Sony ICX445ALA Diagonal 6.0 mm (Type 1/3) Progressive Scan 1.25 Mp, 3.75 µm Pixel Size Interline CCD Image Sensor. Custom Image Sensor Process Review
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1 Sony ICX445ALA Diagonal 6.0 mm (Type 1/3) Progressive Scan 1.25 Mp, 3.75 µm Pixel Size Interline CCD Image Sensor Custom Image Sensor Process Review
2 Sony ICX445ALA CCD Image Sensor 2 Some of the information in this report may be covered by patents, mask and/or copyright protection. This report should not be taken as an inducement to infringe on these rights. Chipworks Inc all rights reserved. Chipworks and the Chipworks logo are registered trademarks of Chipworks Inc. This report is provided exclusively for the use of the purchasing organization. It can be freely copied and distributed within the purchasing organization, conditional upon the accompanying Chipworks accreditation remaining attached. Distribution of the entire report outside of the purchasing organization is strictly forbidden. The use of portions of the document for the support of the purchasing organization s corporate interest (e.g., licensing or marketing activities) is permitted, as defined by the fair use provisions of the copyright act. Accreditation to Chipworks must be attached to any portion of the reproduced information. IPR RF Revision 1.0 Published: August 27, 2012
3 Sony ICX445ALA CCD Image Sensor 3 Table of Contents Introduction Summary of Findings Device Identification ICX445 Die Summary Block Diagram and Pin Configuration Drive Circuit Configuration Device Identification and Die Features ICX445 Package Photographs ICX445 Package X-Rays ICX445 Die Photograph Die Markings Die Corners Pixel Array Corners Microlenses Tilt and Planar Views Optical Black Pixel Location and Pixel Size Minimum Pitch Bond Pads Minimum Pitch Test Pads Die Features Mask Marks Die Features Microlenses and Filters Removed Partial Die Photograph and Die Corners Analysis Sites Pixel Bevel Analysis Pixel Bevel Sample Dark Pixel Overview (from SEM Bevel) Bevel Reference Pixel Bevel Location Z Pixel Bevel Location Y Pixel Bevel Location X Pixel Bevel SCM Locations W and V Pixel Cross-Sectional Analysis Parallel to VCCD Pixel Cross Section Reference Die Thickness Pixel General Structure Edge Pixels Bottom of Pixel Array Edge Pixels Top of Pixel Array Microlens Profile Pixel Dielectrics Overview Substrate Doping Structure SCM Overview Poly Control Line Overview Gate Dielectric and Poly Control Line Detail Poly Control Lines Over VCCD Poly Control Lines Over VCCD Detail
4 Sony ICX445ALA CCD Image Sensor 4 Table of Contents, continued Pixel Cross-Sectional Analysis Perpendicular to VCCD Edge to Active Pixel Transition, Left Side of Array Periphery to Dark Pixel to Active Pixel Transitions Pixel Overview Center of Pixel Aperture SCM of Photocathodes and Pixel Array Well SCM Detail of Pixel Substrate Doping Substrate Dopant and ΦSUB Region Analysis Cu Stained Substrate Sample SRP Sample and SRP Bevel Locations SRP of Location 1 (Coarse and Fine Scans) SRP of Location 2 SRP of Location 3 SRP of Location 4 ΦSUB Pad Region and Substrate Connection Analysis ΦSUB Contact Region Bond Pad, Substrate Connection, and Die Seal SCM of Substrate Connection Region P-Well Contact Overview P-Well Contact AFM and SCM Critical Dimensions Summary Pixel Array Critical Horizontal Dimensions Pixel Array Critical Vertical Dimensions Pixel Array Critical Vertical Dimensions, Continued Statement of Measurement Uncertainty and Scope Variation About Chipworks
5 Sony ICX445ALA CCD Image Sensor 70 About Chipworks Chipworks is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world s largest semiconductor and microelectronics companies. Intellectual property groups and their legal counsel trust Chipworks for success in patent licensing and litigation earning hundreds of millions of dollars in patent licenses, and saving as much in royalty payments. Research & Development and Product Management rely on Chipworks for success in new product design and launch, saving hundreds of millions of dollars in design, and earning even more through superior product design and faster launches. Contact Chipworks To find out more information on this report, or any other reports in our library, please contact Chipworks at Chipworks 1891 Robertson Road, Suite 500 Ottawa, Ontario K2H 5B7 Canada T F Web site: info@chipworks.com Please send any feedback to feedback@chipworks.com
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Rev. 05 25 April 2008 Product data sheet 1. Product profile 1.1 General description The temperature sensors in the have a positive temperature coefficient of resistance and are suitable for use in measurement
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