Delivering the Datacenter of the Future

Transcription

1 Delivering the Datacenter of the Future Making the Open Compute Vision a Reality Eric Hooper Director, Rack Scale Architecture Cloud Platforms Group Intel Corporation

2 Legal Disclaimer INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling , or go to: The TCO or other cost reduction scenarios described in this document are intended to enable you to get a better understanding of how the purchase of a certain products, including Intel products, combined with a number of situation-specific variables, might affect your future cost and savings. Circumstances will vary and there may be unaccounted-for costs related to the use and deployment of a given product. Nothing in this document should be interpreted as either a promise of or contract for a given level of costs. Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See for details. Optimization Notice Intel's compilers may or may not optimize to the same degree for non-intel microprocessors for optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3, and SSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice. - Notice revision # All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice. Intel Xeon, Intel Atom, Intel Open Network Platform, Intel Rack Scale Architecture, Intel Lustre*, Intel SSD, Intel Ethernet Controllers and the Intel logo are trademarks of Intel Corporation or in the US and other countries. Copyright 2014, Intel Corporation. All rights reserved. * Other brands and names may be claimed as the property of others. * Other brands and names may be claimed as the property of others. 3

3 Making the Open Compute Vision a Reality Contributions Development Adoption * Other brands and names may be claimed as the property of others. 3

4 Intel Rack Scale Architecture Vision Flexibility Capital Efficiency Lower TCO Flexible Compute Platform Support range of Intel Xeon or Atom processor based nodes Open Network Platform & Photonics Interconnect Network switch on standard hardware Storage & Memory Systems Modular tray with range of technologies Modular systems (Pooled Resources) Logical Architecture Enables Software Defined Orchestration 5

5 Rack Scale Architecture Near Term Up to OCP Boards 5X2 Silicon Photonics Interconnect Provisioned Power Density 3X1 Cables Up to 1.5X2 Up to Remote Direct Attach Storage Open Network Platform Up to 25X1 NW Downlink So#ware and workloads used in performance tests may have been op9mized for performance only on Intel microprocessors. Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, so#ware, opera9ons and func9ons. Any change to any of those factors may cause the results to vary. You should consult other informa9on and performance tests to assist you in fully evalua9ng your contemplated purchases, including the performance of that product when combined with other products. Results have been es9mated based on internal Intel analysis and are provided for informa9onal purposes only. Any difference in system hardware or so#ware Results have been es9mated based on internal Intel analysis and are provided for informa9onal purposes only. Any difference in system hardware or so#ware design or configura9on may affect actual performance. 1. Improvement based on standard rack with 40 DP servers, 48 port ToR switch, 1GE downlink/server and 4 x10ge uplinks, Cables: 40 downlink and 4 uplink vs. rack with 42 DP servers, SiPh patch panel, 25Gb/s downlink, 100Gb/s uplink,, Cables: 14 op9cal downlink, and 1 op9cal uplink. Actual improvement will vary depending on configura9on and actual implementa9on. 2. Improvement as compared to 20 Dell PowerEdge R720, N+1 redundant power, 705W PSU x2, peak power provisioned 30,000 WaZs vs. same server, shared DC power using 1 power shelf of 7x 700W modules and 4200W (N+1) : power provisioned 4900 WaZs hzp:// content/uploads/2013/01/open_compute_project_power_shelf_v0.3.pdf 6

6 3 Generations of OCP Boards New Boards Certified Boards Decathlete Intel Atom Processor C2000 Product Family Next Generation Intel Xeon Processor E Product Family Windmill Panther Leopard First Functional Rack Scale Architecture Demo with Next Generation Intel Xeon Processor * Other brands and names may be claimed as the property of others. 7

7 7 Intel Silicon Photonics What a difference a year can make January 2013 January 2014 Design is IN PROCESS. MXC connector design is COMPLETE Design Guide DRAFT Available FUNCTIONAL Silicon Photonics interconnect in Rack Scale Architecture OEM SAMPLING & designs

8 Making the Open Compute Vision a Reality Contributions Development Adoption * Other brands and names may be claimed as the property of others. 8

9 Supporting Community Adoption * Other brands and names may be claimed as the property of others. 9

10 Partnership with the OCP Grant Richard Goldman Sachs Technology Fellow, Managing Director * Other brands and names may be claimed as the property of others. 11

11 Goldman Sachs Technology At a Glance 68 Firm and Public Designed Data Centers 34 Megawatts Available 10,000 Network Devices 500,000 Compute Cores 28 PB Storage 8,000+ Engineers & Technologists 118,000+ Servers in the GS Cloud 4,000 Applications 59,000 Databases 1.2BN Lines of code 16MM+ Software changes per month 45,000 Servers 50,000 Remote Desktop Sessions Source Internal Goldman Sachs data 12

12 GS Partnership with the OCP GS attends OCP formation and issues press statement supporting Partners for formation of Hardware Management Track Assists with of C&I Track creation 2011 Open Compute Project GS is a founding member of the Board of Directors of the Facebook Open Compute Foundation Works with financial and other members on 19 Intel & AMD form factor contributions Future: Deploy OCP form factors in production 13

13 How does GS leverage OCP? Requirement: " A single scale out 19 motherboard (from Intel Decathlete) for remote desktop, risk calculation, storage and cloud for traditional cabinets Technical Engagement: " GS Compute Engineering members materially contributed to.. " Technical specifications " Review with CPU manufacturers detail designs " Testing of BIOS and other firmware for functionality and performance 14

14 Supply Chain Model Transformation " Transformation in supply chain brings both disruption and benefits " New partners, vendors and ecosystem to manage Classic Today and Tomorrow Manufacturers Customers Integrators Manufacturers Customers Integrators Bridging hyper-scale technology, which embraces Open Compute principles, with the conventional data centers and applications 15

15 Making the Open Compute Vision a Reality Contributions Development Adoption * Other brands and names may be claimed as the property of others. 15

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