT to be checked After full conversion

12 BGA packages Compatibility 215 C SnPb solder 240 C supplier customer Pb solder ( C) 235 C Pb-free solder 260 C Pb solder ( C) Increase temp. by 20 C FORWARD COMPATIBILITY Pb Today Experience of some Processability: decades of board assembly Reliability: Pb component finish BACKWARD COMPATIBILITY Processabilty below 230 C critical Reliability: (improved to SnPb) For low temperatures critical MSL / PPT to be checked After full conversion Processability: Reliability:

13 Whiskers whiskers are extrusions of tin, due to the internal stress of the coating layer Filament whisker, with high aspect ratio, i.e. length is many times the diameter. It is considered risky if longer than micron However, no field failure is reported for Matt Sn on Cu and A42 Whiskers with low aspect ratio, i.e. length is a few times the diameter. They are not considered risky, as they develop only <50 micron on Cu. On A42, they grow in thermal cycles, at the same extent of PbSn finishing

14 E4 Matte Tin Whiskers-free conditions Matte Tin thicker than 7 µm controls whiskers below 50µm length. Whisker-free after annealing 150 C / 1 h E4 definition for whisker-free : no whisker longer than 50/µm at the end of life

15 Lead-free Packing Labeling Before compliance with JEDEC JESD97 (before January 2005) When compliant with JEDEC JESD97 (February 2005) Type of lead-finishing RoHS Compliant Ecopack is mentioned on inner box (bulk) labels (see ADCS spec # ) Label layout complies with Jedec standard J-std033A September 9, 2005 Rev. 4.1T

16 ST Roadmap The conversion roadmap (Rev.1.0) has been released in the PCN # 744 An update of the roadmap is available at

17 Manufacturing Conversion Deliveries Conversion Conversion roadmaps are related to manufacturing Delivery conversion plans at product level depend on available parts (inventories + work in process) FIFO is the rule in all warehouses but parts might be shipped from different stores.

18 Plating Equipment Conversion requires at least one week per equipment No backward conversion to Pb possible. Therefore, production by campaign is not possible. No room to duplicate equipments due to their size September 9, 2005 Rev. 4.1T

19 Market Conversion Period Forward compatibility Backward compatibility 100% 0% Pb Pb-deliveries Pb-free deliveries Pb-Solder Pb-free solder Pb Stabilization time Mixed technologies Solder conversion e/o Q Main product manufacturing conversion will be completed RoHS deadline July 1st, 2006

20 How to smooth the transition? To smooth the transition, it is recommended : To define a fast and simple qualification process (sampling, tests) To stick to suppliers roadmaps when there is full compatibility between SnPb and Pb-free devices To provide suppliers with accurate consumption forecasts

21 Thank You! For further information: The publication of this document is not authorized without written STMicroelectronics authorisation. Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties, which may result from its use. This document is subject to change without notice.

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