uclamp0508t Low Profile μclamp TM 8-Line ESD protection PROTECTION PRODUCTS - MicroClamp TM Description Features Mechanical Characteristics

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1 - MicroClamp TM Description The μclamp TM series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD. It is designed to replace multilayer varistors (MLVs) in portable applications such as cell phones, notebook computers, and other portable electronics. It features large cross-sectional area junctions for conducting high transient currents. TVS diodes offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. The μclamp TM 008T is in a 8-pin, RoHS/WEEE compliant, SLP73P8T package. It measures.7 x.3 mm with a nominal height of only 0.4mm. The leads are spaced at a pitch of 0.4mm and are finished with leadfree NiPdAu. Each device features eight TVS diodes with an operating voltage of volts and a maximum loading capacitance of only 0pF. They may be used to meet the ESD immunity requirements of IEC , Level 4 (±kv air, ±8kV contact discharge). The combination of small size and high ESD surge capability makes them ideal for use in portable applications such as cellular phones, digital cameras, and notebook computers. Dimensions uclamp008t Low Profile μclamp TM 8-Line ESD protection Features Transient protection for data lines to IEC (ESD) ±kv (air), ±8kV (contact) IEC (EFT) 40A (tp = /0ns) Cable Discharge Event (CDE) Ultra-small package Protects eight data lines Low clamping voltage Working voltage: V Low capacitance (0pF) Solid-state silicon-avalanche technology Mechanical Characteristics SLP73P8T package RoHS/WEEE Compliant Nominal Dimensions:.7 x.3 x 0.4 mm Lead Finish: NiPdAu Molding compound flammability rating: UL 94V-0 Marking : Marking code Packaging : Tape and Reel Applications Cellular Handsets & Accessories Notebooks & Handhelds Micro SD Ports MMC & HS-MMC Ports Portable Instrumentation Digital Cameras Peripherals Schematic BSC 0.40 Tab Revision 0/07/2008 Nominal Dimensions (mm) (SLP73P8T Bottom View)

2 Absolute Maximum Rating Rating Symbol Value Units Peak Pulse Power (tp = 8/20μs) M aximum Peak Pulse Current ( tp = 8/20μs) P pk 2 Watts I pp 2 Amps ESD per IEC ESD per IEC (Air) (Contact) V ESD +/- 20 +/- kv Operating Temperature T J - to +2 C Storage Temperature T STG to +0 - C Electrical Characteristics (T=2 o C) Parameter Symbol Conditions Minimum Typical Maximum Units Reverse Stand-Off Voltage V RWM V Reverse Breakdown Voltage V R B I t = ma 6 V Reverse Leakage Current I R V RWM = V, T=2 C 0.2 μa Forward Voltage V F I F = 0mA. 2 V Clamping Voltage V C I PP = 2A, t = 8/20μs 2. V p Junction Capacitance C j V R = 0V, f = MHz 0 pf Junction Capacitance C j V R = 3.3V, f = MHz 4. pf 2008 Semtech Corp. 2

3 Typical Characteristics Non-Repetitive Peak Pulse Power vs. Pulse Time Power Derating Curve Peak Pulse Power - P PP (kw) Pulse Duration - tp (us) % of Rated Power or I PP Ambient Temperature - T A ( o C) Clamping Voltage vs. Peak Pulse Current Forward Voltage vs. Forward Current 8 7 Clamping Voltage - V C (V) 0 Waveform Parameters: tr = 8μs td = 20μs Forward Voltage - V F V) Waveform Parameters: tr = 8μs td = 20μs Peak Pulse Current - I PP (A) Forward Current - I F (A) Junction Capacitance vs. Reverse Voltage ESD Clamping (8kV Contact per IEC ). f = MHz C J (V R ) / C J (V R =0) Reverse Voltage - V R (V) Note: Data is taken with a 0x attenuator 2008 Semtech Corp. 3

4 Typical Characteristics Insertion Loss S2 Analog Crosstalk CH S2 LOG 6 db / REF 0 db : dB MHz CH S2 LOG 20 db / REF 0 db 0 db -6 db 2 3 2: -.08 db MHz 3: db MHz -2 db -8 db -24 db 4 4: GHz : GHz -30 db -36 db MHz 0 MHz 00 MHz GHz 3 GHz START. 030 MHz STOP MHz START. 030 MHz STOP MHz 2008 Semtech Corp. 4

5 Applications Information Device Connection Options This device is designed to protect eight data lines. The device is unidirectional and may be used on lines where the signal polarity is above ground. Figure - Circuit Diagram (Eight Each) Ground Connection Recommendation Parasitic inductance present in the board layout will affect the filtering and ESD performance of the device. Ground loop inductance can be reduced by using multiple vias to make the connection to the ground plane. Figure 2 shows the recommended device layout. The ground pad vias have a diameter of inches (0.20 mm) while the two external vias have a diameter of 0.00 inches (0.20mm). The internal vias are spacedapproximately evenly from the center of the pad. The designer may choose to use more vias with a smaller diameter (such as 0.00 inches or 0.2mm) since changing the diameter of the via will result in little change in inductance. Circuit Board Layout Recommendations for Suppression of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the TVS near the input terminals or connectors to restrict transient coupling. Minimize the path length between the TVS and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Figure 2 - Recommended Layout using Ground Vias 2008 Semtech Corp.

6 Applications Information - Spice Model uclamp008t Spice Model uclamp008t Spice Parameters Parameter IS BV VJ RS IBV CJO TT U nit D (TVS) Amp 2.0e- Volt 7. 0 Volt 0.80 Ohm 0.7 Amp.0E-3 Farad 9e-2 sec 2.4E- 9 M N --. EG ev Semtech Corp. 6

7 Outline Drawing - SLP73P8T PIN INDICATOR (LASER MARK) aaa C A2 A D A B E A C SEATING PLANE DIMENSIONS INCHES MILLIMETERS DIM MIN NOM MAX MIN NOM MAX A A A (.00) (0.3) 0.0 b D D E E e.06 BSC 0.40 BSC L N 8 8 aaa bbb D LxN E/2 E e/2 N bxn bbb C A B e D/2 NOTES:. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS. Land Pattern - SLP73P8T Z G Y P H X (C) DIMENSIONS DIM INCHES MILLIMETERS C (.00) (.27) G H K.0.40 P X Y Z K NOTES:. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE Semtech Corp. 7

8 Marking Code Ordering Information Part Number Working Voltage Qty per Reel Reel Size PIN INDICATOR 008T YYWW uclamp008t.tct V 3,000 7 Inch Notes: ) This is a lead-free, RoHS/WEEE compliant product MicroClamp, uclamp and μclamp are marks of Semtech Corporation Note: YYWW = Date Code Tape and Reel Specification Pin Location User Direction of feed Device Orientation in Tape A0 B0 K0. +/-0.0 mm.9 +/-0.0 mm /-0.0 mm Tape Width B, (Max) D D E F K (MAX) P P0 P 2 T(MAX) W 8 mm 4.2 mm (.6) mm mm ( ) 0.8 mm ±0.0 (.03).70±.0 mm (.069±.004) 3.±0.0 mm (.38±.002) 2.4 mm (.094) 4.0±0. mm (.7±.00-4) 4.0±0. mm (.7±.00-4) 2.0±0.0mm (.079±.002) 0.4 mm (.06) 8.0 mm mm - 0. mm (.32±.02) Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 9302 Phone: (80)498-2 FAX (80) Semtech Corp. 8