QSys the ultra compact embedded PC platform based on Intel Atom E3800 ( BayTrail )

Transcription

1 QSys the ultra compact embedded PC platform based on Intel Atom E3800 ( BayTrail ) TQ-Group l QSys Design-In Presentation_Rev.003 Slide

2 Architecture Overview Benefits of the new gen. Intel Atom BayTrail (E3800) High Performance with Single Core (.46 GHz) up to Quad Core (.9 GHz) CPU Great computing power based on 64 bit Intel Silvermount microarchitecture Overall performance scaling with factor 5..6 Latest Intel HD Graphics Engine (Generation 7) High graphics performance with additional hardware decode/encode engines Dual display support with high resolution up to 2560x x200 High bandwidth DDR3L interface Up to 8 GB (dual channel, 64 bit, up to 333 MT/s) Big L2-Cache (up to 2 MB) Modern high speed IO USB 3.0, PCIe Gen. 2, SATA II, DisplayPort Extended temperature support (T j -40 C to 0 C) Latest 22 nm tri-gate processor technology Best efficiency and ultra low power (5..0 W TDP) Latest process technology with longevity TQ-Group l QSys Design-In Presentation_Rev.003 Folie 2

3 QSys Concept Overview TQ improves the benefits QSys embedded platform Fully x86 compatible Easy work on SW Win7, Win8 and Linux onboard emcc 4/8GB (32GB) Could keep recovery image on the device Easy installation Easy exchange of msata SSD Reliable & easy service Gigabit Ethernet USB 3.0, esatap WiFi+Bluetooth* UMTS/HSPA/LTE* * via two Mini PCIe sockets (SIM card socket onboard) Scalable with factor 5..6 DDR3L-333 High Speed IO Latest Intel HD Graphics Engine DisplayPort & LVDS+Backlight Native Full HD Dual Display Onboard Audio incl. Amplifier 3 4 Monitor support (opt.) Sentinel HL Security Controller TPM.2 / 2.0 Secure EEPROM TQ-Group l QSys Design-In Presentation_Rev.003 Folie 3

4 QSys Key Features Based on Intel Atom E3800 ( BayTrail ) Optimized for ultra low power Extended temperature (-20 C to 70 C) High speed IO with Gbit Ethernet, USB 3.0 and esatap DisplayPort and LVDS 2 Mini PCIe sockets with SIM card socket onboard Soldered onboard emmc and msata flash card socket Integrated security features Audio with integrated amplifier Ultra compact design (0cm x 0 cm x 2,3 cm) Robust and reliable with longevity Also usable as an embedded alternative for Intel NUC standard boards (enuc) TQ-Group l QSys Design-In Presentation_Rev.003 Folie 4

5 00mm 90,4mm +5V GND (NC) Int. Display (LVDS, Backlight, ) QSys Overview functionality and interfaces 95mm (symmetrical) 2x int. USB Speaker Audio MIC/HP PWR ) Qseven module SIM LVDS EDID EEPROM Sentinel HL Bat. WiFi + BT module 3) TPM.2/2.0 msata module HSPA/LTE or I/O module 3) 7,3mm DisplayPort USB 3.0 esatap 2) Gb ETH 00mm Height profile:.6 mm PCB mm (top) mm (bottom) = 2.3 mm (total) Encrypted EEPROM Reset, Fan ) 5V power in: use Phoenix FMC,5/3-ST-3,5 connector 2) esatap: can be used for external SATA (incl. power) or USB 2.0 3) also other Mini PCIe cards with PCIe and/or USB are supported TQ-Group l QSys Design-In Presentation_Rev.003 Folie 5

6 QSys Special Features Benefits with SafeNet Sentinel HL security controller QSys is the first standard platform in the market which includes SafeNet s Sentinel HL security controller soldered onboard. Hardware + Software combined security QSys samples (Rev. 0) include the controller with a Demo ID for test purposes. In mass production (starting with Rev. 02) this feature is optional. Every customer gets a unique ID in the controller. Supported features: AppOnChip IP Protection Anti-Reverse Engineering Transparent to the end user Simple implementation No additional operational efforts Software Monetization Application feature management Upgrade without hardware change Pay-per-use functionality Copy protection/control Control of product volumes Value on stock reduction TQ-Group l QSys Design-In Presentation_Rev.003 Folie 6

7 QSys Platform Products QSys is a platform and is available with the following products MB-Q7-2 QKit QBox / QPanel Mainboard for Qseven Modules (x86, according spec. 2.0) Only available for OEM partners Hardware Kits for easy integration into complete systems and projectspecific housings BoxPCs and PanelPCs / HMI in various formats according to your requirements Actual qualified CPU modules: conga-qa3 + heatspreader conga-qa3/hsp-t conga-qg (ongoing) + heatspreader conga-qg/hsp-t Heatspreader not shown Existing of: Mainboard+CPU-Module+Heatspreader + optional additional features like msata Parameters: CPU / DDR3 / emmc / Temp Mass storage (msata) i. e. Standard QBox (05 x 05 x 56 mm) with additional interfaces Examples for reference only TQ-Group l QSys Design-In Presentation_Rev.003 Folie 7

8 +5V GND (NC) QSys Design-In detail Internal Interfaces (top side /2) SIM card socket (contacts on top side) (signals are connected to Mini PCIe full size socket) Power-In: 5V Single Supply Fan (temp. controlled) Use only one of the fan connectors at the same time. 3 2 MC.5/3-G-3.5 PHOENIX Reverse voltage protection is implemented Fuse and line filter have to be realized external MOLEX Pin 3 has internal 0K Pull-Up to VCC3V3 Use Phoenix FMC,5/3-ST-3,5 to connect power cord. Connection method: Spring-cage connection TQ-Group l QSys Design-In Presentation_Rev.003 Folie 8

9 QSys Design-In detail Internal Interfaces (top side 2/2) LVDS (out) Backlight (out) DF9G-20P-H Hirose (max. A/pin with AWG28) Backlight (for none-5v) 3 2 DF9G-30P-H Hirose (max. A/pin with AWG28) MC.5/3-G-3.5 PHOENIX Only used, if Backlight_VCC can t be driven from internal VCC5V. (max. input 2V / 5A) TQ-Group l QSys Design-In Presentation_Rev.003 Folie 9

10 QSys Design-In detail Internal Interfaces (bottom side) Audio (MIC, Headphone) Speaker (R/L) 2x MOLEX 4 / 8 Ohm, max. 2W MOLEX 2x internal USB Fan (temp. controlled) Reset USB USB5 Use only one of the fan connectors at the same time MOLEX Pin 3 has internal 0k Pull-Up to VCC3V3 2x MOLEX USB5 is not available if Sentinel HL Security Controller is assembled MOLEX TQ-Group l QSys Design-In Presentation_Rev.003 Folie 0

11 QSys Design-In detail Mechanical integration IO shield Top view Heatspreader (4,2 mm above PCB) Reference (0/0): PCB top side, left PCB (thickness:.6 mm) is shown as dashed line (below connector break-outs) Heatspreader is shown as dashed line (above connector break-outs) Holes for ACT and PWR LEDs and R (Reset) button are optional, diameters are only for reference and could vary ETH connector intrudes into IO shield (~ mm) Simplified QKit 3D STEP file is available on request. (All dimensions are in mm) Use 4x M3 for mounting PCB into chassis Height profile (PCB thickness =.6 mm):» Highest component on top side: heatspreader (4,2 mm + thermal pad)» Highest component on bottom side: battery socket (5,5 mm) TQ-Group l QSys Design-In Presentation_Rev.003 Folie

12 QSys Further information Website: / (English) Contact: Sales & Support: TQ-Systems GmbH Mühlstr. 2, Seefeld, Germany Tel info@tq-group.com / support@tq-group.com Product Management: Harald Maier Harald.Maier@tq-group.com TQ-Group l QSys Design-In Presentation_Rev.003 Folie 4