Chair: Tim Kruse, Plexus Corp. Co-Chair: David Mendez, Solectron Corp. inemi Webinar February 16, 2005

Transcription

1 DPMO Project Final Report Chair: Tim Kruse, Plexus Corp. Co-Chair: David Mendez, Solectron Corp. inemi Webinar February 16, 2005

2 Agenda Participants Background & Motivation Scope of Work Database Structure Sample of Results Accomplishments Lessons Learned Possible Future Activities 2

3 DPMO Project Participants Agilent* Celestica* Delphi Automotive* Georgia Tech Hewlett Packard* Mack Technologies* Motorola Nortel Plexus* Sanmina-SCI* Shipley Solectron* Teradyne Universal Vitronics-Soltec * Data Contributors 3

4 DPMO Definition DPMO - Defects per Million Opportunities Defined in IPC-7912 and IPC-9261 as number of defects divided by number of defect opportunities, multiplied by 10 6 Can be categorized many ways: Process (SMT placement, reflow, wave, etc) Defect type (placement, component, termination, assembly) Package type Others 4

5 Background and Motivation The NEMI 2002 Roadmap required conversion cost reduction in the cost per I/O of each electronic assembly over time A factor in reducing conversion cost is enabling higher quality, thereby: Reducing manufacturing costs through higher utilization Shortening product cycle times Reducing cost of test and inspection With data that quantifies the expected defect spectrum on a PCBA, manufactures can accurately assess: the cost of assembly, test, repair and scrap the estimated shipped product quality level of a product 5

6 Background and Motivation Yield vs. Number of Defect Opportunities 100% 90% 80% Estimated Yield = e -DPU DPU = DPMO x # of Ops IPC % Estimated Yield 60% 50% 40% 30% 20% 10% 0% 0 10,000 20,000 30,000 40,000 Defect Opportunities DPMO=10 DPMO=25 DPMO=50 DPMO=100 DPMO=250 DPMO=500 DPMO=1,000 6

7 Purpose The project objective was to provide tools that: Create an effective environment to continually improve the delivered quality of manufacturing processes Assist in reducing costs of assembly, test, rework, scrap and warranty Help improve line utilization and reduce cycle time Allow manufacturers to better prioritize the deployment of constrained resources Allow manufacturers to benchmark their DPMO rates to others in the industry regardless of board complexity 7

8 Scope of Work Implement methods to protect confidentiality of data Define how data will be shared between team members and with outside parties Define data collection methods around existing IPC standards IPC 9261 In-Process DPMO and Estimated Yield for PWAs IPC 7912 Calculation of DPMO and Manufacturing Indices for PCBAs 8

9 Scope of Work - continued Align efforts with other organizations (IPC & SMART Group) Define data stratification and classification methods Gather data from several component types into database Summarize data and generate reports and documents Lay foundation for ongoing DPMO metric efforts 9

10 Data Sharing Policies Data shared with the industry Methodology, database format, & data classifications Statistics detailing the size and content of the database DPMO level for all board types averaged together within each company Package-level DPMO data will not be shared with the industry Project participants receive the entire database 10

11 Confidentiality of Data Established a secure website for project information Participants submitted data to a neutral party in the pre-defined formats The neutral party replaced the company names with non-descript IDs The data was combined into a single database The combined database was distributed to project participants Georgia Tech was the neutral party 11

12 12 Database Structure

13 Defect Types Defect Types Agreed to 22 defects categories Where possible, aligned NEMI defect categories to other industry initiatives: The SMART Group s PPM project Classified defect categories per IPC Defect Classification for DPMO calculations (Appendix A of IPC9261) Defect was defined as anomaly that required a repair/rework action. False calls, process indicators, or self-correcting defects that are not reworked/repaired were not logged. 13

14 Defect Types - continued NEMI DPMO Project Defect Name PASTE INSUFFICIENT PASTE SMEARING PASTE BRIDGING PASTE SCOOPING OTHER PASTE DEFECT SOLDER TERMINATION BRIDGE - SHORT SOLDER TERMINATION OPEN SOLDER INSUFFICENT SOLDER TERMINATION SHAPE (excess/void/other) SOLDER BALL OTHER TERMINATION DEFECT IPC Defect Classification Assembly Assembly Assembly Assembly Assembly Termination Termination Termination Termination Termination Termination 14

15 Defect Types - continued NEMI DPMO Project Defect Name COMPONENT WRONG COMPONENT ORIENTATION (90/180/270) COMPONENT MISSING COMPONENT PLACEMENT (misaligned, billboard ) COMPONENT LEAD BENT or MISSING LEAD COMPONENT ELECTRICALLY DEFECTIVE COMPONENT DAMAGED MECHANICAL ASSEMBLY DEFECT (heatsink,screw ) BARE BOARD DEFECT (trace/warp) OTHER COMPONENT DEFECT (electrical /mechanical) OTHER DEFECT IPC Defect Classification Placement Placement Placement Placement Component Component Component* Component Component Component Assembly 15

16 Package Types Package Types Agreed to 36 package type categories based on input from several participants Targeted a list that would cover most package types while maintaining a significant number of opportunities per package type. 16

17 Package Types - continued Package Name BGA BGA FP BGA CONN CGA CGA FP FLIP CHIP ARRAY PGA GW 16 MIL GW 20 MIL GW 25 MIL GW GT 25 MIL GW CONN Package Description Ball Grid Array. Standard pitch is 1mm (or 0.039"). Includes plastic, ceramic, eutectic, highmelt. BGA - Fine Pitch. Anything less than standard BGA pitch (1mm or 0.039") may require special handling. Includes CSPs Includes any BGA connector regardless of pitch. Column Grid Array, similar to BGA except terminations are small columns of solder Column Grid Array, fine pitch, Anything less than standard BGA pitch (1mm or 0.039") may require special handling. FCA - Flip Chip Array - a chip on board technology that has bumps attached to the silicon die, is flipped, and mounted directly to a printed wiring board. Ball Grid Array. Standard pitch is 1mm (or 0.039"). Includes plastic, ceramic, eutectic, highmelt. 16 mil gull wing QFP, SOIC, SOP, SSOP, TSOP, TSSOP and hardware (sockets, switches), also includes 12 mil gull wing 20 mil gull wing QFP, SOIC, SOP, SSOP, TSOP, TSSOP and hardware (sockets, switches) 25 mil gull wing QFP, SOIC, SOP, SSOP, TSOP, TSSOP and hardware (sockets, switches) greater than 25 mill gull wing components and hardware (sockets, switches), SOT - Small Outline Transitors, SOD, DPAKs Gullwing connectors, regardless of pitch, (does not include Mictor or Straddle Mount) 17

18 Package Name J LEAD LABEL LAND GRID ARRAY LCC MECH ASSEM MECH FASTENER MICTOR CONN STRADDLEMOUNT CONN MULTICHIP MODULE OPTIC SMT MISC PRESS FIT Package Types - continued Labels land grid array LCC- Leadless Chip Carrier, also LCCC- leadless ceramic chip carrier, both have solderable castellations for terminations Bearing, chassis, faceplates, fan guard, fuse holder, handle, heatsink, plastic part, RF sheilds, Bolt, clip, kit, nut, pin, rivet, screw, spacer, spring, standoff, washer, Mictor connector has both SMT and PTH pins Edge connector with SMT leads on both sides of the board, Includes Straddlemount Mictors Consider 1 component Fiber Optic cables and components Package Description SOJ - Small Outline J-leads, PLCC - Plastic Leaded Chip Carriers, sockets A SMT component that falls into no other category (EMI shields, ground planes, inductors, MELF components, non-leaded ) Press fit connectors and components that are hand pluged, includes ICs hand placed into chip carriers 18

19 Package Types - continued Package Name PTH COMP PTH CONN PTH CONN FP PWB SMT PASSIVE NETWORKS GT 0805 TANT WIRE ADDS / CUTS Pin Through Hole Componenet, SIP, DIP, radial and axial mount components, Also jumpers, Pin Through Hole Array, connectors, sockets - above 50 mil Pin Through Hole Array, connectors, sockets - 50 mil and below Printed Wiring (or PCB-Circuit) Board, includes gold fingers, buried capacitors/resistors Resistor networks, capacitor networks, RPACK, (only if device has solderable castellations, if leaded falls into corresponding category (PTH COMP, GW, etc) 0201 chip components 0402 chip components 0603 chip components 0805 chip components greater than 0805 chip components (excluding Tantalum) Tantalum capacitors Package Description Wire additions and/or trace cuts due to design modifications 19

20 DPMO Calculations d c = # of component defects d p = # of placement defects d t = # of termination defects d a = # of assembly defects o c = # of component opportunities o p = # of placement opportunities o t = # of termination opportunities o a = # of assembly opportunities Example: Component DPMO = DPMO c = [ d c / o c ] x 10 6 Â Â Â È dc + d p + dt DPMO Index1 = Í 10 ÍÎ Â oc + Â o p + Â ot Â Â Â Â È dc + d p + dt + da DPMO Index2 = Í 10 ÍÎ Â oc + Â o p + Â ot + Â oa

21 Database Statistics - Board Types Data contributing companies / mfg sites # of different board types Number of boards Average volume per board type Minimum volume per board type Maximum volume per board type 8 / , ,967 21

22 Database Statistics - DPMO Levels Defects & Ops in the Database Defects Opportunities DPMO (d x / o x ) x 10 6 Termination 198,875 2,454,060, Placement 93, ,571, Component 46, ,905, Assembly 3, ,467 9,026 Total 342,258 3,215,873,

23 23 DPMO by Company DPMO Index # of Assys , , , , , , , , , , , , Avg. Volume DPMO Index1 DPMOa DPMOt DPMOp DPMOc Company

24 DPMO by Mfg Process 400 1,510 10,000,000,000 DPMO ,000,000, ,000,000 10,000,000 1,000, ,000 10,000 1, Opportunities (Log Scale) 0 1 Reflow - SMT Hand Placed Reflow - PTH Hand Placed Reflow - SMT Machine Placed Wave - PTH Hand Placed Wave - PTH Machine Placed Wave - SMT Machine Placed Hand Solder - PTH Hand Placed Hand Solder - SMT Hand Placed Mechanical Assembly PressFit Opportunities DMPO 1M Ops Mfg Process 24

25 DPMO - Discrete Package Types DPMO , Millions Opportunities TANT SMTPASSIVENETWORK 0402 GT0805 Package Opportunities DPMO 25

26 DPMO - ICs (Leaded Perimeter) Millions DPMO Opportunities GW20MIL JLEAD GW25MIL GW16MIL GWGT25MIL Package 0 Opportunities DPMO 26

27 DPMO - ICs (Area Array) DPMO Millions Opportunities PGA CGA BGA Package BGAFP FLIPCHIPARRAY LANDGRIDARRAY Opportunities DPMO 27

28 DPMO - Connectors DPMO Millions Opportunities 0 0 GWCONN STRADDLEMOUNTCONN PTHCONN Package PRESSFIT Opportunities DPMO 28

29 Pckg Breakdown - Defect Spectrum Breakdown of Defects for 0603 Package Type Mfg Process = Machine Placed, Reflow Solder Number of Defects Thousands % 19% 17% 9% 3% 3% 3% 2% 2% 1% 1% 45% 40% 35% 30% 25% 20% 15% 10% 5% 0% Percent of Total Defects COMPONENTMISSING SOLDERTERMINATIONOPEN COMPONENTPLACEMENT COMPONENTWRONG COMPONENTORIENTATION COMPONENTDAMAGED SOLDERTERMINATIONBRIDGESHORT SOLDERINSUFFICIENT COMPONENTELECTRICALLYDEFECTIVE SOLDERTERMINATIONSHAPE OTHER 29

30 Pckg Breakdown 0603 Of the 36 possible package types, 20 had significant data 1,000,000+ opportunities and Used on 10+ different assemblies BGA GW GT 25 MIL SMT MISC 0402 CGA GW CONN PRESS FIT 0603 GW 16 MIL J LEAD PTH COMP 0805 GW 20 MIL MECH ASSEM PTH CONN GT 0805 GW 25 MIL MECH FASTENER SMT PASSIVE NETWORKS TANT Package = 0603 Mfg Operation Opportunities Defects Package DPMO Machine Placed, Reflow Soldered 979,983,646 65, Machine Placed, Wave Soldered 145, Overall 980,129,286 65,

31 Pckg Breakdown - Statistical Analysis Analysis of 0603 package (DPMO per assembly) Anderson-Darling Normality Test A-Squared P-Value < Mean StDev Variance Skew ness Kurtosis N M inimum st Q uartile M edian rd Q uartile M aximum % C onfidence I nterval for Mean % C onfidence I nterval for Median Mean 95% Confidence I nter vals 95% C onfidence I nterval for StDev Median

32 Accomplishments Met project purpose and scope: Database with significant defect opportunities for 20 package types and 8 processes across 8 companies Team members feel data will be useful in supporting: Quality improvement DFX efforts / component selection Applying test and inspection where needed Identify potential problem areas / justify necessary changes Cost estimation/reduction Improved DPMO/Yield estimates, conversion cost estimates Throughput improvements through better application of constrained resources Benchmarking 32

33 Challenges & Concerns Significant challenges in gathering DPMO data by package!!! Data often is stored in different systems Few companies have systems linked to automatically compile the data Existing IPC specs don t address package-dpmo New releases of IPC specs require even more data to be collected (defects and opportunities on non-populated locations) Data collection challenges extended project timeline ~ 12 months Caution must be used when interpreting data Cannot perform blind comparisons based solely on DPMO Effectiveness of test/inspection steps can significantly impact DPMO Despite sanity checks on the submitted data, data accuracy is ultimately dependent on entry points A method for normalizing such factors would be useful 33

34 Possible Follow-on Activities Develop a standard for Package-Level DPMO Use DPMO data in developing Complexity or Manufacturability Index Repeat project / update database at regular intervals Potentially modify the database structure in support of follow-on projects Component specific DPMO (mfg name and part number) Inclusion of process parametric data (chemistry, equipment type,...) Scale back data fields to ease data gathering challenges Potentially modify defect/package categories based on DPMO distributions Assess impact of process variables (lead free) to DPMO 34

35 More Information? Project information available to the public is at: Database architecture and definition Empty database for download and use Data-entry guideline with package type, defect types, Industry presentations Reports and White Papers as published For more information contact project chair/co-chair Tim Kruse Dave Mendez 35

36 contacts: Tim Kruse David Mendez 36