The LVT126 is a high-performance BiCMOS product designed for V CC operation at 3.3 V.

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1 Rev. 04 February 2005 Product data sheet. General description 2. Features 3. Quick reference data The LVT26 is a high-performance BiCMOS product designed for V CC operation at 3.3 V. This device combines low static and dynamic power dissipation with high speed and high output drive. The device is a quad buffer that is ideal for driving bus lines. The device features four output enable inputs (OE, 2OE, 3OE and 4OE), each controlling one of the 3-state outputs. Quad bus interface 3-state buffers Output capability: +64 m and 32 m TTL input and output switching levels Input and output interface capability to systems at 5 V supply Bus-hold data inputs eliminate the need for external pull-up resistors to hold unused inputs Live insertion and extraction permitted No bus current loading when output is tied to 5 V bus Power-up 3-state Latch-up protection: JESD7: exceeds 500 m ESD protection: MIL STD 3 method 305: exceeds 2000 V Machine model: exceeds 200 V Table : Quick reference data GND = 0 V; T amb =25 C. Symbol Parameter Conditions Min Typ Max Unit t PLH propagation delay n to ny C L = 50 pf; V CC = 3.3 V ns t PHL propagation delay n to ny C L = 50 pf; V CC = 3.3 V ns C I input capacitance V I = 0 V or V CC pf C O output capacitance outputs disabled; - - pf V O = 0 V or 3.0 V I CC quiescent supply current outputs disabled; V CC = 3.6 V m

2 4. Ordering information Table 2: Ordering information Type number Package Temperature range Name Description Version D 40 C to +5 C SO4 plastic small outline package; 4 leads; body width 3.9 mm SOT0- DB 40 C to +5 C SSOP4 plastic shrink small outline package; 4 leads; body width SOT mm PW 40 C to +5 C TSSOP4 plastic thin shrink small outline package; 4 leads; body SOT402- width 4.4 mm BQ 40 C to +5 C DHVQFN4 plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 4 terminals; body mm SOT Functional diagram 2 OE OE Y 2Y EN OE 3Y OE 4Y aac42 00aac43 Fig. Logic symbol Fig 2. IEC logic symbol Koninklijke Philips Electronics N.V ll rights reserved. Product data sheet Rev. 04 February of 5

3 6. Pinning information 6. Pinning terminal index area OE VCC OE Y 2OE V CC 4OE 4 4Y Y 2OE 2 2Y GND () OE 4 4Y 3OE 3 Fig Y GND aac44 0 Pin configuration SO4, SSOP4 and TSSOP4 9 3OE 3 3Y Fig 4. 7 GND 3Y Transparent top view 00aac45 () The die substrate is attached to the exposed die pad using conductive die attach material. It can not be used as a supply pin or input. Pin configuration DHVQFN4 6.2 Pin description Table 3: Pin description Symbol Pin Description OE output enable input 2 data input Y 3 data output 2OE 4 2 output enable input data input 2Y 6 2 data output GND 7 ground (0 V) 3Y 3 data output data input 3OE 0 3 output enable input 4Y 4 data output data input 4OE 3 4 output enable input V CC 4 supply voltage Koninklijke Philips Electronics N.V ll rights reserved. Product data sheet Rev. 04 February of 5

4 7. Functional description. Limiting values 7. Function table Table 4: Function table [] Input Output noe n ny H L L H H H L X Z [] H = HIGH voltage level; L = LOW voltage level; X = don t care; Z = high-impedance OFF-state. Table 5: Limiting values In accordance with the bsolute Maximum Rating System (IEC 6034). Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Max Unit V CC supply voltage V V I input voltage [] V V O output voltage output in OFF-state or [] V HIGH-state I IK input diode current V I < 0 V - 50 m I OK output diode current V O < 0 V - 50 m I O output current output in LOW-state - 2 m output in HIGH-state - 64 m T stg storage temperature C T j junction temperature [2] - 50 C [] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. [2] The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability Koninklijke Philips Electronics N.V ll rights reserved. Product data sheet Rev. 04 February of 5

5 9. Recommended operating conditions Table 6: 0. Static characteristics Recommended operating conditions Symbol Parameter Conditions Min Typ Max Unit V CC supply voltage V V I input voltage V V IH HIGH-level input voltage V V IL LOW-level input voltage V I OH HIGH-level output current m I OL LOW-level output current none m current duty cycle m 50 %; f khz t/ V input transition rise or fall outputs enabled ns/v rate T amb ambient temperature in free air C Table 7: Static characteristics t recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit T amb = 40 C to +5 C [] V IK input diode voltage I IK = m; V CC = 2.7 V V V OH HIGH-level output voltage I OH = 00 µ; V CC 0.2 V CC 0. - V V CC = 2.7 V to 3.6 V; I OH = m; V CC = 2.7 V V I OH = 32 m; V CC = 3.0 V V V OL LOW-level output voltage V CC = 2.7 V I OL = 00 µ V I OL = 24 m V V CC = 3.0 V I OL = 6 m V I OL = 32 m V I OL = 64 m V I LI input leakage current all input pins V CC = 0 V or 3.6 V; V I = 5.5 V - 0 µ control pins V CC = 3.6 V; V CC or GND - ±0. ± µ data pins V CC = 3.6 V; V I =V CC [2] - 0. µ V CC = 3.6 V; V I =0V [2] - 5 µ I OFF power-down output current V CC = 0 V; V I or V O = 0 V to 4.5 V - ±00 µ I HOLD bus hold current input V CC = 3 V; V I = 0. V [3] µ V CC = 3 V; V I = 2.0 V µ V CC = 0 V to 3.6 V; V I = 3.6 V ± µ Koninklijke Philips Electronics N.V ll rights reserved. Product data sheet Rev. 04 February of 5

6 Table 7: Static characteristics continued t recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ Max Unit I EX external current into output output in HIGH-state when V O >V CC ; V O = 5.5 V and V CC = 3.0 V µ I PU, I PD power-up or power-down 3-state output current [] Typical values are measured at nominal V CC and T amb = 25 C. [2] Unused pins at V CC or GND. [3] This is the bus hold overdrive current required to force the input to the opposite logic state. [4] This parameter is valid for any V CC between 0 V and.2 V with a transition time of up to 0 ms. From V CC =.2 V to V CC = 3.3 V ± 0.3 V a transition time of 00 µs is permitted. This parameter is valid for T amb =25 C only. [5] Measured with outputs pulled up to V CC or GND. [6] This is the increase in supply current for each input at the specified voltage level other than V CC or GND.. Dynamic characteristics V CC.2 V; V O = 0.5 V to V CC ; V I = GND or V CC ; noe = don t care [4] - ± ±00 µ I OZ 3-state output current V CC = 3.6 V output HIGH: V O = 3.0 V - 5 µ output LOW: V O = 0.5 V - 5 µ I CC quiescent supply current V CC = 3.6 V; V I = GND or V CC ; I O =0 outputs HIGH m outputs LOW m outputs disabled [5] m I CC additional supply current per input pin V CC = 3 V to 3.6 V; one input at V CC 0.6 V and other inputs at V CC or GND [6] m C I input capacitance V I = 0 V or V CC pf C O output capacitance outputs disabled; V O = 0 V or 3.0 V - - pf Table : Dynamic characteristics GND = 0 V; t r =t f = 2.5 ns; C L = 50 pf; R L = 500 Ω; for test circuit see Figure 7. Symbol Parameter Conditions Min Typ Max Unit T amb = 40 C to +5 C [] t PLH propagation delay n to ny V CC = 2.7 V ns V CC = 3.3 V ± 0.3 V ns t PHL propagation delay n to ny V CC = 2.7 V ns V CC = 3.3 V ± 0.3 V ns t PZH output enable time noe to ny V CC = 2.7 V ns V CC = 3.3 V ± 0.3 V ns t PZL output enable time noe to ny V CC = 2.7 V ns V CC = 3.3 V ± 0.3 V ns Koninklijke Philips Electronics N.V ll rights reserved. Product data sheet Rev. 04 February of 5

7 Table : Dynamic characteristics continued GND = 0 V; t r =t f = 2.5 ns; C L = 50 pf; R L = 500 Ω; for test circuit see Figure 7. Symbol Parameter Conditions Min Typ Max Unit t PHZ output disable time noe to ny V CC = 2.7 V ns V CC = 3.3 V ± 0.3 V ns t PLZ output disable time noe to ny V CC = 2.7 V ns V CC = 3.3 V ± 0.3 V ns [] Typical values are at V CC = 3.3 V and T amb =25 C. 2. Waveforms V I n input GND t PLH t PHL V OH ny output V OL mnb072 Fig 5. =.5 V. V OL and V OH are typical voltage output drop that occur with the output load. Propagation delay input (n) to output (ny) V I noe input GND 3.5 V t PZL t PLZ ny output V OL V ny output V OL V OH 0 V t PZH t PHZ V OH 0.3 V 00aac46 Fig 6. =.5 V. V OL and V OH are typical voltage output drop that occur with the output load. Enable and disable times of 3-state outputs Koninklijke Philips Electronics N.V ll rights reserved. Product data sheet Rev. 04 February of 5

8 V I negative pulse 0 V V I positive pulse 0 V t W 90 % 90 % 0 % t THL (t f ) t TLH (t r ) t TLH (t r ) t THL (t f ) 90 % 0 % 0 % t W 00aac22 =.5 V. a. Input pulse definition V EXT V CC PULSE GENERTOR V I D.U.T. V O R L RT C L R L mna66 Test data is given in Table 9. Definitions test circuit: R L = Load resistor. C L = Load capacitance including jig and probe capacitance. R T = Termination resistance should be equal to output impedance Z o of the pulse generator. V EXT = Test voltage for switching times. b. Test circuit Fig 7. Load circuitry for switching times Table 9: Test data Input Load V EXT V I f i t W t r, t f C L R L t PHZ, t PZH t PLZ, t PZL t PLH, t PHL 2.7 V 0 MHz 500 ns 2.5 ns 50 pf 500 Ω GND 6 V open Koninklijke Philips Electronics N.V ll rights reserved. Product data sheet Rev. 04 February 2005 of 5

9 3. Package outline SO4: plastic small outline package; 4 leads; body width 3.9 mm SOT0- D E X c y H E v M Z 4 Q pin index 2 ( ) 3 θ L p 7 L e b p w M detail X mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches max b p c D () E () e H () E L L p Q v w y Z Note. Plastic or metal protrusions of 0.5 mm (0.006 inch) maximum per side are not included θ o o OUTLINE VERSION REFERENCES IEC JEDEC JEIT EUROPEN PROJECTION ISSUE DTE SOT0-076E06 MS Fig. Package outline SO4 (SOT0-) Koninklijke Philips Electronics N.V ll rights reserved. Product data sheet Rev. 04 February of 5

10 SSOP4: plastic shrink small outline package; 4 leads; body width 5.3 mm SOT337- D E X c y H E v M Z 4 Q 2 ( ) 3 pin index 7 L detail X L p θ e b p w M mm scale DIMENSIONS (mm are the original dimensions) UNIT 2 3 b p c D () E () e H E L L p Q v w y Z() max. mm θ o o 0 Note. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEIT EUROPEN PROJECTION ISSUE DTE SOT337- MO Fig 9. Package outline SSOP4 (SOT337-) Koninklijke Philips Electronics N.V ll rights reserved. Product data sheet Rev. 04 February of 5

11 TSSOP4: plastic thin shrink small outline package; 4 leads; body width 4.4 mm SOT402- D E X c y H E v M Z 4 pin index 2 Q ( ) 3 θ 7 e b p w M L detail X L p mm scale DIMENSIONS (mm are the original dimensions) UNIT 2 3 b p c D () E (2) e H () E L L p Q v w y Z max. mm θ o o 0 Notes. Plastic or metal protrusions of 0.5 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEIT SOT402- MO-53 EUROPEN PROJECTION ISSUE DTE Fig 0. Package outline TSSOP4 (SOT402-) Koninklijke Philips Electronics N.V ll rights reserved. Product data sheet Rev. 04 February 2005 of 5

12 DHVQFN4: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads; 4 terminals; body 2.5 x 3 x 0.5 mm SOT762- D B E c terminal index area detail X terminal index area e e b 2 6 v M w M C C B y C C y L 7 E h e D h X mm scale DIMENSIONS (mm are the original dimensions) UNIT () max. b c D () D h E () E h e e L v w y y mm Note. Plastic or metal protrusions of mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEIT SOT MO EUROPEN PROJECTION ISSUE DTE Fig. Package outline DHVQFN4 (SOT762-) Koninklijke Philips Electronics N.V ll rights reserved. Product data sheet Rev. 04 February of 5

13 4. Revision history Table 0: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes _ Product data sheet _3 Modifications: The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. Figure 4: added Figure note. _ Product data sheet _2 _ Product specification Koninklijke Philips Electronics N.V ll rights reserved. Product data sheet Rev. 04 February of 5

14 5. Data sheet status Level Data sheet status [] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 6. Definitions 7. Disclaimers Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the bsolute Maximum Rating System (IEC 6034). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. pplication information pplications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Life support These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status Production ), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.. Contact information For additional information, please visit: For sales office addresses, send an to: sales.addresses@ Koninklijke Philips Electronics N.V ll rights reserved. Product data sheet Rev. 04 February of 5

15 9. Contents General description Features Quick reference data Ordering information Functional diagram Pinning information Pinning Pin description Functional description Function table Limiting values Recommended operating conditions Static characteristics Dynamic characteristics Waveforms Package outline Revision history Data sheet status Definitions Disclaimers Contact information Koninklijke Philips Electronics N.V ll rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: February 2005 Document number: Published in The Netherlands