FGA25N120ANTD 1200V NPT Trench IGBT
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1 FGA25N2ANTD 2V NPT Trench IGBT Features NPT Trench Technology, Positive temperature coefficient Low saturation voltage: V CE(sat), typ = = 25A and Low switching loss: E off, typ = 25A and Extremely enhanced avalanche capability Description August 25 Using Fairchild's proprietary trench design and advanced NPT technology, the 2V NPT IGBT offers superior conduction and switching performances, high avalanche ruggedness and easy parallel operation. This device is well suited for the resonant or soft switching application such as induction heating, microwave oven, etc. C FGA25N2ANTD 2V NPT Trench IGBT G G C E TO-3P E Absolute Maximum Ratings Symbol Description FGA25N2ANTD Units V CES Collector-Emitter Voltage 2 V S Gate-Emitter Voltage ± 2 V Collector 5 A Collector = C 25 A M Pulsed Collector Current (Note ) 75 A I F Diode Continuous Forward = C 25 A I FM Diode Maximum Forward Current 5 A P D Maximum Power 32 W Maximum Power = C 25 W T J Operating Junction Temperature -55 to +5 C T stg Storage Temperature Range -55 to +5 C T L Maximum Lead Temp. for soldering Purposes, /8 from case for 5 seconds 3 C Thermal Characteristics Symbol Parameter Typ. Max. Units R θjc Thermal Resistance, Junction-to-Case for IGBT --.4 C/W R θjc Thermal Resistance, Junction-to-Case for Diode C/W R θja Thermal Resistance, Junction-to-Ambient -- 4 C/W 25 Fairchild Semiconductor Corporation FGA25N2ANTD Rev. B
2 Package Marking and Ordering Information Device Marking Device Package Reel Size Tape Width Quantity FGA25N2ANTD FGA25N2ANTD TO-3P Electrical Characteristics of the IGBT unless otherwise noted Symbol Parameter Test Conditions Min. Typ. Max. Units Off Characteristics ES Collector Cut-Off Current V CE = V CES, = V ma I GES G-E Leakage Current = S, V CE = V ± 25 na On Characteristics (th) G-E Threshold Voltage = 25mA, V CE = V V CE(sat) Collector to Emitter = 25A, = 5V V Saturation Voltage = 25A, = 5V, V = 5A, = 5V V FGA25N2ANTD 2V NPT Trench IGBT Dynamic Characteristics C ies Input Capacitance V CE = 3V, = V, pf C oes Output Capacitance f = MHz pf C res Reverse Transfer Capacitance pf Switching Characteristics t d(on) Turn-On Delay Time V CC = 6 V, = 25A, ns t r Rise Time R G = Ω, = 5V, Inductive Load, ns t d(off) Turn-Off Delay Time ns t f Fall Time -- 8 ns E on Turn-On Switching Loss mj E off Turn-Off Switching Loss mj E ts Total Switching Loss mj t d(on) Turn-On Delay Time V CC = 6 V, = 25A, ns t r Rise Time R G = Ω, = 5V, Inductive Load, ns t d(off) Turn-Off Delay Time ns t f Fall Time ns E on Turn-On Switching Loss mj E off Turn-Off Switching Loss mj E ts Total Switching Loss mj Q g Total Gate Charge V CE = 6 V, = 25A, nc Q ge Gate-Emitter Charge = 5V nc Q gc Gate-Collector Charge -- 5 nc Notes: () Repetitive rating: Pulse width limited by max. junction temperature FGA25N2ANTD Rev. B 2
3 Electrical Characteristics of DIODE unless otherwise noted Symbol Parameter Test Conditions Min. Typ. Max. Units V FM Diode Forward Voltage I F = 25A V t rr Diode Reverse Recovery Time I F = 25A ns di/dt = 2 A/µs I rr Diode Peak Reverse Recovery Current A Q rr Diode Reverse Recovery Charge nc FGA25N2ANTD 2V NPT Trench IGBT FGA25N2ANTD Rev. B 3
4 Typical Performance Characteristics Figure. Typical Output Characteristics Collector Current, 8 T 2V C 5V 2V 6 7V V 4 2 9V 8 6 8V 4 7V 2 = 6V Figure 3. Saturation Voltage vs. Case Temperature at Variant Current Level Figure 2. Typical Saturation Voltage Characteristics Collector Current, = 5V Figure 4. Saturation Voltage vs. FGA25N2ANTD 2V NPT Trench IGBT 3. = 5V 2 = -4 C A = 25A = 2.5A 4A 25A Case Temperature, [ C] Gate-Emitter Voltage, Figure 5. Saturation Voltage vs. Figure 6. Saturation Voltage vs = 2.5A 4A 25A = 2.5A 4A 25A Gate-Emitter Voltage, Gate-Emitter Voltage, FGA25N2ANTD Rev. B 4
5 Typical Performance Characteristics (Continued) Figure 7. Capacitance Characteristics Capacitance [pf] Ciss Coss Crss = V, f = MHz Figure 9. Turn-Off Characteristics vs. Gate Resistance Figure 8. Turn-On Characteristics vs. Gate Resistance Switching Time [ns] tr td(on) V CC = 6V, = ±5V = 25A Gate Resistance, R G [Ω] Figure. Switching Loss vs. Gate Resistance FGA25N2ANTD 2V NPT Trench IGBT Switching Time [ns] V CC = 6V, = ±5V = 25A td(off) tf Switching Loss [mj] V CC = 6V, = ±5V = 25A Eon Eoff Gate Resistance, R G [Ω] Gate Resistance, R G [Ω] Figure. Turn-On Characteristics vs. Collector Current Figure 2. Turn-Off Characteristics vs. Collector Current = ±5V, R G = Ω Switching Time [ns] tr td(on) Switching Time [ns] = ±5V, R G = Ω td(off) tf Collector Current, Collector Current, FGA25N2ANTD Rev. B 5
6 ]hjc[ztseponresmalher..e-e-5e-4e-3..rectangularpuseduration[sectypical Performance Characteristics (Continued) Figure 3. Switching Loss vs. Collector Current Switching Loss [mj] = ±5V, R G = Ω Collector Current, Figure 5. SOA Characteristics Eon Eoff Figure 4. Gate Charge Characteristics Gate-Emitter Voltage, R L = 24Ω Figure 6. Turn-Off SOA Vcc = 2V Gate Charge, Q g [nc] 4V 6V FGA25N2ANTD 2V NPT Trench IGBT Collector Current, Ic. Ic MAX (Pulsed) Ic MAX (Continuous) Single Nonrepetitive Pulse DC Operation ms µs 5µs Curves must be derated linearly with increase in temperature.. Collector Current, Safe Operating Area = 5V, Figure 7. Transient Thermal Impedance of IGBT Collector - Emitter Voltage, V CE single pulsetlpdm t t2 Duty factor D = t / t2 Peak Tj = Pdm Zthjc + ]FGA25N2ANTD Rev. B 6
7 Typical Performance Characteristics (Continued) Figure 8. Forward Characteristics Figure 9. Reverse Recovery Current Forward Current, I F 5 T J T J Forward Voltage, V F 3 25 di/dt = 2A/µs 2 5 di/dt = A/µs Forward Current, I F Figure 2. Stored Charge Figure 2. Reverse Recovery Time Reverse Recovery Currnet, I rr FGA25N2ANTD 2V NPT Trench IGBT 4 3 Stored Recovery Charge, Q rr [nc] 3 2 di/dt = 2A/µs di/dt = A/µs Reverse Recovery Time, t rr [ns] 2 di/dt = A/µs di/dt = 2A/µs Forward Current, I F Forward Current, I F FGA25N2ANTD Rev. B 7
8 Mechanical Dimensions 5.6 ± ±.2 ø3.2 ±. 9.6 ± ±.2 TO-3P 2.76 ± ± ± ± ± ± FGA25N2ANTD 2V NPT Trench IGBT 2. ±.2 3. ±.2. ± ± ±.3.4 ± TYP [5.45 ±.3] 5.45TYP [5.45 ±.3] Dimensions in Millimeters FGA25N2ANTD Rev. B 8
9 TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx ActiveArray Bottomless Build it Now CoolFET CROSSVOLT DOME EcoSPARK E 2 CMOS EnSigna FACT FACT Quiet Series FAST FASTr FPS FRFET GlobalOptoisolator GTO HiSeC I 2 C i-lo ImpliedDisconnect IntelliMAX Across the board. Around the world. The Power Franchise Programmable Active Droop ISOPLANAR LittleFET MICROCOUPLER MicroFET MicroPak MICROWIRE MSX MSXPro OCX OCXPro OPTOLOGIC OPTOPLANAR PACMAN POP Power247 PowerEdge PowerSaver PowerTrench QFET QS QT Optoelectronics Quiet Series RapidConfigure RapidConnect µserdes SILENT SWITCHER SMART START SPM Stealth SuperFET SuperSOT -3 SuperSOT -6 SuperSOT -8 SyncFET TinyLogic TINYOPTO TruTranslation UHC UltraFET UniFET VCX Wire DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. FGA25N2ANTD 2V NPT Trench IGBT LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I6 FGA25N2ANTD Rev. B 9
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