Ultra Low Capacitance Discrete TVS Series

Transcription

1 RoHS Pb GREEN ELV Description The Ultra Low apacitance Discrete TVS series provides unidirectional and bidirectional ESD protection for the world s most challenging high speed serial interfaces. Ultra low capacitance permits excellent signal integrity on the most challenging consumer electronics interfaces, such as USB 3., HDMI.0, DisplayPort, and V-by-One. Providing in excess of 0kV contact ESD protection (IE ) while maintaining extremely low leakage and dynamic resistance, offered in the industry s most popular footprints (040 and 00), the series sets higher standards for signal integrity and usability. SP03 Pinout Features 00DFN 040 DFN 0.3pF MAX bidirectional 0.5pF MAX unidirectional ESD, IE , ±0kV contact, ±0kV air Low clamping voltage of I PP =A (Bidirectional) (t P =8/0μs) Facilitates excellent signal integrity ELV ompliant Halogen free, Lead free and RoHS compliant Low profile 00 and 040 DFN packages Bottom View Applications Ultra-high speed data lines onsumer, mobile and portable electronics Functional Block Diagram USB 3., 3.0,.0 HDMI.0,.4a,.3 DisplayPort (TM) Thunderbolt (Light Peak) V-by-One LVDS interfaces Tablet P and external storage with high speed interfaces Applications requiring high ESD performance in small packages Unidirectional Bidirectional

2 Absolute Maximum Ratings Symbol Parameter Value Units I PP Peak urrent (t p =8/0μs).0 A T OP Operating Temperature -30 to 85 T STOR Storage Temperature -55 to 50 AUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Thermal Information Parameter Rating Units Storage Temperature Range -55 to 50 Maximum Junction Temperature 50 Maximum Lead Temperature (Soldering 0-40s) 60 Unidirectional Electrical haracteristics - (T OP =5 ) Parameter Test onditions Min Typ Max Units Input V R = 0V, f = 3GHz pf Breakdown Voltage V I T =ma 9.00 V Reverse Working Voltage 7.0 V Reverse Leakage urrent I V RWM =5.0V 5 50 na lamping Voltage V I PP =.0A 9.0 V IE (ontact) ±0 ESD Withstand Voltage kv IE (Air) ±0 Bidirectional Electrical haracteristics - (T OP =5 ) Parameter Test onditions Min Typ Max Units Input V R = 0V, f = 3GHz pf Breakdown Voltage V I T =ma 9.80 V Reverse Working Voltage V Reverse Leakage urrent I V RWM =5.0V 5 50 na lamping Voltage V I PP =.0A 0.0 V ESD Withstand Voltage IE (ontact) ±0 IE (Air) ±0 kv Insertion Loss Diagram - Unidirectional Insertion Loss Diagram - Bidirectional S Insertion Loss (db) S Insertion Loss (db) E+06.E+07.E+08.E+09.E+0 Frequency (Hz) E+06.E+07.E+08.E+09.E+0 Frequency (Hz) Ultra Low apactance Discrete TVS series

3 urrent (ma) Temperature urrent (ma) TVS Diode Arrays (SPA Diodes) Device IV urve - Unidirectional Device IV urve - Bidirectional SP Voltage (V) Voltage (V) USB3.0 Eye Diagram 5.0 Gb/s, 000mV differential, PO ompliant Test Pattern Without Device With Device Soldering Parameters Reflow ondition Pre Heat - Temperature Min (T s(min) ) 50 - Temperature Max (T s(max) ) 00 Pb Free assembly - Time (min to max) (t s ) secs Average ramp up rate (Liquidus) Temp (T L ) to peak T S(max) to T L - Ramp-up Rate Reflow - Temperature (T L ) (Liquidus) 7 3 /second max 3 /second max - Temperature (t L ) seconds Peak Temperature (T P ) 60 +0/-5 Time within 5 of actual peak Temperature (t p ) 0 40 seconds Ramp-down Rate 6 /second max Time 5 to peak Temperature (T P ) 8 minutes Max. Do not exceed 60 T P T L T S(max) T S(min) 5 t S Preheat Ramp-up time to peak temperature Product haracteristics of 040 DFN Package Lead Plating Lead Material Lead oplanarity Substrate material Pre-Plated Frame t P opper Alloy inches(0.0mm) Silicon Body Material Molded Epoxy Flammability UL 94 V-0 t L Ramp-down Time ritical Zone TL to TP Notes :. All dimensions are in millimeters. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI -3.

4 Package Dimensions 00 DFN TOP VIEW SIDE VIEW SIDE VIEW Symbol Millimeters Inches Min Max Min Max A A A ref ref. b D E e BS BS L L K 0.7 BS BS M N P BOTTOM VIEW Package Dimensions 040 DFN Symbol Millimeters Inches Min Typ Max Min Typ Max A A A3 0.3REF 0.005REF TOP VIEW END VIEW- END VIEW- b TOP VIEW END VIEW- END VIEW- D E e 0.65BS 0.06BS L SIDE VIEW- SIDE VIEW- SIDE VIEW- SIDE VIEW- BOTTOM VIEW- BOTTOM VIEW- BOTTOM VIEW- BOTTOM VIEW-

5 Part Numbering System Part Marking System TVS Diode Arrays (SPA Diodes) SP xxxx X UL 0 X T G G= Green Size Directional U: Unidirectional B: Bidirectional Ultra L T= Tape & Reel Package U: 00 DFN E: 040 DFN Number of hannels Unidirectional Bidirectional SP03 Ordering Information Part Number Package Marking Reel Quantity SP00U-UL-0UTG 00 DFN I 5000 SP00B-UL-0UTG 00 DFN 5000 SP040U-UL-0ETG 040 DFN I 0000 SP040B-UL-0ETG 040 DFN 0000 Embossed arrier Tape & Reel Specification 00 DFN W P0 P A0 K0 T P B0 D D0 E F Symbol Millimeters A min/0.4 max B min/0.7 max D0 ø / -0 D ø 0.0 +/ E.75+/-0.0 F 3.50+/-0.05 K min/0.39 max P /-0.0 P.00+/-0.0 P.00+/-0.05 W /-0.0 T 0.3 min/0.5 max Embossed arrier Tape & Reel Specification 040 DFN W P0 P T P D D0 E F Symbol Millimeters A /-0.05 B0.5+/-0.05 D0 ø.50+/-0.0 D ø /-0.0 E.75+/-0.0 F 3.50+/-0.0 K /-0.05 P /-0.0 P.00+/-0.0 P.00+/-0.05 W /-0.0 T 0.0+/-0.05 A0 K0 B0